CN107793702A - A kind of resin combination and its glued membrane of making, cover layer - Google Patents
A kind of resin combination and its glued membrane of making, cover layer Download PDFInfo
- Publication number
- CN107793702A CN107793702A CN201710817661.7A CN201710817661A CN107793702A CN 107793702 A CN107793702 A CN 107793702A CN 201710817661 A CN201710817661 A CN 201710817661A CN 107793702 A CN107793702 A CN 107793702A
- Authority
- CN
- China
- Prior art keywords
- resin
- resin combination
- epoxy resin
- parts
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
Abstract
The invention provides a kind of resin combination, and glued membrane and cover layer by its making.The resin combination includes：Calculated by solid weight part, the polyamide-imide resin of 30 70 parts by weight, the epoxy resin of 10 50 parts by weight and 10 20 parts by weight phosphorus containing phenolic resins.The glued membrane or cover layer made by the resin combination not only has high glass-transition temperature, the characteristics of heat resistance and excellent in flame retardance, and with the peel strength of copper foil and polyimides it is high the advantages of, the flexible printed-circuit board application of more high-temperature resistant and high reliability request can be met.
Description
Technical field
The present invention relates to resin combination, the more particularly to a kind of glued membrane being used in flexible printed-circuit board and cover layer
Resin combination, and glued membrane and cover layer by its making.
Background technology
Flexible printed-circuit board (Flexible Printed Circuit Board, abbreviation FPCB) is a kind of using flexible
There is the printed circuit board of figure made of base material (Flexible copper clad laminate, abbreviation FCCL).FPCB has
There is the advantages of not available for many rigid printed circuit plates, such as it can be with free bend, winding, folding, can be according to space cloth
Office requires arbitrary arrangement, and can arbitrarily be moved in three dimensions and flexible, is connected with wire so as to reaching components and parts assembling
Integration, the volume of electronic product can be substantially reduced using FPCB, adapt to electronic product to high density, miniaturization, high reliability
The needs that direction is developed.
In multi-layer FPC B manufacturing process, it usually needs using glued membrane as tack coat to realize the company of sandwich construction
Connect.Glued membrane coats one layer of adhesive thereon and formed generally using mould release membrance or release liners as carrier；Cover layer is a kind of weight
The flexible circuit base material wanted, for being covered in the outer surface of flexible printed-circuit board, welding resistance effect is played, and prevent circuit
Not by the pollution of dust, moisture and chemicals and damaging for other forms, while there is certain flexibility and enhancing to make
With can reduce the influence of conductor stress in BENDING PROCESS, improve the resistance to deflection of flexible printed-circuit board.Cover layer is typically
Using Kapton as base material, and coat one layer of adhesive thereon and form.The glue of common glued membrane or cover layer used in it
For adhensive layer generally based on rubber modified epoxy resin glue or acrylate glue etc., its Tg (glass transition temperature) is universal relatively low,
Typically not greater than 80 DEG C, it is difficult to suitable for requiring higher flexible printed-circuit board application.
The content of the invention
The problem of for prior art, it is an object of the invention to provide can meet more high-temperature resistant and high reliability request
Flexible printed-circuit board application resin combination, and by its making glued membrane and cover layer.
The purpose of the present invention can be achieved through the following technical solutions.
One aspect of the present invention provides a kind of resin combination, it is characterised in that is calculated by solid weight part, the tree
Oil/fat composition includes：The polyamide-imide resin of 30-70 parts by weight, the epoxy resin of 10-50 parts by weight and 10-20 parts by weight
Phosphorus containing phenolic resin.
Preferably, phosphorus containing phenolic resin includes the phenolic aldehyde containing the miscellaneous -10- phospho hetero phenanthrenes -10- oxide structures of dihydro-9-oxy
Resin.
Preferably, the phosphorus content of phosphorus containing phenolic resin is 5%-15% weight %.
Preferably, the hydroxyl equivalent of phosphorus containing phenolic resin is 200-500g/eq.
Preferably, epoxy resin is bisphenol A type epoxy resin, phosphorous epoxy resin, novolac epoxy resin, biphenyl type epoxy
One or more of combinations in resin, dicyclopentadiene type epoxy resin, cycloaliphatic epoxy resin.
It is further preferred that phosphorous epoxy resin is to contain 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide knot
The epoxy resin of structure.
Preferably, resin combination also includes curing accelerator and/or solvent.
Preferably, resin combination is free of rubber modified epoxy resin and/or acrylic resin.
Another aspect of the present invention provides a kind of glued membrane, including mould release membrance or release liners and in the mould release membrance or release
Gluing oxidant layer on paper, the gluing oxidant layer are prepared by above-mentioned resin combination.
Another aspect of the invention provides a kind of cover layer, including insulating properties plastic substrate film and thin in the base material
Gluing oxidant layer on film, the gluing oxidant layer are prepared by above-mentioned resin combination.
The glued membrane or cover layer made by the resin combination of the present invention not only has high Tg, heat resistance and excellent in flame retardance
The characteristics of, and with the peel strength of copper foil and polyimides (PI) it is high the advantages of, so as to meet more high-temperature resistant and
The flexible printed-circuit board application of high reliability request.
Embodiment
The present invention will be described in more detail below.
1st, resin combination
The resin combination of the present invention includes polyamide-imide resin, epoxy resin, phosphorus containing phenolic resin and optional
Curing accelerator and/or solvent.
(1) polyamide-imide resin
The resin combination of the present invention includes the polyamide-imide resin of 30-70 parts by weight, with the total of resin combination
Weight is 100 parts of calculating.It is 1000~200000 that polyamide-imide resin available for the present invention, which includes number-average molecular weight,
Polyamide-imide resin, its representative resin include the HR-71DD that (TOYOBO) company is spun by Japan, Su Wei (SOLVAY) company
A1-10 etc..
(2) epoxy resin
The resin combination of the present invention includes the epoxy resin of 10-50 parts by weight, using the gross weight of resin combination as 100
Part calculates.Epoxy resin can include bisphenol A type epoxy resin, phosphorous epoxy resin, novolac epoxy resin, biphenyl type epoxy tree
One or more of combinations in fat, dicyclopentadiene type epoxy resin, cycloaliphatic epoxy resin.
Phosphorous epoxy resin refers to the epoxy resin that phosphorus atoms are absorbed using reactive phosphorus compound, by chemical bond.Instead
The example of answering property phosphorus compound can include 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,5- dihydroxyphenyls
Base) -10- hydrogen -9- oxa- -10- phospho hetero phenanthrene -10- oxides etc..Commercially available phosphorous epoxy resin includes XZ92530 (Tao Shiization
Company), YEP-250, YEP-300 (Guang Shan Chemical Co., Ltd.s) etc..
(3) phosphorus containing phenolic resin
The resin combination of the present invention includes the phosphorus containing phenolic resin of 10-20 parts by weight, with the gross weight of resin combination
For 100 parts of calculating.Phosphorous epoxy resin refers to the phenolic aldehyde tree that phosphorus atoms are absorbed using reactive phosphorus compound, by chemical bond
Fat.Representational reactive phosphorus compound includes the miscellaneous -10- phospho hetero phenanthrenes -10- oxides of 9,10- dihydro-9-oxies.It is commercially available to contain
Have the miscellaneous -10- phospho hetero phenanthrenes -10- oxide structures of dihydro-9-oxy phenolic resin include LC-950 (SHINA chemical companies),
XZ92741 (Dow Chemical) etc., the structure included by them is as follows：
With
Phosphorus content available for the phosphorous epoxy resin of the present invention is 5%-15% weight %.In addition, phosphorous epoxy resin
Hydroxyl equivalent can be 200-500g/eq.
(4) other compositions
In addition to the composition of above-mentioned (1)-(3), resin combination of the invention can also contain curing accelerator and/or molten
Agent.
Curing accelerator is used for the solidification for promoting resin component.Using the gross weight of resin combination as 100 parts of calculating, solidification
The dosage of accelerator can be 0.01 to 1 part.Curing accelerator can include imidazoles curing accelerator, tertiary amine, quaternary ammonium salt, phosphine
Class, caprylate etc..It is preferred that imidazoles curing accelerator, for example, imidazoles, 2-methylimidazole, 1- methylimidazoles, 2- ethyl -4- first
Base imidazoles, the methylimidazole of 1- cyanoethyl -2- ethyls -4,2- phenylimidazoles, 2- undecyl imidazoles, 2- phenyl -4-methylimidazole
Deng.Curing accelerator individually one or two kinds of combination of the above can use.
Solvent is used to the various solid constituents in resin combination being deployed into glue.Solvent available for the present invention includes
Organic solvent, such as dimethylformamide, dimethyl acetamide, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, acetone, butanone, cyclohexanone
One or more in.
The resin combination of the present invention can also include fire retardant, organic/inorganic filler etc., but use these compositions
When, its type and quantity need to be considered, to avoid causing the deterioration of performance needed for resin combination.
Preferably, resin combination of the invention does not include the rubber commonly used in traditional glued membrane or cover layer resin combination
The resin component such as glue modified epoxy and/or acrylic resin.
2nd, glued membrane
The glued membrane of the present invention includes mould release membrance or release liners and the gluing oxidant layer on the mould release membrance or release liners, wherein
Gluing oxidant layer is prepared by the above-mentioned resin combination of the present invention.Can by by the present invention resin composition in mould release membrance
Or in release liners, then dry and obtain glued membrane.Dried film thickness can be 10-100 μm, preferably 30-80 μm.
Mould release membrance or release liners can include polyethylene, polyester, polyolefin, polymethylpentene, polyvinyl chloride, polyvinylidene fluoride
The plastic sheetings such as alkene, polyphenylene sulfide and film that they are crossed by the surface coated treatment such as silicone or fluorine compounds, by they
Being laminated paper, dipping or the face coat formed has paper of fissility resin etc..
3rd, cover layer
The cover layer of the present invention includes insulated plastic film and the gluing oxidant layer on the plastic sheeting, wherein gluing
Oxidant layer is prepared by the above-mentioned resin combination of the present invention.Cover layer is additionally may included in the protecting film layer in gluing oxidant layer.
Insulated plastic film is included by polyimides, polyester, polyphenylene sulfide, polyether sulfone, polyether-ether-ketone, aromatics polyacids
The film that the plastics such as amine, makrolon, polyarylate are formed, thickness can be 5-200 μm, also can therefrom choose multiple thin
Film is laminated.Protecting film layer can use above-mentioned mould release membrance or release liners.
Technical scheme is illustrated below by embodiment, wherein the mass parts of organic resin are by organic solid
Shape amount of substance part is counted.
Embodiment one：
Being total up to 100 parts of resin combination includes：30 parts of polyamide-imide resin (TOYOBO, HR-71DD), bis-phenol
50 parts of A types epoxy resin (stepping figure, EPIKOTE 1001), phosphorus-containing phenolic aldehyde (SHINA chemistry, LC-950) (phosphorus content 9%, hydroxyl
Equivalent 340) 20 parts.Adding 0.06 part of Imidizole accelerator and dimethyl acetamide (DMAC) solvent in the composition can match somebody with somebody
Into glue, coated on mould release membrance or Kapton after being uniformly mixed, after in an oven 155 degree toast 5 minutes and go
Except solvent, glued membrane or cover layer product are obtained.Detection performance is shown in Table 1.
Embodiment two：
Being total up to 100 parts of resin combination includes：60 parts of polyamide-imide resin (TOYOBO, HR-71DD), it is phosphorous
30 parts of epoxy resin (DOW Chemical, XZ92530), phosphorus-containing phenolic aldehyde (SHINA chemistry, LC-950) (phosphorus content 9%, hydroxyl equivalent
340) 10 parts.Glue can be made into by adding 0.05 part of Imidizole accelerator and DMAC solvents in the composition, be stirred
Coated on mould release membrance or Kapton after even, after in an oven 155 degree bakings, 5 minutes removal solvents obtain glued membrane or cover
Epiphragma product.Detection performance is shown in Table 1.
Embodiment three：
Being total up to 100 parts of resin combination includes：70 parts of polyamide-imide resin (SOLVAY, AI-10), biphenyl type
15 parts of epoxy resin (Japanese chemical drug, NC3000H), phosphorus-containing phenolic aldehyde (DOW Chemical, XZ92741) (phosphorus content 9%, hydroxyl equivalent
450) 15 parts.Glue can be made into by adding 0.03 part of Imidizole accelerator and DMAC solvents in the composition, be stirred
Coated on mould release membrance or Kapton after even, after in an oven 155 degree bakings, 5 minutes removal solvents obtain glued membrane or cover
Epiphragma product.Detection performance is shown in Table 1.
Comparative example one：
Being total up to 100 parts of resin combination includes：60 parts of bisphenol A type epoxy resin (stepping figure, EPIKOTE 1001), end
30 parts of carboxyl nitrile rubber (ZEON, Nipol 1072CG), 5 parts of DDS, phosphate flame retardants (Clariant,
OP935) 5 parts.Glue can be made into by adding 0.03 part of Imidizole accelerator and butanone solvent in the composition, be stirred
Coated on mould release membrance or Kapton after even, after in an oven 155 degree bakings, 5 minutes removal solvents obtain glued membrane or cover
Epiphragma product.Detection performance is shown in Table 1.
Comparative example two：
Being total up to 100 parts of resin combination includes：97 parts of acrylate copolymer emulsion, 3 parts of aldehyde amines curing agent,
0.1 part of accelerator and solvent are added in said composition can be made into glue, coated in mould release membrance or poly- after being uniformly mixed
On imide membrane, after in an oven 155 degree baking 5 minutes remove solvent obtain glued membrane or cover layer product.Detection performance is shown in
Table 1.
Comparative example three：
Being total up to 100 parts of resin combination includes：70 parts of polyamide-imide resin (SOLVAY, AI-10), biphenyl type
15 parts of epoxy resin (Japanese chemical drug, NC3000H), 15 parts of phenol type phenolic aldehyde (HEXION, PHL6635).In the composition again
Glue can be made into by adding 0.03 part of Imidizole accelerator and DMAC solvents, sub- coated in mould release membrance or polyamides after being uniformly mixed
On amine film, after in an oven 155 degree baking 5 minutes remove solvent obtain glued membrane or cover layer product.Detection performance is shown in Table 1.
Comparative example four：
Being total up to 100 parts of resin combination includes：60 parts of polyamide-imide resin (TOYOBO, HR-71DD), it is phosphorous
30 parts of epoxy resin (DOW Chemical, XZ92530), 10 parts of phosphate flame retardants (Clariant, OP935).In the composition again
Glue can be made into by adding 0.05 part of Imidizole accelerator and DMAC solvents, sub- coated in mould release membrance or polyamides after being uniformly mixed
On amine film, after in an oven 155 degree baking 5 minutes remove solvent obtain glued membrane or cover layer product.Detection performance is shown in Table 1.
Table 1
The method of testing of above test event is as follows：
Glass transition temperature (Tg)：According to differential scanning calorimetry (DSC), according to IPC-TM-6502.4.25 defineds
DSC method be measured.
Heat decomposition temperature (Td)：According to thermogravimetry (TGA), according to the TGA side of IPC-TM-6502.4.24 defineds
Method is measured.
The method of testing of peel strength uses IPC-TM-650 standards.
Thermal stress：Glued membrane or cover layer are kept for 20 seconds in 288 DEG C of tin stove, range estimation layering and blister formation.
Flammability method of testing is according to U.S.'s UL94 standard testings.
From test result as can be seen that the glass transition temperature of embodiment is all higher, than comparative example one and two (i.e. at present
Conventional glued membrane or cover layer formula system) be higher by a lot, Td is also higher by a lot, can reach fire-retardant V-0 levels, and with PI stripping
From intensity height.In the case where replacing phosphorus-containing phenolic aldehyde using common phenolic aldehyde (comparative example three), do not have an anti-flammability, and with PI stripping
Low intensity.In the case where replacing phosphorus-containing phenolic aldehyde using phosphate flame retardants (comparative example four), though there is anti-flammability, with PI's
Peel strength is low.
In summary, glued membrane of the invention or cover layer have higher Tg (130 DEG C of ＞), heat resistance and anti-flammability excellent
It is different, it is high with copper foil and PI peel strength, the flexible printed-circuit board application of more high-temperature resistant and high reliability request can be met.
More than, only presently preferred embodiments of the present invention for the person of ordinary skill of the art, can be according to this hair
Bright technical scheme and technical concept makes other various corresponding changes and deformation, and all these changes and deformation should all belong to
In the scope of the claims in the present invention.
The present invention illustrates the method detailed of the present invention by above-described embodiment, but the invention is not limited in above-mentioned detailed
Method, that is, do not mean that the present invention has to rely on above-mentioned method detailed and could implemented.Person of ordinary skill in the field should
Understand, any improvement in the present invention, addition, the concrete mode of equivalence replacement and auxiliary element to each raw material of product of the present invention
Selection etc., all fall within protection scope of the present invention and it is open within the scope of.
Claims (10)
1. a kind of resin combination, it is characterised in that calculated by solid weight part, the resin combination includes：30-70 weight
Polyamide-imide resin, the epoxy resin and 10-20 parts by weight phosphorus containing phenolic resins of 10-50 parts by weight of part.
2. resin combination as claimed in claim 1, it is characterised in that the phosphorus containing phenolic resin includes containing dihydro -9-
The phenolic resin of oxa- -10- phospho hetero phenanthrene -10- oxide structures.
3. resin combination as claimed in claim 1, it is characterised in that the phosphorus content of the phosphorus containing phenolic resin is 5%-
15% weight %.
4. resin combination as claimed in claim 1, it is characterised in that the hydroxyl equivalent of the phosphorus containing phenolic resin is 200-
500g/eq。
5. resin combination as claimed in claim 1, it is characterised in that the epoxy resin is bisphenol A type epoxy resin, contained
In phosphorus epoxy resin, novolac epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, cycloaliphatic epoxy resin
One or more of combinations.
6. resin combination as claimed in claim 5, it is characterised in that the phosphorous epoxy resin for contain 9,10- dihydros-
The epoxy resin of 9- oxa- -10- phospho hetero phenanthrene -10- oxide structures.
7. resin combination as claimed in claim 1, it is characterised in that the resin combination also includes curing accelerator
And/or solvent.
8. resin combination as claimed in claim 1, it is characterised in that the resin combination is free of rubber modified epoxy tree
Fat and/or acrylic resin.
9. a kind of glued membrane, including mould release membrance or release liners and the gluing oxidant layer on the mould release membrance or release liners, its feature exist
In the gluing oxidant layer is prepared by resin combination according to any one of claim 1 to 8.
10. a kind of cover layer, including insulated plastic film and the gluing oxidant layer on the plastic sheeting, it is characterised in that
The gluing oxidant layer is prepared by resin combination according to any one of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817661.7A CN107793702B (en) | 2017-09-12 | 2017-09-12 | Resin composition and adhesive film and covering film made of same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817661.7A CN107793702B (en) | 2017-09-12 | 2017-09-12 | Resin composition and adhesive film and covering film made of same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107793702A true CN107793702A (en) | 2018-03-13 |
| CN107793702B CN107793702B (en) | 2020-09-08 |
Family
ID=61532461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710817661.7A Active CN107793702B (en) | 2017-09-12 | 2017-09-12 | Resin composition and adhesive film and covering film made of same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107793702B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108893090A (en) * | 2018-05-03 | 2018-11-27 | 广东生益科技股份有限公司 | Resin combination and its glue film of production, cover film |
| CN109096979A (en) * | 2018-08-15 | 2018-12-28 | 南昌正业科技有限公司 | A kind of adhesive and a kind of flexibility coat copper plate with high glass-transition temperature |
| CN110577803A (en) * | 2018-06-11 | 2019-12-17 | 3M创新有限公司 | Flame-retardant pressure-sensitive adhesive, flame-retardant pressure-sensitive adhesive sheet and preparation method thereof |
| CN111592760A (en) * | 2020-06-10 | 2020-08-28 | 浙江福斯特新材料研究院有限公司 | Colored cover film composition, colored cover film and copper-clad plate assembly |
| CN114685989A (en) * | 2020-12-30 | 2022-07-01 | 广东生益科技股份有限公司 | Resin composition and adhesive film and covering film containing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060523A (en) * | 2006-08-01 | 2008-03-13 | Hitachi Chem Co Ltd | Sealing film and semiconductor device using it |
| CN101851480A (en) * | 2010-05-11 | 2010-10-06 | 华烁科技股份有限公司 | Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate |
| CN102977829A (en) * | 2012-11-01 | 2013-03-20 | 宁波大榭开发区综研化学有限公司 | Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape |
| CN105419231A (en) * | 2015-11-27 | 2016-03-23 | 广东生益科技股份有限公司 | Resin composition and copper-clad plate and PCB made of same |
-
2017
- 2017-09-12 CN CN201710817661.7A patent/CN107793702B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060523A (en) * | 2006-08-01 | 2008-03-13 | Hitachi Chem Co Ltd | Sealing film and semiconductor device using it |
| CN101851480A (en) * | 2010-05-11 | 2010-10-06 | 华烁科技股份有限公司 | Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate |
| CN102977829A (en) * | 2012-11-01 | 2013-03-20 | 宁波大榭开发区综研化学有限公司 | Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape |
| CN105419231A (en) * | 2015-11-27 | 2016-03-23 | 广东生益科技股份有限公司 | Resin composition and copper-clad plate and PCB made of same |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108893090A (en) * | 2018-05-03 | 2018-11-27 | 广东生益科技股份有限公司 | Resin combination and its glue film of production, cover film |
| CN108893090B (en) * | 2018-05-03 | 2021-03-02 | 广东生益科技股份有限公司 | Resin composition and adhesive film and covering film made of same |
| CN110577803A (en) * | 2018-06-11 | 2019-12-17 | 3M创新有限公司 | Flame-retardant pressure-sensitive adhesive, flame-retardant pressure-sensitive adhesive sheet and preparation method thereof |
| CN110577803B (en) * | 2018-06-11 | 2021-11-26 | 3M创新有限公司 | Flame-retardant pressure-sensitive adhesive, flame-retardant pressure-sensitive adhesive sheet and preparation method thereof |
| CN109096979A (en) * | 2018-08-15 | 2018-12-28 | 南昌正业科技有限公司 | A kind of adhesive and a kind of flexibility coat copper plate with high glass-transition temperature |
| CN111592760A (en) * | 2020-06-10 | 2020-08-28 | 浙江福斯特新材料研究院有限公司 | Colored cover film composition, colored cover film and copper-clad plate assembly |
| CN111592760B (en) * | 2020-06-10 | 2022-11-29 | 杭州福斯特电子材料有限公司 | Colored cover film composition, colored cover film and copper-clad plate assembly |
| CN114685989A (en) * | 2020-12-30 | 2022-07-01 | 广东生益科技股份有限公司 | Resin composition and adhesive film and covering film containing same |
| WO2022141817A1 (en) * | 2020-12-30 | 2022-07-07 | 广东生益科技股份有限公司 | Resin composition and adhesive film and cover film comprising same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107793702B (en) | 2020-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107793702A (en) | A kind of resin combination and its glued membrane of making, cover layer | |
| US8227084B2 (en) | Thermosetting resin composition for high performance laminates | |
| KR101508083B1 (en) | Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same | |
| JP4723865B2 (en) | Flame-retardant epoxy resin composition, prepreg containing the same composition, laminate and printed wiring board | |
| CN108893090A (en) | Resin combination and its glue film of production, cover film | |
| JP2009108144A (en) | Flexible halogen-free epoxy resin composition, metallic foil with resin, cover-lay film, prepreg, laminate for printed wiring board, metal-clad flexible laminate | |
| JP2012097197A (en) | Flame-retardant adhesive composition and adhesive sheet and coverlay film using the same | |
| JP5303826B2 (en) | Resin composition, prepreg and printed wiring board using the same | |
| KR101100381B1 (en) | Adhesive Composition for Halogen-Free Coverlay Film and Coverlay Film Coated by the Same | |
| JP2007211143A (en) | Resin composition, cover-lay film and metal-clad laminate | |
| JP2005336287A (en) | Thermosetting adhesive sheet for flexible printed wiring board, manufacturing method therefor and multilayer flexible printed wiring board and flex-rigid printed wiring board using the same | |
| JP2007077247A (en) | Resin composition, coverlay film using it and metal-clad laminate | |
| JP2008143925A (en) | Polyamide resin and resin composition containing the same | |
| TW201942241A (en) | Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package | |
| JP2007002121A (en) | Epoxy adhesive, cover lay, prepreg, metal-clad laminate, printed circuit substrate | |
| WO2008105563A1 (en) | Flame-retardant adhesive resin composition and flexible printed board material using the same | |
| TWI381017B (en) | Composition and Manufacturing Method of Halogen - free Printed Circuit Board with Low Dielectric Loss | |
| JP5428212B2 (en) | Resin composition, prepreg and printed wiring board using the same | |
| WO2022141817A1 (en) | Resin composition and adhesive film and cover film comprising same | |
| JP2009132780A (en) | Resin composition for circuit board, insulating layer with supporting substrate, laminate, and circuit board | |
| JP3343443B2 (en) | Resin composition and prepreg | |
| JP2005105182A (en) | Resin composition, prepreg and laminate | |
| JP2007045931A (en) | Epoxy adhesive, coverlay, prepreg, metal-clad laminate and printed circuit board | |
| JP2007016062A (en) | Epoxy-based adhesive, coverlay, prepreg, metal-clad laminate, printed wiring board | |
| KR101074858B1 (en) | Adhesive Composition for Halogen-Free Coverlay Film and Coverlay Film Using the Same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |