CN107793702B - Resin composition and adhesive film and covering film made of same - Google Patents
Resin composition and adhesive film and covering film made of same Download PDFInfo
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- CN107793702B CN107793702B CN201710817661.7A CN201710817661A CN107793702B CN 107793702 B CN107793702 B CN 107793702B CN 201710817661 A CN201710817661 A CN 201710817661A CN 107793702 B CN107793702 B CN 107793702B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention provides a resin composition, and a glue film and a covering film made of the resin composition. The resin composition comprises: 30-70 parts by weight of polyamide-imide resin, 10-50 parts by weight of epoxy resin and 10-20 parts by weight of phosphorus-containing phenolic resin calculated by solid parts by weight. The adhesive film or the covering film prepared from the resin composition has the characteristics of high glass transition temperature, excellent heat resistance and flame retardance, has the advantage of high peel strength with copper foil and polyimide, and can meet the application of flexible printed circuit boards with higher temperature resistance and high reliability requirements.
Description
Technical Field
The invention relates to a resin composition, in particular to a resin composition for an adhesive film and a covering film in a flexible printed circuit board, and the adhesive film and the covering film made of the resin composition.
Background
A Flexible Printed Circuit Board (FPCB) is a Printed Circuit Board having a pattern formed by using a Flexible substrate (FCCL). The FPCB has the advantages that many rigid printed circuit boards do not have, for example, the FPCB can be freely bent, wound and folded, can be randomly arranged according to space layout requirements, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved, the size of an electronic product can be greatly reduced by utilizing the FPCB, and the FPCB is suitable for the requirements of the development of the electronic product towards high density, miniaturization and high reliability.
In the manufacturing process of the multi-layer FPCB, it is generally required to use an adhesive film as an adhesive layer to achieve the connection of the multi-layer structure. The adhesive film is usually formed by taking a release film or release paper as a carrier and coating a layer of adhesive on the carrier; the cover film is an important flexible circuit substrate, is used for covering the outer surface of the flexible printed circuit board, plays a role in resisting soldering, prevents the circuit from being polluted by dust, moisture and chemicals and other damages, has certain flexibility and reinforcement, can reduce the influence of stress of a conductor in the bending process, and improves the flexibility resistance of the flexible printed circuit board. The coverlay film is generally formed by coating a polyimide film as a substrate and a layer of adhesive on the polyimide film. The adhesive layer used by the common adhesive film or cover film is mainly rubber modified epoxy resin glue or acrylic acid glue, the Tg (glass transition temperature) of the adhesive layer is generally low and usually not more than 80 ℃, and the adhesive layer is difficult to be applied to the flexible printed circuit board with higher requirements.
Disclosure of Invention
In view of the problems of the prior art, the present invention aims to provide a resin composition for flexible printed circuit board applications, which can meet the requirements of higher temperature resistance and high reliability, and an adhesive film and a cover film made of the resin composition.
The purpose of the invention can be realized by the following technical scheme.
One aspect of the present invention provides a resin composition characterized by comprising, in parts by weight of solids: 30-70 parts of polyamide-imide resin, 10-50 parts of epoxy resin and 10-20 parts of phosphorus-containing phenolic resin.
Preferably, the phosphorus-containing phenolic resin comprises a phenolic resin containing a dihydro-9-oxa-10-phosphaphenanthrene-10-oxide structure.
Preferably, the phosphorus-containing phenolic resin has a phosphorus content of 5% to 15% by weight.
Preferably, the phosphorus-containing phenolic resin has a hydroxyl equivalent weight of 200-500 g/eq.
Preferably, the epoxy resin is one or a combination of more of bisphenol A epoxy resin, phosphorus-containing epoxy resin, novolac epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin and alicyclic epoxy resin.
Further preferably, the phosphorus-containing epoxy resin is an epoxy resin containing a 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide structure.
Preferably, the resin composition further comprises a curing accelerator and/or a solvent.
Preferably, the resin composition is free of rubber-modified epoxy resin and/or acrylic resin.
Another aspect of the present invention provides an adhesive film, which includes a release film or release paper and an adhesive layer on the release film or release paper, wherein the adhesive layer is prepared from the above resin composition.
In a further aspect of the present invention, there is provided a coverlay film comprising an insulating plastic base film and an adhesive layer on the base film, the adhesive layer being prepared from the above-mentioned resin composition.
The adhesive film or the covering film prepared from the resin composition has the characteristics of high Tg, excellent heat resistance and flame retardance, and has the advantage of high peel strength with copper foil and Polyimide (PI), so that the adhesive film or the covering film can meet the application of flexible printed circuit boards with higher temperature resistance and high reliability requirements.
Detailed Description
The present invention will be described in more detail below.
1. Resin composition
The resin composition of the present invention comprises a polyamideimide resin, an epoxy resin, a phosphorus-containing phenol resin, and optionally a curing accelerator and/or a solvent.
(1) Polyamide-imide resin
The resin composition of the present invention comprises 30 to 70 parts by weight of the polyamideimide resin, based on 100 parts by weight of the total resin composition. The polyamideimide resin that can be used in the present invention includes polyamideimide resins having a number average molecular weight of 1000 to 200000, and representative resins thereof include HR-71DD manufactured by Toyo Boenki (TOYOBO), A1-10 manufactured by Suwei (SOLVAY), and the like.
(2) Epoxy resin
The resin composition of the present invention comprises 10 to 50 parts by weight of the epoxy resin, based on 100 parts by weight of the total resin composition. The epoxy resin can comprise one or more of bisphenol A epoxy resin, phosphorus-containing epoxy resin, novolac epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin and alicyclic epoxy resin.
The phosphorus-containing epoxy resin refers to an epoxy resin in which a reactive phosphorus compound is used and a phosphorus atom is absorbed by a chemical bond. Examples of the reactive phosphorus compound may include 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2, 5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide, and the like. Commercially available phosphorous epoxy resins include XZ92530 (Dow chemical), YEP-250, YEP-300 (Guangshan chemical Co., Ltd.), and the like.
(3) Phosphorus-containing phenolic resin
The resin composition of the present invention comprises 10 to 20 parts by weight of the phosphorus-containing phenol resin, based on 100 parts by weight of the total resin composition. The phosphorus-containing epoxy resin is a phenol resin which absorbs a phosphorus atom through a chemical bond using a reactive phosphorus compound. Representative reactive phosphorus compounds include 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. Commercially available phenol resins containing a dihydro-9-oxa-10-phosphaphenanthrene-10-oxide structure include LC-950(SHINA chemical Co.), XZ92741 (Dow chemical Co., Ltd.), and the like, and they include the following structures:
the phosphorus-containing epoxy resins useful in the present invention have a phosphorus content of 5% to 15% by weight. In addition, the hydroxyl equivalent of the phosphorus-containing epoxy resin can be 200-500 g/eq.
(4) Other ingredients
The resin composition of the present invention may contain a curing accelerator and/or a solvent in addition to the above-mentioned components (1) to (3).
The curing accelerator is used to accelerate curing of the resin component. The curing accelerator may be used in an amount of 0.01 to 1 part, based on 100 parts by weight of the total resin composition. The curing accelerator may include imidazole-based curing accelerators, tertiary amines, quaternary ammonium salts, phosphines, octanoates, and the like. Imidazole-based curing accelerators such as imidazole, 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-phenyl-4-methylimidazole and the like are preferable. The curing accelerator may be used singly or in combination of two or more.
The solvent is used to formulate various solid components in the resin composition into a gum solution. Solvents useful in the present invention include organic solvents such as one or more of dimethylformamide, dimethylacetamide, propylene glycol methyl ether, ethylene glycol methyl ether, acetone, butanone, cyclohexanone, and the like.
The resin composition of the present invention may further contain a flame retardant, an organic/inorganic filler, etc., but when these components are used, the kind and amount thereof should be considered in order to avoid causing deterioration of the desired properties of the resin composition.
Preferably, the resin composition of the present invention does not contain resin components such as rubber-modified epoxy resin and/or acrylic resin which are commonly used in resin compositions for conventional adhesive films or coverlay films.
2. Glue film
The adhesive film of the present invention comprises a release film or release paper and an adhesive layer on the release film or release paper, wherein the adhesive layer is prepared from the above resin composition of the present invention. The adhesive film can be obtained by coating the resin composition of the present invention on a release film or a release paper, followed by drying. The thickness of the dried adhesive film can be 10-100 μm, preferably 30-80 μm.
The release film or paper may include plastic films such as polyethylene, polyester, polyolefin, polymethylpentene, polyvinyl chloride, polyvinylidene fluoride, polyphenylene sulfide, etc., films obtained by subjecting them to surface coating treatment with silicone or a fluorine compound, etc., paper obtained by laminating them, paper impregnated or surface-coated with a release resin, etc.
3. Covering film
The coverlay film of the present invention comprises an insulating plastic film and an adhesive layer on the plastic film, wherein the adhesive layer is prepared from the above resin composition of the present invention. The cover film may also include a protective film layer over the adhesive layer.
The insulating plastic film includes a film made of a plastic such as polyimide, polyester, polyphenylene sulfide, polyethersulfone, polyetheretherketone, aramid, polycarbonate, polyarylate, and the like, and may have a thickness of 5 to 200 μm, or a plurality of films selected therefrom may be laminated. The protective film layer can adopt the release film or the release paper.
The technical solution of the present invention will be illustrated by examples below, wherein the parts by mass of the organic resin are calculated as the parts by mass of the organic solid matter.
The first embodiment is as follows:
a total of 100 parts of the resin composition comprises: 30 parts of polyamide-imide resin (TOYOBO, HR-71DD), 50 parts of bisphenol A type epoxy resin (Mylar, EPIKOTE 1001), and 20 parts of phosphorus-containing phenolic aldehyde (SHINA chemical, LC-950) (phosphorus content 9%, hydroxyl equivalent 340). 0.06 part of imidazole accelerator and a Dimethylacetamide (DMAC) solvent are added into the composition to prepare a glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and the release film or the polyimide film is baked in an oven at 155 ℃ for 5 minutes to remove the solvent, so that a glue film or a cover film product is obtained. The detection properties are shown in Table 1.
Example two:
a total of 100 parts of the resin composition comprises: 60 parts of polyamide-imide resin (TOYOBO, HR-71DD), 30 parts of phosphorus-containing epoxy resin (Dow chemical, XZ92530) and 10 parts of phosphorus-containing phenolic aldehyde (SHINA chemical, LC-950) (the phosphorus content is 9 percent, and the hydroxyl equivalent is 340). 0.05 part of imidazole accelerator and DMAC solvent are added into the composition to prepare glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and the release film or the polyimide film is baked in an oven at 155 ℃ for 5 minutes to remove the solvent, so that a glue film or a covering film product is obtained. The detection properties are shown in Table 1.
Example three:
a total of 100 parts of the resin composition comprises: 70 parts of polyamide-imide resin (SOLVAY, AI-10), 15 parts of biphenyl type epoxy resin (Japan chemical, NC3000H), and 15 parts of phosphorus-containing phenol formaldehyde (Tao's chemical, XZ92741) (phosphorus content 9%, hydroxyl equivalent 450). 0.03 part of imidazole accelerator and DMAC solvent are added into the composition to prepare glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and the release film or the polyimide film is baked in an oven at 155 ℃ for 5 minutes to remove the solvent, so that a glue film or a covering film product is obtained. The detection properties are shown in Table 1.
Comparative example one:
a total of 100 parts of the resin composition comprises: 60 parts of bisphenol A type epoxy resin (Mylar, EPIKOTE 1001), 30 parts of carboxyl-terminated butadiene acrylonitrile rubber (ZEON, Nipol 1072CG), 5 parts of 4, 4' -diaminodiphenyl sulfone and 5 parts of phosphate flame retardant (Kelaien, OP 935). 0.03 part of imidazole accelerator and butanone solvent are added into the composition to prepare glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and the glue film or the cover film is baked in an oven at 155 ℃ for 5 minutes to remove the solvent, so that a glue film or a cover film product is obtained. The detection properties are shown in Table 1.
Comparative example two:
a total of 100 parts of the resin composition comprises: 97 parts of acrylate copolymer emulsion and 3 parts of aldehyde amine curing agent, 0.1 part of accelerator and solvent are added into the composition to prepare glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and then the glue solution is baked in an oven at 155 ℃ for 5 minutes to remove the solvent to obtain a glue film or a cover film product. The detection properties are shown in Table 1.
Comparative example three:
a total of 100 parts of the resin composition comprises: 70 parts of polyamide-imide resin (SOLVAY, AI-10), 15 parts of biphenyl type epoxy resin (Japan chemical, NC3000H) and 15 parts of phenol type phenolic aldehyde (HEXION, PHL 6635). 0.03 part of imidazole accelerator and DMAC solvent are added into the composition to prepare glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and the release film or the polyimide film is baked in an oven at 155 ℃ for 5 minutes to remove the solvent, so that a glue film or a covering film product is obtained. The detection properties are shown in Table 1.
Comparative example four:
a total of 100 parts of the resin composition comprises: 60 parts of polyamide-imide resin (TOYOBO, HR-71DD), 30 parts of phosphorus-containing epoxy resin (Dow chemical, XZ92530) and 10 parts of phosphate flame retardant (Kelain, OP 935). 0.05 part of imidazole accelerator and DMAC solvent are added into the composition to prepare glue solution, the glue solution is uniformly stirred and mixed and then coated on a release film or a polyimide film, and the release film or the polyimide film is baked in an oven at 155 ℃ for 5 minutes to remove the solvent, so that a glue film or a covering film product is obtained. The detection properties are shown in Table 1.
TABLE 1
The test method of the above test items is as follows:
glass transition temperature (Tg): the measurement was carried out by Differential Scanning Calorimetry (DSC) according to the DSC method defined by IPC-TM-6502.4.25.
Thermal decomposition temperature (Td): the measurement was carried out by the TGA method defined in IPC-TM-6502.4.24 according to the thermogravimetric analysis (TGA).
The peel strength was measured using IPC-TM-650 standard.
Thermal stress: the film or cover was held at 288 ℃ for 20 seconds in a tin oven and visually inspected for delamination and blistering.
Flammability test method test according to the us UL94 standard.
As can be seen from the test results, the glass transition temperatures of the examples are higher than those of the first and second comparative examples (namely, the conventional adhesive film or cover film formula system at present), and the Td is also higher, so that the flame retardant V-0 grade can be achieved, and the peeling strength with PI is high. In the case of using a phenol resin in place of the phosphorus-containing phenol resin (comparative example three), it was not flame-retardant and had a low peel strength with PI. In the case of using a phosphate flame retardant in place of the phosphorus-containing phenol aldehyde (comparative example four), although flame retardancy was obtained, the peel strength with PI was low.
In conclusion, the adhesive film or the cover film has higher Tg (higher than 130 ℃), excellent heat resistance and flame retardance, and high peel strength with copper foil and PI, and can meet the application of flexible printed circuit boards with higher temperature resistance and high reliability requirements.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
The present invention is illustrated in detail by the examples described above, but the present invention is not limited to the details described above, i.e., it is not intended that the present invention be implemented by relying on the details described above. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (9)
1. A resin composition, characterized in that the resin composition comprises, in parts by weight of solids: 60-70 parts of polyamide-imide resin, 10-50 parts of epoxy resin and 10-20 parts of phosphorus-containing phenolic resin,
wherein the resin composition does not contain a rubber-modified epoxy resin and/or an acrylic resin.
2. The resin composition according to claim 1, wherein the phosphorus-containing phenol resin comprises a phenol resin containing a dihydro-9-oxa-10-phosphaphenanthrene-10-oxide structure.
3. The resin composition of claim 1, wherein the phosphorus-containing phenolic resin has a phosphorus content of 5% to 15% by weight.
4. The resin composition according to claim 1, wherein the phosphorus-containing phenol resin has a hydroxyl equivalent weight of 200-500 g/eq.
5. The resin composition according to claim 1, wherein the epoxy resin is one or a combination of bisphenol a epoxy resin, phosphorus-containing epoxy resin, novolac epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin and alicyclic epoxy resin.
6. The resin composition according to claim 5, wherein the phosphorus-containing epoxy resin is an epoxy resin having a 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide structure.
7. The resin composition according to claim 1, further comprising a curing accelerator and/or a solvent.
8. An adhesive film comprising a release film or a release paper and an adhesive layer on the release film or the release paper, characterized in that the adhesive layer is prepared from the resin composition according to any one of claims 1 to 7.
9. A coverlay film comprising an insulating plastic film and an adhesive layer on the plastic film, characterized in that the adhesive layer is prepared from the resin composition according to any one of claims 1 to 7.
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| CN201710817661.7A CN107793702B (en) | 2017-09-12 | 2017-09-12 | Resin composition and adhesive film and covering film made of same |
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| CN108893090B (en) * | 2018-05-03 | 2021-03-02 | 广东生益科技股份有限公司 | Resin composition and adhesive film and covering film made of same |
| CN110577803B (en) * | 2018-06-11 | 2021-11-26 | 3M创新有限公司 | Flame-retardant pressure-sensitive adhesive, flame-retardant pressure-sensitive adhesive sheet and preparation method thereof |
| CN109096979A (en) * | 2018-08-15 | 2018-12-28 | 南昌正业科技有限公司 | A kind of adhesive and a kind of flexibility coat copper plate with high glass-transition temperature |
| CN111592760B (en) * | 2020-06-10 | 2022-11-29 | 杭州福斯特电子材料有限公司 | Colored cover film composition, colored cover film and copper-clad plate assembly |
| CN114685989A (en) * | 2020-12-30 | 2022-07-01 | 广东生益科技股份有限公司 | Resin composition and adhesive film and covering film containing same |
| WO2024054702A2 (en) * | 2022-09-02 | 2024-03-14 | Ppg Industries Ohio, Inc. | Thermal spray powder coating |
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| CN102977829A (en) * | 2012-11-01 | 2013-03-20 | 宁波大榭开发区综研化学有限公司 | Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape |
| CN105419231A (en) * | 2015-11-27 | 2016-03-23 | 广东生益科技股份有限公司 | Resin composition and copper-clad plate and PCB made of same |
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| JP2008060523A (en) * | 2006-08-01 | 2008-03-13 | Hitachi Chem Co Ltd | Sealing film and semiconductor device using it |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851480A (en) * | 2010-05-11 | 2010-10-06 | 华烁科技股份有限公司 | Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate |
| CN102977829A (en) * | 2012-11-01 | 2013-03-20 | 宁波大榭开发区综研化学有限公司 | Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape |
| CN105419231A (en) * | 2015-11-27 | 2016-03-23 | 广东生益科技股份有限公司 | Resin composition and copper-clad plate and PCB made of same |
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