CN114685057A - Nano metal induced etching method for glass substrate - Google Patents
Nano metal induced etching method for glass substrate Download PDFInfo
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- CN114685057A CN114685057A CN202210329792.1A CN202210329792A CN114685057A CN 114685057 A CN114685057 A CN 114685057A CN 202210329792 A CN202210329792 A CN 202210329792A CN 114685057 A CN114685057 A CN 114685057A
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- glass substrate
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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Abstract
The invention provides a nano metal induced etching method of a glass substrate, which comprises the following steps: s1, providing a glass substrate; s2, arranging a mask plate on the surface of the glass substrate; s3, perforating the mask plate to obtain a preset pattern; s4, depositing a layer of nano metal in the holes of the mask plate; s5, etching the glass substrate by the etching solution; and S6, removing the mask plate and cleaning the glass substrate to finish etching. The method can effectively prevent the whole glass substrate from being thinned in the etching process, and solves the problem that the whole glass thickness is uncontrollable because the glass substrate is thinned in the etching process by the conventional laser-assisted glass through hole etching method.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a nano metal induced etching method for a glass substrate.
Background
Since the introduction of moore's law, the development of integrated circuits has been rapidly followed, that is, when the price is not changed, the number of components that can be accommodated on the integrated circuit is doubled about every 18-24 months, and the performance is doubled. As the size of integrated circuits has been scaled down to the nanometer scale and gradually approaches its physical limits, the approach to scaling down feature sizes has failed to further improve the performance and functionality of integrated circuits. The demand in the microelectronics market continues to grow and the development of integrated circuits faces a series of problems and challenges.
Three-dimensional integration techniques can solve the above-mentioned problems. Compared with the traditional planar circuit, the three-dimensional integration technology carries out chip stacking and integration in the vertical direction, and improves the integration level of the circuit without further reducing the characteristic size of the device. The three-dimensional integration technology can integrate chips with various materials, various processes and various functions, and obviously improves the electronic performance of the circuit. The stack packaging mode based on the TSV vertical interconnection gradually leads the development trend of the packaging technology by the key technical advantages of the short-distance interconnection and the high-density integration.
The existing laser-assisted etching method of a glass through hole (TGV) is to soak picosecond laser-modified glass in an etching solution for etching. However, the method can thin the whole glass substrate in the etching process, so that the whole thickness of the glass is not controllable, and the improvement is needed.
Disclosure of Invention
Based on the above, in order to solve the problem that the whole thickness of the glass substrate is uncontrollable because the glass substrate is thinned integrally in the etching process by the conventional laser-assisted glass through hole etching method, the invention provides a nano metal induced etching method for the glass substrate, which has the following specific technical scheme:
a nano metal induced etching method of a glass substrate comprises the following steps:
s1, providing a glass substrate.
And S2, arranging a mask plate on the surface of the glass substrate.
And S3, perforating the mask plate to obtain a preset pattern.
And S4, depositing a layer of nano metal in the holes of the mask plate.
And S5, etching the glass substrate by the etching solution.
And S6, removing the mask plate and cleaning the glass substrate to finish etching.
Through deposit one deck nanometer metal in the hole of mask plate to pour etching solution into in the mask plate with right the glass substrate etches, can effectively prevent the whole attenuate of etching in-process glass substrate, has solved current laser-assisted etching glass through-hole method and can make the whole attenuate of glass substrate in the etching process, leads to the uncontrollable problem of whole thickness of glass.
Further, in step S2, before a mask is disposed on the surface of the glass substrate, the surface of the glass substrate is pretreated.
Further, the pretreatment includes acid washing, alkali washing, and drying.
Further, in step S3, the hole drilling method includes laser drilling and mechanical drilling.
Further, the mask is made of teflon, polyethylene, polypropylene or organic resin material.
Further, in step S4, the deposition method includes magnetron sputtering and coating.
Further, the nano metal is gold, silver, platinum, titanium or copper.
Further, the shape of the hole is rectangular or circular.
A computer-readable storage medium storing a computer program which, when executed by a processor, implements the method for nanometal-induced etching of a glass substrate.
Drawings
The invention will be further understood from the following description in conjunction with the accompanying drawings. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the embodiments. Like reference numerals designate corresponding parts throughout the different views.
FIG. 1 is a schematic overall flow chart of a method for nano-metal induced etching of a glass substrate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating the effect of step S2 in the method for etching a glass substrate with a nano-metal induction etching process according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating the effect of step S3 in the method for etching a glass substrate with a nano-metal induction according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating the effect of step S4 in the method for etching a glass substrate with a nano-metal induction etching process according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating the effect of step S5 in the method for etching a glass substrate with a nano-metal induction etching process according to an embodiment of the present invention;
fig. 6 is a schematic view illustrating an effect of step S6 in the method for etching a glass substrate with a nano-metal induction according to an embodiment of the invention.
Description of reference numerals:
1. a glass substrate; 2. a mask plate; 3. a hole; 4. and (3) nano metal.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to embodiments thereof. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terms "first" and "second" used herein do not denote any particular order or quantity, but rather are used to distinguish one element from another.
The first embodiment is as follows:
as shown in fig. 1, a method for nano-metal induced etching of a glass substrate includes the following steps:
s1, the glass substrate 1 is provided.
S2, disposing a mask 2 on the surface of the glass substrate 1, as shown in fig. 2.
Preferably, before the mask plate 2 is arranged on the surface of the glass substrate, the surface of the glass substrate is pretreated to ensure the surface of the glass substrate to be clean. Specifically, the pretreatment method comprises acid washing, alkali washing and drying.
S3, opening the mask 2 to obtain a predetermined pattern, as shown in fig. 3.
S4, depositing a layer of nano metal 4 in the holes 3 of the mask 2, as shown in fig. 4.
S5, etching the glass substrate with the etching solution, as shown in fig. 5.
As a preferable technical solution, when the glass substrate is etched by the etching solution, ultrasonic vibration may be added to increase the etching rate.
S6, removing the mask 2 and cleaning the glass substrate, completing the etching, as shown in fig. 6.
Because part of the nano metal 4 is deposited in the holes 3 of the mask plate 2 and the rest of the nano metal 4 is deposited on the surface of the mask plate 2, the etching process is not influenced, so that the etching solution is poured into the mask plate 2, the glass substrate can be selectively etched, and the glass substrate 1 cannot be thinned integrally.
That is to say, the nano metal induced etching method of the glass substrate can effectively prevent the whole thinning of the glass substrate in the etching process by depositing a layer of nano metal 4 in the holes 3 of the mask plate 2 and pouring etching liquid into the mask plate 2 to etch the glass substrate, and solves the problem that the whole thickness of the glass substrate is uncontrollable because the whole thinning of the glass substrate is caused in the etching process by the conventional laser-assisted etching method of the glass through holes.
Example two:
a nano metal induced etching method of a glass substrate comprises the following steps:
s1, the glass substrate 1 is provided.
And S2, arranging a mask plate 2 on the surface of the glass substrate 1.
Preferably, before the mask plate 2 is arranged on the surface of the glass substrate, the surface of the glass substrate is pretreated to ensure the cleanness of the surface of the glass substrate. Specifically, the pretreatment method comprises acid washing, alkali washing and drying.
Preferably, the mask 2 is made of a material having a function of absorbing and storing an etching solution and having corrosion resistance. Specifically, the material includes, but is not limited to, teflon, polyethylene, polypropylene, or organic resin, etc.
And S3, perforating the mask plate 2 to obtain a preset pattern. And after the preset pattern is obtained, cleaning the residual mask plate 2 material generated in the hole opening process.
And S4, depositing a layer of nano metal 4 in the holes 3 of the mask plate 2.
And S5, etching the glass substrate by the etching solution.
Specifically, an etching liquid may be poured into the mask 2 to etch the glass substrate. After the etching solution is poured into the mask plate 2, the etching solution wets the nano metal 4 layer along the mask plate 2 to perform selective etching on the glass substrate. Of course, the glass substrate and the mask 2 after depositing a layer of nano metal 4 may be immersed in the etching solution.
And S6, removing the mask plate 2 and cleaning the glass substrate to finish etching.
Because part of the nano metal 4 is deposited in the holes 3 of the mask plate 2 and the rest of the nano metal 4 is deposited on the surface of the mask plate 2, the etching process is not influenced, so that the etching solution is poured into the mask plate 2, the glass substrate can be selectively etched, and the glass substrate 1 cannot be thinned integrally.
That is to say, the nano metal induced etching method of the glass substrate can effectively prevent the whole thinning of the glass substrate in the etching process by depositing a layer of nano metal 4 in the holes 3 of the mask plate 2 and pouring etching liquid into the mask plate 2 to etch the glass substrate, and solves the problem that the whole thickness of the glass substrate is uncontrollable because the whole thinning of the glass substrate is caused in the etching process by the conventional laser-assisted etching method of the glass through holes.
In addition, the nano metal induced etching method of the glass substrate is used for punching the mask plate 2 to obtain preset patterns, the etched patterns are more diversified, the grooves and the holes can be integrally formed, and the application range is wide.
In this embodiment, in step S3, the hole drilling method includes laser drilling and mechanical drilling. In step S4, the deposition method includes, but is not limited to, magnetron sputtering and coating. The nano metal 4 includes, but is not limited to, gold, silver, platinum, titanium, copper and other nano metal 4 materials.
In this embodiment, the shape of the hole 3 is rectangular or circular. Through the nano metal induced etching method of the glass substrate, circuits such as through holes, blind holes and grooves can be etched.
As a preferred technical scheme, the specific process flow of the nano-metal induced etching method for the glass substrate is as follows:
taking a glass substrate 1 with the length, width and height of 30mm x 1mm, carrying out acid washing, alkali washing and drying on the glass substrate 1 to ensure that the surface of the glass is clean, then pasting a layer of mask plate 2 with the thickness of 200 mu m, and carrying out ultraviolet laser perforating on the mask plate 2 to manufacture preset patterns. And removing residual mask 2 material generated in the laser irradiation area.
The mask plate 2 is placed in a magnetron sputtering machine to sputter a layer of platinum metal with the thickness of 50 nm. At this time, part of the nano metal 4 will be deposited in the holes 3, and the rest of the nano metal 4 will be deposited on the surface of the mask 2.
And adding an etching solution of which the main component is hydrofluoric acid into the mask plate 2 until the etching solution is saturated, wetting the nano metal 4 along the mask plate 2, and etching the surface of the glass substrate contacted with the nano metal 4 to form a line hole 3. As the reaction proceeds, the nanometal 4 is always positioned at the lowermost end of the hole 3 on the glass substrate. The etching rate at the side wall of the hole 3 on the glass substrate is slow although contacting with the etching solution, and is only one tenth of the etching rate at the bottom end of the hole 3 on the glass substrate contacting with the nano metal 4. Therefore, the holes 3 etched in the glass substrate are conical holes 3 with a large upper radius and a small lower radius.
After the etching of the glass substrate is completed, the mask plate 2 is removed to clean the glass substrate thoroughly.
As shown in fig. 6, as a preferred embodiment, the method for etching a glass substrate by nano-metal induction further includes the following steps: when a plurality of holes 3 are formed in the glass substrate 1 and a part of the holes 3 in the glass substrate 1 are grooves or blind holes (that is, at least a plurality of grooves or at least a plurality of blind holes are formed in the glass substrate), after etching the glass substrate for a preset time by using an etching solution, adding a preset volume of ultrapure water into a part of the holes 3 to delay the etching rate of the part of the holes 3; and after the etching of the mask plate and the holes 3 is finished, cleaning the mask plate 2 and the glass substrate by using ultrapure water, finally removing the mask plate 2 and cleaning the glass substrate again, and finishing the etching after the glass substrate is dried.
The glass substrate after etching comprises a plurality of through holes and a plurality of grooves, or comprises a plurality of through holes and a plurality of blind holes, or comprises a plurality of through holes, a plurality of blind holes and a plurality of grooves.
A computer-readable storage medium storing a computer program which, when executed by a processor, implements the method for nanometal-induced etching of a glass substrate.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A nano metal induced etching method of a glass substrate is characterized by comprising the following steps:
s1, providing a glass substrate;
s2, arranging a mask plate on the surface of the glass substrate;
s3, perforating the mask plate to obtain a preset pattern;
s4, depositing a layer of nano metal in the holes of the mask plate;
s5, etching the glass substrate by the etching solution;
and S6, removing the mask plate and cleaning the glass substrate to finish etching.
2. The method of claim 1, wherein in step S2, the surface of the glass substrate is pretreated before the surface of the glass substrate is masked.
3. The method according to claim 2, wherein the pretreatment comprises acid washing, alkali washing and drying.
4. The method for nano-metal induced etching of a glass substrate of claim 1, wherein in step S3, the opening method comprises laser opening and mechanical drilling.
5. The method of claim 1, wherein the mask is made of teflon, polyethylene, polypropylene or organic resin material.
6. The method for nano-metal induced etching of a glass substrate of claim 1, wherein in step S4, the deposition method comprises magnetron sputtering and coating.
7. The method according to claim 6, wherein the nano-metal is gold, silver, platinum, titanium or copper.
8. The method according to claim 1, wherein the shape of the hole is rectangular or circular.
9. A computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program which, when executed by a processor, implements the method for nanometal-induced etching of a glass substrate according to any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210329792.1A CN114685057A (en) | 2022-03-30 | 2022-03-30 | Nano metal induced etching method for glass substrate |
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| CN202210329792.1A CN114685057A (en) | 2022-03-30 | 2022-03-30 | Nano metal induced etching method for glass substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115108729A (en) * | 2022-08-04 | 2022-09-27 | 广东工业大学 | Glass deep hole machining method adopting passivation solution |
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Inventor after: Yang Bin Inventor after: Liu Yu Inventor after: Hua Xiangang Inventor after: Wang Jiaojiao Inventor after: Lin Tingyu Inventor before: Yang Bin Inventor before: Liu Yu Inventor before: Hua Xiangang Inventor before: Cui Chengqiang Inventor before: Lin Tingyu |