CN115108729A - Glass deep hole machining method adopting passivation solution - Google Patents
Glass deep hole machining method adopting passivation solution Download PDFInfo
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- CN115108729A CN115108729A CN202210934168.4A CN202210934168A CN115108729A CN 115108729 A CN115108729 A CN 115108729A CN 202210934168 A CN202210934168 A CN 202210934168A CN 115108729 A CN115108729 A CN 115108729A
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- etching
- passivation
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
- C03C17/009—Mixtures of organic and inorganic materials, e.g. ormosils and ormocers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/111—Deposition methods from solutions or suspensions by dipping, immersion
Abstract
The invention relates to the technical field of glass processing, and discloses a glass deep hole processing method adopting passivation solution, which comprises the following steps: s1) immersing the glass to be processed in the passivation solution, forming a passivation film on the outer surface of the glass to be processed and coating the outer surface of the glass to be processed; s2) immersing the glass to be processed in an active catalytic solution containing metal ions, and irradiating the surface of the passivation film in the area to be perforated with laser beams, wherein the metal ions in the active catalytic solution in the area to be perforated are reduced by the irradiation of the laser beams and form metal particles which are adsorbed on the surface of the corresponding area; s3) transferring the glass to be processed absorbed with the metal particles and immersing the glass to be processed in the etching solution, then irradiating the corresponding area of the glass to be processed with laser beams, and forming etching holes on the surface of the corresponding area until the etching holes penetrate through the glass to be processed; the protection of the passivation film can be utilized to cool the etching liquid on the glass, the etching efficiency of the laser beam is guaranteed, impurities are dissolved by the etching liquid, and unevenness of an etched hole is avoided.
Description
Technical Field
The invention relates to the technical field of glass processing, in particular to a glass deep hole processing method adopting passivation solution.
Background
Glass is an amorphous inorganic non-metallic material, has good transparency and chemical stability, and with the development of industry, micromachining of transparent hard and brittle materials represented by glass more and more meets the requirements of the industry.
Glass deep hole processing is a difficult processing technology, the mode of the prior art is to perform reaming on the glass by a hot forming method, then perform deep hole cutting on the reaming by a machine tool, and the precision of a processed part is poor due to the fact that a cutter is easy to vibrate during cutting, and in addition, the machined product has the defects of low yield and serious pollution.
The process of processing the glass deep hole by adopting the laser has the advantages that the energy loss is serious and the cost is higher when the deep hole is processed by the laser in the prior art; and during laser etching processing, impurities of solid particles are continuously generated at the part etched by the laser, the impurities block the running track of the laser beam, and the impurities are melted again by the laser and adhered to the inner wall of the etching hole, so that the inner wall of the etching hole is uneven, and the working efficiency and the product quality of glass deep hole processing are seriously influenced.
Disclosure of Invention
In view of the above problems, the present invention provides a method for processing a deep hole in glass by using a passivation solution, in which a glass to be processed is immersed in an etching solution, and the etching solution is cooled by the glass and dissolves impurities under the protection of a passivation film, thereby preventing the inner wall of an etching hole from being uneven.
In order to achieve the purpose, the invention adopts the following technical scheme:
a glass deep hole processing method adopting passivation solution comprises the following steps:
s1) immersing the glass to be processed in the passivation solution to form a passivation film on the outer surface of the glass to be processed, wherein the passivation film completely covers the outer surface of the glass to be processed;
s2) immersing the glass to be processed coated with the passivation film into an active catalytic solution containing metal ions, irradiating the surface of the passivation film in the region to be perforated with laser beams to melt the passivation film in the region to be perforated, reducing the metal ions in the active catalytic solution in the region to be perforated by the irradiation of the laser beams to form metal particles, and adsorbing the metal particles on the surface of the glass to be processed in the corresponding region;
s3) transferring the glass to be processed absorbed with metal particles and immersing the glass to be processed in etching solution, irradiating the corresponding area of the glass to be processed by using laser beams, forming etching holes on the surface of the corresponding area, and gradually deepening the etching holes into the glass to be processed along with the irradiation of the laser beams and the prolonging of etching time until the etching holes reach the required depth or penetrate through the glass to be processed;
s4) sequentially performing the machining of the next etching hole until all the etching holes are machined.
Specifically, in step S1), the raw material of the passivation solution includes paraffin, polyethylene solution or a mixed solution of butyl carbitol, ethyl cellulose, lubricant and glass powder;
the passivation solution contains polyethylene, butyl carbitol, ethyl cellulose and a lubricant with the mass fraction range of 1-15 wt%;
the mass ratio of the butyl carbitol to the ethyl cellulose to the lubricant is 1 (0.1-0.8) to 0.05-0.3, and the addition amount of the glass powder is 0 wt% -20 wt% of the total mass of the butyl carbitol, the ethyl cellulose and the lubricant.
Preferably, in step S2), the active catalyst solution contains one or more metal ions selected from Cu ions, Ag ions, Au ions, Pd ions, and Pt ions;
the concentration of the metal ions contained in the active catalytic liquid is 0.05-1 mol/l.
Preferably, the power of the laser generator emitting the laser beam is 1W to 400W in steps S2) and S3).
Preferably, in step S3), the raw material of the etching solution includes hydrofluoric acid and an organic solvent, and the organic solvent includes CTAB, PEG, and PVP;
the concentration of the hydrofluoric acid contained in the etching solution is 0.01-1 mol/l;
the etching solution contains an organic solvent with the mass concentration of 1 wt% -25 wt%, wherein the mass concentration ratio of CTAB, PEG and PVP is 1 (0.1-0.8) to (0.05-0.5).
Preferably, the thickness of the glass to be processed is 5 to 700 micrometers.
Preferably, the glass to be processed is soda-lime glass, high-silica glass, borosilicate glass, lead-silicate glass, aluminosilicate glass or quartz glass.
The technical scheme of the invention has the beneficial effects that: according to the glass deep hole processing method adopting the passivation solution, the surface of the glass to be processed is coated with the passivation film, so that the glass to be processed can be immersed in the etching solution for processing, and during etching processing, the etching solution only erodes the region to be perforated, which is irradiated by the laser beam, so that the glass surface of the obtained non-perforated region can be protected from erosion by the passivation film, and thus the glass surface of the perforated region can be cooled by the etching solution, so that the etching efficiency of the laser beam can be guaranteed; because the part etched by the laser continuously has the impurity production of solid particle, consequently, the processing of submergence in the etching solution can also make the impurity that is solid particle of the position that is corroded come up to usable etching solution in time dissolves impurity, and avoids impurity to block the orbit of laser beam, and avoids impurity adhesion at the inner wall in etching hole, and then avoids the unevenness of the inner wall in etching hole that consequently leads to, still can improve glass deep hole processing's work efficiency and processingquality.
The innovation of the invention is that:
1. the laser-corrosion-catalysis composite processing method is utilized to improve the processing efficiency. The catalytic effect of the metal particles can accelerate the etching reaction, and the etching reaction can be accelerated by using laser while etching.
2. The metal ions are reduced into metal particles at the specific position of the surface of the glass to be processed by utilizing laser, and the effect of etching and punching only at the specific position is realized by matching with the design of a passivation layer.
Drawings
FIGS. 1-6 are schematic views illustrating the process of the deep hole processing method of glass using passivation solution according to the present invention;
FIG. 7 is a microscopic scan of an etching hole of an open-celled article according to embodiments of the present invention;
wherein, the glass to be processed 1; passivating solution 2; a passivation film 3; a laser beam 4; an active catalyst solution 5; metal particles 6; and an etching solution 7.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The drawings are for illustrative purposes only and are not to be construed as limiting the patent.
In the description herein, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
A glass deep hole processing method adopting passivation solution comprises the following steps:
s1) immersing the glass 1 to be processed into the passivation solution 2, forming a passivation film 3 on the outer surface of the glass 1 to be processed, wherein the passivation film 3 completely covers the outer surface of the glass 1 to be processed;
s2) immersing the glass 1 to be processed coated with the passive film 3 into an active catalytic solution 5 containing metal ions, irradiating the surface of the passive film 3 in the region to be perforated with a laser beam 4 to melt the passive film 3 in the region to be perforated, reducing the metal ions in the active catalytic solution 5 in the region to be perforated by irradiating the laser beam 4 to form metal particles 6, and adsorbing the metal particles 6 on the surface of the glass 1 to be processed in the corresponding region;
s3) transferring and immersing the glass 1 to be processed adsorbed with the metal particles 6 into an etching solution 7, then irradiating the corresponding area of the glass 1 to be processed by using a laser beam 4, forming an etching hole on the surface of the corresponding area, and gradually deepening the etching hole into the glass 1 to be processed along with the irradiation of the laser beam 4 and the prolonging of etching time until the etching hole reaches the required depth or penetrates through the glass 1 to be processed;
s4) repeating steps S1) to S3), and processing the next etching hole in sequence until all the etching holes are processed.
According to the glass deep hole processing method adopting the passivation solution, the surface of the glass 1 to be processed is coated with the passivation film 3, so that the glass 1 to be processed can be immersed in the etching solution 7 for processing, firstly, the passivation film of the area to be processed is removed by laser, and during etching processing, the etching solution 7 only erodes the area to be perforated, which is irradiated by the laser beam 4, so that the glass surface of the area to be perforated, which is obtained and is not perforated, can be protected from being eroded by the passivation film 3, and the etching precision is guaranteed; in addition, the etching efficiency can be further improved by forming catalytic metal particles on the surface to be processed; because the part etched by the laser continuously has the impurity production of solid particle, consequently, processing in etching solution 7 of submergence, can also make the impurity that is solid particle of the position that is corroded come up to usable etching solution 7 in time dissolves impurity, and avoids impurity to block the orbit of laser beam 4, and avoids impurity adhesion at the inner wall in etching the hole, and then avoids the unevenness of the inner wall in etching the hole that consequently leads to, still can improve glass deep hole processing's work efficiency and processingquality.
In step S2), the passivation film 3 in the irradiated region is decomposed and melted, and the passivation film 3 in the irradiated region is modified and softened, so that the metal particles 6 formed by reducing the metal ions through the irradiation of the laser beam 4 can penetrate into the irradiated region and be adsorbed on the surface of the corresponding region of the glass 1 to be processed, and the metal particles 6 form positive charges during etching, which is beneficial to improving the etching effect of the etching solution 7 and increasing the speed of dissolving impurities in the etching solution 7.
Specifically, in step S1), the raw materials of the passivation solution 2 include butyl carbitol, ethyl cellulose, a lubricant and glass powder;
the passivation solution 2 contains butyl carbitol, ethyl cellulose and a lubricant with the mass fraction range of 1-15 wt%;
the mass ratio of the butyl carbitol to the ethyl cellulose to the lubricant is 1 (0.1-0.8) to 0.05-0.3, and the addition amount of the glass powder is 0 wt% -20 wt% of the total mass of the butyl carbitol, the ethyl cellulose and the lubricant.
Wherein, the butyl carbitol is a film forming agent and a tackifier of the passive film 3, the ethyl cellulose is used for improving the flexibility of the passive film 3, the lubricant can improve the fluidity of the passive liquid 2, the glass powder is used as a dispersant, and the glass powder can also improve the fullness of the passive film 3.
Preferably, in step S2), the active catalyst liquid 5 contains one or more metal ions selected from Cu ions, Ag ions, Au ions, Pd ions, and Pt ions;
the concentration of the metal ions contained in the active catalyst liquid 5 is 0.05-1 mol/l.
Under the action of laser, the metal ions absorb energy, are reduced into metal particles and are adsorbed on the surface of the glass. The metal particles are used as a catalyst, so that the corrosion speed of the hydrofluoric acid corrosive liquid on the glass can be accelerated.
Preferably, the power of the laser generator emitting the laser beam 4 is 1W to 400W in steps S2) and S3).
The laser generator adopting continuous emission with power of 1W-400W has better effect than a pulse laser generator.
Specifically, in step S3), the raw materials of the etching solution 7 include hydrofluoric acid and an organic solvent, and the organic solvent includes CTAB, PEG, and PVP;
the concentration of the hydrofluoric acid contained in the etching solution 7 is 0.01mol/l-1 mol/;
the etching solution 7 contains 15-25 wt% of organic solvent, wherein the mass concentration ratio of CTAB, PEG and PVP is 1 (0.1-0.8) to (0.05-0.5).
The chinese names CTAB, PEG and PVP correspond to cetyltrimethylammonium bromide, polyethylene glycol and polyvinylpyrrolidone, respectively.
Hydrofluoric acid is the etchant, CTAB, PEG and PVP are as the dispersant, can promote the effect that hydrofluoric acid corrodes glass, and CTAB and PEG adsorb on the glass surface of waiting to open pore region in the laser irradiation process, make the solid particle surface of the cohesion of glass surface easily moist and disperse, be favorable to improving the work efficiency of the etching trompil of hydrofluoric acid and laser, PVP forms the adsorbed layer and makes the electric charge increase at the glass surface of waiting to open pore region, thereby improve and form the reaction force that hinders the solid particle gathering, and then reduce the solid particle that the laser etching in-process produced and block at the inner wall of corroding the hole, and then avoid corroding the inner wall surface unevenness of hole and corroding the aperture of hole inconsistent from top to bottom.
Preferably, the thickness of the glass 1 to be processed is between 5 and 700 μm.
The thickness range of the processable glass is larger, the processed surface is smoother, and the processing precision is higher.
Preferably, the glass 1 to be processed is soda-lime glass, high-silica glass, borosilicate glass, lead-silicate glass, aluminosilicate glass or quartz glass.
The glass deep hole processing method adopting the passivation solution is suitable for the hole opening processing of glass with various components.
Examples
Taking a piece of quartz glass with the thickness of 700 micrometers as glass to be processed for deep hole processing 1, wherein the hole to be processed is required to be a special-shaped penetrating hole, the pore diameters of two ends are 75-83 micrometers, and the pore diameter of the middle part is 50-60 micrometers, and deep hole processing is carried out on the glass to be processed 1 according to the following steps:
s1) immersing the glass 1 to be processed in the passivation solution 2, forming a passivation film 3 on the outer surface of the glass 1 to be processed, wherein the passivation film 3 completely covers the outer surface of the glass 1 to be processed;
s2) immersing the glass 1 to be processed coated with the passive film 3 into an active catalytic solution 5 containing metal ions, irradiating the surface of the passive film 3 in the region to be perforated with a laser beam 4 to melt the passive film 3 in the region to be perforated, reducing the metal ions in the active catalytic solution 5 in the region to be perforated by irradiating the laser beam 4 to form metal particles 6, and adsorbing the metal particles 6 on the surface of the glass 1 to be processed in the corresponding region;
s3) transferring the glass to be processed 1 absorbed with the metal particles 6 and immersing the glass to be processed in the etching solution 7, then irradiating the corresponding area of the glass to be processed 1 by using the laser beam 4, forming an etching hole on the surface of the corresponding area, and gradually deepening the etching hole into the glass to be processed 1 along with the irradiation of the laser beam 4 and the prolonging of the etching time until the etching hole penetrates through the glass to be processed 1;
s4) repeating the steps S1) to S3), and processing the next etching hole in sequence until all etching holes are processed;
the passivation solution 2 contains butyl carbitol, ethyl cellulose and a lubricant with the mass fraction range of 1-15 wt%;
the mass ratio of the butyl carbitol to the ethyl cellulose to the lubricant is 1 (0.1-0.8) to 0.05-0.3, and the addition amount of the glass powder is 0 wt% -20 wt% of the total mass of the butyl carbitol, the ethyl cellulose and the lubricant.
In step S2), the metal ions contained in the active catalyst solution 5 are Cu ions and Ag ions;
the active catalytic liquid 5 contains Cu ions with a concentration of 0.05mol/l and Ag ions with a concentration of 0.03 mol/l;
steps S2) and S3), the power of the laser generator emitting the laser beam 4 is 300W;
in the step S3), the raw materials of the etching solution 7 include hydrofluoric acid and an organic solvent, and the organic solvent includes CTAB, PEG, and PVP;
the concentration of the hydrofluoric acid contained in the etching solution 7 is 0.04 mol/;
the etching solution 7 contains 18 wt% of organic solvent, wherein the mass concentration ratio of CTAB, PEG and PVP is 1:0.5: 0.3.
A cross-sectional microscopic scan of the etched holes of the articles of the above examples is shown in fig. 7.
In summary, in the glass deep hole processing method using the passivation solution of the present invention, the passivation film 3 is coated on the surface of the glass 1 to be processed, so that the glass 1 to be processed can be immersed in the etching solution 7 for processing, and during the etching processing, the etching solution 7 only erodes the region to be perforated, which is irradiated by the laser beam 4, so that the glass surface of the obtained non-perforated region can be protected from erosion by the passivation film 3, and thus the glass surface of the perforated region can be cooled by the etching solution 7, so as to ensure the etching efficiency of the laser beam 4; because the part etched by the laser continuously has the impurity production of solid particle, consequently, processing in etching solution 7 of submergence, can also make the impurity that is solid particle of the position that is corroded come up to usable etching solution 7 in time dissolves impurity, and avoids impurity to block the orbit of laser beam 4, and avoids impurity adhesion at the inner wall in etching the hole, and then avoids the unevenness of the inner wall in etching the hole that consequently leads to, still can improve glass deep hole processing's work efficiency and processingquality.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (7)
1. A glass deep hole processing method adopting passivation solution is characterized by comprising the following steps:
s1) immersing the glass to be processed in the passivation solution to form a passivation film on the outer surface of the glass to be processed, wherein the passivation film completely covers the outer surface of the glass to be processed;
s2) immersing the glass to be processed coated with the passivation film into an active catalytic solution containing metal ions, irradiating the surface of the passivation film in the region to be perforated with laser beams to melt the passivation film in the region to be perforated, reducing the metal ions in the active catalytic solution in the region to be perforated by the irradiation of the laser beams to form metal particles, and adsorbing the metal particles on the surface of the glass to be processed in the corresponding region;
s3) transferring the glass to be processed absorbed with metal particles and immersing the glass to be processed in etching solution, irradiating the corresponding area of the glass to be processed by using laser beams, forming etching holes on the surface of the corresponding area, and gradually deepening the etching holes into the glass to be processed along with the irradiation of the laser beams and the prolonging of etching time until the etching holes reach the required depth or penetrate through the glass to be processed;
s4) sequentially performing the machining of the next etching hole until all the etching holes are machined.
2. The method for deep hole processing of glass by using passivation solution as claimed in claim 1, wherein in step S1), the raw material of passivation solution comprises paraffin wax or polyethylene solution or mixed solution of butyl carbitol, ethyl cellulose, lubricant and glass powder;
the passivation solution contains polyethylene, butyl carbitol, ethyl cellulose and a lubricant with the mass fraction range of 1-15 wt%;
the mass ratio of the butyl carbitol to the ethyl cellulose to the lubricant is 1 (0.1-0.8) to 0.05-0.3, and the addition amount of the glass powder is 0 wt% -20 wt% of the total mass of the butyl carbitol, the ethyl cellulose and the lubricant.
3. The method for deep hole processing of glass by using passivation solution as claimed in claim 1, wherein in step S2), the active catalytic solution contains one or more metal ions selected from Cu ions, Ag ions, Au ions, Pd ions and Pt ions;
the concentration of the metal ions contained in the active catalytic liquid is 0.05-1 mol/l.
4. The method for deep hole processing of glass using a passivation solution as claimed in claim 1, wherein the power of the laser generator emitting the laser beam is 1W to 400W in steps S2) and S3).
5. The method according to claim 1, wherein in step S3), the raw materials of the etching solution include hydrofluoric acid and organic solvents, and the organic solvents include CTAB, PEG, and PVP;
the concentration of the hydrofluoric acid contained in the etching solution is 0.01-1 mol/l;
the etching solution contains an organic solvent with the mass concentration of 1 wt% -25 wt%, wherein the mass concentration ratio of CTAB, PEG and PVP is 1 (0.1-0.8) to (0.05-0.5).
6. The method according to claim 1, wherein the thickness of the glass to be processed is 5 to 700 μm.
7. The method for deep hole processing of glass by using passivation solution as claimed in claim 1, wherein said glass to be processed is soda lime glass, high silica glass, borosilicate glass, lead silicate glass, aluminosilicate glass or quartz glass.
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| CN202210934168.4A CN115108729A (en) | 2022-08-04 | 2022-08-04 | Glass deep hole machining method adopting passivation solution |
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| CN202210934168.4A CN115108729A (en) | 2022-08-04 | 2022-08-04 | Glass deep hole machining method adopting passivation solution |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815963A (en) * | 2007-10-01 | 2010-08-25 | Lg化学株式会社 | Method for manufacturing glass cliche using laser etching and apparatus for laser irradiation therefor |
| CN103418912A (en) * | 2013-05-16 | 2013-12-04 | 广东工业大学 | Machining device and machining method for enhancing sapphire laser back wet etching rate |
| CN107922254A (en) * | 2015-08-31 | 2018-04-17 | 日本板硝子株式会社 | The manufacture method of glass with fine structure |
| CN114685057A (en) * | 2022-03-30 | 2022-07-01 | 广东佛智芯微电子技术研究有限公司 | Nano metal induced etching method for glass substrate |
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2022
- 2022-08-04 CN CN202210934168.4A patent/CN115108729A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815963A (en) * | 2007-10-01 | 2010-08-25 | Lg化学株式会社 | Method for manufacturing glass cliche using laser etching and apparatus for laser irradiation therefor |
| CN103418912A (en) * | 2013-05-16 | 2013-12-04 | 广东工业大学 | Machining device and machining method for enhancing sapphire laser back wet etching rate |
| CN107922254A (en) * | 2015-08-31 | 2018-04-17 | 日本板硝子株式会社 | The manufacture method of glass with fine structure |
| CN114685057A (en) * | 2022-03-30 | 2022-07-01 | 广东佛智芯微电子技术研究有限公司 | Nano metal induced etching method for glass substrate |
Non-Patent Citations (1)
| Title |
|---|
| 田文超等: "《传感器与检测技术》", vol. 1, 西安电子科技大学出版社, pages: 107 - 112 * |
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