CN114657612B - Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board - Google Patents
Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board Download PDFInfo
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- CN114657612B CN114657612B CN202210459843.2A CN202210459843A CN114657612B CN 114657612 B CN114657612 B CN 114657612B CN 202210459843 A CN202210459843 A CN 202210459843A CN 114657612 B CN114657612 B CN 114657612B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses an electroplating processing method of a multilayer flexible circuit board and the multilayer flexible circuit board. The method comprises the following steps: drilling the multilayer flexible circuit substrate, and performing a plasma photoresist removing process on the drilled multilayer flexible circuit substrate; coating a layer of conductive carbon on the hole wall of the multilayer flexible circuit substrate, and obtaining a corresponding copper plating pattern to perform hole copper plating operation so as to form a hole copper plating layer on the hole wall; and (3) carrying out film stripping on the multilayer flexible circuit substrate subjected to hole copper plating, carrying out whole-plate copper plating treatment after film stripping, filling the step between the hole copper plating layer and the multilayer flexible circuit substrate, and carrying out outer-layer circuit manufacturing on the filled multilayer flexible circuit substrate to obtain the target multilayer flexible circuit board. According to the invention, the hole copper plating treatment is firstly carried out, then the whole plate copper plating is carried out, and the filling treatment is carried out on the hole copper plating step part in the whole plate copper plating process, so that the generation of film sticking bubbles in circuit manufacturing is avoided, and the problem that corrosion open circuit is easy to generate in circuit manufacturing is avoided.
Description
Technical Field
The invention relates to the technical field of manufacturing of multilayer flexible circuit boards, in particular to an electroplating processing method of a multilayer flexible circuit board and the multilayer flexible circuit board.
Background
The common thin line width line distance multilayer flexible circuit board is manufactured by the following steps: the method comprises the steps of inner layer circuit manufacturing, laminated plate pressure transmission, copper reduction, drilling, plasma photoresist removal, shadow blacking, copper electroplating and outer layer circuit manufacturing, and is qualified as long as a circuit network and a via hole meet the open-short circuit function.
However, for special multilayer flexible circuit boards with hole copper thickness of 35um or more, line width of 55um or less and line spacing of 55um or less, the line width and line spacing requirements of the special products are guaranteed, the total copper thickness of the copper plated surface of the product is controlled to be 25um or less, and dry films with thickness of 25um or less are required to be used for manufacturing outer-layer circuits. If the conventional direct whole-plate copper plating method is adopted for the special product, the line width and line distance requirements cannot be met on the premise of preferentially meeting the thickness of the hole copper; on the premise of preferentially meeting the line width and line distance, the thickness of the hole copper cannot meet the requirement, so that the situation that copper is not plated in the place where the main circuit of the multilayer flexible circuit board is manufactured is required to be optimal. To meet the above requirements, the following methods are generally adopted: exposing and developing the product by sticking a dry film after shadow, exposing the part plated with the through hole for hole copper plating, wherein the part plated with the hole is protruded, a step is formed in a non-hole plating area, the height difference exceeds 45um, the dry film of 25um is used, even if a vacuum film sticking process is matched, the dry film still cannot completely fill the step position during circuit manufacturing, the problem of corrosion open circuit easily occurs after circuit manufacturing, and the product yield is affected; the other method is that the whole plate copper plating is carried out after the product is subjected to the shadow, and the total thickness of the copper layer on the surface is controlled to be less than or equal to 25 mu m; the maximum thickness of the hole copper is only 15m, the copper plating is exposed at the position where the through hole is plated through exposure and development of the dry film, the hole copper plating is carried out, the thickness of the hole copper plating is more than or equal to 20um, the thickness of the surface copper plating is more than 30um, the position where the hole copper plating protrudes, the non-hole plating area form a step, the height difference exceeds 30um, the step position can be completely filled only by using a vacuum film pasting mode in the outer layer circuit manufacturing, the equipment cost is high, and the production efficiency is low.
Disclosure of Invention
The embodiment of the invention provides an electroplating processing method of a multilayer flexible circuit board and the multilayer flexible circuit board, and aims to solve the problem that insufficient filling is easy to occur at a hole copper plating step of the multilayer flexible circuit board in the prior art.
The embodiment of the invention provides an electroplating processing method of a multilayer flexible circuit board, which comprises the following steps:
drilling the multilayer flexible circuit substrate, and performing a plasma photoresist removing process on the drilled multilayer flexible circuit substrate;
coating a layer of conductive carbon on the hole wall of the multilayer flexible circuit substrate, and obtaining a corresponding copper plating pattern to perform hole copper plating operation so as to form a hole copper plating layer on the hole wall;
and carrying out film stripping on the multilayer flexible circuit substrate subjected to hole copper plating, carrying out whole-plate copper plating treatment after film stripping, filling the step between the hole copper plating layer and the multilayer flexible circuit substrate, and carrying out outer-layer circuit manufacturing on the filled multilayer flexible circuit substrate to obtain the target multilayer flexible circuit board.
The embodiment of the invention also provides a multilayer flexible circuit board, which is manufactured by adopting the electroplating processing method of the multilayer flexible circuit board.
The embodiment of the invention provides an electroplating processing method of a multilayer flexible circuit board and the multilayer flexible circuit board, wherein the method comprises the following steps: drilling the multilayer flexible circuit substrate, and performing a plasma photoresist removing process on the drilled multilayer flexible circuit substrate; coating a layer of conductive carbon on the hole wall of the multilayer flexible circuit substrate, and obtaining a corresponding copper plating pattern to perform hole copper plating operation so as to form a hole copper plating layer on the hole wall; and carrying out film stripping on the multilayer flexible circuit substrate subjected to hole copper plating, carrying out whole-plate copper plating treatment after film stripping, filling the step between the hole copper plating layer and the multilayer flexible circuit substrate, and carrying out outer-layer circuit manufacturing on the filled multilayer flexible circuit substrate to obtain the target multilayer flexible circuit board. According to the embodiment of the invention, the hole copper plating treatment is firstly carried out, then the whole plate copper plating is carried out, and the hole copper plating step is filled in the whole plate copper plating process, so that the generation of film sticking bubbles in circuit manufacturing is avoided, and the problem that corrosion open circuits are easy to generate in circuit manufacturing is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of an electroplating processing method of a multilayer flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a multilayer flexible circuit board after being electroplated by a direct hole plating method;
FIG. 3 is a schematic diagram of open circuit of circuit corrosion of a multilayer flexible circuit board after plating by direct hole plating and full board copper + hole plating;
FIG. 4 is a schematic diagram of a multilayer flexible circuit board after being electroplated by a full-board copper plating+hole plating method;
fig. 5 is a schematic view of a processing procedure of an electroplating processing method of a multilayer flexible circuit board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another processing procedure of the electroplating processing method of the multilayer flexible circuit board according to the embodiment of the invention;
fig. 7 is a schematic structural diagram of another processing procedure of the electroplating processing method of the multilayer flexible circuit board according to the embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, fig. 1 is a schematic flow chart of an electroplating processing method of a multi-layer flexible circuit board according to an embodiment of the invention, and the method includes steps S101 to S103.
S101, drilling a multilayer flexible circuit substrate, and performing a plasma photoresist removing process on the drilled multilayer flexible circuit substrate;
s102, coating a layer of conductive carbon on the hole wall of the multilayer flexible circuit substrate, and obtaining a corresponding copper plating pattern to perform hole copper plating operation so as to form a hole copper plating layer on the hole wall;
s103, film stripping is carried out on the multilayer flexible circuit substrate after hole copper plating, whole board copper plating treatment is carried out after film stripping, step positions between the hole copper plating layer and the multilayer flexible circuit substrate are filled, and outer layer circuit manufacturing is carried out on the filled multilayer flexible circuit substrate, so that the target multilayer flexible circuit board is obtained.
In this embodiment, the multilayer flexible circuit substrate is first drilled, then subjected to a plasma photoresist removing process, a conductive carbon layer is coated on the hole wall, then subjected to a hole copper plating operation, then subjected to a film removing process, then subjected to a whole-plate copper plating process, and filled in the step between the hole copper plating layer and the multilayer flexible circuit substrate, and finally subjected to an outer layer circuit manufacturing, thereby obtaining the target multilayer flexible circuit board.
The conventional electroplating processing method of the multilayer flexible circuit board generally adopts a direct hole plating method or a whole board copper plating and hole plating method. As shown in fig. 2 and 3, after the black film is completed on the multilayer flexible circuit substrate, the direct hole plating method directly selects the corresponding copper plating pattern and performs hole copper plating operation, the plating position forms a step of 45um, after the dry film vacuum film with the thickness of 25um is used, the step position easily forms film sticking bubbles, the film sticking bubbles cannot be completely filled, and the problem of open circuit caused by corrosion during circuit etching is easily generated. As shown in fig. 4, after the black film is completed on the multilayer flexible circuit substrate, the whole plate copper plating process is performed first, then the hole copper plating process is performed, a step of 30um is formed at the electroplating position, at this time, a dry film of 25um is used, and a common wet film pasting process is matched, so that film pasting bubbles are easily formed at the step position, the film cannot be completely filled, and the problem of open circuit due to corrosion during circuit etching can be generated.
In this embodiment, as shown in fig. 5-7, after the black film is completed on the multilayer flexible circuit substrate, hole copper plating is performed first to form a structure shown in fig. 5, film stripping is performed again to obtain a structure shown in fig. 6, and filling is performed at the step formed by hole copper plating when the whole board is subjected to copper plating, so as to form a whole board copper plating layer which completely covers the multilayer flexible circuit substrate and the hole copper plating layer, thereby obtaining a structure shown in fig. 7, and avoiding the generation of bubbles in the outer layer circuit film.
The multilayer flexible circuit substrate is provided with different layers, and connection is realized in a hole copper plating mode in order to conduct the upper circuit and the lower circuit of the multilayer flexible circuit substrate, so that drilling holes are needed to be carried out on the multilayer flexible circuit substrate before a hole copper plating process; after drilling, plasma photoresist removing treatment is carried out, so that the multilayer flexible circuit substrate is cleaned, and the specific process is as follows: the multi-layer flexible circuit substrate is placed in a vacuum state, active plasmas are generated by utilizing gas to bombard the surface of the multi-layer flexible circuit substrate, so that substances to be removed on the surface of the multi-layer flexible circuit substrate are changed into ions or gas, and then the cleaned substances are pumped out by utilizing a vacuum pump, so that the cleaning purpose is achieved; after plasma photoresist removal is completed, carrying out shadow treatment on the multilayer flexible circuit substrate, namely coating a layer of conductive carbon on the hole wall to form a coating, so that the multilayer flexible circuit substrate has higher conductivity; after the shadow coating is finished, selecting a copper plating pattern required by hole copper plating, and performing hole copper plating treatment to conduct upper and lower circuits of the multilayer flexible circuit substrate; after the film stripping treatment is completed, copper plating is performed on the whole plate, and meanwhile, the step positions formed by hole copper plating are filled, so that bubbles are avoided.
In one embodiment, before the step S101, the method includes:
manufacturing an inner layer circuit on the base material copper layer, and respectively attaching PI films to the upper surface and the lower surface of the base material copper layer after manufacturing the inner layer circuit;
and bonding a layer of base copper on the outer surface of each layer of PI film, and respectively carrying out copper reduction treatment on the base copper of each layer of PI film to obtain the multilayer flexible circuit substrate.
In this embodiment, before drilling, a base copper layer is obtained, an inner layer circuit is made on the base copper layer, a PI film is attached to the upper and lower surface layers of the base copper layer, a base copper layer is attached to the outer surfaces of the PI films, and finally copper reduction treatment is performed on the base copper layer and the lower base copper layer, so as to obtain the multilayer flexible circuit substrate.
In one embodiment, the obtaining the corresponding copper plating pattern performs a hole copper plating operation to form a hole copper plating layer at the hole wall, including:
and (3) continuously electroplating the multilayer flexible circuit substrate for 35-45min by using electroplating equipment according to the current density of 2-3ASD and the jet frequency of 30-40hz, thereby obtaining the multilayer flexible circuit substrate with the hole copper plating layer.
In this embodiment, the hole copper plating operation employs a plating apparatus with a plating solution of a leveler, and the multilayer flexible circuit substrate with a hole copper plating layer is obtained by plating the drilled hole of the multilayer flexible circuit substrate at a current density of 2.5ASD and a jet frequency of 35hz for 40 minutes.
In one embodiment, the step between the hole copper plating layer and the multilayer flexible circuit substrate is filled by performing a whole copper plating process after film removal, comprising:
electroplating the multilayer flexible circuit substrate after film stripping with electroplating liquid medicine containing leveling agent according to current density of 1.8-2.4ASD and jet frequency of 15-20hz by using electroplating equipment, and adopting low jet mode to continuously electroplate for 25-35min.
In this embodiment, the whole plating copper process uses electroplating equipment with electroplating liquid of leveling agent, the current density is 2.1ASD, the jet frequency is 15-20hz, and the upper and lower outer surfaces of the multilayer flexible circuit substrate are uniformly electroplated for 30min by adopting a low jet mode, so as to obtain the multilayer flexible circuit substrate with leveling copper layers on the upper and lower outer surfaces.
In one embodiment, the copper thickness of the hole copper plating layer at the hole wall is 20-25um, and the height difference at the step between the hole copper plating layer and the surface layer of the multilayer flexible circuit substrate is 30-35um.
In this embodiment, after the hole copper plating operation is performed on the drilled hole on the multilayer flexible circuit substrate, the copper thickness of the hole copper plating layer formed at the hole wall is controlled to be 20-25um, and the height difference at the step between the hole copper plating layer and the outer surface of the multilayer flexible circuit substrate is 30-35um.
In one embodiment, the substrate base copper thickness of the target multilayer flexible circuit board is 6-8um. In this embodiment, the copper-reducing treatment is performed on the base copper, and the thickness of the base copper of the target multilayer flexible circuit board is reduced to 6-8um.
In one embodiment, the total thickness of the surface copper layer of the target multilayer flexible circuit board is 18-25um. In this embodiment, after the whole board copper plating treatment, copper is plated on the outer surface layer of the multilayer flexible circuit substrate by copper with a thickness of 12-17um, and the total thickness of the surface layer copper of the multilayer flexible circuit substrate reaches 18-25um.
In one embodiment, the total thickness of the hole wall copper at the drilling position of the target multilayer flexible circuit board is greater than or equal to 35um. In this embodiment, after the whole board copper plating treatment, the total thickness of the hole wall copper at the drilled hole of the multilayer flexible circuit substrate is greater than or equal to 35um.
In one embodiment, the outer layer circuit fabrication includes:
and adopting a water-soluble dry film with the thickness of less than or equal to 25um to carry out wet film pasting treatment on the multilayer flexible circuit substrate.
In this embodiment, after copper plating of the whole board is completed, wet film pasting is performed by using a water-soluble dry film with a thickness of 25um, and the target multilayer flexible circuit board is obtained.
The embodiment of the invention also provides a multilayer flexible circuit board, which is manufactured by adopting the electroplating processing method of the multilayer flexible circuit board.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. An electroplating processing method of a multilayer flexible circuit board is characterized by comprising the following steps:
drilling the multilayer flexible circuit substrate, and performing a plasma photoresist removing process on the drilled multilayer flexible circuit substrate;
coating a layer of conductive carbon on the hole wall of the multilayer flexible circuit substrate, and obtaining a corresponding copper plating pattern to perform hole copper plating operation so as to form a hole copper plating layer on the hole wall;
and carrying out film stripping on the multilayer flexible circuit substrate subjected to hole copper plating, carrying out whole-plate copper plating treatment after film stripping, filling the step between the hole copper plating layer and the multilayer flexible circuit substrate, and carrying out outer-layer circuit manufacturing on the filled multilayer flexible circuit substrate to obtain the target multilayer flexible circuit board.
2. The method of electroplating processing of a multilayer flexible circuit board according to claim 1, wherein before the drilling process is performed on the multilayer flexible circuit board, comprising:
manufacturing an inner layer circuit on the base material copper layer, and respectively attaching PI films to the upper surface and the lower surface of the base material copper layer after manufacturing the inner layer circuit;
and bonding a layer of base copper on the outer surface of each layer of PI film, and respectively carrying out copper reduction treatment on the base copper of each layer of PI film to obtain the multilayer flexible circuit substrate.
3. The plating processing method of a multilayer flexible wiring board according to claim 1, wherein the obtaining a corresponding copper plating pattern performs a hole copper plating operation to form a hole copper plating layer at the hole wall, comprising:
and (3) continuously electroplating the multilayer flexible circuit substrate for 35-45min by using electroplating equipment according to the current density of 2-3ASD and the jet frequency of 30-40hz, thereby obtaining the multilayer flexible circuit substrate with the hole copper plating layer.
4. The plating method of a multilayer flexible wiring board according to claim 1, wherein the performing the whole board copper plating treatment after film removal and filling the step between the hole copper plating layer and the multilayer flexible wiring board comprises:
electroplating the electroplating liquid containing the leveling agent by using electroplating equipment according to the current density of 1.8-2.4ASD and the jet frequency of 15-20hz, and continuously electroplating the multilayer flexible circuit substrate subjected to film stripping by adopting a low jet mode for 25-35min.
5. The plating method of claim 1, wherein the copper thickness of the hole copper plating layer at the hole wall is 20-25um, and the height difference at the step between the hole copper plating layer and the surface layer of the multilayer flexible wiring substrate is 30-35um.
6. The method of electroplating processing of a multilayer flexible circuit board according to claim 2, wherein the base copper thickness of the target multilayer flexible circuit board is 6-8um.
7. The method of electroplating processing of a multilayer flexible circuit board according to claim 2, wherein the total thickness of surface copper of the target multilayer flexible circuit board is 18-25um.
8. The method of electroplating processing of a multilayer flexible circuit board according to claim 2, wherein the total thickness of hole wall copper at the drilled hole of the target multilayer flexible circuit board is greater than or equal to 35um.
9. The method of electroplating processing a multilayer flexible circuit board according to claim 1, wherein the outer layer circuit fabrication comprises:
and adopting a water-soluble dry film with the thickness of less than or equal to 25um to carry out wet film pasting treatment on the multilayer flexible circuit substrate.
10. A multilayer flexible circuit board, characterized in that it is produced by the electroplating processing method of the multilayer flexible circuit board according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210459843.2A CN114657612B (en) | 2022-04-24 | 2022-04-24 | Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board |
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| CN202210459843.2A CN114657612B (en) | 2022-04-24 | 2022-04-24 | Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board |
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| CN114657612B true CN114657612B (en) | 2023-05-23 |
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2022
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| KR101544161B1 (en) * | 2015-03-25 | 2015-08-12 | 박종호 | Manufacturing Method for Ultra Thin Copper Foil |
| CN109152229A (en) * | 2018-10-22 | 2019-01-04 | 台山市精诚达电路有限公司 | A kind of production method of flex circuit application |
| CN111511120A (en) * | 2020-06-09 | 2020-08-07 | 胜宏科技（惠州）股份有限公司 | Raided Pad manufacturing method |
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