CN112867274A - Additive manufacturing process of fine circuit board - Google Patents
Additive manufacturing process of fine circuit board Download PDFInfo
- Publication number
- CN112867274A CN112867274A CN202011604114.9A CN202011604114A CN112867274A CN 112867274 A CN112867274 A CN 112867274A CN 202011604114 A CN202011604114 A CN 202011604114A CN 112867274 A CN112867274 A CN 112867274A
- Authority
- CN
- China
- Prior art keywords
- copper
- base material
- circuit board
- manufacturing process
- fine circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses an additive manufacturing process of a fine circuit board, which comprises the following steps: immersing the base material into a microetching solution, and assisting ultrasonic oscillation to carry out microetching treatment on the base material; placing the base material in a chemical copper plating solution, and carrying out chemical copper plating to obtain a copper-clad base material; drilling a through hole on the copper-clad substrate; depositing a conductive carbon layer on the via hole of the copper-clad substrate; pasting a photosensitive dry film on the copper-clad substrate; carrying out exposure and development treatment on the photosensitive dry film to obtain a groove of the fine circuit; forming a copper layer in the groove by using an electroplating mode; and removing the dry film, and placing the copper-clad base material in a flash etching solution for flash etching treatment. The process adopts the conductive carbon layer to realize the conduction between the conducting hole and the circuit, and directly forms the copper circuit by matching the pattern electroplating process with the flash etching process, the process is simple, the production cost is low, the production efficiency is high, the bonding force between the copper circuit of the prepared circuit board and the base material is high, and the product yield is high.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to an additive manufacturing process of a fine circuit board.
Background
With the continuous innovation and development of electronic products in the direction of multifunctionality and intellectualization, higher requirements are also put forward for carrier printed circuit boards bearing electronic parts, and the development of the circuit boards in the directions of lightness, thinness, shortness and smallness is further promoted. Therefore, the circuit boards with the lines becoming denser and thinner and the line width/space of 3mil/3mil gradually become products with conventional requirements; while circuit boards with 2.5mil, or even 2mil traces have been produced by companies and will be a trend. For such fine lines, the production process flow becomes especially important; the production process with high product yield and high production efficiency is a constantly-researched and pursued target of numerous circuit board factories.
The production method of the circuit board mainly comprises a subtractive method and an additive method; the traditional addition method comprises the following process flows: feeding → chemical copper → primary copper plating → pretreatment of circuit → dry film application → exposure → development → secondary copper plating → tin plating → film removal → alkaline etching → tin stripping → washing → drying → post process; the traditional addition method generally adopts a chemical copper process to carry out chemical copper plating on the via hole, so that the production efficiency of the process is low, and the environment is easily polluted; in addition, the traditional additive process needs to go through a copper plating process and a secondary copper plating process, and also needs operations of tin plating and tin stripping, so that the process flow is complex, the production cost is high, and the production efficiency is low; the traditional etching process of the addition method is an alkaline etching process, and the adopted liquid medicine is alkaline etching liquid medicine such as ammonium bicarbonate and ammonium chloride, so that the process is long, the environmental pollution is serious, the content of ammonia nitrogen in the liquid medicine is high, the waste liquid treatment difficulty is high, and the post-treatment cost is increased. Moreover, the copper circuit obtained by the traditional additive process has small binding force with the base material and is easy to fall off, thereby reducing the yield.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide an additive manufacturing process of a fine circuit board; the process adopts the conductive carbon layer to realize the conduction between the conducting hole and the circuit, and directly forms the copper circuit by matching the pattern electroplating process with the flash etching process, the process is simple, the production cost is low, the production efficiency is high, the bonding force between the copper circuit of the prepared circuit board and the base material is high, and the product yield is high.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
an additive manufacturing process of a fine circuit board comprises the following steps:
s1, substrate treatment: immersing the base material into a microetching solution, and assisting ultrasonic oscillation to carry out microetching treatment on the base material;
s2, electroless copper plating: placing the base material treated in the step S1 in a chemical copper plating solution, and carrying out chemical copper plating to obtain a copper-clad base material;
s3, drilling: drilling a through hole on the copper-clad substrate;
s4, black hole: depositing a conductive carbon layer on the via hole of the copper-clad substrate;
s5, pasting a dry film: pasting a photosensitive dry film on the copper-clad substrate;
s6, exposure development: carrying out exposure and development treatment on the photosensitive dry film to obtain a groove of the fine circuit;
s7, electroplating copper: forming a copper layer in the groove by using an electroplating mode;
s8, flash etching: and removing the dry film, and putting the copper-clad base material processed in the step S7 into a flash etching solution for flash etching treatment.
Further, the microetching solution comprises phosphoric acid, sulfuric acid, manganese dioxide and water.
Furthermore, the volume ratio of the phosphoric acid to the sulfuric acid to the water in the microetching solution is 1: 3-3.5: 1, and the content of the manganese dioxide is 50-80 g/L.
Further, the microetching time of the step S1 is 10-15 min, and the temperature of the microetching liquid is 50-60 ℃.
Further, the electroless copper plating solution comprises 5-20 g/L of copper salt, 3-5 g/L of complexing agent, 1-5 g/L of reducing agent, 0.005-0.02 g/L of stabilizing agent and 5-15 g/L of pH regulator.
Further, the conductive carbon layer of step S4 is formed by depositing nano conductive carbon powder on the hole wall of the via hole by chemical deposition; the thickness of the conductive carbon layer is 1-2 μm.
Further, the electroplating solution used in step S7 includes 50-80 g/L anhydrous copper sulfate, 100-150 ml/L sulfuric acid, and 50-70 ml/L hydrochloric acid.
Further, the flash etching solution adopted in the step S8 comprises 100-200 g/L of sulfuric acid, 15-25 g/L of hydrogen peroxide, 1-5 g/L of hydrogen peroxide stabilizer, 0.5-5 g/L of bank protection agent and the balance of water; the flash etching time is 1-3 min.
Further, the copper thickness of the copper-clad base material obtained in step S2 is 2 to 4 μm.
The invention has the beneficial effects that:
according to the invention, the microetching solution containing manganese dioxide, sulfuric acid, phosphoric acid and water is firstly used for carrying out microetching treatment on the base material, so that uniform micropores are formed on the surface of the base material, the roughness of the surface of the base material is improved, the binding force between a copper circuit formed subsequently and the base material is improved, and the falling of the copper circuit is effectively avoided;
according to the invention, the conductive carbon layer is deposited on the via hole of the copper-clad substrate, so that the via hole is communicated with the copper wire on the surface of the substrate through the conductive carbon layer, and compared with a process for chemically plating copper in the via hole, the process is beneficial to environmental protection and has higher process efficiency;
the invention adopts the pattern electroplating process to form the copper circuit, does not need primary copper plating and secondary copper plating, and does not need tinning and tin stripping processes, thereby reducing the production procedures, shortening the production time and improving the production efficiency;
according to the invention, the unnecessary ultrathin chemical copper plating layer (the area which is protected by the dry film and is not subjected to electroplating thickening) is quickly etched by adopting a flash etching mode, the copper plating layer is reserved, and the required fine circuit can be easily obtained;
the invention adopts the flash etching liquid of a sulfuric acid and hydrogen peroxide system and is matched with the use of the bank protection agent, thereby greatly reducing the side etching, obtaining the rectangular circuit shape and improving the product quality.
Detailed Description
The technical solutions in the present invention will be described clearly and completely with reference to specific embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an additive manufacturing process of a fine circuit board, which comprises the following steps:
s1, substrate treatment: immersing the base material into a microetching solution, and assisting ultrasonic oscillation to carry out microetching treatment on the base material;
s2, electroless copper plating: placing the base material treated in the step S1 in a chemical copper plating solution, and carrying out chemical copper plating to obtain a copper-clad base material;
s3, drilling: drilling a through hole on the copper-clad substrate;
s4, black hole: depositing a conductive carbon layer on the via hole of the copper-clad substrate;
s5, pasting a dry film: pasting a photosensitive dry film on the copper-clad substrate;
s6, exposure development: carrying out exposure and development treatment on the photosensitive dry film to obtain a groove of the fine circuit;
s7, electroplating copper: forming a copper layer in the groove by using an electroplating mode;
s8, flash etching: and removing the dry film, and putting the copper-clad base material processed in the step S7 into a flash etching solution for flash etching treatment.
Wherein the micro-etching solution comprises phosphoric acid, sulfuric acid, manganese dioxide and water; the volume ratio of the phosphoric acid to the sulfuric acid to the water is 1: 3-3.5: 1, and the content of manganese dioxide is 50-80 g/L; the microetching time of the step S1 is 10-15 min, and the temperature of the microetching liquid is 50-60 ℃.
The electroless copper plating solution in the step S2 comprises 5-20 g/L of copper salt, 3-5 g/L of complexing agent, 1-5 g/L of reducing agent, 0.005-0.02 g/L of stabilizing agent and 5-15 g/L of pH regulator; the copper thickness of the copper-clad base material obtained in the step S2 is 2-4 mu m;
the conductive carbon layer of the step S4 is formed by depositing nano conductive carbon powder on the hole wall of the via hole in a chemical deposition mode; the thickness of the conductive carbon layer is 1-2 μm.
The electroplating solution used in step S7 includes 50-80 g/L anhydrous copper sulfate, 100-150 ml/L sulfuric acid, and 50-70 ml/L hydrochloric acid.
The flash etching solution adopted in the step S8 comprises 100-200 g/L of sulfuric acid, 15-25 g/L of hydrogen peroxide, 1-5 g/L of hydrogen peroxide stabilizer, 0.5-5 g/L of bank protection agent and the balance of water; the flash etching time is 1-3 min.
Example 1
An additive manufacturing process of a fine circuit board comprises the following steps:
s1, substrate treatment: immersing the base material into a microetching solution, and assisting ultrasonic oscillation to carry out microetching treatment on the base material; the total volume of phosphoric acid, sulfuric acid and water in the microetching solution is 150ml, and the volume ratio of the phosphoric acid to the sulfuric acid to the water is 1:3: 1; the content of manganese dioxide is 50 g/L; the microetching time is 10min, and the temperature of the microetching liquid is 50 ℃; the ultrasonic frequency is 40 kHz;
s2, electroless copper plating: placing the base material treated in the step S1 in chemical copper plating solution, wherein the chemical copper plating solution comprises 10g/L of copper sulfate pentahydrate, 3g/L of citrate complexing agent, 2g/L of formaldehyde reducing agent, 0.005g/L of stabilizer (potassium ferrocyanide) and 5g/L of pH regulator (sodium carbonate), and carrying out chemical copper plating to obtain a copper-clad base material; the thickness of a copper layer of the copper-clad substrate is 2 mu m;
s3, drilling: drilling a through hole on the copper-clad substrate;
s4, black hole: depositing nano conductive carbon powder on the hole wall of the via hole by using black hole line equipment in a chemical deposition mode to form a conductive carbon layer;
s5, pasting a dry film: pasting a photosensitive dry film (plating resistance dry film) on the copper-clad base material;
s6, exposure development: carrying out exposure and development treatment on the photosensitive dry film to obtain a groove of the fine circuit;
s7, electroplating copper: forming a copper layer in the groove by using an electroplating mode; the electroplating solution adopted by electroplating comprises 50g/L of anhydrous copper sulfate, 120ml/L of sulfuric acid and 50ml/L of hydrochloric acid;
s8, flash etching: removing the dry film, and placing the copper-clad base material processed in the step S7 in a flash etching solution for flash etching; the flash etching solution comprises 150g/L of sulfuric acid, 15g/L of hydrogen peroxide, 2g/L of hydrogen peroxide stabilizer (n-butyl alcohol), 1g/L of bank protection agent (imidazole) and the balance of water; the flash etching time was 1.5 min.
After the flash etching treatment, the fine circuit board is obtained through the subsequent procedures of water washing, drying and the like.
Example 2
An additive manufacturing process of a fine circuit board comprises the following steps:
s1, substrate treatment: immersing the base material into a microetching solution, and assisting ultrasonic oscillation to carry out microetching treatment on the base material; the total volume of the phosphoric acid, the sulfuric acid and the water in the microetching solution is 150ml, and the volume ratio of the phosphoric acid to the sulfuric acid to the water is 1:3.5: 1; the content of manganese dioxide is 80 g/L; the microetching time is 15min, and the temperature of the microetching liquid is 60 ℃; the ultrasonic frequency is 40 kHz;
s2, electroless copper plating: placing the base material treated in the step S1 into chemical copper plating solution, wherein the chemical copper plating solution comprises 15g/L of copper sulfate pentahydrate, 5g/L of citrate complexing agent, 5g/L of formaldehyde reducing agent, 0.02g/L of stabilizer (potassium ferrocyanide) and 10g/L of pH regulator (sodium carbonate), and carrying out chemical copper plating to obtain a copper-clad base material; the thickness of a copper layer of the copper-clad substrate is 2 mu m;
s3, drilling: drilling a through hole on the copper-clad substrate;
s4, black hole: depositing nano conductive carbon powder on the hole wall of the via hole by using black hole line equipment in a chemical deposition mode to form a conductive carbon layer;
s5, pasting a dry film: pasting a photosensitive dry film (plating resistance dry film) on the copper-clad base material;
s6, exposure development: carrying out exposure and development treatment on the photosensitive dry film to obtain a groove of the fine circuit;
s7, electroplating copper: forming a copper layer in the groove by using an electroplating mode; the electroplating solution adopted by electroplating comprises 70g/L of anhydrous copper sulfate, 150ml/L of sulfuric acid and 70ml/L of hydrochloric acid;
s8, flash etching: removing the dry film, and placing the copper-clad base material processed in the step S7 in a flash etching solution for flash etching; the flash etching solution comprises 180g/L of sulfuric acid, 25g/L of hydrogen peroxide, 5g/L of hydrogen peroxide stabilizer (n-butyl alcohol), 2g/L of bank protection agent (imidazole) and the balance of water; the flash etching time was 2 min.
After the flash etching treatment, the fine circuit board is obtained through the subsequent procedures of water washing, drying and the like.
The fine wiring boards produced by the manufacturing processes of example 1 and example 2 both had a line yield of greater than 90%.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (9)
1. An additive manufacturing process of a fine circuit board is characterized by comprising the following steps:
s1, substrate treatment: immersing the base material into a microetching solution, and assisting ultrasonic oscillation to carry out microetching treatment on the base material;
s2, electroless copper plating: placing the base material treated in the step S1 in a chemical copper plating solution, and carrying out chemical copper plating to obtain a copper-clad base material;
s3, drilling: drilling a through hole on the copper-clad substrate;
s4, black hole: depositing a conductive carbon layer on the via hole of the copper-clad substrate;
s5, pasting a dry film: pasting a photosensitive dry film on the copper-clad substrate;
s6, exposure development: carrying out exposure and development treatment on the photosensitive dry film to obtain a groove of the fine circuit;
s7, electroplating copper: forming a copper layer in the groove by using an electroplating mode;
s8, flash etching: and removing the dry film, and putting the copper-clad base material processed in the step S7 into a flash etching solution for flash etching treatment.
2. The additive manufacturing process of claim 1, wherein the microetching solution comprises phosphoric acid, sulfuric acid, manganese dioxide and water.
3. The additive manufacturing process of the fine circuit board according to claim 2, wherein the volume ratio of phosphoric acid, sulfuric acid and water in the microetching solution is 1: 3-3.5: 1, and the content of manganese dioxide is 50-80 g/L.
4. The additive manufacturing process of a fine circuit board according to claim 1, wherein the microetching time of step S1 is 10-15 min, and the temperature of the microetching solution is 50-60 ℃.
5. The additive manufacturing process of the fine circuit board according to claim 1, wherein the electroless copper plating solution comprises 5-20 g/L copper salt, 3-5 g/L complexing agent, 1-5 g/L reducing agent, 0.005-0.02 g/L stabilizer and 5-15 g/L pH regulator.
6. The additive manufacturing process of a fine circuit board according to claim 1, wherein the conductive carbon layer of step S4 is formed by depositing nano conductive carbon powder on the hole wall of the via hole by chemical deposition; the thickness of the conductive carbon layer is 1-2 μm.
7. The additive manufacturing process of a fine circuit board as claimed in claim 1, wherein the electroplating solution used in step S7 comprises 50-80 g/L anhydrous copper sulfate, 100-150 ml/L sulfuric acid, and 50-70 ml/L hydrochloric acid.
8. The addition method manufacturing process of the fine circuit board according to claim 1, wherein the flash etching solution adopted in the step S8 comprises 100-200 g/L sulfuric acid, 15-25 g/L hydrogen peroxide, 1-5 g/L hydrogen peroxide stabilizer, 0.5-5 g/L bank protection agent and the balance of water; the flash etching time is 1-3 min.
9. The additive manufacturing process of a fine circuit board according to claim 1, wherein the copper thickness of the copper-clad substrate obtained in step S2 is 2 to 4 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011604114.9A CN112867274A (en) | 2020-12-29 | 2020-12-29 | Additive manufacturing process of fine circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011604114.9A CN112867274A (en) | 2020-12-29 | 2020-12-29 | Additive manufacturing process of fine circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112867274A true CN112867274A (en) | 2021-05-28 |
Family
ID=75998412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011604114.9A Pending CN112867274A (en) | 2020-12-29 | 2020-12-29 | Additive manufacturing process of fine circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112867274A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114657612A (en) * | 2022-04-24 | 2022-06-24 | 珠海景旺柔性电路有限公司 | Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board |
| CN114921825A (en) * | 2022-04-24 | 2022-08-19 | 江苏富乐华功率半导体研究院有限公司 | DPC ceramic substrate copper plating pretreatment method |
| CN115074735A (en) * | 2022-08-04 | 2022-09-20 | 温州珑泰深拓新材料有限公司 | Novel nitrogen-free fluorine-free environment-friendly tin stripping liquid |
| CN117144367A (en) * | 2023-10-30 | 2023-12-01 | 深圳市板明科技股份有限公司 | Circuit etching solution for IC packaging carrier plate and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1332041A (en) * | 1970-04-21 | 1973-10-03 | Rca Corp | Process for forming a conductive coating on a substrate |
| US3983267A (en) * | 1973-09-25 | 1976-09-28 | W. Canning & Company Limited | Treatment of the surfaces of polyphenylene oxide materials |
| CN101892469A (en) * | 2010-06-29 | 2010-11-24 | 陕西师范大学 | Method for micro-etching surfaces of ABS (Acrylonitrile Butadiene Styrene Acrylonitrile Butadiene Styrene) engineering plastic parts by ultrasonic micro-etching system |
| CN107801310A (en) * | 2017-11-29 | 2018-03-13 | 瑞声声学科技(苏州)有限公司 | Circuit board manufacturing method and circuit board |
-
2020
- 2020-12-29 CN CN202011604114.9A patent/CN112867274A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1332041A (en) * | 1970-04-21 | 1973-10-03 | Rca Corp | Process for forming a conductive coating on a substrate |
| US3983267A (en) * | 1973-09-25 | 1976-09-28 | W. Canning & Company Limited | Treatment of the surfaces of polyphenylene oxide materials |
| CN101892469A (en) * | 2010-06-29 | 2010-11-24 | 陕西师范大学 | Method for micro-etching surfaces of ABS (Acrylonitrile Butadiene Styrene Acrylonitrile Butadiene Styrene) engineering plastic parts by ultrasonic micro-etching system |
| CN107801310A (en) * | 2017-11-29 | 2018-03-13 | 瑞声声学科技(苏州)有限公司 | Circuit board manufacturing method and circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114657612A (en) * | 2022-04-24 | 2022-06-24 | 珠海景旺柔性电路有限公司 | Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board |
| CN114921825A (en) * | 2022-04-24 | 2022-08-19 | 江苏富乐华功率半导体研究院有限公司 | DPC ceramic substrate copper plating pretreatment method |
| CN114921825B (en) * | 2022-04-24 | 2023-04-07 | 江苏富乐华功率半导体研究院有限公司 | DPC ceramic substrate copper plating pretreatment method |
| CN114657612B (en) * | 2022-04-24 | 2023-05-23 | 珠海景旺柔性电路有限公司 | Electroplating processing method of multilayer flexible circuit board and multilayer flexible circuit board |
| CN115074735A (en) * | 2022-08-04 | 2022-09-20 | 温州珑泰深拓新材料有限公司 | Novel nitrogen-free fluorine-free environment-friendly tin stripping liquid |
| CN117144367A (en) * | 2023-10-30 | 2023-12-01 | 深圳市板明科技股份有限公司 | Circuit etching solution for IC packaging carrier plate and preparation method and application thereof |
| CN117144367B (en) * | 2023-10-30 | 2023-12-26 | 深圳市板明科技股份有限公司 | Circuit etching solution for IC packaging carrier plate and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112867274A (en) | Additive manufacturing process of fine circuit board | |
| US6521328B1 (en) | Copper etching compositions and products derived therefrom | |
| JP2005336614A (en) | Method for metallizing plastic surface | |
| JPH0350431B2 (en) | ||
| CN103491732A (en) | Method for manufacturing circuit board layer-adding structure | |
| KR20110016410A (en) | Method for electroless nickel-palladium-gold plating, plated product, printed wiring board, interposer and semiconductor apparatus | |
| CN104651840A (en) | Etching composition and method for producing printed-wiring board using the same | |
| KR20200029398A (en) | Copper etching solution | |
| CN104780710A (en) | PCB (Printed circuit board) and manufacturing method thereof | |
| TW201914384A (en) | Method for manufacturing cupper pillar on pcb | |
| JP3337802B2 (en) | Direct plating method by metallization of copper (I) oxide colloid | |
| JPS6252480B2 (en) | ||
| JP2001519477A (en) | Methods and solutions for producing a gold layer | |
| EP1427869B1 (en) | Regeneration method for a plating solution | |
| CN104120427B (en) | The processing method of wiring substrate and the wiring substrate manufactured using this method | |
| JP5005883B2 (en) | Circuit forming etching solution for subtractive method | |
| GB2070647A (en) | Selective chemical deposition and/or electrodeposition of metal coatings, especially for the production of printed circuits | |
| CN105386016B (en) | The method of chemical nickel plating method and chemical plating cupro-nickel conducting wire | |
| EP4314383A1 (en) | Method for plasma-treating a surface of a substrate | |
| KR101049236B1 (en) | Electroless Plating Method Using Palladium | |
| JPH05259611A (en) | Production of printed wiring board | |
| CN103556134A (en) | Pre-treatment method of non-electrolytic nickel plating | |
| JPH09246716A (en) | Surface layer printed wiring board (slc) manufacturing method | |
| KR20040102768A (en) | Method for manufacturing the copper thin film using in printed circuit board | |
| WO2011099597A1 (en) | Method for producing printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210528 |
|
| RJ01 | Rejection of invention patent application after publication |