CN114650727A - Circuit board assembly processing system - Google Patents
Circuit board assembly processing system Download PDFInfo
- Publication number
- CN114650727A CN114650727A CN202011497644.8A CN202011497644A CN114650727A CN 114650727 A CN114650727 A CN 114650727A CN 202011497644 A CN202011497644 A CN 202011497644A CN 114650727 A CN114650727 A CN 114650727A
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- Prior art keywords
- circuit board
- board assembly
- defective
- detection
- information
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- 238000012545 processing Methods 0.000 title claims abstract description 38
- 230000002950 deficient Effects 0.000 claims abstract description 75
- 238000001514 detection method Methods 0.000 claims abstract description 73
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims abstract description 7
- 238000003860 storage Methods 0.000 claims description 13
- 238000007689 inspection Methods 0.000 claims description 11
- 238000012423 maintenance Methods 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 24
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
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- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- General Factory Administration (AREA)
Abstract
A circuit board assembly processing system comprising: reflow soldering equipment, detection equipment, first board receiving equipment, second board receiving equipment, cache equipment, corner equipment and computer equipment. The buffer device is used for temporarily storing the circuit board assembly welded by the reflow soldering device and transmitting the circuit board assembly to the detection device for detection. The corner device is used for transmitting the circuit board assembly to the first board collecting device when the circuit board assembly is judged to be good, and transmitting the circuit board assembly to the second board collecting device when the circuit board assembly is judged to be defective. And the computer equipment is in communication connection with the detection equipment and is used for displaying the detection information of the circuit board assembly judged to be defective by the detection equipment so as to judge whether the circuit board assembly is a defective product. The invention can improve the detection accuracy of the processing defects of the circuit board assembly.
Description
Technical Field
The invention relates to the field of Surface Mount Technology (SMT), in particular to a circuit board assembly processing system.
Background
SMT is a new generation of electronic assembly technology developed from hybrid integrated circuit technology, and is characterized by using component surface mount technology and reflow soldering technology, and is a new generation of assembly technology in electronic product manufacturing. The SMT production line mainly includes a printer, a chip mounter, reflow soldering equipment, Automatic Optical Inspection (AOI) equipment, and the like. An existing SMT production line generally maintains one SMT production line by one person, and an AOI detection device detects the welding condition of a circuit board assembly by means of a template comparison algorithm and possibly has the situation of misjudgment or missed judgment.
Disclosure of Invention
Accordingly, there is a need for a circuit board assembly processing system that can improve the accuracy of detecting processing defects of circuit board assemblies.
An embodiment of the present invention provides a circuit board assembly processing system, which includes a reflow soldering device, a detection device, and a first board collecting device. The circuit board assembly processing system further comprises: a second plate collecting device; the buffer device is used for temporarily storing the circuit board assembly welded by the reflow soldering device and transmitting the circuit board assembly to the detection device for detection; the corner device is used for transmitting the circuit board assembly to the first board collecting device when the circuit board assembly is judged to be a good product, and transmitting the circuit board assembly to the second board collecting device when the circuit board assembly is judged to be a defective product; and the computer equipment is in communication connection with the detection equipment and is used for displaying detection information of the circuit board assembly judged to be defective by the detection equipment so as to judge whether the circuit board assembly is a defective product or not.
In some embodiments, the circuit board assembly processing system includes a plurality of circuit board assembly processing lines and the computer device, each of the circuit board assembly processing lines includes the reflow soldering device, the detection device, the first board collecting device, the second board collecting device, the cache device, and the corner device, and the computer device is in communication connection with the plurality of detection devices.
In some embodiments, when the detection device determines that the circuit board assembly is a defective product, the detection device sends the processing defective area image of the circuit board assembly to the computer device, and the computer device displays the processing defective area image to determine whether the circuit board assembly is a defective product.
In some embodiments, when the computer device transmits the information that the circuit board assembly is determined to be a good product to the detection device, the corner device transmits the circuit board assembly to the first board collecting device.
In some embodiments, when the computer device transmits the information that the circuit board assembly is determined to be a defective product to the detection device, the corner device transmits the circuit board assembly to the second board collecting device.
In some embodiments, the computer device is configured to aggregate the detection information of the plurality of circuit board assemblies judged as bad, and store the detection information to the designated storage area.
In some embodiments, the computer device generates a detection signboard, which displays the defective rate information, the defective area distribution information, and the defective product quantity information, based on the detection information of the plurality of circuit board assemblies that are repeatedly judged to be defective.
In some embodiments, the designated storage area is a hard disk storage area of the computer device, or a server.
In some embodiments, when the designated storage area receives an information inquiry request for a defective circuit board assembly, the information inquiry request is responded, and defective product information corresponding to the information inquiry request is output, so that the defective circuit board assembly is repaired according to the defective product information.
In some embodiments, the detection device is an Automatic Optical Inspection (AOI) device, and when the AOI device determines that the circuit board assembly is a defective product, the AOI device sends an image acquired by detecting the circuit board assembly to the computer device.
Compared with the prior art, according to the circuit board assembly processing system, when the circuit board assembly is judged to be defective by the detection equipment, the computer equipment displays the detection information of the circuit board assembly judged to be defective by the detection equipment, so that production management personnel can conveniently judge whether the circuit board assembly is defective, the detection accuracy of the welding situation of the circuit board assembly can be improved, and shunting collection of the circuit board assemblies of good products and defective products is realized.
Drawings
Fig. 1 is a schematic diagram of a circuit board assembly processing system according to an embodiment of the invention.
Fig. 2 is an application scenario diagram of a computer device according to an embodiment of the present invention.
Fig. 3 is a diagram of an application scenario of a computer device according to another embodiment of the present invention.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is further noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Fig. 1 is a schematic diagram of a circuit board assembly processing system according to an embodiment of the present invention.
In one embodiment, the circuit board assembly processing system 100 includes a plurality of SMT production lines (fig. 1 illustrates four SMT production lines 10a, 10b, 10c, 10d, and may include more than 4 SMT production lines or less than 4 SMT production lines) and a computer device 20. Each SMT production line 10a, 10b, 10c, 10d may include a solder paste printing device 101, a die attaching device 102, a reflow soldering device 103, a buffer device 104, a detecting device 105, a corner device 106, a first board collecting device 107, and a second board collecting device 108. The computer device 20 is connected to a plurality of detecting devices 105 in a communication manner, and the number of the computer device 20 and the detecting devices 105 in communication can be set according to actual requirements. For example, if a production manager is used to manage four SMT production lines, the computer device 20 may be communicatively coupled to 4 inspection devices 105 (as shown in fig. 2).
Solder paste printing equipment 101 is used for printing the solder paste in the pad of Circuit Board, and paster equipment 102 is used for carrying out the components and parts dress to the Circuit Board, and reflow soldering equipment 103 is used for making the solder paste be heated and melts to let the components and parts of dress and Circuit Board pad pass through the solder paste and combine together, obtain Circuit Board Assembly (PCBA). The buffer device 104 is configured to temporarily store the circuit board assembly soldered by the reflow soldering device 103, and transmit the circuit board assembly to the detection device 105 for detection, for example, when the detection device 105 completes detection of the current circuit board assembly and transmits the current circuit board assembly to the corner device 106, the buffer device 104 transmits a circuit board assembly to be detected to the detection device 105 for detection. The cache device 104 can prevent the soldering speed of the circuit board assembly by the reflow soldering device 103 from being asynchronous with the detection speed of the detection device 105, so that the detection device 105 accumulates more circuit board assemblies to wait for detection.
The detection equipment 105 comprises a camera, the detection equipment 105 can utilize the camera to scan the PCBA to acquire images, the acquired welding spot data are compared with qualified data of a pre-constructed database, the PCBA welding condition is identified through image processing, and the abnormal welding condition can be marked. The detection device 105 may be an AOI device. When the AOI device determines that the circuit board assembly is defective, the AOI device may send an image acquired by detecting the circuit board assembly to the computer device 20, where the acquired image includes an entire image of the defective, a local image of a non-defective area, and a local image of a defective area, for example.
The corner device 106 is configured to transmit the circuit board assembly to the first board collecting device 107 for collection when the circuit board assembly is determined to be a good product, and the corner device 106 is further configured to transmit the circuit board assembly to the second board collecting device 108 for collection when the circuit board assembly is determined to be a defective product, so that classified collection of the good product and the defective product is realized.
The computer device 20 includes a display screen, and the computer device 20 is configured to display detection information of the circuit board assembly determined as defective by the detection device 105, so that a production manager can make a double determination as to whether the circuit board assembly is defective. The computer device 20 may be a desktop computer, a notebook computer, an industrial computer, etc.
In an embodiment, when the detecting device 105 determines that the circuit board assembly is a defective product, the detecting device 105 sends the image of the processing defective area of the circuit board assembly to the computer device 20, and the computer device 20 can display the image of the processing defective area, so that the production manager can conveniently determine whether the circuit board assembly is a defective product. When the production manager re-determines that the circuit board assembly is still a defective product, the production manager may input a first re-determination instruction to the computer device 20, where the first re-determination instruction is used to indicate that the circuit board assembly is re-determined as a defective product, and when the computer device 20 may transmit information that the circuit board assembly is re-determined as a defective product to the detection device 105, the corner device 106 may transmit the circuit board assembly to the second board receiving device 108 for collection. When the production manager re-determines that the circuit board assembly is good, the production manager may input a second re-determination instruction to the computer device 20, where the second re-determination instruction is used to indicate that the circuit board assembly is good, and then the computer device 20 may transmit the information that the circuit board assembly is good to the detection device 105, and the corner device 106 may transmit the circuit board assembly to the first board receiving device 107 for collection.
In one embodiment, the computer device 20 is further configured to aggregate the detection information of each circuit board assembly judged as defective and store the aggregated detection information in the designated storage area. The detection information may include an entire image of the defective product, an image of the defective region, defect description information, and the like. The designated storage area may be a hard disk storage area of the computer device 20 itself, or an entity server, a cloud server, or the like.
In one embodiment, the computer device 20 may store the summarized detection information of each circuit board assembly identified as bad again in its own hard disk storage area, and store the summarized detection information of each circuit board assembly identified as bad again in the server for backup. The computer 20 can generate the inspection signboard based on the inspection information of each circuit board assembly judged as defective again, thereby facilitating visual management of the defective condition of the 4 SMT production lines. The detection signboard can display the defective rate information, the defective area distribution information, the defective product quantity information and the like.
As shown in fig. 3, the storage area is designated as the server 30, the computer device 20 collects the detection information of each circuit board assembly judged as bad and stores the detection information in the server 30, and the maintenance personnel can access the server 30 to inquire the detection information of the bad circuit board assembly, thereby facilitating the maintenance of the bad circuit board assembly. For example, when a maintenance person performs maintenance on the defective circuit board assembly P1, the maintenance person may send an information query request for the defective circuit board assembly P1 to the server 30 through a query device (for example, the query device is the computer device 20, an office computer of the maintenance person itself, or a portable device), when the server 30 receives the information query request for the defective circuit board assembly P1, the server 30 may respond to the information query request and output defective product information corresponding to the information query request, and the maintenance person may perform maintenance on the defective circuit board assembly P1 according to the queried defective product information.
In an embodiment, the production manager, the computer device 20 or the server 30 may also perform data analysis based on the detection information of the defective circuit board assembly stored in the server 30 to determine whether the current SMT production process has defects, or to improve the current SMT production process, or the like.
According to the circuit board assembly processing system, when the circuit board assembly is judged to be defective by the detection equipment, the computer equipment displays the detection information of the circuit board assembly judged to be defective by the detection equipment, so that production management personnel can conveniently judge whether the circuit board assembly is defective or not, the detection accuracy of the welding situation of the circuit board assembly can be improved, and a plurality of SMT production lines can be controlled by one person.
It will be apparent to those skilled in the art that other variations and modifications may be made in accordance with the invention and its spirit and scope in accordance with the practice of the invention disclosed herein.
Claims (10)
1. The utility model provides a circuit board assembly system of processing, includes reflow soldering equipment, check out test set and first receipts board equipment, its characterized in that, circuit board assembly system of processing still includes:
a second plate collecting device;
the buffer device is used for temporarily storing the circuit board assembly welded by the reflow soldering device and transmitting the circuit board assembly to the detection device for detection;
the corner device is used for transmitting the circuit board assembly to the first board collecting device when the circuit board assembly is judged to be good, and transmitting the circuit board assembly to the second board collecting device when the circuit board assembly is judged to be defective;
and the computer equipment is in communication connection with the detection equipment and is used for displaying detection information of the circuit board assembly judged to be defective by the detection equipment so as to judge whether the circuit board assembly is a defective product or not.
2. The circuit board assembly processing system according to claim 1, wherein the circuit board assembly processing system includes a plurality of circuit board assembly processing lines and the computer device, each of the circuit board assembly processing lines includes the reflow soldering device, the detection device, the first board collecting device, the second board collecting device, the cache device, and the corner device, and the computer device is in communication connection with the plurality of detection devices.
3. The circuit board assembly processing system according to claim 1, wherein when the detection device determines that the circuit board assembly is a defective product, the detection device transmits a processing defective area image of the circuit board assembly to the computer device, and the computer device displays the processing defective area image to re-determine whether the circuit board assembly is a defective product.
4. The circuit board assembly processing system according to claim 3, wherein when the computer device transmits information that the circuit board assembly is determined as good to the detection device, the corner device transfers the circuit board assembly to the first board collecting device.
5. The circuit board assembly processing system according to claim 3, wherein when the computer device transmits information that the circuit board assembly is determined as a defective product to the detection device, the corner device transfers the circuit board assembly to the second board collecting device.
6. The circuit board assembly processing system according to claim 3, wherein the computer device is configured to aggregate the inspection information of a plurality of circuit board assemblies judged as defective and store the aggregated inspection information in a designated storage area.
7. The circuit board assembly processing system according to claim 6, wherein the computer device generates a detection signboard, which displays the defective rate information, the defective area distribution information, and the defective quantity information, based on the detection information of a plurality of circuit board assemblies which are repeatedly judged to be defective.
8. The circuit board assembly processing system according to claim 6, wherein the designated storage area is a hard disk storage area of the computer device or a server.
9. The circuit board assembly processing system according to claim 6, wherein when the specified storage area receives an information inquiry request for a defective circuit board assembly, the information inquiry request is responded to and defective product information corresponding to the information inquiry request is output to perform maintenance on the defective circuit board assembly according to the defective product information.
10. The circuit board assembly processing system according to claim 3, wherein the inspection apparatus is an automatic optical inspection apparatus, and when the automatic optical inspection apparatus determines that the circuit board assembly is a defective product, the automatic optical inspection apparatus transmits an image acquired by inspecting the circuit board assembly to the computer apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011497644.8A CN114650727A (en) | 2020-12-17 | 2020-12-17 | Circuit board assembly processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011497644.8A CN114650727A (en) | 2020-12-17 | 2020-12-17 | Circuit board assembly processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114650727A true CN114650727A (en) | 2022-06-21 |
Family
ID=81990049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011497644.8A Pending CN114650727A (en) | 2020-12-17 | 2020-12-17 | Circuit board assembly processing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114650727A (en) |
-
2020
- 2020-12-17 CN CN202011497644.8A patent/CN114650727A/en active Pending
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220621 |
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| WD01 | Invention patent application deemed withdrawn after publication |