CN114622164A - Preparation method of burr-free coated device, coating attaching structure and device picking structure - Google Patents
Preparation method of burr-free coated device, coating attaching structure and device picking structure Download PDFInfo
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- CN114622164A CN114622164A CN202210231809.XA CN202210231809A CN114622164A CN 114622164 A CN114622164 A CN 114622164A CN 202210231809 A CN202210231809 A CN 202210231809A CN 114622164 A CN114622164 A CN 114622164A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Computer Hardware Design (AREA)
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Abstract
The invention relates to the technical field of semiconductor packaging, and discloses a preparation method of a burr-free coated device, a coated film attaching structure and a device picking structure, which comprise the following steps: providing a film coating device; attaching the surface of a circuit board of a film-coating device to the surface of the adhesive layer of the adhesive tape to obtain a film-coating attachment structure comprising the film-coating device and the adhesive tape, wherein when the surface of the circuit board is attached to the surface of the adhesive layer of the adhesive tape, a concave part is formed on the surface of the adhesive layer outside the side wall of the film-coating device; and forming a coating layer on the coating attaching structure, and separating to obtain a coating device with the coating layer free of burrs. The invention forms corresponding concave parts on the surface of the adhesive tape, so that after a coating layer is formed on a coating attaching structure, the contact included angle between the coating layer on the side wall of the coating device and the coating layer on the surface of the adhesive tape at the concave part is changed from the original 90-degree right angle to an obtuse angle of more than 90 degrees and less than 180 degrees, and the coating device is longitudinally stretched and broken along the surface of the coating layer during separation, and finally the coating device with a broken section without burrs is obtained.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a preparation method of a burr-free coated device, a coated film attaching structure and a device picking structure.
Background
In the traditional device coating method, firstly, a rubber belt is flatly pasted on a coating carrier, then a part placing machine is used for adsorbing a coating device to be placed on the surface of a rubber layer of the rubber belt, the coating device is pressed down by the part placing machine or the coating device is pressed by a pressing machine, so that the circuit board surface at the bottom of the coating device is tightly attached to the surface of the rubber layer, and a coating attaching structure comprising the coating device and the rubber belt is obtained; putting the coating carrier with the coating attaching structure into a coating machine table, and performing a series of pretreatments on the surface of the coating attaching structure by using a physical vapor deposition method, wherein the coating process is as follows: depositing pre-plated atoms in the whole vacuum space, and plating a film on the surface of one side of a film plating device of the film plating attachment structure to form a film plating layer; separating the coated device from the adhesive tape by using a jacking device, and placing the coated device obtained by separation into a material receiving tray, wherein in the separation process, the continuous coating layer is broken to generate coating layer burrs on the back of the coated device; and fixing the back of the coating device with the coating layer formed upwards in a material receiving tray, and removing burrs of the coating layer on the back of the coating device by using a brush.
Specifically, referring to fig. 1, a method for coating a film on a film-coated device in a conventional film-coating method includes an electronic device 10, a plastic package material 20, and a circuit board 60, where the circuit board 60 is connected to the electronic device 10 through a soldering and soldering process, and the plastic package material 20 is used to plastically mold the electronic device 10 to protect the electronic device 10.
The coating device comprises a circuit board surface 61, the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape 40 to form a coating attachment structure comprising the coating device and the adhesive tape, and the surface of one side of the coating attachment structure comprising the coating device, namely the surface of the other side of the coating device except the circuit board surface 61 and the surface of one side of the adhesive tape, is coated to form a coating layer 30; the coating device for forming the coating layer 30 and the adhesive tape 40 for forming the coating layer 30 are separated by a separation process, as shown in fig. 1, which is a schematic view of the effects of the coating device for forming the coating layer 30 and the adhesive tape 40 for forming the coating layer 30 after separation, and it can be seen that coating layer burrs 31 remain on the back surface of the coating device when the continuous coating layer 30 is broken in the separation process.
In the prior art, in order to remove coating layer burrs, the back of a coating device forming a coating layer is fixed upwards in a material receiving disc, and the coating layer burrs on the back of the coating device are removed by using a brush, but the following defects can exist in the process of removing the coating layer burrs on the back of the coating device: removing burrs by using an automatic brush or manual dust-free cloth, wherein the back of the film coating device has the risk of bad damage of the plate edges due to the external force of the brush or the dust-free cloth; the brush or the dust-free cloth is in contact friction with the film coating device, so that static electricity is easily generated, electrostatic breakdown of an electronic product is caused, and the electrical property of the film coating device is disabled; burrs are removed by a brush or dust-free cloth, the falling coating burrs are easy to remain on the back surface of the coating device, particularly on the concave welding pads and are difficult to remove, short circuit between the welding pads is caused by the conductive burrs, and the function of the coating device is invalid; in the process of wiping and deburring, the coating device can continuously move and rub in the carrying disc, so that the coating film is scratched or the substrate is damaged badly.
Disclosure of Invention
The invention aims to overcome the defects of the traditional film coating method and provides a preparation method of a burr-free film coating device, a film coating attaching structure and a device pickup structure.
In order to achieve the aim, the invention provides a preparation method of a burr-free coated device, which comprises the following steps:
providing a film coating device, wherein the film coating device comprises a circuit board surface;
attaching the circuit board surface of the film coating device to the surface of the adhesive layer of the adhesive tape to obtain a film coating attachment structure comprising the film coating device and the adhesive tape, wherein when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a concave part is formed on the surface of the adhesive layer on the outer side of the side wall of the film coating device;
forming a film coating layer with a preset thickness on the surface of one side, which contains a film coating device, of the film coating attaching structure based on a film coating process, wherein the included angle between the film coating layer on the surface of the adhesive tape at the concave part and the film coating layer on the side wall of the film coating device connected with the adhesive tape is more than 90 degrees and less than 180 degrees;
and separating the film coating device on the film coating attaching structure after the film coating layer is formed from the adhesive tape based on a separation process to obtain the film coating device with the film coating layer free of burrs.
As an implementation manner, a circuit board surface of the film coating device is attached to a glue layer surface of a tape, so as to obtain a film coating attachment structure including the film coating device and the tape, wherein when the circuit board surface is attached to the glue layer surface of the tape, the step of forming a recess on the glue layer surface outside a sidewall of the film coating device specifically includes:
the coating device is adsorbed in a picking cavity of a device picking structure by using a device picking structure, the shape and the size of the picking cavity are matched with those of the coating device, wherein the circuit board surface faces the opening of the picking cavity, other surfaces of the coating device except the circuit board surface face the inner wall surface of the picking cavity, and the part of the side wall of the picking cavity, which exceeds the circuit board surface, is provided with an outwards convex side wall foot; and attaching the circuit board surface of the film coating device adsorbed in the picking cavity to the surface of the adhesive layer of the adhesive tape to obtain a film coating attachment structure comprising the film coating device and the adhesive tape, wherein when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a concave part corresponding to the side wall foot is formed on the surface of the adhesive tape.
As an implementation mode, the device pickup structure is a vacuum suction nozzle, the pickup cavity is a suction nozzle cavity, a vacuum hole is formed in the upper side of the suction nozzle cavity, and the vacuum suction is performed through the vacuum hole to suck the film-coated device into the suction nozzle cavity.
As an implementation manner, when the plating device is adsorbed in the pickup cavity, a gap between the surface of the plating device facing the inner wall surface of the side wall of the pickup cavity and the inner wall surface of the side wall of the pickup cavity is larger than 0.1mm and smaller than or equal to a thickness value corresponding to a subsequently formed plating layer with a predetermined thickness.
As an implementation mode, the shape of the side basement is a V shape, and the shape of the surface of the adhesive tape at the concave position is a V shape.
As an implementation mode, the height of the side wall foot ranges from 5 um to 90 um.
As an implementation mode, the film coating device comprises an electronic device, a circuit board and a plastic package material, wherein the electronic device is electrically connected with the circuit board through a soldering tin or welding wire process, the electronic device and the circuit board which are electrically connected are subjected to plastic package based on the plastic package material to obtain a plastic package device, and the plastic package device is cut based on a cutting process to obtain a plurality of film coating devices with independent functional units.
As an implementable mode, the sticky tape is the PI material, the thickness range of sticky tape is 50 ~ 150um, the glue film is the silica gel material, the thickness range of glue film is 10 ~ 100 um.
Correspondingly, the invention also provides a coating attaching structure which comprises an adhesive tape and a coating device, wherein the circuit board surface of the coating device is attached to the adhesive layer surface of the adhesive tape, when the circuit board surface is attached to the adhesive layer surface of the adhesive tape, a depression is formed on the adhesive layer surface outside the side wall of the coating device, so that the included angle between the coating layer on the adhesive tape surface of the depression formed subsequently and the coating layer on the side wall of the coating device connected with the depression is larger than 90 degrees and smaller than 180 degrees.
Correspondingly, the invention also provides a device picking structure, which comprises a picking cavity, wherein the picking cavity is used for adsorbing the film-coated device in the picking cavity, the shape and the size of the picking cavity are adapted to the film plating device, the circuit board surface of the film plating device faces to the opening of the picking cavity, the other surfaces of the film plating device except the circuit board surface face the inner wall surface of the picking cavity, the part of the side wall of the picking cavity, which exceeds the circuit board surface, is provided with a convex side wall foot, so that when the circuit board surface of the film coating device absorbed in the picking cavity is bonded with the adhesive layer surface of the adhesive tape to obtain a film coating bonding structure comprising the film coating device and the adhesive tape, the surface of the adhesive tape is provided with a concave part corresponding to the side wall foot, and the included angle between the coating layer on the surface of the subsequently formed concave adhesive tape and the coating layer on the side wall of the coating device connected with the coating layer is larger than 90 degrees and smaller than 180 degrees.
The invention has the beneficial effects that: the invention provides a preparation method of a burr-free coating device, a coating attaching structure and a device pickup structure, wherein corresponding concave parts are formed on the surface of an adhesive tape, so that after a coating layer is formed on the coating attaching structure, the contact included angle between the coating layer on the side wall of the coating device and the coating layer on the surface of the adhesive tape at the concave parts is changed from the original 90-degree right angle to an obtuse angle of more than 90 degrees and less than 180 degrees, and when the coating device and the adhesive tape are separated, the coating device with a fracture section free of burrs is obtained by stretching and fracturing along the surface of the coating layer in the longitudinal direction.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a coated device and a tape separated in a conventional coating method.
Fig. 2 is a schematic step diagram of a method for manufacturing a burr-free coated device according to an embodiment of the invention.
Fig. 3 is a schematic cross-sectional structure diagram of a coated device adsorbed in a pickup cavity in the method for manufacturing a burr-free coated device according to the embodiment of the present invention.
Fig. 4 is a schematic cross-sectional structure diagram of the coating device adsorbed in the pickup cavity and the adhesive tape in the method for manufacturing a burr-free coating device according to the embodiment of the present invention.
Fig. 5 is a schematic cross-sectional structure view of the coating attachment structure in the method for manufacturing a burr-free coated device according to the embodiment of the present invention.
Fig. 6 is a schematic cross-sectional structure view of the plated film attachment structure after the surface of the plated film attachment structure is plated in the method for manufacturing a burr-free plated film device according to the embodiment of the present invention.
Fig. 7 is a schematic cross-sectional structure diagram of a coated device after being separated from an adhesive tape in the method for manufacturing a burr-free coated device according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to obtain a coating device without coating layer burrs, referring to fig. 2, this embodiment provides a technical solution: a preparation method of a burr-free film-coated device comprises the following steps:
step S100: providing a film coating device, wherein the film coating device comprises a circuit board surface;
step S200: attaching the circuit board surface of the film coating device to the surface of the adhesive layer of the adhesive tape to obtain a film coating attachment structure comprising the film coating device and the adhesive tape, wherein when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a concave part is formed on the surface of the adhesive layer on the outer side of the side wall of the film coating device;
step S300: forming a film coating layer with a preset thickness on the surface of one side, which contains a film coating device, of the film coating attaching structure based on a film coating process, wherein the included angle between the film coating layer on the surface of the adhesive tape at the concave part and the film coating layer on the side wall of the film coating device connected with the adhesive tape is more than 90 degrees and less than 180 degrees;
step S400: and separating the film coating device on the film coating attaching structure after the film coating layer is formed from the adhesive tape based on a separation process to obtain the film coating device with the film coating layer free of burrs.
Step S100 is executed, in this embodiment, the film plating device includes an electronic device, a circuit board, and a plastic package material, the electronic device is electrically connected to the circuit board through a soldering or wire bonding process, the electronic device and the circuit board which are electrically connected are plastic-packaged based on the plastic package material to obtain a plastic package device, and the plastic package device is cut based on a cutting process to obtain a plurality of film plating devices having independent functional units.
Specifically, the plastic package material is an epoxy plastic package material, and the electronic device is subjected to thermoplastic molding based on the epoxy plastic package material, wherein the electronic device is subjected to thermoplastic molding by generally adopting Transfer molding or Compression molding, so that the electronic device has certain structural strength and physical isolation.
The plastic package device includes a circuit board surface, the circuit board surface is the back of the plastic package device, and the plastic package device is formed and then further includes: and taking the surface opposite to the circuit board surface of the plastic package device as the front surface of the plastic package device for surface printing and recording related visual information, wherein the surface printing generally adopts a laser process, and the process has high contrast and cannot generate other negative effects.
In this embodiment, the cutting process is a blade mechanical cutting process, and if the cutting process is irregular, a laser cutting process may be used, but the cut section after the laser cutting is cleaned by a cleaning method such as dry ice cleaning, so as to ensure the adhesion of the coating film.
Executing step S200, and attaching the circuit board surface of the coating device to the adhesive layer surface of the adhesive tape to obtain a coating attachment structure comprising the coating device and the adhesive tape, wherein when the circuit board surface is attached to the adhesive layer surface of the adhesive tape, the step of forming a concave part on the adhesive layer surface outside the side wall of the coating device specifically comprises the following steps:
the coating device is adsorbed in a picking cavity of a device picking structure by using a device picking structure, the shape and the size of the picking cavity are matched with those of the coating device, wherein the circuit board surface faces the opening of the picking cavity, other surfaces of the coating device except the circuit board surface face the inner wall surface of the picking cavity, and the part of the side wall of the picking cavity, which exceeds the circuit board surface, is provided with an outwards convex side wall foot; and attaching the circuit board surface of the film coating device adsorbed in the picking cavity to the surface of the adhesive layer of the adhesive tape to obtain a film coating attachment structure comprising the film coating device and the adhesive tape, wherein when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a concave part corresponding to the side wall foot is formed on the surface of the adhesive tape.
As shown in fig. 3, as an embodiment, the device pickup structure may specifically be a vacuum suction nozzle, the pickup cavity may specifically be a suction nozzle cavity, the plating device includes a circuit board 60 and an electronic device 10 that is encapsulated by a molding compound 20, the plating device is absorbed in the suction nozzle cavity 50, the plating device includes a circuit board surface 61, and a portion of a side wall of the suction nozzle cavity 50 that exceeds the circuit board surface 61 has a side wall foot 52 with an outward convex shape, where the side wall foot may specifically be "V" shaped, and may also be "U" shaped or other outward convex shapes.
The upper side of the suction nozzle cavity 50 is provided with a vacuum hole 51, and the coating device is adsorbed in the suction nozzle cavity 50 by vacuum adsorption through the vacuum hole 51.
In this embodiment, the cutting process uses a cutting machine to perform mechanical cutting by a blade, and the sorting function carried by the cutting machine includes a vacuum suction nozzle, so that in the embodiment, the vacuum suction nozzle integrated in the cutting machine is directly utilized, and the vacuum suction nozzle is improved and then is adsorbed, so that a corresponding recess is formed on the surface of the adhesive tape, but in other examples, the recess can be formed on the surface of the adhesive layer on the outer side of the sidewall of the coating device in other manners to achieve the purpose.
Specifically, the device picking structure comprises a picking cavity, the bottom of a side wall of the picking cavity is specially designed, namely, a side wall corner with an outward convex shape is arranged at the bottom of the side wall of the picking cavity, the front face of the film coating device, namely the printing face of the film coating device, is sucked by the improved picking cavity, so that a corresponding concave part is formed on the surface of an adhesive tape when the film coating device adsorbed in the picking cavity is adhered to the adhesive tape at the later stage, and in addition, the side wall foot with the outward convex shape at the bottom of the side wall of the picking cavity also has the function of a guide frame, so that the film coating device can be smoothly guided into the picking cavity.
When the film coating device is attached to the pickup cavity, as shown in fig. 3, other surfaces of the film coating device except the circuit board surface 61 face the inner wall surface of the pickup cavity, and in order to enable the film coating device to be smoothly attached to the pickup cavity, an included angle larger than 90 degrees and smaller than 180 degrees can be formed between the film coating layer on the side wall of the film coating device and the film coating layer on the surface of the adhesive tape at the concave part of the adhesive tape connected with the film coating layer after film coating in the later period, and a gap larger than 0.1mm and smaller than or equal to a thickness value corresponding to a film coating layer with a predetermined thickness formed subsequently is formed between the surface of the film coating device facing the inner wall surface of the side wall of the pickup cavity and the inner wall surface of the side wall of the pickup cavity.
As shown in fig. 4, the coating device absorbed in the suction nozzle cavity 50 is adhered to an adhesive tape 40, specifically, a circuit board surface of the coating device is adhered to an adhesive layer of the adhesive tape 40, and a certain pressure is applied during the adhering process, so that the coating device can be fixed on the adhesive tape by the pressure, so that the circuit board surface of the coating device and the adhesive layer of the adhesive tape 40 are adhered to form a whole, and due to the convex design of the side wall foot at the bottom of the side wall of the suction nozzle cavity, in the process of adhering the coating device, the convex side wall foot 52 is synchronously pressed into the adhesive tape, the suction nozzle cavity 50 generates a downward shearing force on the adhesive tape 40, so that the adhesive tape 40 forms a corresponding concave 41, and when the side wall foot is in a "V" shape, the concave shape is also in a "V" shape, and finally, the coating attaching structure including the coating device and the adhesive tape shown in fig. 5 is obtained, and no gap is formed between the obtained adhesive tape and the coating device, so that the subsequent coating operation is facilitated, and the finger diffusion coating of the circuit board surface of the coating device is avoided.
The adhesive tape is made of PI (polyimide), the thickness range of the adhesive tape is 50-150 um, the adhesive layer is made of silica gel, and the thickness range of the adhesive layer is 10-100 um; the height range of the side wall foot is 5-90 um.
Step 300 is executed, a coating carrier is attached to the bottom of the adhesive tape of the coating attachment structure, the coating carrier attached with the coating attachment structure is placed into a coating machine, and a coating layer with a preset thickness is coated on the surface of one side of the coating attachment structure, which contains a coating device, by means of a coating process, wherein the coating process is the prior art, and detailed description is omitted in this embodiment.
After the coating process is completed, as shown in fig. 6, a uniform coating layer 30 is formed on the primary surface of the coating device on the coating attachment structure, that is, the surface of the tape attached to the side of the coating device, excluding the other surfaces of the circuit board surface, including the surface of the tape at the bottom edge of the coating device, wherein the surface of the tape at the recess 41 includes an angle of greater than 90 ° and less than 180 °.
Step S400 is executed, the bottom edge of the coated device is separated from the V-shaped recess of the adhesive tape by a separation process, in this embodiment, a blanking machine is used for separation, as shown in fig. 7, it can be seen that the fracture section 31 of the coating layer at the bottom of the upper sidewall of the coated device after separation is burr-free, and the removed coated device on which the coating layer is formed is sequentially placed into a material receiving tray.
In the embodiment, the side wall foot with the convex shape is designed by designing the special shape of the bottom of the side wall of the pickup cavity, and applying pressure to stick the pickup cavity and the coating device on the surface of the adhesive tape by using the pickup cavity to make the surface of the adhesive tape generate concave deformation to form a concave part corresponding to the side wall foot, the contact included angle between the coating layer on the side wall of the coating device and the coating layer on the surface of the adhesive tape at the concave part is changed from the original 90-degree right angle to an obtuse angle which is more than 90 degrees and less than 180 degrees, when the coating layer on the bottom edge of the outer side of the side wall of the coating device is disconnected with the coating layer on the surface of the adhesive tape at the concave part, the coating layer is longitudinally stretched and fractured along the surface of the coating layer, and the coating layer on the adhesive tape is stripped and remained on the coating device due to the transverse stripping fracture surface of the coating device in the non-traditional process, so that no burrs are left on the fracture section of the finally obtained coating device.
Based on the same invention concept, the embodiment of the invention also provides a coating attaching structure, which comprises an adhesive tape and a coating device, wherein the circuit board surface of the coating device is attached to the surface of the adhesive layer of the adhesive tape, when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a depression is formed on the surface of the adhesive layer outside the side wall of the coating device, so that the included angle between the coating layer on the surface of the subsequently formed depression adhesive tape and the coating layer on the side wall of the coating device connected with the depression is larger than 90 degrees and smaller than 180 degrees; and separating the film coating device on the film coating attaching structure with the formed film coating layer from the adhesive tape based on a separation process to obtain the film coating device with the film coating layer free of burrs.
Based on the same conception, the embodiment of the invention also provides a device pickup structure for preparing a burr-free coated device, which comprises a pickup cavity, wherein the pickup cavity is used for adsorbing the coated device in the pickup cavity, the shape and the size of the pickup cavity are adaptive to the coated device, the circuit board surface of the coated device faces to the opening of the pickup cavity, the other surfaces of the coated device except the circuit board surface face to the inner wall surface of the pickup cavity, the part of the side wall of the pickup cavity, which exceeds the circuit board surface, is provided with a convex side wall foot, so that when the circuit board surface of the coated device adsorbed in the pickup cavity is attached to the adhesive layer surface of an adhesive tape to obtain a coated attaching structure comprising the coated device and the adhesive tape, the adhesive tape surface is provided with a concave part corresponding to the side wall foot, and a coated layer on the surface of the subsequently formed concave part adhesive tape and a coated layer on the side wall of the coated device connected with the adhesive tape are formed The included angle between the two is more than 90 degrees and less than 180 degrees; and the upper side of the picking cavity is provided with a vacuum hole, and the coating device is adsorbed in the picking cavity by vacuum adsorption through the vacuum hole.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (10)
1. The preparation method of the burr-free film coating device is characterized by comprising the following steps of:
providing a film coating device, wherein the film coating device comprises a circuit board surface;
attaching the circuit board surface of the film coating device to the surface of the adhesive layer of the adhesive tape to obtain a film coating attachment structure comprising the film coating device and the adhesive tape, wherein when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a concave part is formed on the surface of the adhesive layer on the outer side of the side wall of the film coating device;
forming a film coating layer with a preset thickness on the surface of one side, which contains a film coating device, of the film coating attaching structure based on a film coating process, wherein the included angle between the film coating layer on the surface of the adhesive tape at the concave part and the film coating layer on the side wall of the film coating device connected with the adhesive tape is more than 90 degrees and less than 180 degrees;
and separating the film coating device on the film coating attaching structure after the film coating layer is formed from the adhesive tape based on a separation process to obtain the film coating device with the film coating layer free of burrs.
2. The method according to claim 1, wherein the step of attaching the circuit board surface of the plating device to the adhesive layer surface of an adhesive tape to obtain a plating attachment structure comprising the plating device and the adhesive tape, wherein when the circuit board surface is attached to the adhesive layer surface of the adhesive tape, the step of forming the depressions on the adhesive layer surface outside the sidewalls of the plating device specifically comprises:
the coating device is adsorbed in a picking cavity of a device picking structure by using a device picking structure, the shape and the size of the picking cavity are matched with those of the coating device, the circuit board surface faces an opening of the picking cavity, other surfaces of the coating device except the circuit board surface face the inner wall surface of the picking cavity, and the part of the side wall of the picking cavity, which exceeds the circuit board surface, is provided with an outward convex side wall pin; and attaching the circuit board surface of the film coating device adsorbed in the picking cavity to the surface of the adhesive layer of the adhesive tape to obtain a film coating attachment structure comprising the film coating device and the adhesive tape, wherein when the circuit board surface is attached to the surface of the adhesive layer of the adhesive tape, a concave part corresponding to the side wall foot is formed on the surface of the adhesive tape.
3. The method according to claim 2, wherein the device pick-up structure is a vacuum suction nozzle, the pick-up cavity is a suction nozzle cavity, and a vacuum hole is formed at an upper side of the suction nozzle cavity, and the coated device is sucked into the suction nozzle cavity by vacuum suction through the vacuum hole.
4. The method according to claim 2, wherein when the plating device is attached to the pickup chamber, a gap having a thickness value greater than 0.1mm and less than or equal to a thickness value corresponding to a subsequently formed plating layer of a predetermined thickness is formed between a surface of the plating device facing the inner wall surface of the side wall of the pickup chamber and the inner wall surface of the side wall of the pickup chamber.
5. The method for preparing the burr-free film-coated device according to claim 2, wherein the shape of the side wall foot is a V shape, and the shape of the surface of the adhesive tape at the concave part is a V shape.
6. The method for preparing the burr-free film-coated device according to claim 2, wherein the height of the side wall foot ranges from 5 to 90 um.
7. The method according to claim 1, wherein the film-coated device comprises an electronic device, a circuit board and a plastic package material, the electronic device is electrically connected with the circuit board through a soldering or welding process, the electrically connected electronic device and the circuit board are subjected to plastic package based on the plastic package material to obtain a plastic package device, and the plastic package device is cut based on a cutting process to obtain a plurality of film-coated devices with independent functional units.
8. The method according to claim 1, wherein the adhesive tape is made of PI, the thickness of the adhesive tape is 50-150 μm, the adhesive layer is made of silica gel, and the thickness of the adhesive layer is 10-100 μm.
9. The utility model provides a coating film laminated structure, its characterized in that includes sticky tape and coating film device, the circuit face of coating film device and the laminating of the glue film surface of sticky tape, wherein, the circuit face with when the glue film surface laminating of sticky tape, the lateral wall outside of coating film device the glue film surface is formed with the depressed part for the contained angle between the coating film layer on the depressed part sticky tape surface of follow-up formation and the coating film layer of being connected with it on the lateral wall of coating film device is for being greater than 90 and being less than 180.
10. A device picking structure is characterized by comprising a picking cavity, wherein the picking cavity is used for adsorbing a film-coated device in the picking cavity, the shape and the size of the picking cavity are adapted to the filming device, the circuit board surface of the filming device faces to the opening of the picking cavity, the other surfaces of the film plating device except the circuit board surface face the inner wall surface of the picking cavity, the part of the side wall of the picking cavity, which exceeds the circuit board surface, is provided with a convex side wall foot, so that when the circuit board surface of the film coating device absorbed in the picking cavity is bonded with the adhesive layer surface of the adhesive tape to obtain a film coating bonding structure comprising the film coating device and the adhesive tape, the surface of the adhesive tape is provided with a concave part corresponding to the side wall foot, and the included angle between the coating layer on the surface of the subsequently formed concave adhesive tape and the coating layer on the side wall of the coating device connected with the coating layer is larger than 90 degrees and smaller than 180 degrees.
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| JP2003218184A (en) * | 2002-01-18 | 2003-07-31 | Yokogawa Electric Corp | Device carrying method and device handler |
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