CN219132915U - Combined plastic sealing device - Google Patents
Combined plastic sealing device Download PDFInfo
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- CN219132915U CN219132915U CN202223357284.9U CN202223357284U CN219132915U CN 219132915 U CN219132915 U CN 219132915U CN 202223357284 U CN202223357284 U CN 202223357284U CN 219132915 U CN219132915 U CN 219132915U
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Abstract
The utility model discloses a composite plastic sealing device, which comprises a first die, a second die, a substrate and a fixing assembly, wherein the first die is arranged on the substrate; the first die comprises a forming cavity which is an open cavity, the second die comprises a substrate carrier plate, the first die is in butt joint with the second die, the opening of the forming cavity is in butt joint with the substrate carrier plate, the forming cavity and the substrate carrier plate are enclosed to form a plastic package space, the forming cavity is used for filling and forming plastic package materials, and the substrate carrier plate is used for supporting a substrate; the fixed subassembly includes the clamp plate, base plate and clamp plate set up in the plastic envelope space, and the plastic envelope material is connected with the upper surface part of base plate, and the clamp plate is connected with the base plate carrier plate, and the lower surface of clamp plate and the other part of upper surface contact of base plate, and the clamp plate presss from both sides the base plate in the upper surface of base plate carrier plate. The plastic package device disclosed by the scheme is characterized in that the substrate in the cavity is fixed by pressing through the fixing component, so that the substrate is prevented from warping or displacing under the action of the adhesive driving of the plastic package material, and the problem that the plastic package product is damaged due to adhesion deformation is solved.
Description
Technical Field
The utility model relates to the technical field of IC plastic packaging, in particular to a compound plastic packaging device.
Background
In the conventional plastic packaging mold for the IC board plastic packaging process, the situation that an IC plastic packaging material piece is stuck on the inner surface of a mold cavity of the mold and is not completely separated from the mold often occurs in the conventional mold opening process of a plastic packaging product, so that the plastic packaging product is damaged in the mold cavity of the mold, the surface (lower surface measured in the mold cavity) of the plastic packaging mold has a substrate vacuum adsorption function, and the state of the substrate can be effectively detected before plastic packaging. However, in the mold opening process of the mold, the substrate and the plastic packaging material are adhered, the substrate is warped to cause vacuum failure of the substrate and the substrate is away, the substrate is warped due to damage of the edge of the substrate before plastic packaging, vacuum adsorption cannot be normally performed due to deformation of the substrate, the product is not completely separated from the upper mold after mold opening, during production of the plastic packaging mold, the plastic packaging material is easy to adhere to the surface of the mold (the upper surface of the inner side of the mold cavity) due to certain viscosity of the plastic packaging material, the product is easy to damage in appearance, unnecessary loss is caused, a user needs to clean and moisten the inner space of the mold cavity of the plastic packaging mold, the manufacturing cost is increased, the plastic packaging product is stuck to the mold and the substrate is scratched to cause unnecessary loss, and the substrate is warped to cause vacuum alarm of the substrate, so that the plastic packaging equipment is stopped and cannot be continuously produced.
Disclosure of Invention
The embodiment of the utility model provides a composite plastic packaging device, which aims to solve the problem that a plastic packaging product is stuck to a mould to damage a substrate in the prior art method.
The embodiment of the utility model discloses a composite plastic sealing device, which comprises a first die, a second die, a substrate and a fixing assembly, wherein the first die is arranged on the substrate; the first die comprises a forming cavity which is an open cavity, the second die comprises a substrate carrier plate, the first die is in butt joint with the second die, the opening of the forming cavity is in butt joint with the substrate carrier plate, the forming cavity and the substrate carrier plate are enclosed to form a plastic package space, the forming cavity is used for filling and forming plastic package materials, and the substrate carrier plate is used for supporting a substrate; the fixed subassembly includes the clamp plate, base plate and clamp plate set up in the plastic envelope space, and the plastic envelope material is connected with the upper surface part of base plate, and the clamp plate is connected with the base plate carrier plate, and the lower surface of clamp plate and the other part of upper surface contact of base plate, and the clamp plate presss from both sides the base plate in the upper surface of base plate carrier plate.
Further, the upper surface of the pressing plate is abutted to the edge of the bottom of the side wall of the forming cavity, the fixing assembly comprises an elastic piece, and the pressing plate is connected with the substrate carrier plate through the elastic piece.
Further, a sealing interlayer is arranged on the butt joint contact surface of the first die and the pressing plate.
Further, the pressing plate is arranged in the forming cavity, and the pressing plate is connected with the substrate carrier plate through the movable connecting piece.
Further, a sealing interlayer is arranged on the butt joint contact surface of the first die and the substrate carrier plate.
Further, a feeding hole is formed in a side wall surface, opposite to the substrate carrier plate, of the first die, and the forming cavity is communicated with a feeder through the feeding hole.
Further, the substrate carrier plate is provided with a positioning needle, the substrate is provided with a positioning hole, and the positioning hole is used for penetrating the positioning needle.
Further, a coating layer is arranged on the inner side wall surface of the first die, and the coating layer is used for spacing the first die and the plastic packaging material.
Further, the upper surface of the substrate carrier plate is provided with a sucker, and the substrate carrier plate is connected with the substrate in a vacuum adsorption mode through the sucker.
According to the composite plastic packaging device, the substrate in the cavity is fixed in a pressing mode through the fixing assembly, the substrate is prevented from warping or displacing under the bonding driving action of the plastic packaging material, and the problem that a plastic packaging product is damaged due to adhesion deformation in the plastic packaging device is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an overall structure of a composite molding device according to an embodiment of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As shown in fig. 1, the composite plastic sealing device provided in the present embodiment includes a first mold 1, a second mold 2, a substrate 3, and a fixing component; the first die 1 comprises a forming cavity, the forming cavity is an open cavity, the second die 2 comprises a substrate carrier plate, the first die 1 is in butt joint with the second die 2, the opening of the forming cavity is in butt joint with the substrate carrier plate, the forming cavity and the substrate carrier plate are enclosed to form a plastic package space, the forming cavity is used for filling and forming a plastic package material 4, and the substrate carrier plate is used for supporting a substrate 3; the fixed subassembly includes the clamp plate, base plate 3 and clamp plate set up in the plastic envelope space, and plastic envelope material 4 is connected with the upper surface part of base plate 3, and the clamp plate is connected with the base plate carrier plate, and the lower surface of clamp plate contacts with the upper surface other part of base plate 3, and the clamp plate presss from both sides base plate 3 in the upper surface of base plate carrier plate.
In an actual use scene, the composite plastic sealing device disclosed by the scheme is characterized in that a device integral structure is formed by vertically butt-jointing a first die 1 and a second die 2, the first die 1 and the second die 2 are in composite connection to form a plastic sealing space, the plastic sealing space is used for solidifying and forming a liquid plastic sealing material 4, the plastic sealing material 4 is in contact with a substrate 3 in the plastic sealing space and is subjected to a substrate 3 plastic sealing process, after the plastic sealing material 4 is solidified and formed, the first die 1 is separated from the second die 2, and the substrate 3 plastic sealing process is completed; more specifically, a fixing component is arranged in the composite plastic packaging device and used for strengthening the stability of the substrate 3 in the process of solidifying and forming the plastic packaging material 4 and separating the dies, the fixing component is used for stably pressing the substrate 3 on the second die 2, so that the substrate 3 is prevented from being warped at the edge in the process of forming the plastic packaging material 4, and the substrate 3 is prevented from being damaged by adhesion between the plastic packaging material 4 and the substrate 3 and dragging the substrate 3 when the first die 1 is separated from the second die 2; more specifically, a molding cavity is arranged in the first mold 1, one side of the second mold 2, which is close to the first mold 1, is a plane for supporting objects, a substrate carrier plate is arranged on the second mold 2 and is used for supporting a substrate 3, the first mold 1 is covered on the second mold 2, an opening of the molding cavity, which faces the second mold 2, is in butt joint with the substrate carrier plate and is enclosed, an inner cavity of the molding cavity, which is taken as a molding device, is a molding process construction space of the molding material 4 and the substrate 3, after the inner cavity space of the molding device is constructed, the molding material 4 is poured into the molding cavity and begins to be solidified and molded, at the moment, the substrate 3 supports the molding material 4 under the support of the substrate carrier plate, the base plate carrier plate is directly connected with the edge of the bottom part of the side wall of the first die 1, the upper surface of the base plate carrier plate is connected with the pressing plate in the fixing component, the pressing plate is arranged inside the forming cavity, the lower surface of the pressing plate is contacted with the rest part of the upper surface of the base plate 3, the bottom surface of the pressing plate is abutted with the part of the upper surface of the base plate 3 so as to press the base plate 3 on the upper surface of the base plate carrier plate, the pressing plate can be arranged at the position of the edge in the forming cavity, the space condition of manual position adjustment is reserved for the base plate 3, and meanwhile, the problem of edge warping risk in the plastic packaging process caused by complete contact between the edge of the base plate 3 and the plastic packaging material 4 is further prevented.
In conclusion, the combined type plastic packaging device completes the installation and edge fixation of the substrate 3 before the plastic packaging process of the substrate 3 is carried out in a mode of combining the die with the built-in substrate 3 to ensure that the substrate 3 keeps stable plane in the plastic packaging process of plastic packaging material 4 pouring and fixed molding, prevent the substrate 3 from warping and moving at the edge in the plastic packaging process, avoid the problem that the substrate 3 is passively adhered and dragged due to the adhesion of the first die 1 and the second die 2 to the upper surface of the substrate 3 in the separation process because of the adhesion of the plastic packaging material 4, well solve the problem of adhesion instability of a material part received by the plastic packaging process of the substrate 3, reduce the damage rate of the substrate 3, improve the plastic packaging efficiency and success rate of the substrate 3 and save the cleaning cost of the cavity space of the plastic packaging device.
Further, the upper surface of the pressing plate is abutted with the edge of the bottom of the side wall of the forming cavity, the fixing assembly comprises an elastic piece 5, and the pressing plate is connected with the substrate carrier plate through the elastic piece 5.
Specifically, the fixed subassembly still includes the elastic component 5 that has elastic connection function, the elastic component 5 is the spring in preference, the upper surface of elastic component 5 connection base plate support plate and the lower surface of clamp plate, the clamp plate receives the influence of elastic component 5 to the pressfitting intensity of base plate 3, set up the clamp plate on the position of base plate support plate edge for when first mould 1 takes place to dock with second mould 2, the bottom edge of first mould 1 lateral wall and the upper surface butt of clamp plate, first mould 1 exerts pressure to the clamp plate in the butt joint in-process with second mould 2, the clamp plate moves down and presss from both sides in the upper surface of base plate 3 under the shrink effect of elastic component 5, namely, the user can adjust the pressfitting intensity of clamp plate under the effect of elastic component 5 according to actual base plate 3 thickness, the pressure that makes base plate 3 receive is controllable, wall base plate 3 receives too big pressure and takes place to warp.
Further, a sealing interlayer is arranged on the abutting contact surface of the first die 1 and the pressing plate.
Specifically, the bottom edge of part of the side wall of the first die 1 is in direct contact with the upper surface of the pressing plate, a sealing interlayer is arranged on the contact surface of the bottom edge of the side wall of the first die and the upper surface of the pressing plate, the tightness of the molding cavity is enhanced, leakage of the molding material 4 is prevented, and the effectiveness of the molding process is ensured.
Further, the pressing plate is arranged in the forming cavity and is connected with the substrate carrier plate through the movable connecting piece.
Specifically, set up the clamp plate in the shaping intracavity, after compound installation of first mould 1 and second mould 2, the clamp plate is accomplished to be connected and is pressed together base plate 3 with the base plate carrier plate in the shaping intracavity, and the clamp plate is connected with the base plate carrier plate through movable connection spare, and the user is nimble adjusts the relative position relation between clamp plate and the base plate 3 through adjusting movable connection spare, optimizes the fixed effect of clamp plate to base plate 3, prevents that base plate 3 from excessive pressure is impaired.
Further, a sealing interlayer is arranged on the butt joint contact surface of the first die 1 and the substrate carrier plate.
Specifically, the bottom surface of the side wall of the first mold 1 is in direct contact with the substrate carrier, and the sealing interlayer is arranged on the contact surface, so that the plastic sealing tightness between the plastic sealing material 4 in the molding cavity and the substrate 3 is enhanced.
Further, a feeding hole is formed in a side wall surface, opposite to the substrate carrier plate, of the first die 1, and the forming cavity is communicated with the feeder through the feeding hole.
Specifically, the substrate carrier plate is opposite to and parallel to the top surface of the first die 1, a feeding hole is formed in the top surface of the first die 1, the feeding hole is communicated with the forming cavity, a plastic package material 4 is poured into the forming cavity, and the plastic package material 4 is in direct contact with the substrate 3 in the forming cavity to complete the plastic package process.
Further, the substrate carrier plate is provided with positioning pins, the substrate 3 is provided with positioning holes, and the positioning holes are used for penetrating the positioning pins.
Specifically, the positioning pins are arranged on the substrate carrier, the substrate 3 is mounted on the upper surface of the substrate carrier, the corresponding positioning holes are arranged on the substrate 3 for penetrating the positioning pins, corresponding mounting position determining conditions between the substrate 3 and the substrate carrier are formed, and sliding deviation of the substrate 3 on the substrate carrier can be prevented.
Further, a coating layer is arranged on the inner side wall surface of the first die 1, and the coating layer is used for spacing the first die 1 and the plastic packaging material 4.
Specifically, the inner wall surface of the first mold 1 is in direct contact with the plastic package material 4, and a coating layer is arranged on the wall surface to prevent poor adhesion between the plastic package material 4 and the first mold 1, so that the problem that the plastic package material 4 is driven by the first mold 1 to adhere and drag the substrate 3 can be solved, and the stability of the substrate 3 in the plastic package process can be maintained.
Further, a sucking disc is arranged on the upper surface of the substrate carrier plate, and the substrate carrier plate is connected with the substrate 3 through vacuum adsorption by the sucking disc.
Specifically, the upper surface of the substrate carrier plate is provided with a sucker for forming a connection condition for vacuum sucking the substrate 3, so that the bearing effect of the substrate carrier plate on the substrate 3 is enhanced.
The utility model discloses a composite plastic sealing device which comprises a first die 1, a second die 2, a substrate 3 and a fixing assembly, wherein the first die is arranged on the substrate; the first die 1 comprises a forming cavity, the forming cavity is an open cavity, the second die 2 comprises a substrate carrier plate, the first die 1 is in butt joint with the second die 2, the opening of the forming cavity is in butt joint with the substrate carrier plate, the forming cavity and the substrate carrier plate are enclosed to form a plastic package space, the forming cavity is used for filling and forming a plastic package material 4, and the substrate carrier plate is used for supporting a substrate 3; the fixed subassembly includes the clamp plate, base plate 3 and clamp plate set up in the plastic envelope space, and plastic envelope material 4 is connected with the upper surface part of base plate 3, and the clamp plate is connected with the base plate carrier plate, and the lower surface of clamp plate contacts with the upper surface other part of base plate 3, and the clamp plate presss from both sides base plate 3 in the upper surface of base plate carrier plate. The upper surface of the substrate carrier plate is connected with a pressing plate in the fixing assembly, the pressing plate is arranged in the forming cavity, the lower surface of the pressing plate is contacted with the rest part of the upper surface of the substrate 3, the bottom surface of the pressing plate is abutted with part of the upper surface of the substrate 3 so as to press the substrate 3 on the upper surface of the substrate carrier plate, the pressing plate can be arranged at a position which is more marginal in the forming cavity, the space condition of manual position adjustment is reserved for the substrate 3, and meanwhile, the problem of edge warping risk in the plastic packaging process caused by complete contact between the edge of the substrate 3 and the plastic packaging material 4 is further prevented; the substrate 3 is mounted and edge-fixed before the plastic packaging process of the substrate 3 is carried out, so that the substrate 3 is kept planar stably in the plastic packaging material 4 pouring and fixing molding plastic packaging process, edge warping and movement of the substrate 3 in the plastic packaging process are prevented, the problem that the substrate 3 is passively adhered and dragged due to adhesion of the plastic packaging material 4 to the upper surface of the substrate 3 in the separation process of the first die 1 and the second die 2 is avoided, the problem of material adhesion instability of the substrate 3 in the plastic packaging process is well solved, the damage rate of the substrate 3 is reduced, the plastic packaging efficiency and the success rate of the substrate 3 are improved, and the cleaning cost of the cavity space of the plastic packaging device is saved.
The present utility model is not limited to the above embodiments, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the present utility model, and these modifications and substitutions are intended to be included in the scope of the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a compound plastic envelope device for base plate plastic envelope, its characterized in that includes: the device comprises a first die, a second die, a substrate and a fixing assembly;
the first die comprises a forming cavity, the forming cavity is an opening cavity, the second die comprises a substrate carrier plate, the first die is in butt joint with the second die, an opening of the forming cavity is in butt joint with the substrate carrier plate, the forming cavity and the substrate carrier plate are enclosed to form a plastic package space, the forming cavity is used for filling and forming plastic package materials, and the substrate carrier plate is used for supporting a substrate;
the fixing component comprises a pressing plate, the substrate and the pressing plate are arranged in the plastic packaging space, the plastic packaging material is in partial contact with the upper surface of the substrate, the pressing plate is connected with the substrate carrier, the lower surface of the pressing plate is in contact with the rest of the upper surface of the substrate, and the pressing plate is used for pressing the substrate on the upper surface of the substrate carrier.
2. The composite plastic packaging device of claim 1, wherein the upper surface of the pressing plate abuts against the bottom edge of the side wall of the molding cavity, the fixing assembly comprises an elastic piece, and the pressing plate is connected with the substrate carrier plate through the elastic piece.
3. The composite plastic packaging device of claim 2, wherein a sealing interlayer is disposed on a butt-joint contact surface of the first mold and the pressing plate.
4. The composite plastic packaging device of claim 1, wherein the pressure plate is disposed in the molding cavity, and the pressure plate is connected to the substrate carrier plate through a movable connection.
5. The composite plastic packaging device of claim 4, wherein a sealing interlayer is disposed on a butt-joint contact surface of the first mold and the substrate carrier.
6. The composite plastic packaging device of claim 1, wherein a feeding hole is formed in a side wall surface of the first die, which is opposite to the substrate carrier plate, and the forming cavity is communicated with a feeder through the feeding hole.
7. The composite plastic packaging device of claim 1, wherein the substrate carrier is provided with positioning pins, and the substrate is provided with positioning holes for passing through the positioning pins.
8. The composite plastic packaging device of claim 1, wherein a coating layer is disposed on an inner sidewall surface of the first mold, and the coating layer is used for spacing the first mold and the plastic packaging material.
9. The composite plastic packaging device of claim 1, wherein the upper surface of the substrate carrier is provided with a suction cup, and the substrate carrier is connected with the substrate by vacuum suction through the suction cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223357284.9U CN219132915U (en) | 2022-12-14 | 2022-12-14 | Combined plastic sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223357284.9U CN219132915U (en) | 2022-12-14 | 2022-12-14 | Combined plastic sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219132915U true CN219132915U (en) | 2023-06-06 |
Family
ID=86565704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223357284.9U Active CN219132915U (en) | 2022-12-14 | 2022-12-14 | Combined plastic sealing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219132915U (en) |
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2022
- 2022-12-14 CN CN202223357284.9U patent/CN219132915U/en active Active
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