CN114615827A - Seamless welding flexible circuit board assembling method - Google Patents
Seamless welding flexible circuit board assembling method Download PDFInfo
- Publication number
- CN114615827A CN114615827A CN202210310836.6A CN202210310836A CN114615827A CN 114615827 A CN114615827 A CN 114615827A CN 202210310836 A CN202210310836 A CN 202210310836A CN 114615827 A CN114615827 A CN 114615827A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit area
- circuit
- copper foil
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229920001721 polyimide Polymers 0.000 claims abstract description 71
- 239000004642 Polyimide Substances 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000011889 copper foil Substances 0.000 claims abstract description 50
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 230000004927 fusion Effects 0.000 claims abstract description 10
- 238000004080 punching Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 143
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a seamless welding flexible circuit board assembling method, which comprises the following steps: pre-attaching a polyimide film at the top of a circuit area and a glue layer at the top of the circuit area together, punching at a welding position after pre-attaching to form an opening between the polyimide film and the glue layer, and then laminating the polyimide film at the top of the circuit area and the glue layer at the top of the circuit area on a copper foil layer, wherein the copper foil layer forms a required conducting circuit through dry film pressing, exposure, development, etching and film stripping; pre-bonding a polyimide layer at the bottom of the circuit area and a glue layer at the bottom of the circuit area together, punching at a welding position after pre-bonding to form an opening between the polyimide layer and the glue layer, and laminating the polyimide layer at the bottom of the circuit area and the glue layer at the bottom of the circuit area under the copper foil layer; after the welding zone copper foil layer between two adjacent flexible line way board bodies overlaps and aligns, use ultrasonic welding equipment to carry out the butt fusion operation. The welding process has no spark and is environment-friendly and safe.
Description
Technical Field
The invention relates to the technical field of flexible circuit board assembly, in particular to a seamless welding flexible circuit board assembly method.
Background
In recent years, electronic accessories have come into widespread use in various fields and are being updated at a development rate of several generations per year. Printed circuit boards, which are important components of electronic accessories, are also continuously perfected and updated. The FPC is a main development trend of the printed circuit board due to its characteristics of convenience, smallness, high density, and high performance. Along with the improvement of living standard of people, the material aspect also has certain requirement to the aspect thereupon, especially in the aspect of electronic auxiliary material, not only explains practicality pleasing to the eye, also the requirement in the aspects such as volume, integrated level, function of auxiliary material is more and more high. With the development of the industry, the application field of the FPC is continuously increased, the demand is continuously increased, the requirements on the FPC are also diversified, and in order to better meet the market demand, expand more use spaces and reduce the production cost, the product process needs to be continuously optimized.
Aiming at large-size FPC products, the processing can not be finished at one time, a plurality of FPCs are required to be assembled together, and a welding technology is used at a joint.
Disclosure of Invention
The invention aims to provide a seamless welding flexible circuit board assembling method, which has no spark in the welding process, is environment-friendly and safe, and can ensure that the resistivity of a circuit is extremely low and is almost zero.
In order to achieve the above object, the present application provides a method for assembling a seamlessly welded flexible printed circuit, including: pre-laminating a polyimide film on the top of a circuit area and a glue layer on the top of the circuit area together, punching at a welding position after pre-laminating to form an opening between the polyimide film and the glue layer on the top of the circuit area, and then laminating the polyimide film on the top of the circuit area and the glue layer on the top of the circuit area on a copper foil layer, wherein the copper foil layer forms a required conducting circuit through dry film pressing, exposure, development, etching and film stripping;
pre-bonding a polyimide layer at the bottom of the circuit area and a glue layer at the bottom of the circuit area together, punching at a welding position after pre-bonding to form an opening between the polyimide layer and the glue layer, and laminating the polyimide layer at the bottom of the circuit area and the glue layer at the bottom of the circuit area under the copper foil layer;
after the welding zone copper foil layer between two adjacent flexible line way board bodies overlaps and aligns, use ultrasonic welding equipment to carry out the butt fusion operation.
Further, pass through the laminating of welding zone top glue film with welding zone top polyimide layer on the copper foil layer after the butt fusion operation, the laminating of welding zone bottom polyimide layer passes through welding zone bottom glue film below the copper foil layer after the butt fusion.
Further, the welding zone top glue layer completely covers the welding part and extends to the positions above the circuit zone top polyimide layers on the two sides during fitting, the welding zone bottom glue layer completely covers the positions below the welding part and extends to the positions below the circuit zone bottom polyimide layers on the two sides, and then pressing operation is conducted.
Furthermore, the flexible circuit board body comprises a circuit area top polyimide layer, a copper foil layer and a circuit area bottom polyimide layer, wherein the circuit area top polyimide layer is laid on the copper foil layer through a circuit area top adhesive layer, the circuit area bottom polyimide layer is laid below the copper foil layer through a circuit area bottom adhesive layer, and a conducting circuit is formed on the copper foil layer; and the circuit area top polyimide layer, the circuit area top adhesive layer, the circuit area bottom polyimide layer and the circuit area bottom adhesive layer are provided with notches at the welding ends so that the copper foil layer is exposed.
Furthermore, the thickness of the glue layer at the top of the welding area is larger than the sum of the thicknesses of the polyimide layer at the top of the circuit area and the glue layer at the top of the circuit area at two sides, and the thickness of the glue layer at the bottom of the welding area is larger than the sum of the thicknesses of the polyimide layer at the bottom of the circuit area and the glue layer at the bottom of the circuit area at two sides.
Furthermore, when the polyimide layer at the top of the circuit area and the copper foil layer are pressed together, the glue layer at the top of the circuit area flows to fill the gaps between the circuits, and when the polyimide layer at the bottom of the circuit area and the copper foil layer are pressed together, the glue layer at the bottom of the circuit area flows to fill the gaps between the circuits.
Compared with the prior art, the technical scheme adopted by the invention has the advantages that: the method can realize seamless welding of the flexible circuit board body, can ensure that the electrical resistivity of the circuit is extremely low and is almost zero, and has no spark in the welding process, environmental protection and safety; the outer layer of the welding zone is provided with the polyimide layer for insulation, the tensile strength is high, the welding line part can be effectively protected, and the welding zone has the characteristics of moisture resistance, water resistance, corrosion resistance and the like. The size of the FPC far exceeds the conventional size under the condition of keeping the performance of the product unchanged through a welding mode, various three-dimensional space wiring requirements can be matched as required, the overall wiring weight is light, and the space occupancy rate is low.
Drawings
FIG. 1 is a schematic structural diagram of a flexible circuit board body;
FIG. 2 is a cross-sectional view of two adjacent flexible printed circuit boards before welding;
fig. 3 is a cross-sectional view of two adjacent flexible circuit board bodies after welding.
Wherein: 1. circuit district top polyimide layer, 2, circuit district top glue film, 3, copper foil layer, 4, circuit district bottom glue film, 5, circuit district bottom polyimide layer, 6, the copper foil layer that exposes, 7, welding district top polyimide layer, 8, welding district top glue film, 9, welding district bottom glue film, 10, welding district bottom polyimide layer, 11, the copper foil layer after the butt fusion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the application, i.e., the embodiments described are only a subset of, and not all embodiments of the application. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
Example 1
As shown in fig. 1 to 3, the present embodiment provides a method for assembling a seamlessly welded flexible printed circuit board, including: a method of assembling a seamlessly fused flexible circuit board, comprising: pre-bonding a polyimide film on the top of the circuit area and a glue layer on the top of the circuit area together, wherein the bonding parameters can be 110 ℃ and 0.4 Mpa; punching the pre-attached polyimide film at the top of the circuit area and the adhesive layer at the top of the circuit area at the welding position to form an opening in the welding area; then pressing a polyimide film 1 at the top of the circuit area and a glue layer 2 at the top of the circuit area on a copper foil layer, wherein the copper foil layer forms a required conducting circuit by pressing a dry film, exposing, developing, etching and removing the film; pre-bonding the polyimide layer 5 at the bottom of the circuit area and the glue layer 4 at the bottom of the circuit area together, wherein the bonding parameters can be 110 ℃ and 0.4 Mpa; punching the line area bottom polyimide layer 5 and the line area bottom adhesive layer 4 which are pre-attached together at a welding position to form an opening in the welding area, and pressing the line area bottom polyimide layer 5 and the line area bottom adhesive layer 4 under the copper foil layer; after copper foil layers in welding areas between two adjacent flexible circuit board bodies are overlapped and aligned, welding operation is carried out by using ultrasonic welding equipment; pass through the laminating of welding zone top glue film with welding zone top polyimide layer after the butt fusion operation on the copper foil layer after the butt fusion, welding zone bottom polyimide layer passes through welding zone bottom glue film laminating below the copper foil layer after the butt fusion, and welding zone top glue film and welding zone bottom glue film cover the butt fusion part completely and extend to respectively during the laminating more than the circuit district top polyimide layer of both sides, below the circuit district bottom polyimide layer, then carry out the pressfitting operation, accomplish and connect between the flexible line way board body.
The flexible wiring board body includes:
the thickness of the polyimide layer 1 on the top of the circuit area is 7-200 microns, and can be selected according to performance requirements such as different structures, tensile strength and the like.
The top glue layer 2 of the circuit area comprises acrylic acid or epoxy resin, and the ratio of the thickness to the thickness of the circuit is 1: 1.4 or more matching selection. The polyimide layer 1 and the copper foil layer 3 on the top of the circuit area are pressed together at high temperature and high pressure, and meanwhile, the glue layer 2 on the top of the circuit area flows to fill gaps between circuits in the pressing process. The pressing parameters can be 180 ℃ of temperature, 110Kgf of pressure and 180S of time.
The copper foil layer 3, it forms the necessary conducting circuit through FPC's dry film of pressing-exposing-developing-etching-demolding mode;
the bottom glue layer 4 of the circuit area comprises acrylic acid or epoxy resin, and the ratio of the thickness to the thickness of the circuit is 1: 1.4 or more matching selection. The polyimide layer 5 at the bottom of the circuit area and the copper foil layer 3 are pressed together at high temperature and high pressure, and meanwhile, the glue layer 4 at the bottom of the circuit area flows to fill gaps between circuits in the pressing process. The pressing parameters can be 180 ℃, 110Kgf of pressure and 180S of time.
The thickness of the polyimide layer 5 at the bottom of the circuit area is 7-200 microns, and can be selected according to performance requirements such as different structures, tensile strength and the like.
The exposed copper foil layer 6 has only one layer of copper foil on the circuit part before welding, and the copper foil is directly contacted with the copper foil for welding operation during welding. The ultrasonic welding parameters may be: power 1400KW, pressure 0.5MPa, time 1S.
And a welding zone top polyimide layer 7 which is laid on the welded copper foil layer through a welding zone top adhesive layer 8.
And the welding zone top glue layer 8 is made of acrylic acid or epoxy resin, and the thickness of the welding zone top glue layer is larger than the sum of the thicknesses of the circuit zone top polyimide layer and the circuit zone top glue layer on the two sides. And pressing the polyimide layer 7 on the top of the welding area and the welded copper foil layer 11 together through high temperature and high pressure. The pressing parameters can be 180 ℃, 110Kgf of pressure and 180S of time.
The bottom glue layer 9 of the welding zone is made of acrylic acid or epoxy resin, and the thickness of the bottom glue layer is larger than the sum of the thicknesses of the polyimide layer at the bottom of the circuit zone and the glue layers at the bottom of the circuit zone on the two sides. And pressing the polyimide layer 10 at the bottom of the welding area and the welded copper foil layer 11 together through high temperature and high pressure. The pressing parameters can be 180 ℃, 110Kgf of pressure and 180S of time.
And the polyimide layer 10 at the bottom of the welding zone is laid below the copper foil layer after welding through the glue layer 9 at the bottom of the welding zone.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (6)
1. A method of assembling a seamlessly fused flexible circuit board, comprising: pre-attaching a polyimide film at the top of a circuit area and a glue layer at the top of the circuit area together, punching at a welding position after pre-attaching to form an opening between the polyimide film and the glue layer, and then laminating the polyimide film at the top of the circuit area and the glue layer at the top of the circuit area on a copper foil layer, wherein the copper foil layer forms a required conducting circuit through dry film pressing, exposure, development, etching and film stripping;
pre-bonding a polyimide layer at the bottom of the circuit area and a glue layer at the bottom of the circuit area together, punching at a welding position after pre-bonding to form an opening between the polyimide layer and the glue layer, and laminating the polyimide layer at the bottom of the circuit area and the glue layer at the bottom of the circuit area under the copper foil layer;
after the welding zone copper foil layer between two adjacent flexible line way board bodies overlaps and aligns, use ultrasonic welding equipment to carry out the butt fusion operation.
2. The method of claim 1, wherein the top polyimide layer is attached to the top of the copper foil layer after the bonding process via a top adhesive layer, and the bottom polyimide layer is attached to the bottom of the copper foil layer after the bonding process via a bottom adhesive layer.
3. The method of claim 2, wherein the bonding step comprises bonding the top adhesive layer to cover the top of the bonding area and extend to the top polyimide layer of the circuit area, and bonding the bottom adhesive layer to cover the bottom of the bonding area and extend to the bottom polyimide layer of the circuit area.
4. The assembly method of claim 1, wherein the flexible printed circuit board body comprises a top polyimide layer of the circuit area, a copper foil layer and a bottom polyimide layer of the circuit area, wherein the top polyimide layer of the circuit area is laid on the copper foil layer through a top glue layer of the circuit area, the bottom polyimide layer of the circuit area is laid under the copper foil layer through a bottom glue layer of the circuit area, and conductive traces are formed on the copper foil layer; and the circuit area top polyimide layer, the circuit area top adhesive layer, the circuit area bottom polyimide layer and the circuit area bottom adhesive layer are provided with notches at the welding ends so that the copper foil layer is exposed.
5. The method of claim 4, wherein the thickness of the top glue layer of the soldering area is greater than the sum of the thicknesses of the top polyimide layer of the circuit area and the top glue layer of the circuit area on both sides, and the thickness of the bottom glue layer of the soldering area is greater than the sum of the thicknesses of the bottom polyimide layer of the circuit area and the bottom glue layer of the circuit area on both sides.
6. The method of claim 4, wherein the glue layer on the top of the circuit region flows to fill the inter-circuit gap when the polyimide layer on the top of the circuit region and the copper foil layer are bonded together, and the glue layer on the bottom of the circuit region flows to fill the inter-circuit gap when the polyimide layer on the bottom of the circuit region and the copper foil layer are bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210310836.6A CN114615827B (en) | 2022-03-28 | 2022-03-28 | Flexible circuit board assembling method for seamless welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210310836.6A CN114615827B (en) | 2022-03-28 | 2022-03-28 | Flexible circuit board assembling method for seamless welding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114615827A true CN114615827A (en) | 2022-06-10 |
| CN114615827B CN114615827B (en) | 2024-03-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210310836.6A Active CN114615827B (en) | 2022-03-28 | 2022-03-28 | Flexible circuit board assembling method for seamless welding |
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| Country | Link |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030211234A1 (en) * | 1998-07-30 | 2003-11-13 | Hideyuki Kurita | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards |
| JP2006024590A (en) * | 2004-07-06 | 2006-01-26 | Fujikura Ltd | Method of ultrasonic bonding terminal of flexible wiring board |
| JP2014072270A (en) * | 2012-09-28 | 2014-04-21 | Adwelds:Kk | Connection method |
| CN206452610U (en) * | 2017-01-20 | 2017-08-29 | 深圳市鹏博辉电子有限公司 | Integrate rigidity and flexible two sided pcb |
| CN207835898U (en) * | 2017-11-28 | 2018-09-07 | 上海埃富匹西电子有限公司 | A kind of hollow out wiring board of no glue |
| CN208227478U (en) * | 2015-10-02 | 2018-12-11 | 株式会社村田制作所 | Resin substrate tectosome |
| US20190297731A1 (en) * | 2016-12-15 | 2019-09-26 | Toppan Printing Co., Ltd. | Wiring board, multilayer wiring board, and method of manufacturing wiring board |
-
2022
- 2022-03-28 CN CN202210310836.6A patent/CN114615827B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030211234A1 (en) * | 1998-07-30 | 2003-11-13 | Hideyuki Kurita | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards |
| JP2006024590A (en) * | 2004-07-06 | 2006-01-26 | Fujikura Ltd | Method of ultrasonic bonding terminal of flexible wiring board |
| JP2014072270A (en) * | 2012-09-28 | 2014-04-21 | Adwelds:Kk | Connection method |
| CN208227478U (en) * | 2015-10-02 | 2018-12-11 | 株式会社村田制作所 | Resin substrate tectosome |
| US20190297731A1 (en) * | 2016-12-15 | 2019-09-26 | Toppan Printing Co., Ltd. | Wiring board, multilayer wiring board, and method of manufacturing wiring board |
| CN206452610U (en) * | 2017-01-20 | 2017-08-29 | 深圳市鹏博辉电子有限公司 | Integrate rigidity and flexible two sided pcb |
| CN207835898U (en) * | 2017-11-28 | 2018-09-07 | 上海埃富匹西电子有限公司 | A kind of hollow out wiring board of no glue |
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| Publication number | Publication date |
|---|---|
| CN114615827B (en) | 2024-03-12 |
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