CN114615790A

CN114615790A - Coupler and electronic equipment

Info

Publication number: CN114615790A
Application number: CN202011452139.1A
Authority: CN
Inventors: 罗善文; 叶晓菁; 林继生
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2022-06-10
Anticipated expiration: 2040-12-09
Also published as: CN114615790B

Abstract

The invention discloses a coupler and electronic equipment, wherein the coupler comprises a first core board, a separation board and a second core board which are sequentially stacked; the first inner core plate comprises a first signal line and a second signal line, and the second inner core plate comprises a third signal line and a fourth signal line; the first signal line comprises a first coupling section coupled with the second signal line correspondingly and a first non-coupling section not coupled with the second signal line, and the first coupling section and the first non-coupling section are connected with each other; the first direct-connected heat-conducting column penetrates through the first core plate and the second core plate, and one end of the first direct-connected heat-conducting column is connected with the first non-coupling section. By the mode, the heat dissipation performance of the coupler can be effectively improved.

Description

Coupler and electronic equipment

Technical Field

The present invention relates to the field of integrated circuit technologies, and in particular, to a coupler and an electronic device.

Background

Couplers are commonly used in electronic circuits or electronic devices. Such as base stations, repeaters, signal combining, splitting, and power combining in indoor coverage. The 3dB 90-degree coupler is also called a 3dB 90-degree electric bridge, a hybrid bridge and a same-frequency combiner, and is a 4-port passive element widely applied in the communication field. It can divide an input signal into two signals which are equal in amplitude and have a phase difference of 90 degrees.

The existing coupler gradually develops a multilayer structure, and the heat dissipation performance of the whole coupler is poor due to the fact that the thermal resistance value between the multilayer structures is greatly improved.

Disclosure of Invention

The invention mainly provides a coupler and electronic equipment. The problem that the coupler in the prior art is poor in heat dissipation performance is solved.

In order to solve the technical problems, the invention adopts a technical scheme that: providing a coupler, wherein the coupler comprises a first direct-connection heat conduction column, and a first core plate and a second core plate which are sequentially stacked; the first core board comprises a first signal circuit arranged on a first surface far away from the second core board and a second signal circuit arranged on a second surface close to the second core board, and the second core board comprises a third signal circuit arranged on a third surface close to the first core board and a fourth signal circuit arranged on a fourth surface far away from the first core board; wherein the first signal line includes a first coupling section coupled to a corresponding one of the second signal lines and a first non-coupling section not coupled to the second signal line, the first coupling section and the first non-coupling section being connected to each other; the first direct-connected heat conduction column penetrates through the first core plate and the second core plate, and one end of the first direct-connected heat conduction column is connected with the first non-coupling section.

According to an embodiment of the present invention, the coupler includes a second directly connected thermal conductive post, the fourth signal line includes a second coupling section coupled to the third signal line and a second non-coupling section not coupled to the third signal line, and the second coupling section and the second non-coupling section are connected to each other; the second direct-connected heat-conducting column penetrates through the first core plate and the second core plate, and one end of the second direct-connected heat-conducting column is connected with the second non-coupling section.

According to an embodiment of the present invention, the first and second directly connected heat-conducting pillars are metal heat-conducting pillars; the first direct-connected heat conduction column is not directly and electrically connected with the second signal circuit, the third signal circuit and the fourth signal circuit; the second direct-connected heat conduction column is not directly and electrically connected with the first signal line, the second signal line and the third signal line.

According to an embodiment of the present invention, the first core board includes a first metal heat conduction pad disposed on a first surface, and the second core board includes a second metal heat conduction pad disposed on a fourth surface; the other end of the first direct-connected heat-conducting column is connected with the second metal heat-conducting bonding pad, and the other end of the second direct-connected heat-conducting column is connected with the first metal heat-conducting bonding pad.

According to an embodiment of the present invention, the coupler further includes a first outer core plate disposed on the first inner core plate and away from the second inner core plate, a second outer core plate disposed on the second inner core plate and away from the first inner core plate, and two non-direct-connection heat conduction columns sequentially penetrating through the first outer core plate, the first inner core plate, the second inner core plate, and the second outer core plate, one of the two non-direct-connection heat conduction columns being connected to the first metal heat conduction pad, and the other of the two non-direct-connection heat conduction columns being connected to the second metal heat conduction pad; the non-direct-connection heat conduction column is electrically connected with the first signal line, the second signal line, the third signal line and the fourth signal line.

According to an embodiment of the present invention, the non-direct-connection heat-conducting pillar is exposed from a line of one side surface of the coupler or from two adjacent side surfaces of the coupler.

According to an embodiment of the present invention, the first and second directly connected heat-conducting pillars further penetrate the first and second outer core plates, and the first and second directly connected heat-conducting pillars are not connected to the first and/or second ground lines.

According to an embodiment of the present invention, the first core board includes first non-functional pads and second non-functional pads disposed on the second surface, and the second core board includes third non-functional pads and fourth non-functional pads disposed on the third surface; the first direct-connection heat conduction column is sequentially connected with the first non-functional bonding pad and the third non-functional bonding pad, and the second direct-connection heat conduction column is sequentially connected with the second non-functional bonding pad and the fourth non-functional bonding pad.

According to an embodiment of the present invention, the coupler further includes a spacer plate disposed between the first core plate and the second core plate; the partition plate includes a ground metal layer provided on a surface facing the first core plate and/or the second core plate, respectively; the grounding metal layer comprises two heat dissipation isolation pads, each heat dissipation isolation pad comprises a heat dissipation isolation groove and a heat dissipation pad arranged in the heat dissipation isolation groove, the heat dissipation pad of one of the two heat dissipation isolation pads is thermally coupled with the first direct-connection heat conduction column, and the heat dissipation pad of the other of the two heat dissipation isolation pads is thermally coupled with the second direct-connection heat conduction column.

According to an embodiment of the present invention, the first uncoupled section includes a first port of the first signal line, and the second uncoupled section includes a second port of the fourth signal line; one end of the first direct-connected heat-conducting column is connected with the first port, and one end of the second direct-connected heat-conducting column is connected with the second port.

In order to solve the technical problem, the invention adopts another technical scheme that: there is provided an electronic device comprising a coupler according to any of the above.

The invention has the beneficial effects that: different from the prior art, through providing the first continuous heat conduction post that runs through first inner core board and second inner core board, because first continuous heat conduction post compares first inner core medium plate, second inner core medium plate, has better heat conductivity, consequently can effectual improvement whole coupler range upon range of upward heat conductivility to be favorable to the heat dissipation of whole coupler. And furthermore, because the main heat production of coupler is produced by signal lines such as first signal line, through directly being connected first direct heat conduction post with first signal line, can directly lead away the heat that first signal line produced through first direct heat conduction post directly. And the parasitic performance of the first non-coupling section of the first signal circuit can be effectively improved by the first continuous heat conduction column.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a schematic structural diagram of a first embodiment of a coupler provided in the present invention;

fig. 2 is a schematic top view of a first embodiment of the first buried pillar and the second buried pillar of fig. 1 through a ground metal layer;

FIG. 3 is a schematic top view of a buried stud through ground metal layer as provided herein;

FIG. 4 is a schematic top view of one embodiment of the ground metal layer of FIG. 1;

fig. 5 is a schematic top view of a second embodiment of the first buried pillar and the second buried pillar of fig. 1 through a ground metal layer;

fig. 6 is a schematic top view of a third embodiment of the first buried pillar and the second buried pillar of fig. 1 through a ground metal layer;

fig. 7 is a schematic top view of a fourth embodiment of the first buried pillar and the second buried pillar of fig. 1 through a ground metal layer;

FIG. 8 is a schematic structural diagram of a second embodiment of a coupler provided in the present invention;

FIG. 9 is a schematic structural diagram of a third embodiment of a coupler provided in the present invention;

FIG. 10 is a schematic structural diagram of a fourth embodiment of a coupler provided in the present invention;

FIG. 11 is a schematic structural diagram of a fifth embodiment of a coupler according to the present invention;

FIG. 12 is a schematic structural diagram of a sixth embodiment of a coupler provided in the present invention;

fig. 13 is a schematic top view of a heat-conducting embedded column penetrating through a second core board according to the present invention;

FIG. 14 is a top view of a thermally conductive edge post through a first core board in accordance with the present invention;

FIG. 15 is a schematic structural diagram of a seventh embodiment of a coupler provided in the present invention;

FIG. 16 is a schematic structural diagram of an eighth embodiment of a coupler provided in the present invention;

FIG. 17 is a schematic structural diagram of a ninth embodiment of a coupler provided in the present invention;

FIG. 18 is a top view of a first directly connected thermally conductive post and a non-directly connected thermally conductive post through a second core plate in accordance with the present invention;

FIG. 19 is a top view of a second core plate with second directly connected thermally conductive columns and non-directly connected thermally conductive columns provided in accordance with the present invention;

FIG. 20 is a schematic top view of a first and second directly connected thermally conductive post penetrating a partition provided by the present invention;

FIG. 21 is a schematic structural diagram of a tenth embodiment of a coupler according to the present invention;

FIG. 22 is a schematic structural diagram of an eleventh embodiment of a coupler provided in the present invention;

FIG. 23 is a schematic structural diagram of a twelfth embodiment of a coupler provided in the present invention;

FIG. 24 is a schematic structural diagram of an embodiment of an electronic device provided in the present invention;

fig. 25 is a schematic structural diagram of another embodiment of the electronic device provided in the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The first embodiment:

referring to fig. 1, the present invention provides a coupler 10, wherein the coupler 10 includes a first core board 100, a partition board 300 and a second core board 200.

The first core board 100 includes a first signal line 120 disposed on the first surface 110 far from the isolation board 300 and a second signal line 140 disposed on the second surface 130 near the isolation board 300, and the second core board 200 includes a third signal line 220 disposed on the third surface 210 near the isolation board 300 and a fourth signal line 240 disposed on the fourth surface 230 far from the isolation board 300.

Optionally, the first core board 100 further includes a first core dielectric board 101, and the first signal line 120 and the second signal line 140 are both attached to the first core dielectric board 101.

The second core board 200 further includes a second core dielectric board 201, and the third signal line 220 and the fourth signal line 240 are both attached to the second core dielectric board 201.

As shown in fig. 1, the coupler 10 further includes a first buried pillar 410 and a second buried pillar 420, the first buried pillar 410 sequentially penetrates through the first core board 100 and the isolation board 300 to electrically connect the first signal line 120 and the third signal line 220, and the second buried pillar 420 sequentially penetrates through the isolation board 300 and the second core board 200 to electrically connect the second signal line 140 and the fourth signal line 240.

The first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240 are all metallization patterns, and the first buried pillar 410 and the second buried pillar 420 are metal holes formed by copper plating after punching.

Alternatively, the first signal line 120, the first buried pillar 410, and the third signal line 220 may form a first coupling line, the second signal line 140, the second buried pillar 420, and the fourth signal line 240 may form a second coupling line, and the first coupling line and the second coupling line may be coupled to each other.

Alternatively, the first signal line 120 may be coupled to the second signal line 140, the first buried pillar 410 may be coupled to the second buried pillar 420, and the third signal line 220 may be coupled to the fourth signal line 240.

The isolation board 300 may be provided with metal to shield the signal lines of the first core board 100 and the second core board 200 from each other, so as to prevent mutual interference.

As shown in fig. 2, since the isolation plate 300 has metal thereon, the first buried pillar 410 and the second buried pillar 420 provide an isolation pad 310 at a position penetrating the isolation plate 300 to prevent a short circuit caused by contact with the metal on the isolation plate 300. The isolation pad 310 is an isolation trench 311 without a metal layer or a conductive layer, and the first buried pillar 410 and the second buried pillar 420 are both disposed through the isolation trench 311 and spaced and insulated from the metal layer outside the isolation trench 311. The isolation pad 310 is also called an anti-pad.

That is, optionally, at least portions of first buried pillar 410 and second buried pillar 420 are located within the same isolation trench 311. Compared with a scheme that two isolation pads are arranged on two buried columns as shown in fig. 3, that is, a scheme that one isolation pad is arranged on each buried column independently, the isolation pad corresponding to each buried column generally has a strict upper diameter limit due to the requirement of routing density, so that the obtained capacitive performance corresponding to each buried column is poor, impedance mismatching is caused, and the return loss of the whole signal transmission process is large.

In the above embodiment, the isolation plate 300 is disposed between the first core board 100 and the second core board 200, so that signal isolation is performed on the signal lines of the first core board 100 and the second core board 200, and mutual interference is reduced. In addition, the first buried pillar 410 and the second buried pillar 420 are arranged in the same isolation slot 311 in a penetrating manner, so that the area of the whole isolation slot 311 (namely the area of the shared isolation slot 311) is greatly increased on the one hand, the whole capacitive parasitic effect is compensated better, impedance matching is ensured, and the signal return loss can be effectively reduced. On the other hand, the first buried pillar 410 and the second buried pillar 420 are both located in the same isolation trench 311, that is, no metal or other medium is present between the portions of the first buried pillar 410 and the second buried pillar 420 in the isolation trench 311, so that the influence of the metal or other medium on the first buried pillar 410 and the second buried pillar 420 can be reduced, and the coupling performance between the first buried pillar 410 and the second buried pillar 420 can be effectively improved. In actual production, if the signal return loss is too large and the coupling performance is poor and does not meet the required requirements, the lengths of the first coupling line and the second coupling line need to be increased, that is, the wiring density or the wiring length of the first coupling line and the second coupling line is increased, in the existing process, the wiring density is difficult to improve, so that the wiring length is generally increased, and thus the volume of the whole coupler 10 is further increased. Thereby meeting the miniaturization requirement of the device and further being beneficial to the miniaturization of the whole equipment.

As shown in fig. 4 and 5, the isolation pad 310 further includes a first contact pad 312 and a second contact pad 313 located in the isolation slot 311, the first buried pillar 410 penetrates the first contact pad 312, and the second buried pillar 420 penetrates the second contact pad 313. That is, the first contact pad 312 is sleeved on the first buried pillar 410, and the second contact pad 313 is sleeved on the second buried pillar 420.

Optionally, the first contact pad 312 is sleeved on the first buried pillar 410, and the second contact pad 313 is sleeved on the second buried pillar 420, so that the coupling area between the first buried pillar 410 and the second buried pillar 420 can be effectively increased, and the coupling performance can be improved.

As shown in fig. 1, the isolation board 300 includes a ground metal layer 320 on a surface facing the first core board 100 and/or the second core board 200, respectively, the isolation pad 310 is disposed on the ground metal layer 320, and the first contact pad 312 and the second contact pad 313 are spaced apart from the ground metal layer 320 by an isolation slot 311.

The ground metal layer 320 may be provided on both surfaces, and then the corresponding isolation pads 310 are also two. And the two isolation pads 310 are identical in structure.

Optionally, the ground metal layer 320 may isolate electrical signals of the signal lines of the first core board 100 from the signal lines of the second core board 200, that is, may effectively prevent signal interference between layers by using the shielding performance of metal. On the other hand, the grounding device can also be used for grounding, and is favorable for the transmission performance of signals.

Optionally, the isolation board 300 further includes a grounding dielectric board 301, and the grounding metal layer 320 may be a copper foil or the like directly attached to the grounding dielectric board 301. In an alternative embodiment, a copper foil may be attached to the ground dielectric board 301, and then the copper foil is patterned, such as defining the first contact pad 312 and the second contact pad 313 in a predetermined area, and then removing a portion of the copper foil around the first contact pad 312 and the second contact pad 313 to expose the ground dielectric board 301, i.e. forming the first contact pad 312 and the second contact pad 313 and the isolation trench 311 isolated from other copper foils.

Optionally, the isolation pad 310 is disposed on the ground metal layer 320, and since the first contact pad 312 and the second contact pad 313 are both located in the same isolation slot 311, that is, no copper foil or the like is disposed between the first contact pad 312 and the second contact pad 313 for signal isolation, so that the coupling performance between the first contact pad 312 and the second contact pad 313 can be effectively improved.

As shown in fig. 5, in an alternative embodiment, the first contact pad 312 and the second contact pad 313 are respectively disposed at two ends of the isolation slot 311 and symmetrically disposed along a center line of the isolation slot 311.

As shown in fig. 5, the projection of the isolation groove 311 on the surface of the isolation plate 300 is elliptical.

As shown in fig. 6, the projection of the isolation groove 311 on the surface of the isolation plate 300 is of a race type.

As shown in fig. 7, the projection of the isolation groove 311 on the surface of the isolation plate 300 may also be rectangular.

In an alternative embodiment, the maximum length of the isolation slot 311 is greater than or equal to 0.4mm, that is, the distance between two points of the isolation slot 311 farthest from each other is greater than or equal to 0.4mm, for example, the projection of the isolation slot 311 is an ellipse, that is, the long axis of the isolation slot 311 is greater than or equal to 0.4mm, for example, the projection of the isolation slot 311 is a rectangle, the long side of the isolation slot 311 is greater than or equal to 0.4mm, for example, the projection of the isolation slot 311 is a racetrack, that is, the farthest distance between two ends of the isolation slot 311 is greater than or equal to 0.4 mm.

As shown in fig. 8, in an alternative embodiment, the first buried columns 410 may further penetrate through the second core board 200 to connect with the first connection pads 250 disposed on the fourth surface 230 of the second core board 200 remote from the partition board 300, and the second buried columns 420 may also penetrate through the first core board 100 to connect with the second connection pads 150 disposed on the first surface 110 of the first core board 100.

Alternatively, the first connection pad 250 and the second connection pad 150 may be referred to as a non-electrical connection or a non-signal connection pad, and may have only fixing and heat dissipating functions. The first connection pad 250 is independent of the fourth signal line 240, i.e., not connected to the fourth signal line 240, and the second connection pad 150 is independent of the first signal line 120, i.e., not connected to the first signal line 120.

By further penetrating the first buried columns 410 through the second core board 200 and connecting the first buried columns with the first connection pads 250, and further penetrating the second buried columns 420 through the first core board 100 and connecting the second buried columns 420 with the second connection pads 150, the lengths of the first buried columns 410 and the second buried columns 420 can be effectively extended, thereby improving heat dissipation performance.

As shown in fig. 9, the coupler 10 further includes a first outer core plate 500 and a second outer core plate 600, the first outer core plate 500 is disposed on a side of the first inner core plate 100 away from the partition plate 300, and the second outer core plate 600 is disposed on a side of the second inner core plate 200 away from the partition plate 300.

Wherein the first outer core plate 500 includes a first ground line 520 disposed on a fifth surface 510 remote from the isolation plate 300 and/or the second outer core plate 600 includes a second ground line 620 disposed on a sixth surface 610 remote from the isolation plate 300. That is, the first ground line 520 is located on the fifth surface 510 of the first outer core board 500 away from the partition board 300, and the second ground line 620 is located on the sixth surface 610 of the second outer core board 600 away from the partition board 300.

Similarly, the first outer core board 500 includes a first outer core dielectric board 501, the second outer core board 600 includes a second outer core dielectric board 601, the first grounding circuit 520 is made of copper foil disposed on the first outer core dielectric board 501, and the second grounding circuit 620 is made of copper foil disposed on the second outer core dielectric board 601.

In an alternative embodiment, the first inner core dielectric plate 101, the second inner core dielectric plate 201, the first outer core dielectric plate 501, and the second outer core dielectric plate 601 may be made of base material plates made of the same material, and the base material plates may be made of a combination of a plurality of bonding sheets, which are made by impregnating a paper substrate, a glass fiber cloth substrate, a synthetic fiber cloth substrate, a non-woven fabric substrate, a composite substrate, and the like with resin. In a specific embodiment, a copper foil can be coated on one side or both sides of the substrate board, and then hot-pressing and curing are carried out to prepare the copper-clad board. The copper foil is then patterned in accordance with the design pattern, thereby generating the first signal line 120, the second signal line 140, the third signal line 220, the fourth signal line 240, the first ground line 520, the second ground line 620, and the like.

As shown in fig. 9, the coupler 10 further includes a conductive post 430 penetrating the coupler 10, the conductive post 430 connecting the first ground line 520 and the second ground line 620. Optionally, the conductive posts 430 are also plated with copper after punching, and are not described in detail herein.

As shown in fig. 9, a connection layer 800 is further provided between the first outer core plate 500 and the first core plate 100, between the first core plate 100 and the separator 300, between the separator 300 and the second core plate 200, and between the second core plate 200 and the second outer core plate 600, and the connection layer 800 may be formed by thermosetting a prepreg.

Example two:

referring to fig. 10, the present invention provides a coupler 10, wherein the coupler 10 includes a heat-conducting pillar 440, and a first outer core plate 500, a first inner core plate 100, a second inner core plate 200, and a second outer core plate 600 stacked in sequence.

The first core board 100 includes a first signal line 120 disposed on the first surface 110 far from the second core board 200 and a second signal line 140 disposed on the second surface 130 near the second core board 200, and the second core board 200 includes a third signal line 220 disposed on the third surface 210 near the first core board 100 and a fourth signal line 240 disposed on the fourth surface 230 far from the first core board 100.

Wherein the first outer core board 500 includes a first ground line 520 and/or the second outer core board 600 includes a second ground line 620. Alternatively, the first ground line 520 is located on the fifth surface 510 of the first outer core plate 500 away from the partition plate 300, and the second ground line 620 is located on the sixth surface 610 of the second outer core plate 600 away from the partition plate 300.

Wherein the heat conductive pillar 440 connects one of the first and second

outer core plates

500 and 600 and at least one of the first and

second core plates

100 and 200. That is, the heat conductive pillar 440 penetrates at least one of the first and

second core plates

500 and 600 and one of the first and

second core plates

100 and 200.

In an alternative scenario, as shown in fig. 10, the heat-conducting pillar 440 may connect the first outer core plate 500 and the first core plate 100, i.e., the heat-conducting pillar 440 penetrates the first outer core plate 500 and the first core plate 100 in sequence.

As another alternative scenario, the heat-conducting pillar 440 may connect the second outer core plate 600 and the second core plate 200, i.e., the heat-conducting pillar 440 penetrates the second outer core plate 600 and the second core plate 200 in sequence.

As another alternative scenario, as shown in fig. 11, the heat-conducting pillar 440 may connect the first outer core plate 500, the first inner core plate 100 and the second inner core plate 200, that is, the heat-conducting pillar 440 sequentially penetrates through the first outer core plate 500, the first inner core plate 100 and the second inner core plate 200.

As another alternative scenario, the heat-conducting pillar 440 may connect the first core plate 100, the second core plate 200 and the second core plate 600, that is, the heat-conducting pillar 440 sequentially penetrates through the first core plate 100, the second core plate 200 and the second core plate 600.

In another alternative scenario, as shown in fig. 12, a heat-conducting post 440 may connect the first outer core plate 500, the first core plate 100, the second core plate 200, and the second outer core plate 600. That is, the heat-conducting pillar 440 penetrates the first outer core plate 500, the first inner core plate 100, the second inner core plate 200, and the second outer core plate 600 in sequence.

Optionally, the number of the heat conducting pillars 440 may be multiple, and the connection manner of each heat conducting pillar 440 is independent, that is, the connection manner of any one of the above scenarios may be adopted, which is not limited herein.

The heat-conducting pillar 440 is electrically connected to the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240. That is, the heat conductive pillar 440 serves only a heat conductive function and does not serve an electrical connection function. And optionally, the heat conducting pillar 440 may also be made by copper plating or copper filling on the inner wall after the hole is dug.

In the above-described embodiment, by providing the heat conduction column 440 connecting at least one of the first core plate 500 and the second core plate 600 and at least one of the first core plate 100 and the second core plate 200, because the heat-conducting pillars 440 have better thermal conductivity (the thermal conductivity of copper can reach 399w/m k, while the thermal conductivity of the first inner core dielectric plate 101 and other dielectric plates is generally 0.2-0.6 w/m k) than the first inner core dielectric plate 101, the second inner core dielectric plate 201, the first outer core dielectric plate 501 and the second outer core dielectric plate 601, therefore, the heat conduction performance in the stacking direction of the entire coupler 10 can be effectively improved, so that the heat of the first core board 100 and/or the second core board 200, which is difficult to dissipate, is conducted to the first outer core board 500 and/or the second outer core board 600, which is easy to dissipate, thereby facilitating the heat dissipation of the entire coupler 10. Furthermore, since the thermal conductive post 440 is electrically disconnected from the first signal trace 120, the second signal trace 140, the third signal trace 220, and the fourth signal trace 240, the signal profile of the entire coupler 10 is not affected.

As shown in fig. 12, at least one of the first and

second surfaces

110 and 130 of the first core board 100 and the third and

fourth surfaces

210 and 230 of the second core board 200 is provided with a heat conductive pad 710, the heat conductive pad 710 is thermally coupled to the heat conductive pillar 440, and the heat conductive pad 710 is electrically disconnected from each of the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240.

Optionally, the heat conduction pillars 440 may penetrate the heat conduction pads 710 and contact and connect with the heat conduction pads 710, and optionally, the heat conduction pads 710 may be provided to help increase the contact area between the heat conduction pillars 440 and the first core board 100 and/or the second core board 200, so as to facilitate rapid heat transfer from the first core board 100 and/or the second core board 200 to the heat conduction pillars 440.

In alternative embodiments, the thermally conductive post 440 may be embodied as a solid post or a hollow post. Such as solid posts, may be formed by drilling the coupler 10 in the stacking direction and then filling the entire hole with copper. The hollow columns are formed by plating copper on the inner walls of the holes.

In other embodiments, the heat conducting column 440 may also be made of other non-metallic materials with better thermal conductivity, such as graphite, ceramic, etc. And by being made of a non-metallic material, the electrical performance of the entire coupler 10 is not easily affected.

In alternative embodiments, the heat-conducting post 440 may specifically be a heat-conducting buried post 441 and/or a heat-conducting side post 442. As shown in fig. 13 and 15, the heat-conducting embedded column 441 is enclosed by the medium entirely located in the coupler 10, and only two ends of the heat-conducting embedded column can be exposed from the upper surface 11 or the lower surface 12 of the coupler 10. As shown in fig. 14 and 15, the thermally conductive side post 442 is partially enclosed by the medium of the coupler 10, and the thermally conductive side post 442 is exposed from the side surface 13 of the coupler 10. The thermally conductive side post 442 is partially directly connected to the side surface 13 of the coupler 10.

As shown in fig. 14 and 15, the heat-conducting side column 442 may be exposed from one side surface 13 of the coupler 10, that is, the heat-conducting side column 442 is located on the side surface 13 of the coupler 10, and optionally, if the heat-conducting side column 442 is a solid column, the projection of the heat-conducting side column 442 on the upper surface 11 of the coupler 10 may be a sector, such as a semicircle. Alternatively, if the thermally conductive side column 442 is a hollow column, the projection of the thermally conductive side column 442 on the upper surface 11 of the coupler 10 may be a non-closed ring, such as a semi-ring.

As shown in fig. 14 and 15, the heat-conducting side column 442 may also be exposed from the junction of two adjacent side surfaces 13 of the coupler 10 or from two adjacent side surfaces 13, that is, the heat-conducting side column 442 is located at a corner of the coupler 10, and optionally, if the heat-conducting side column 442 is a solid column, the projection of the heat-conducting side column 442 on the upper surface 11 of the coupler 10 may be a sector, such as a quarter circle. Alternatively, if the thermally conductive side column 442 is a hollow column, the projection of the thermally conductive side column 442 on the upper surface 11 of the coupler 10 may be a non-closed ring, such as a quarter ring.

In the same coupler 10, there may be a plurality of heat conducting pillars 440, and some of the heat conducting pillars 440 are heat conducting embedded pillars 441 and some of the heat conducting pillars are heat conducting side pillars 442, which are not limited herein.

In the above embodiment, by providing the heat-conducting side column 442, on one hand, compared with the heat-conducting embedded column 441, since both the drilling and the copper filling are visual, the degree of control can be effectively performed, and thus the difficulty and cost of the whole process can be reduced. On the other hand, since at least a portion of the heat-conducting side column 442 is exposed through the side surface 13 of the coupler 10, that is, the heat-conducting side column can be directly contacted with air, so that the heat-dissipating contact surface with air and the like is greatly improved, and the heat-dissipating performance is effectively improved.

As shown in fig. 10, the coupler 10 further includes a spacer 300 disposed between the first core board 100 and the second core board 200, the spacer 300 including a ground metal layer 320 on a surface facing the first core board 100 and/or the second core board 200, respectively. The heat conducting pillars 440 include grounded heat conducting pillars (not shown) and/or non-grounded heat conducting pillars (not shown) sequentially penetrating through the first outer core plate 500, the first inner core plate 100, the partition plate 300, the second inner core plate 200, and the second outer core plate 600, that is, the heat conducting pillars 440 may include grounded heat conducting pillars, and may also ensure that non-grounded heat conducting pillars or both grounded heat conducting pillars and non-grounded heat conducting pillars are included.

In a specific scenario, the ground heat-conducting pillar connects the first ground line 520, the two ground metal layers 320, and the second ground line 620 in sequence. By connecting the grounding heat-conducting column with the first grounding circuit 520, all the grounding metal layers 320 and the second grounding circuit 620, an electromagnetic wave cavity can be formed, so that electromagnetic wave radiation backflow is realized, that is, the effect similar to a lightning rod is realized, electromagnetic waves in the coupler 10 can be effectively guided and guided out from the first grounding circuit 520 and the second grounding circuit 620, and the coupling performance of the whole coupler 10 is improved.

As shown in fig. 12, heat conductive pads 710 are provided on the fifth surface 510 of the first outer core plate 500 away from the first core plate 100, the sixth surface 610 of the second outer core plate 600 away from the second core plate 200, and both surfaces of the partition plate 300; the non-grounded heat-conducting pillars are sequentially thermally coupled to the plurality of heat-conducting pads 710, and the heat-conducting pads 710 are electrically connected to the first ground line 520, the two ground metal layers 320, and the second ground line 620.

As shown in fig. 24, the present application also provides an electronic device 1, where the electronic device 1 includes the coupler 10 in any embodiment of the present application.

As shown in fig. 24, the electronic device 1 further includes a PCB 20, the coupler 10 may be disposed on the PCB 20, the PCB 20 is disposed with a ground strip 21 and a heat sink 22, the ground strip 21 may be electrically connected to the first ground trace 520 or the second ground trace 620 of the coupler 10, and the heat sink 22 is thermally coupled to the heat-conducting pillar 440 of the coupler 10. That is, by providing the heat sink 22 on the PCB 20, the heat of the coupler 10 is advantageously conducted to the PCB 20 with better heat dissipation performance through the heat conduction pillars 440, thereby facilitating the heat dissipation performance of the entire coupler 10.

Example three:

referring to fig. 16, the present invention provides a coupler 10, wherein the coupler 10 includes a first straight heat-conducting pillar 450, and a first core board 100 and a second core board 200 stacked in sequence.

As shown in fig. 16, the first core board 100 includes a first signal line 120 disposed on the first surface 110 far from the second core board 200 and a second signal line 140 disposed on the second surface 130 near the second core board 200, and the second core board 200 includes a third signal line 220 disposed on the third surface 210 near the first core board 100 and a fourth signal line 240 disposed on the fourth surface 230 far from the first core board 100.

Optionally, the first signal line 120 includes a first coupling segment 121 coupled to the second signal line 140, and a first decoupling segment 122 uncoupled from the second signal line 140, and the first coupling segment 121 and the first decoupling segment 122 are connected to each other.

In a specific scenario, the first coupling section 121 refers to a line on the first signal line 120 corresponding to or identical to at least a part of the second signal line 140, that is, the first coupling section 121 may be coupled with the second signal line 140. The first uncoupled section 122 refers to a line on the first signal line 120 that is different from or identical to the second signal line 140, that is, the first uncoupled section 122 cannot be coupled to the second signal line 140.

The first direct heat-conducting pillar 450 penetrates through the first core board 100 and the second core board 200, and has one end connected to the first non-coupling section 122. Alternatively, since the first direct heat conductive post 450 is connected to the first non-coupling section 122 of the second core board 200, it is not directly connected to the second signal line 140 during the process of penetrating the first core board 100 and the second core board 200.

In the above embodiment, by providing the first continuous thermal conductive post 450 penetrating through the first core board 100 and the second core board 200, the first continuous thermal conductive post 450 has better thermal conductivity than the first core dielectric plate 101 and the second core dielectric plate 201, so that the thermal conductivity in the stacking direction of the whole coupler 10 can be effectively improved, and the heat dissipation of the whole coupler 10 is facilitated. Further, since the main heat generation of the coupler 10 is generated by the signal lines such as the first signal line 120, the heat generated by the first signal line 120 can be directly conducted out through the first direct-connected heat pillar 450 by directly connecting the first direct-connected heat pillar 450 with the first signal line 120.

As shown in fig. 16, the coupler 10 further includes a second directly connected thermally conductive post 460, the fourth signal line 240 includes a second coupled section 241 coupled with the third signal line 220 and a second uncoupled section 242 uncoupled from the third signal line 220, the second coupled section 241 and the second uncoupled section 242 are connected to each other; the second direct-connected heat-conducting pillar 460 penetrates the first core board 100 and the second core board 200, and has one end connected to the second non-coupled section 242.

The first and second directly connected thermally

conductive pillars

450, 460 may be metal or non-metal thermally conductive pillars, such as metal thermally conductive pillars. The inner wall of the hole can be plated with copper or filled with metal such as copper after the hole is dug. And further, the first direct thermal conductive post 450 is not directly electrically connected to the third signal line 220 and the fourth signal line 240. That is, the first direct thermal post 450 has no direct electrical connection with the second signal line 140 on the second surface 130, the third signal line 220 on the third surface 210, and the fourth signal line 240 on the fourth surface 230 when passing through the second surface 130, the third surface 210, and the fourth surface 230. And similar to the first directly connected thermally conductive post 450, the second directly connected thermally conductive post 460 is not directly electrically connected to the first signal trace 120, the second signal trace 140, and the third signal trace 220. Due to the metal heat-conducting columns, the parasitic capacitance of the coupler 10 can be effectively improved.

In an alternative embodiment, the first uncoupled section 122 includes a first port (not shown) for the first signal line 120, and the second uncoupled section 242 includes a second port (not shown) for the fourth signal line 240. One end of the first directly connected thermally conductive post 450 is connected to the first port and one end of the second directly connected thermally conductive post 460 is connected to the second port.

In the above embodiment, one end of the first directly connected thermally conductive post 450 is directly connected to the first port, and one end of the second directly connected thermally conductive post 460 is directly connected to the second port. Parasitic capacitance at the port can be reduced, and impedance matching, signal isolation and various RF performance indexes at the port can be guaranteed. Thereby improving the performance of the overall coupler 10.

In a particular embodiment, coupler 10 further includes a third directly connected thermally conductive post (not shown) and a fourth directly connected thermally conductive post (not shown) extending through first core plate 100 and second core plate 200. The second signal line 140 further includes a third coupling section 141 coupled to the first coupling section 121, and a third decoupling section 142 decoupled from the first signal line 120, wherein the third coupling section 141 and the third decoupling section 142 are connected to each other. The third signal line 220 includes a fourth coupling section 221 coupled corresponding to the second coupling section 241 and a fourth non-coupling section 222 not coupled to the fourth signal line 240, and the fourth coupling section 221 and the fourth non-coupling section 222 are connected to each other.

In an alternative embodiment, the third directly connected thermally conductive post is connected to the third non-coupled section 142 and is not directly electrically connected to the first signal line 120, the third signal line 220, and the fourth signal line 240, and the fourth directly connected thermally conductive post is connected to the fourth non-coupled section 222 and is not directly electrically connected to the first signal line 120, the second signal line 140, and the fourth signal line 240.

Optionally, the third directly connected heat conducting pillar and the fourth directly connected heat conducting pillar are made of the same material as the first directly connected heat conducting pillar 450 and the second directly connected heat conducting pillar 460, and are not described herein again.

As shown in fig. 17, the first core board 100 further includes a first metallic heat conduction pad 720 disposed on the first surface 110, and the second core board 200 includes a second metallic heat conduction pad 730 disposed on the fourth surface 230. The other end of the first direct connecting thermal conductive pillar 450 is connected to the second metal thermal conductive pad 730, and the other end of the second direct connecting thermal conductive pillar 460 is connected to the first metal thermal conductive pad 720. Optionally, the first metal thermal conductive pad 720 and the second metal thermal conductive pad 730 may be the thermal conductive pad 710 of the second embodiment, or may be pads similar to the thermal conductive pad 710 of the second embodiment, that is, the first metal thermal conductive pad 720 is not electrically connected to the first signal line 120, and the second metal thermal conductive pad 730 is not electrically connected to the fourth signal line 240.

As shown in fig. 17, 18 and 19, the coupler 10 includes two non-directly connected thermally conductive posts 490 and a first outer core plate 500 disposed on the first core plate 100 away from the second core plate 200 and a second outer core plate 600 disposed on the second core plate 200 away from the first core plate 100. The two non-direct-connected heat-conducting pillars 490 sequentially penetrate the first outer core plate 500, the first inner core plate 100, the second inner core plate 200, and the second outer core plate 600. One of the two non-direct-connected heat-conducting columns 490 is connected to the first metal heat-conducting pad 720, and the other of the two non-direct-connected heat-conducting columns 490 is connected to the second metal heat-conducting pad 730; the non-direct-connection heat-conducting post 490 is not directly electrically connected to the first signal line 120, the second signal line 140, the third signal line 220, the fourth signal line 240, the first ground line 520, and the second ground line 620.

In alternative embodiments, the non-straight thermally conductive post 490 may be the thermally conductive side post 442 of embodiment two or may be similar to the thermally conductive side post 442.

As shown in fig. 18, the non-straight conductive post 490 may be exposed from one side surface 13 of the coupler 10, that is, the non-straight conductive post 490 is located on the side surface 13 of the coupler 10, and optionally, if the non-straight conductive post 490 is a solid post, the projection of the non-straight conductive post 490 on the upper surface 11 of the coupler 10 may be a fan shape, such as a semi-circle. Alternatively, if the non-straight-through heat-conducting pillar 490 is a hollow pillar, the projection of the non-straight-through heat-conducting pillar 490 on the upper surface 11 of the coupler 10 may be a non-closed ring, such as a semi-ring.

As shown in fig. 19, the non-direct-connected heat-conducting pillars 490 may also be exposed from the connection between two adjacent side surfaces 13 of the coupler 10, or may be directly exposed from two adjacent side surfaces 13 of the coupler 10, that is, the non-direct-connected heat-conducting pillars 490 are located at the corners of the coupler 10, or alternatively, if the non-direct-connected heat-conducting pillars 490 are solid pillars, and the projection of the non-direct-connected heat-conducting pillars 490 on the upper surface 11 of the coupler 10 may be a fan shape, such as a quarter circle. Alternatively, if the non-straight-through heat-conducting pillar 490 is a hollow pillar, the projection of the non-straight-through heat-conducting pillar 490 on the upper surface 11 of the coupler 10 may be a non-closed ring, such as a quarter ring.

Optionally, the non-direct-connected heat-conducting columns 490 are arranged to penetrate through the whole coupler 10, heat of the first direct-connected heat-conducting columns 450 and the second direct-connected heat-conducting columns 460 can be further transmitted to the first outer core plate 500 and the second outer core plate 600 which are more convenient to dissipate heat through the non-direct-connected heat-conducting columns 490, the non-direct-connected heat-conducting columns 490 are exposed from the side surface 13 of the coupler 10, the contact area between the heat-conducting columns and air can be greatly increased, the heat dissipation area is increased, and heat dissipation is facilitated.

In an alternative embodiment, the first core board 100 further includes first non-functional pads (not shown) and second non-functional pads (not shown) disposed on the second surface 130, and the second core board 200 further includes third non-functional pads (not shown) and fourth non-functional pads (not shown) disposed on the third surface 210. Similarly, the first, second, third and fourth non-functional pads are similar or identical to the thermal conductive pad 710 of the second embodiment, and are not electrically connected to the second signal line 140 and the third signal line 220. The first direct-connection heat-conduction column 450 is sequentially connected with the first non-functional pad and the third non-functional pad, and the second direct-connection heat-conduction column 460 is sequentially connected with the second non-functional pad and the fourth non-functional pad.

Optionally, by providing the first non-functional pad, the second non-functional pad, the third non-functional pad and the fourth non-functional pad, the contact area between the first directly connected heat-conducting pillar 450 and the second directly connected heat-conducting pillar 460 and the first core board 100 and the second core board 200 is increased, so that heat of the first core board 100 and the second core board 200 is transferred to the first directly connected heat-conducting pillar 450 and the second directly connected heat-conducting pillar 460, and the heat-conducting effect is enhanced.

As shown in fig. 20, the ground metal layer 320 includes two thermal isolation pads 330, the thermal isolation pads 330 include a thermal isolation groove 331 and a thermal pad 332 disposed in the thermal isolation groove 331, the thermal pad 332 of one of the two thermal isolation pads 330 is thermally coupled to the first direct-connected thermal pillar 450, and the thermal pad 332 of the other of the two thermal isolation pads 330 is thermally coupled to the second direct-connected thermal pillar 460.

In other embodiments, the first directly connected heat conducting pillar 450, the second directly connected heat conducting pillar 460, the third directly connected heat conducting pillar, and the fourth directly connected heat conducting pillar may also be solid pillars or hollow pillars, and may all sequentially penetrate through the first outer core plate 500, the first inner core plate 100, the second inner core plate 200, and the second outer core plate 600. So that heat can be directly conducted to the first core board 500 and/or the second core board 600, which easily dissipate heat, thereby facilitating heat dissipation of the entire coupler 10.

Example four:

referring to fig. 21, the present invention provides a coupler 10, wherein the coupler 10 includes an insulating heat-conducting pillar 470 and a first core board 100 and a second core board 200 stacked in sequence.

As shown in fig. 21, the first core board 100 includes a first signal line 120 disposed on the first surface 110 far from the second core board 200 and a second signal line 140 disposed on the second surface 130 near the second core board 200, and the second core board 200 includes a third signal line 220 disposed on the third surface 210 near the first core board 100 and a fourth signal line 240 disposed on the fourth surface 230 far from the first core board 100.

Wherein the insulating heat-conducting column 470 penetrates the first core board 100 and the second core board 200 in sequence.

Optionally, the insulating heat-conducting pillar 470 is made of an insulating and highly heat-conducting material, so that it has insulating property and good heat conductivity.

In the above embodiment, the insulating heat-conducting columns 470 penetrating through the first core board 100 and the second core board 200 are provided to enhance the heat conductivity of the coupler 10 in the vertical direction, thereby facilitating the heat dissipation of the entire coupler 10. And further, since the insulating thermally conductive post 470 is an insulating material, it does not affect the electrical performance of the coupler 10.

Optionally, the thermal conductivity of the insulating thermal conductive column 470 is greater than the thermal conductivity of the first core plate 100 and the second core plate 200. The thermal conductivity of the insulating heat-conducting column 470 is greater than the thermal conductivity of the first core dielectric plate 101 and the second core dielectric plate 201.

In an alternative embodiment, the insulating thermal post 470 is not connected to the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240.

In another alternative embodiment, the insulating thermal pillar 470 is connected to at least one of the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240.

In an alternative embodiment, the insulating thermal pillar 470 is connected to the first signal trace 120, the second signal trace 140, the third signal trace 220, or the fourth signal trace 240.

As another alternative embodiment, the insulative thermally conductive post 470 is coupled to the first signal trace 120 and the second signal trace 140.

As another alternative embodiment, the insulating thermal post 470 is connected to the third signal trace 220 and the fourth signal trace 240.

As another alternative embodiment, the insulating thermal post 470 is connected to the first and

second signal lines

120, 140 and the third signal line 220.

In another alternative embodiment, the insulating thermal pillar 470 is connected to the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240.

Alternatively, since the entire coupler 10 is considered, heat is generated mainly by the signal lines such as the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240. Therefore, by directly connecting the insulating heat-conducting post 470 with the first signal line 120, the second signal line 140, the third signal line 220, and the fourth signal line 240, since there is no isolation of the first core dielectric plate 101, the second core dielectric plate 201, and other dielectric plates in the middle, heat can be directly conducted to the insulating heat-conducting post 470, thereby greatly improving heat-conducting performance. Furthermore, due to the insulating property of the insulating heat-conducting pillars 470, one insulating heat-conducting pillar 470 may connect two or more signal lines, for example, may connect the first signal line 120 and the fourth signal line 240, so as to conduct heat to the first signal line 120 and the fourth signal line 240 without affecting the electrical performance between different signal lines, and compared with the first directly-connected heat-conducting pillar 450 and the second directly-connected heat-conducting pillar 460 in the above embodiments, the effect of conducting heat to multiple signal lines by one insulating heat-conducting pillar 470 may be achieved, so as to effectively reduce the number of insulating heat-conducting pillars 470, and reduce the limitation on the arrangement position of the insulating heat-conducting pillars 470. Therefore, the volume of the entire coupler 10 can be reduced.

In alternative embodiments, the insulating thermally conductive post 470 is a solid post or a hollow post. That is, similarly, the insulating and high thermal conductive material may be injected after the hole is punched to form a solid column, or the insulating and high thermal conductive material may be coated on the inner wall after the hole is punched to form a hollow column, which is not limited herein.

As an alternative, the insulating and heat-conducting pillar 470 may be made of ceramic.

In alternative embodiments, the insulating thermally conductive post 470 includes an insulating thermally conductive buried post 471 and/or an insulating thermally conductive edge post 472.

The insulating heat-conducting buried pillar 471 is similar to the heat-conducting buried pillar 441 in the second embodiment, i.e. it is enclosed by the medium entirely located in the coupler 10, and only two ends of the insulating heat-conducting buried pillar 471 can be exposed from the upper surface 11 or the lower surface 12 of the coupler 10.

As shown in fig. 22, the insulating thermal conductive edge column 472 is similar to the thermal conductive edge column 442 in the second embodiment, for example, the insulating thermal conductive edge column 472 can be exposed from one side surface 13 of the coupler 10, that is, the insulating thermal conductive edge column 472 is located on the side surface 13 of the coupler 10, alternatively, if the insulating thermal conductive edge column 472 is a solid column, and the projection of the insulating thermal conductive edge column 472 on the upper surface 11 of the coupler 10 can be a sector, for example, a semicircle. Alternatively, if the insulating and thermally conductive side column 472 is a hollow column, the projection of the insulating and thermally conductive side column 472 on the upper surface 11 of the coupler 10 may be a non-closed ring, such as a semi-ring. The insulating and thermally conductive side column 472 may also be exposed from the junction of the two adjacent side surfaces 13 of the coupler 10, or from the two adjacent side surfaces 13, that is, the insulating and thermally conductive side column 472 is located at a corner of the coupler 10, and optionally, if the insulating and thermally conductive side column 472 is a solid column, and the projection of the insulating and thermally conductive side column 472 on the upper surface 11 of the coupler 10 may be a sector, such as a quarter circle. Alternatively, if the insulating and thermally conductive side column 472 is a hollow column, the projection of the insulating and thermally conductive side column 472 on the upper surface 11 of the coupler 10 may be a non-closed ring, such as a quarter ring.

Optionally, by arranging the insulating heat-conducting side column 472, the contact area with air can be effectively increased, so that heat dissipation is improved.

In an alternative embodiment, if the insulating thermal conductive pillar 470 is an insulating thermal conductive edge pillar 472, and the insulating thermal conductive edge pillar 472 is connected to at least one of the first signal line 120, the second signal line 140, the third signal line 220 and the fourth signal line 240, an insulating thermal conductive pad (not shown) or a non-insulating thermal conductive pad (not shown) is disposed between the insulating thermal conductive edge pillar 472 and at least one of the first signal line 120, the second signal line 140, the third signal line 220 and the fourth signal line 240. Since the first signal line 120, the second signal line 140, the third signal line 220 and the fourth signal line 240 are generally located in the middle regions of the corresponding surfaces, it is necessary to connect the insulating and heat-conducting side columns 472 located at the edges through an insulating and heat-conducting pad (not shown) or a non-insulating and heat-conducting pad (not shown).

As shown in fig. 24, the coupler 10 further includes a first outer core plate 500 disposed on the first core plate 100 away from the second core plate 200 and a second outer core plate 600 disposed on the second core plate 200 away from the first core plate 100, the first outer core plate 500 including a first ground line 520 and/or the second outer core plate 600 including a second ground line 620; the insulating thermally conductive post 470 is connected to the first ground trace 520 and/or the second ground trace 620.

As shown in fig. 23, the coupler 10 further includes a spacer plate 300 disposed between the first core plate 100 and the second core plate 200, the spacer plate 300 including a ground metal layer 320 on a surface facing the first core plate 100 and/or the second core plate 200, respectively. The insulating thermally conductive post 470 is connected to the ground metal layer 320.

In an alternative embodiment, the thermal conductivity of the insulating thermal column 470 is greater than the thermal conductivity of the grounded dielectric plate 301, the first outer core dielectric plate 501, and the second outer core dielectric plate 502.

Compared with the case where the first core dielectric sheet 101, the second core dielectric sheet 201, the ground dielectric sheet 301, the first outer core dielectric sheet 501, and the second outer core dielectric sheet 502 are used. Since the insulating heat-conducting column 470 has a better heat conductivity coefficient, the heat conductivity in the vertical direction is far better than that of the first core dielectric plate 101, the second core dielectric plate 201, the grounding dielectric plate 301, the first outer core dielectric plate 501 and the second outer core dielectric plate 502, so that the heat dissipation performance of the whole coupler 10 is greatly improved.

Optionally, no matter the insulating heat-conducting embedded column 471 or the insulating heat-conducting side column 472, at least a portion of the insulating heat-conducting embedded column 471 or the insulating heat-conducting side column 472 is located in the first inner core dielectric slab 101, the second inner core dielectric slab 201, the grounding dielectric slab 301, the first outer core dielectric slab 501 and the second outer core dielectric slab 502, because the first inner core dielectric slab 101, the second inner core dielectric slab 201, the grounding dielectric slab 301, the first outer core dielectric slab 501 and the second outer core dielectric slab 502 have certain buffering performance, the insulating heat-conducting embedded column 471 (when using ceramic) is not easy to crack under the condition of high heat, and has extremely high safety.

In an optional scenario, the first ground line 520, the second ground line 620, and the ground metal layer 320 are metal plates with large areas, which have good heat dissipation performance. By directly connecting the insulating heat-conducting post 470 with the first ground line 520, the second ground line 620 and the ground metal layer 320, the heat of the first core board 100 and the second core board 200 inside the coupler 10 can be effectively and directly transferred to the first ground line 520, the second ground line 620 and the ground metal layer 320 with good heat dissipation performance, and further, because the first ground line 520 and the second ground line 620 are exposed, a better heat dissipation effect can be achieved.

Referring to fig. 25, the present invention further provides an electronic device 1, where the electronic device 1 includes a PCB 20 and the coupler 10 of any one of the above embodiments disposed on the PCB 20.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A coupler is characterized by comprising a first direct-connection heat-conducting column, a first core plate and a second core plate which are sequentially stacked;

the first core board comprises a first signal circuit arranged on a first surface far away from the second core board and a second signal circuit arranged on a second surface close to the second core board, and the second core board comprises a third signal circuit arranged on a third surface close to the first core board and a fourth signal circuit arranged on a fourth surface far away from the first core board;

wherein the first signal line includes a first coupling section coupled to a corresponding one of the second signal lines and a first non-coupling section not coupled to the second signal line, the first coupling section and the first non-coupling section being connected to each other;

the first direct-connected heat conduction column penetrates through the first core plate and the second core plate, and one end of the first direct-connected heat conduction column is connected with the first non-coupling section.

2. The coupler of claim 1, wherein the coupler comprises a second directly connected thermally conductive post, the fourth signal line comprises a second coupled segment coupled to a corresponding one of the third signal lines and a second uncoupled segment uncoupled from the third signal line, the second coupled segment and the second uncoupled segment being connected to one another;

the second direct-connected heat-conducting column penetrates through the first core plate and the second core plate, and one end of the second direct-connected heat-conducting column is connected with the second non-coupling section.

3. The coupler of claim 2, wherein the first and second directly connected thermally conductive posts are metallic thermally conductive posts;

the first direct-connection heat conduction column is not directly and electrically connected with the second signal circuit, the third signal circuit and the fourth signal circuit;

the second direct-connected heat conduction column is not directly and electrically connected with the first signal line, the second signal line and the third signal line.

4. The coupler of claim 2, wherein the first core plate includes a first metallic heat conducting pad disposed on a first surface, and the second core plate includes a second metallic heat conducting pad disposed on a fourth surface;

the other end of the first direct-connected heat-conducting column is connected with the second metal heat-conducting bonding pad, and the other end of the second direct-connected heat-conducting column is connected with the first metal heat-conducting bonding pad.

5. The coupler of claim 4, further comprising a first outer core plate disposed on the first inner core plate away from the second inner core plate and a second outer core plate disposed on the second inner core plate away from the first inner core plate, and two non-directly connected heat-conducting pillars sequentially penetrating the first outer core plate, the first inner core plate, the second inner core plate, and the second outer core plate, one of the two non-directly connected heat-conducting pillars being connected to the first metal heat-conducting pad, and the other of the two non-directly connected heat-conducting pillars being connected to the second metal heat-conducting pad;

the non-direct-connection heat conduction column is electrically connected with the first signal line, the second signal line, the third signal line and the fourth signal line.

6. The coupler of claim 5, wherein the non-directly connected thermally conductive post lines out from one side surface of the coupler or emerges from two adjacent side surfaces of the coupler.

7. The coupler of claim 5,

the first and second directly connected heat-conducting columns further penetrate through the first and second outer core plates, and are not connected with the first and/or second grounding lines.

8. The coupler of claim 2, wherein the first core board includes first and second non-functional pads disposed on a second surface, and the second core board includes third and fourth non-functional pads disposed on a third surface;

the first direct-connection heat conduction column is sequentially connected with the first non-functional bonding pad and the third non-functional bonding pad, and the second direct-connection heat conduction column is sequentially connected with the second non-functional bonding pad and the fourth non-functional bonding pad.

9. The coupler of claim 2, further comprising an isolator plate disposed between the first core plate and the second core plate;

the isolation plate comprises grounding metal layers which are respectively arranged on the surfaces facing the first core plate and/or the second core plate;

the grounding metal layer comprises two heat dissipation isolation pads, each heat dissipation isolation pad comprises a heat dissipation isolation groove and a heat dissipation pad arranged in the heat dissipation isolation groove, the heat dissipation pad of one of the two heat dissipation isolation pads is thermally coupled with the first direct-connection heat conduction column, and the heat dissipation pad of the other of the two heat dissipation isolation pads is thermally coupled with the second direct-connection heat conduction column.

10. The coupler of claim 1, wherein the first uncoupled section includes a first port for the first signal line, and the second uncoupled section includes a second port for the fourth signal line;

one end of the first direct-connected heat-conducting column is connected with the first port, and one end of the second direct-connected heat-conducting column is connected with the second port.

11. An electronic device, characterized in that the electronic device comprises a coupler according to any of claims 1-10.