CN210576370U

CN210576370U - Coupler

Info

Publication number: CN210576370U
Application number: CN201921451078.XU
Authority: CN
Inventors: 陈媛; 罗林; 叶晓菁; 缪桦
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2019-09-02
Filing date: 2019-09-02
Publication date: 2020-05-19
Anticipated expiration: 2029-09-02

Abstract

The utility model provides a coupler, include: the middle layer is respectively laminated with the top layer core plate layer and the bottom layer core plate layer through corresponding dielectric layers; the middle layer is of a multilayer structure and comprises a first inner core plate layer and a second inner core plate layer, the first inner core plate layer comprises a first signal line and a second signal line which are arranged on two opposite surfaces, and the second inner core plate layer comprises a third signal line and a fourth signal line which are arranged on two opposite surfaces; the first signal line is connected with the third signal line to form a first coupling line, and the second signal line is connected with the fourth signal line to form a second coupling line; an isolation layer is arranged between the first core plate layer and the second core plate layer to isolate signals between different layers of signal wires on the same coupling wire. The purpose of improving the performance index of the coupler is achieved.

Description

Coupler

Technical Field

The utility model relates to a coupler design technical field especially relates to a laminated structure's coupler.

Background

As a commonly used passive device in communication systems, couplers, particularly 3dB couplers, are widely used in radio frequency, microwave circuits and communication systems. The coupler is a general microwave/millimeter wave component, and can be used for separating and synthesizing signals. The 3dB coupler can continuously sample transmission power along a certain determined direction of a transmission line, can divide an input signal into two signals which are mutually equal in amplitude and have a phase difference of 90 degrees, can also be used for multi-signal synthesis, and improves the utilization rate of an output signal. The 3dB couplers may also be used in power amplifiers, low noise amplifiers, adjustable phase shifters and adjustable attenuators. The core indexes mainly comprise: return loss, insertion loss, coupling degree, isolation degree, coupling flatness and amplitude flatness.

With the increasing expansion of communication frequency band, the design frequency band of 3dB coupler is also changing, even including the design of unequal power distribution ratio and the miniaturization of coupler volume. At present, in order to realize the miniaturization of the volume of the coupler, a multipurpose laminated structure is realized: that is, one coupling line adopts multilayer wiring, but this method can cause mutual interference between signals, and further influence the coupling index.

SUMMERY OF THE UTILITY MODEL

The utility model mainly provides a laminated structure's coupler for realize the little volume design of coupler, and guarantee the performance index of coupler.

In order to solve the technical problem, the utility model discloses a technical scheme be:

provided is a coupler including: the core plate comprises a top core plate layer, a middle layer and a bottom core plate layer, wherein the middle layer is respectively superposed with the top core plate layer and the bottom core plate layer through corresponding dielectric layers;

the interlayer comprises a first inner core plate layer and a second inner core plate layer which are laminated, wherein a first signal line and a second signal line are respectively arranged on two opposite surfaces of the first inner core plate layer, and a third signal line and a fourth signal line are respectively arranged on two opposite surfaces of the second inner core plate layer;

the first signal line is connected with the third signal line to form a first coupling line, and the second signal line is connected with the fourth signal line to form a second coupling line;

and an isolation layer is arranged between the first inner core plate layer and the second inner core plate layer so as to isolate electric signals between signal lines of different layers on the same coupling line.

The utility model has the advantages that: different from the prior art, the utility model provides a coupler, including top core plate layer, first inner core plate layer and second inner core plate layer, bottom core plate layer, be provided with first signal line and second signal line on the two surfaces of first inner core plate layer, be provided with third signal line and fourth signal line on the two surfaces of second inner core plate layer; the first signal line is connected with the third signal line to form a first coupling line, and the second signal line is connected with the fourth signal line to form a second coupling line; and an isolation layer is arranged between the first inner core plate layer and the second inner core plate layer to isolate electric signals between signal lines of different layers on the same coupling line. The utility model discloses a laminated structure is with a coupling line layered design to realize the long wire winding structure of small volume coupler, keep apart the signal between the signal line on the same layer with the same coupling line through the isolation layer, in order to prevent signal mutual interference.

Drawings

Fig. 1 is a schematic perspective view of the coupler of the present invention;

fig. 2 a-2 b are schematic plan views of a first embodiment of the coupler of the present invention;

fig. 3 a-3 b are schematic plan views of a coupler according to a second embodiment of the present invention.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

The terms "first," "second," "third," and the like in the description and in the claims, and in the drawings described above, are used for distinguishing between different objects and not necessarily for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, system, article, or apparatus.

The present invention will be described in detail with reference to the accompanying drawings and examples.

Please refer to fig. 1, which is a schematic diagram of a three-dimensional structure of the coupler of the present invention, the coupler 100 is used to realize the design of low frequency band and small size, the processing is simple, and the performance index of the coupler 100 is ensured to meet the industry requirement. Specifically, the coupler 100 includes: a plurality of core layers 101 and a plurality of dielectric layers 102, wherein a corresponding dielectric layer 102 is disposed between any two adjacent core layers 101 to stack the plurality of core layers 101 together; each core board layer 101 includes a substrate and at least one signal line disposed on at least one surface of the substrate, the signal line on at least one core board layer 101 is connected to the signal line on another core board layer 101 to form a coupling line, and an isolation layer is disposed between the core board layers to isolate signals between different layers of signal lines on the same coupling line.

Specifically, please refer to fig. 2 a-2 b, which are schematic plane structural diagrams of a coupler according to a first embodiment of the present invention. Wherein the plurality of core layers 101 includes: a top core layer 11, an intermediate layer and a bottom core layer 17, the intermediate layer being superimposed with the top core layer 11 and the bottom core layer 17, respectively, by means of respective said

dielectric layers

12, 16.

The top core layer 11 includes a substrate 111 and a metal layer disposed on the substrate 111 and away from the middle layer; the bottom core board layer 17 includes a substrate 171 and a metal layer disposed on the substrate 171 and away from the middle layer, in this embodiment, the top core board layer 11 and the bottom core board layer 17 both have a metal layer, and the surfaces having the metal layer are both away from the middle layer.

The metal layer of the surface of the top core board layer 11 away from the middle layer is provided with a first circuit layer 112, and the metal layer of the surface of the bottom core board layer 17 away from the middle layer is provided with a second circuit layer 172. Wherein the first circuit layer 112 in the top core layer 11 is connected to the second circuit layer 172 in the bottom core layer 17. In one embodiment, the thickness of the first circuit layer 112 and the second circuit layer 172 is not less than 1 ounce.

Specifically, the first circuit layer 112 in the top core layer 11 is connected to the second circuit layer 172 in the bottom core layer 17 by conductive vias 19, the conductive vias 19 extending through the top core layer 11, the middle layers, and the bottom core layer 17.

Wherein the content of the first and second substances,

the interlayer is a multilayer structure, and specifically includes a first core plate layer 13 and a second core plate layer 15, and it should be noted that the first core plate layer 13 and the second core plate layer 15 are also stacked by corresponding dielectric layers. The first core board layer 13 and the second core board layer 15 are the same as the top core board layer 11 and the bottom core board layer 17, and each include a base material board and a metal layer disposed on at least one surface of the base material board. In the present embodiment, both surfaces of the first core layer 13 and the second core layer 15 have metal layers. The first core board layer 13 includes a substrate board 131 and first and

second signal lines

132 and 133 on metal layers on opposite surfaces of the substrate board 131, and the second core board layer 15 includes a substrate board 151 and third and

fourth signal lines

152 and 153 on metal layers on opposite surfaces of the substrate board 151; wherein the first signal line 132 of the first core layer 13 is connected to the third signal line 152 of the second core layer 15 to form a first coupled line; the second signal line 133 of the first core layer 13 is connected to the fourth signal line 153 of the second core layer 15 to form a second coupled line.

An isolation layer 141 is further disposed between the first core board layer 13 and the second core board layer 15, and the isolation layer 141 is respectively stacked on the first core board layer 13 and the second core board layer 15 through the corresponding

dielectric layers

142 and 143. Both

dielectric layers

142, 143 are prepregs. The isolation layer 141 is connected to the top core board layer 11 and the bottom core board layer 17 through the conductive via 19, and is used for shielding signals between different circuit layers on the same coupling line. Specifically, the top core layer 11 and the bottom core layer 17 are both provided with ground wires, and the isolation layer 141 is connected with the ground wires on the top core layer 11 and the bottom core layer 17 through the conductive through holes 19, so as to shield signals between different layers of circuit layers on the same coupling line.

Wherein, a first conductive buried via 181 and a second conductive buried via 182 are disposed in the middle layer, wherein the first signal line 132 of the first core board layer 13 is connected to the third signal line 152 of the second core board layer 15 through the first conductive buried via 181; the second signal line 133 of the first core layer 13 is connected to the fourth signal line 153 of the second core layer 15 through the second conductive buried via 182. Specifically, referring to fig. 2a, the first conductive buried via 181 penetrates from the first signal line 132 of the first core layer 13 to the third signal line 152 of the second core layer 15, and the second conductive buried via 182 penetrates from the second signal line 133 of the first core layer 13 to the fourth signal line 153 of the second core layer 15.

It should be noted that the inner walls of the conductive via 19, the first conductive buried via 181, and the second conductive buried via 182 have metal layers to realize electrical connection, and the thickness of the metal layers is 20 to 25 μm.

In the above embodiment, the first signal line 132 is connected to the third signal line 152, and the second signal line 133 is connected to the fourth signal line 153, but in another embodiment, the first signal line 132 may be connected to the third signal line 152 and located outside the second signal line 133 connected to the fourth signal line 153, as shown in fig. 2 b.

The utility model discloses in, top layer core layer 11, first core plate layer 13, second core plate layer 15 and bottom core layer 17 are the copper-clad plate, the copper-clad plate is the base material of preparation circuit board, be in including base material board and cover copper foil on the substrate, the base material board soaks with the resin by materials such as paper base plate, glass fabric base plate, synthetic fiber fabric base plate, non-woven fabrics base plate, composite substrate, makes bonding sheet, is made by many bonding sheet combinations, covers with the copper foil at base material board single face that the preparation is good or two-sided, carries out the hot press solidification again in order to make the copper-clad plate.

In this embodiment, the top core layer 11 and the bottom core layer 17 may be copper clad laminates with copper foils on one side, the first circuit layer 112 and the second circuit layer 172 are both disposed on the copper foils, the first core layer 13 and the second core layer 15 are copper clad laminates with copper foils on both sides, and the first signal line 132, the second signal line 133, the third signal line 152 and the fourth signal line 153 are all disposed on the copper foils.

The utility model discloses in, dielectric layer (12, 14, 16) are the prepreg, and its interlayer tie coat when as the lamination, specifically, the prepreg mainly comprises resin and reinforcing material, and when making multilayer circuit board, adopt the fine cloth of glass to make reinforcing material usually, with its resin glue solution in the flooding, the thin slice is baked in advance to the thermal treatment again, and its heating can soften under the pressurization, can solidify after the cooling, and has the stickness, can bind adjacent two-layer in high temperature pressfitting process.

In one embodiment, the top core layer, the first core layer, the second core layer, and the bottom core layer are all high frequency plates.

In the present embodiment, the isolation layer 141 is a single-layer structure, which may be a conductive shielding layer, such as a copper layer, respectively stacked on the first core layer 13 and the second core layer 15 through the

dielectric layers

142 and 143, as shown in fig. 2 a. The core board can also be a core board with a copper foil covered on one side, and the core board is a copper clad board. As shown in fig. 2b, the isolation layer 141 includes a substrate 1441 and a conductive shielding layer 145 (i.e., copper foil) disposed on the substrate 1441.

Please refer to fig. 3 a-3 b, which are schematic structural diagrams of a coupler according to a third embodiment of the present invention. The difference compared to the second embodiment is that the separation layer 141 is a multi-layered structure. In one embodiment, as shown in fig. 3a, the isolation layer 141 includes multiple conductive shielding layers 145 and 146 arranged in a stacked manner, and a connection layer 144 is sandwiched between the conductive shielding layers 145 and 146; in an embodiment, the connection layer 144 is a dielectric layer, specifically a prepreg; in another embodiment, the connection layer 144 is a core board, i.e., a copper-clad board, that is, the core board includes a first substrate board and metal layers disposed on two surfaces of the first substrate board, where the metal layers are conductive shielding layers. Or in another embodiment, the connection layer 144 may be a combination of core and dielectric layers.

As shown in fig. 3b, the isolation layer 141 includes a first isolation layer 147, a dielectric layer 149 and a second isolation layer 148 stacked in sequence from top to bottom. Specifically, first isolation layer 147 includes a second substrate plate 1472 and a first electrically conductive shield layer 1471 overlying second substrate plate 1472 and proximate to second isolation layer 148, and second isolation layer 148 includes a third substrate plate 1481 and a second electrically conductive shield layer 1482 overlying third substrate plate 1481 and proximate to first isolation layer 147. The first conductive-shield layer 1471 and the second conductive-shield layer 1482 are both metal layers, i.e., copper layers.

In an embodiment, the material of the top core layer 11, the first core layer 13, the second core layer 15 and the bottom core layer 17 of the present invention is a high frequency plate, and the coupler is a 3dB coupler.

In this embodiment, only a part of the related structures of the coupler are described, and other structures are the same as those of the coupler in the prior art, and are not described herein again.

The utility model provides a coupler, including top core layer, first inner core layer, second inner core layer and bottom core layer, just including first signal line and second signal line on the first inner core layer, the second inner core layer includes third signal line and fourth signal line, first inner core layer first signal line is connected the second inner core layer the third signal line is in order to form first coupling line, first inner core layer the second signal line is connected the second inner core layer the fourth signal line is in order to form second coupling line, still be equipped with the isolation layer between first inner core layer, the second inner core layer, the isolation layer with top core layer reaches the bottom core layer is connected to shield the signal between the different layers circuit layer on with same coupling line. Therefore, one coupling line is designed in a layered mode, a long winding structure of the small-size coupler is achieved, and signal interference of the coupling lines is prevented through the isolation layer.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A coupler, characterized in that the coupler comprises: the core plate comprises a top core plate layer, a middle layer and a bottom core plate layer, wherein the middle layer is respectively superposed with the top core plate layer and the bottom core plate layer through corresponding dielectric layers;

2. The coupler of claim 1,

one sides of the top core plate layer and the bottom core plate layer are provided with grounding wires;

the coupler is provided with a conductive through hole connected with a grounding wire of the top core plate layer and/or the bottom core plate layer, and the isolation layer is connected with the top core plate layer and/or the bottom core plate layer through the conductive through hole.

3. The coupler of claim 1,

a first conductive buried hole for connecting the first signal line and the third signal line to form a first coupling line is formed in the coupler; and

and a second conductive buried via connecting the second signal line and the fourth signal line to form a second coupling line.

4. The coupler of claim 1, wherein dielectric layers are disposed on both sides of the isolation layer to bond the isolation layer to the first and second core plate layers.

5. Coupler according to claim 4, characterized in that the isolating layer is in particular a conductive shielding layer.

6. The coupler of claim 4, wherein the isolation layer comprises a plurality of stacked conductive shielding layers, and a connecting layer sandwiched between any two adjacent conductive shielding layers;

wherein the connecting layer is a dielectric layer, a core plate or a combined layer; the combined layer is formed by randomly stacking and combining a dielectric layer and a core board, and the core board comprises a first base material board and conductive shielding layers arranged on two opposite surfaces of the first base material board.

7. The coupler of claim 1, wherein the isolation layer comprises a first isolation layer, a dielectric layer and a second isolation layer which are sequentially stacked from top to bottom;

wherein the first isolation layer comprises a second substrate plate and a first conductive shield layer covering the second substrate plate and being proximate to the second isolation layer, the second isolation layer comprises a third substrate plate and a second conductive shield layer covering the third substrate plate and being proximate to the first isolation layer.

8. The coupler of claim 2, wherein the top core layer includes a first wiring layer on a surface remote from the intermediate layer;

the bottom core layer includes a second circuit layer on a surface remote from the intermediate layer.

9. The coupler of claim 8, wherein the first and second wire layers are each no less than 1 ounce thick.

10. The coupler of claim 1, wherein the top core layer, the first core layer, the second core layer, and the bottom core layer are high frequency plates.