CN114613896A - 发光元件及其制作方法 - Google Patents

发光元件及其制作方法 Download PDF

Info

Publication number
CN114613896A
CN114613896A CN202210151896.8A CN202210151896A CN114613896A CN 114613896 A CN114613896 A CN 114613896A CN 202210151896 A CN202210151896 A CN 202210151896A CN 114613896 A CN114613896 A CN 114613896A
Authority
CN
China
Prior art keywords
layer
light
light emitting
wavelength conversion
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210151896.8A
Other languages
English (en)
Chinese (zh)
Inventor
谢明勋
卢宗宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epistar Corp filed Critical Epistar Corp
Publication of CN114613896A publication Critical patent/CN114613896A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8515Wavelength conversion means not being in contact with the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8514Wavelength conversion means characterised by their shape, e.g. plate or foil
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/872Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Led Device Packages (AREA)
  • Optical Filters (AREA)
  • Vehicle Body Suspensions (AREA)
  • Control Of El Displays (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Devices (AREA)
CN202210151896.8A 2018-02-20 2019-02-20 发光元件及其制作方法 Pending CN114613896A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862632732P 2018-02-20 2018-02-20
US62/632,732 2018-02-20
CN201910126438.7A CN110176529B (zh) 2018-02-20 2019-02-20 发光元件及其制作方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201910126438.7A Division CN110176529B (zh) 2018-02-20 2019-02-20 发光元件及其制作方法

Publications (1)

Publication Number Publication Date
CN114613896A true CN114613896A (zh) 2022-06-10

Family

ID=67481530

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201910126438.7A Active CN110176529B (zh) 2018-02-20 2019-02-20 发光元件及其制作方法
CN202210151896.8A Pending CN114613896A (zh) 2018-02-20 2019-02-20 发光元件及其制作方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201910126438.7A Active CN110176529B (zh) 2018-02-20 2019-02-20 发光元件及其制作方法

Country Status (6)

Country Link
US (2) US10833233B2 (enExample)
JP (1) JP7224201B2 (enExample)
KR (1) KR102453678B1 (enExample)
CN (2) CN110176529B (enExample)
DE (1) DE102019104268A1 (enExample)
TW (3) TWI797259B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153995A (zh) * 2023-10-30 2023-12-01 罗化芯显示科技开发(江苏)有限公司 一种led封装膜层及led封装结构

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102551354B1 (ko) * 2018-04-20 2023-07-04 삼성전자 주식회사 반도체 발광 소자 및 그 제조 방법
TWI800548B (zh) * 2018-11-06 2023-05-01 晶元光電股份有限公司 發光裝置及其製作方法
CN112635640A (zh) * 2020-12-14 2021-04-09 深圳信息职业技术学院 量子点发光器件及其制备方法与应用
TWI811625B (zh) * 2021-01-29 2023-08-11 台灣愛司帝科技股份有限公司 晶片移轉方法、晶片移轉裝置以及影像顯示器
JP7401809B2 (ja) * 2021-09-29 2023-12-20 日亜化学工業株式会社 発光装置及び発光装置の製造方法
EP4160704B1 (en) * 2021-09-29 2024-12-18 Nichia Corporation Light emitting device and method of manufacturing light emitting device
CN114300586B (zh) * 2021-12-29 2024-03-29 深圳市思坦科技有限公司 一种发光器件制备方法、发光器件及显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101447543A (zh) * 2004-12-24 2009-06-03 京瓷株式会社 发光装置以及照明装置
CN102754229A (zh) * 2010-02-09 2012-10-24 日亚化学工业株式会社 发光装置、及发光装置的制造方法
US20130094176A1 (en) * 2011-10-13 2013-04-18 Intematix Corporation Wavelength conversion component with improved protective characteristics for remote wavelength conversion
CN105006508A (zh) * 2015-07-02 2015-10-28 厦门市三安光电科技有限公司 发光二极管封装结构
CN107039573A (zh) * 2016-02-04 2017-08-11 晶元光电股份有限公司 发光元件及其制造方法

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4172196B2 (ja) * 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
US7772609B2 (en) * 2004-10-29 2010-08-10 Ledengin, Inc. (Cayman) LED package with structure and materials for high heat dissipation
JP5065888B2 (ja) * 2005-03-24 2012-11-07 京セラ株式会社 発光装置ならびに照明装置
JP4771837B2 (ja) 2005-11-28 2011-09-14 京セラ株式会社 波長変換器および発光装置
JP2007288139A (ja) * 2006-03-24 2007-11-01 Sumitomo Chemical Co Ltd モノシリック発光デバイス及びその駆動方法
JP2007294890A (ja) * 2006-03-31 2007-11-08 Toshiba Lighting & Technology Corp 発光装置
JP2008166782A (ja) * 2006-12-26 2008-07-17 Seoul Semiconductor Co Ltd 発光素子
US20100277932A1 (en) * 2008-01-23 2010-11-04 Helio Optoelectronics Corporation Halation-Free Light-Emitting Diode Holder
TWI478370B (zh) * 2008-08-29 2015-03-21 晶元光電股份有限公司 一具有波長轉換結構之半導體發光裝置及其封裝結構
KR100982991B1 (ko) 2008-09-03 2010-09-17 삼성엘이디 주식회사 양자점 파장변환체, 양자점 파장변환체의 제조방법 및 양자점 파장변환체를 포함하는 발광장치
JP5431706B2 (ja) * 2008-10-01 2014-03-05 ミネベア株式会社 発光装置
JP5377985B2 (ja) * 2009-01-13 2013-12-25 株式会社東芝 半導体発光素子
KR100986336B1 (ko) * 2009-10-22 2010-10-08 엘지이노텍 주식회사 발광소자, 발광소자 제조방법 및 발광소자 패키지
US20110303940A1 (en) * 2010-06-14 2011-12-15 Hyo Jin Lee Light emitting device package using quantum dot, illumination apparatus and display apparatus
KR20140035978A (ko) 2011-07-05 2014-03-24 데쿠세리아루즈 가부시키가이샤 형광체 시트 형성용 수지 조성물
KR101251821B1 (ko) * 2011-09-15 2013-04-09 엘지이노텍 주식회사 발광 소자 패키지
KR101686572B1 (ko) * 2011-10-21 2016-12-15 삼성전자 주식회사 발광 소자
JP5889646B2 (ja) * 2012-01-26 2016-03-22 シャープ株式会社 蛍光体板、蛍光体板を用いた発光装置及び蛍光体板の製造方法
DE102012102119A1 (de) * 2012-03-13 2013-09-19 Osram Opto Semiconductors Gmbh Flächenlichtquelle
CN103152932A (zh) * 2013-04-21 2013-06-12 杭州乐图光电科技有限公司 一种可调光可调色温的led驱动电路
KR102084039B1 (ko) 2013-07-02 2020-03-04 삼성디스플레이 주식회사 광원 유닛, 그것의 제조 방법, 및 그것을 포함하는 백라이트 유닛
WO2015020205A1 (ja) * 2013-08-09 2015-02-12 株式会社光波 発光装置
KR20150035065A (ko) * 2013-09-27 2015-04-06 삼성전자주식회사 불소계 형광체를 사용한 표시 장치
EP3975272A1 (en) * 2014-05-29 2022-03-30 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package
JP2016076634A (ja) * 2014-10-08 2016-05-12 エルジー ディスプレイ カンパニー リミテッド Ledパッケージ、バックライトユニット及び液晶表示装置
TWI583019B (zh) * 2015-02-17 2017-05-11 新世紀光電股份有限公司 Light emitting diode and manufacturing method thereof
US9966514B2 (en) * 2015-07-02 2018-05-08 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode package structure and fabrication method
CN204923802U (zh) * 2015-09-09 2015-12-30 宁波天海制冷设备有限公司 谷物干燥机用热泵
JP6459880B2 (ja) * 2015-09-30 2019-01-30 日亜化学工業株式会社 発光装置及びその製造方法
TWI677114B (zh) * 2015-10-05 2019-11-11 行家光電股份有限公司 具導角反射結構的發光裝置
JP6500255B2 (ja) * 2015-10-15 2019-04-17 豊田合成株式会社 発光装置の製造方法
CN106816520A (zh) 2015-11-30 2017-06-09 隆达电子股份有限公司 波长转换材料及其应用
DE102016103463A1 (de) * 2016-02-26 2017-08-31 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US10825970B2 (en) * 2016-02-26 2020-11-03 Epistar Corporation Light-emitting device with wavelength conversion structure
JP6711021B2 (ja) * 2016-03-02 2020-06-17 日亜化学工業株式会社 発光装置及びその製造方法
EP3491679B1 (en) * 2016-07-26 2023-02-22 CreeLED, Inc. Light emitting diodes, components and related methods
CN107706281B (zh) * 2016-08-09 2019-07-19 行家光电股份有限公司 具湿气阻隔结构的晶片级封装发光装置
KR102674066B1 (ko) * 2016-11-11 2024-06-13 삼성전자주식회사 발광 소자 패키지
KR102680862B1 (ko) * 2016-12-16 2024-07-03 삼성전자주식회사 반도체 발광장치
KR102754224B1 (ko) * 2017-01-09 2025-01-10 삼성전자주식회사 발광 소자 패키지, 그 제조 방법, 발광 소자 패키지를 포함하는 백라이트 유닛, 및 표시 장치
CN106876561A (zh) * 2017-03-14 2017-06-20 河北利福光电技术有限公司 一种远程荧光粉封装结构及其实现方法
JP6966691B2 (ja) * 2017-05-31 2021-11-17 日亜化学工業株式会社 発光装置及び発光装置の製造方法
KR102389815B1 (ko) * 2017-06-05 2022-04-22 삼성전자주식회사 양자점 유리셀 및 이를 포함하는 발광소자 패키지
KR102401826B1 (ko) * 2017-09-15 2022-05-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 이를 포함하는 조명장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101447543A (zh) * 2004-12-24 2009-06-03 京瓷株式会社 发光装置以及照明装置
CN102754229A (zh) * 2010-02-09 2012-10-24 日亚化学工业株式会社 发光装置、及发光装置的制造方法
US20130094176A1 (en) * 2011-10-13 2013-04-18 Intematix Corporation Wavelength conversion component with improved protective characteristics for remote wavelength conversion
CN105006508A (zh) * 2015-07-02 2015-10-28 厦门市三安光电科技有限公司 发光二极管封装结构
CN107039573A (zh) * 2016-02-04 2017-08-11 晶元光电股份有限公司 发光元件及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153995A (zh) * 2023-10-30 2023-12-01 罗化芯显示科技开发(江苏)有限公司 一种led封装膜层及led封装结构

Also Published As

Publication number Publication date
US20190259922A1 (en) 2019-08-22
US10833233B2 (en) 2020-11-10
JP2019145794A (ja) 2019-08-29
TW201935716A (zh) 2019-09-01
US20210020815A1 (en) 2021-01-21
KR102453678B1 (ko) 2022-10-11
CN110176529B (zh) 2022-03-08
CN110176529A (zh) 2019-08-27
TW202249305A (zh) 2022-12-16
DE102019104268A1 (de) 2019-08-22
TWI797259B (zh) 2023-04-01
TW201935714A (zh) 2019-09-01
JP7224201B2 (ja) 2023-02-17
TWI794127B (zh) 2023-02-21
TWI774927B (zh) 2022-08-21
KR20190100076A (ko) 2019-08-28
US11430925B2 (en) 2022-08-30

Similar Documents

Publication Publication Date Title
CN110176529B (zh) 发光元件及其制作方法
US12119321B2 (en) Semiconductor device and a method of manufacturing thereof
CN114497311B (zh) 发光元件
CN110071134B (zh) 发光元件、其制造方法及显示模块
US9627577B2 (en) Semiconductor light-emitting device and method for forming the same
US10749076B2 (en) Light-emitting device
CN105845800B (zh) 发光装置
TWI674684B (zh) 發光裝置以及其製造方法
KR101068649B1 (ko) 반도체 발광 소자 및 그 형성 방법
CN109980077A (zh) 一种发光元件及其发光装置
CN100364121C (zh) 半导体发光元件及其制造方法
CN107204395A (zh) 半导体装置及其制造方法
CN106935697B (zh) 发光装置以及其制造方法
TW202036936A (zh) 發光模組
CN101174668A (zh) 半导体发光元件及其制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20220610

WD01 Invention patent application deemed withdrawn after publication