CN114613896A - 发光元件及其制作方法 - Google Patents
发光元件及其制作方法 Download PDFInfo
- Publication number
- CN114613896A CN114613896A CN202210151896.8A CN202210151896A CN114613896A CN 114613896 A CN114613896 A CN 114613896A CN 202210151896 A CN202210151896 A CN 202210151896A CN 114613896 A CN114613896 A CN 114613896A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Landscapes
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Vehicle Body Suspensions (AREA)
- Control Of El Displays (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862632732P | 2018-02-20 | 2018-02-20 | |
| US62/632,732 | 2018-02-20 | ||
| CN201910126438.7A CN110176529B (zh) | 2018-02-20 | 2019-02-20 | 发光元件及其制作方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910126438.7A Division CN110176529B (zh) | 2018-02-20 | 2019-02-20 | 发光元件及其制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114613896A true CN114613896A (zh) | 2022-06-10 |
Family
ID=67481530
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910126438.7A Active CN110176529B (zh) | 2018-02-20 | 2019-02-20 | 发光元件及其制作方法 |
| CN202210151896.8A Pending CN114613896A (zh) | 2018-02-20 | 2019-02-20 | 发光元件及其制作方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910126438.7A Active CN110176529B (zh) | 2018-02-20 | 2019-02-20 | 发光元件及其制作方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10833233B2 (enExample) |
| JP (1) | JP7224201B2 (enExample) |
| KR (1) | KR102453678B1 (enExample) |
| CN (2) | CN110176529B (enExample) |
| DE (1) | DE102019104268A1 (enExample) |
| TW (3) | TWI797259B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153995A (zh) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | 一种led封装膜层及led封装结构 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102551354B1 (ko) * | 2018-04-20 | 2023-07-04 | 삼성전자 주식회사 | 반도체 발광 소자 및 그 제조 방법 |
| TWI800548B (zh) * | 2018-11-06 | 2023-05-01 | 晶元光電股份有限公司 | 發光裝置及其製作方法 |
| CN112635640A (zh) * | 2020-12-14 | 2021-04-09 | 深圳信息职业技术学院 | 量子点发光器件及其制备方法与应用 |
| TWI811625B (zh) * | 2021-01-29 | 2023-08-11 | 台灣愛司帝科技股份有限公司 | 晶片移轉方法、晶片移轉裝置以及影像顯示器 |
| JP7401809B2 (ja) * | 2021-09-29 | 2023-12-20 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
| EP4160704B1 (en) * | 2021-09-29 | 2024-12-18 | Nichia Corporation | Light emitting device and method of manufacturing light emitting device |
| CN114300586B (zh) * | 2021-12-29 | 2024-03-29 | 深圳市思坦科技有限公司 | 一种发光器件制备方法、发光器件及显示装置 |
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| US20130094176A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
| CN105006508A (zh) * | 2015-07-02 | 2015-10-28 | 厦门市三安光电科技有限公司 | 发光二极管封装结构 |
| CN107039573A (zh) * | 2016-02-04 | 2017-08-11 | 晶元光电股份有限公司 | 发光元件及其制造方法 |
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| KR102754224B1 (ko) * | 2017-01-09 | 2025-01-10 | 삼성전자주식회사 | 발광 소자 패키지, 그 제조 방법, 발광 소자 패키지를 포함하는 백라이트 유닛, 및 표시 장치 |
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| JP6966691B2 (ja) * | 2017-05-31 | 2021-11-17 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
| KR102389815B1 (ko) * | 2017-06-05 | 2022-04-22 | 삼성전자주식회사 | 양자점 유리셀 및 이를 포함하는 발광소자 패키지 |
| KR102401826B1 (ko) * | 2017-09-15 | 2022-05-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 이를 포함하는 조명장치 |
-
2019
- 2019-02-20 CN CN201910126438.7A patent/CN110176529B/zh active Active
- 2019-02-20 KR KR1020190019950A patent/KR102453678B1/ko active Active
- 2019-02-20 DE DE102019104268.2A patent/DE102019104268A1/de not_active Withdrawn
- 2019-02-20 JP JP2019028489A patent/JP7224201B2/ja active Active
- 2019-02-20 TW TW108105645A patent/TWI797259B/zh active
- 2019-02-20 US US16/280,465 patent/US10833233B2/en active Active
- 2019-02-20 TW TW108105622A patent/TWI774927B/zh not_active IP Right Cessation
- 2019-02-20 CN CN202210151896.8A patent/CN114613896A/zh active Pending
- 2019-02-20 TW TW111127725A patent/TWI794127B/zh not_active IP Right Cessation
-
2020
- 2020-10-01 US US17/060,772 patent/US11430925B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447543A (zh) * | 2004-12-24 | 2009-06-03 | 京瓷株式会社 | 发光装置以及照明装置 |
| CN102754229A (zh) * | 2010-02-09 | 2012-10-24 | 日亚化学工业株式会社 | 发光装置、及发光装置的制造方法 |
| US20130094176A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
| CN105006508A (zh) * | 2015-07-02 | 2015-10-28 | 厦门市三安光电科技有限公司 | 发光二极管封装结构 |
| CN107039573A (zh) * | 2016-02-04 | 2017-08-11 | 晶元光电股份有限公司 | 发光元件及其制造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153995A (zh) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | 一种led封装膜层及led封装结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190259922A1 (en) | 2019-08-22 |
| US10833233B2 (en) | 2020-11-10 |
| JP2019145794A (ja) | 2019-08-29 |
| TW201935716A (zh) | 2019-09-01 |
| US20210020815A1 (en) | 2021-01-21 |
| KR102453678B1 (ko) | 2022-10-11 |
| CN110176529B (zh) | 2022-03-08 |
| CN110176529A (zh) | 2019-08-27 |
| TW202249305A (zh) | 2022-12-16 |
| DE102019104268A1 (de) | 2019-08-22 |
| TWI797259B (zh) | 2023-04-01 |
| TW201935714A (zh) | 2019-09-01 |
| JP7224201B2 (ja) | 2023-02-17 |
| TWI794127B (zh) | 2023-02-21 |
| TWI774927B (zh) | 2022-08-21 |
| KR20190100076A (ko) | 2019-08-28 |
| US11430925B2 (en) | 2022-08-30 |
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