CN114594845A - Preparation method of aluminum-copper radiator - Google Patents
Preparation method of aluminum-copper radiator Download PDFInfo
- Publication number
- CN114594845A CN114594845A CN202210229493.0A CN202210229493A CN114594845A CN 114594845 A CN114594845 A CN 114594845A CN 202210229493 A CN202210229493 A CN 202210229493A CN 114594845 A CN114594845 A CN 114594845A
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- CN
- China
- Prior art keywords
- aluminum
- radiator
- copper
- laser
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 32
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract 5
- 238000005245 sintering Methods 0.000 claims abstract 2
- 238000001465 metallisation Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 239000011889 copper foil Substances 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of heat dissipation, and particularly relates to a preparation method of an aluminum-copper radiator. The invention is to spread a metal foil with the thickness of 0.01-0.1mm on the surface of an aluminum radiator base, open a computer to draw a graph, set laser parameters, open a laser to carry out laser scanning sintering, and scan for a plurality of times. The aluminum radiator has higher specific heat capacity, so that the heat of the radiator is quickly transferred to the air, but the heat conductivity coefficient of aluminum is low, the process of transferring the heat from the temperature of a CPU to the radiator is slow, the heat conductivity coefficient of copper is much larger than that of aluminum, so that the temperature of the CPU is also quickly transferred to the surface of copper, and finally, the temperature is quickly transferred to the air from the surface of the aluminum radiator.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a preparation method of an aluminum-copper radiator.
Background
With the progress of times and science and technology, people have a demand for convenience of notebook computers, so that the size of the computers is smaller and smaller, the internal space of the computer body is infinitely compressed, and the heat dissipation problem of the notebook computers is solved. High temperature may cause the computer to be jammed, which affects the user experience, seriously damages accessories and shortens the service life of the computer. In this case, the external radiator is timed. The base radiator is the radiator most often purchased by users, and the heat generated in the computer is diffused as soon as possible through the fan, so that the cooling effect is achieved.
Most of the radiators are aluminum radiators, and because the specific heat capacity of aluminum is large, the heat dissipation is fast, but the heat conductivity of aluminum is low, and the temperature of a CPU is slowly transferred to the radiating fins, so that the heat dissipation efficiency of the whole radiator is affected.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a preparation method of an aluminum-copper radiator, aiming at improving the heat dissipation efficiency of the radiator by carrying out low-cost rapid laser scanning metallization on the surface of an aluminum radiator base and plating copper metal on the surface of the aluminum radiator base. The invention is specially applied to a heat dissipation structure for independent use, and the heat radiator applied in the invention has higher heat conductivity coefficient and lower thermal resistance than the common heat radiator.
The technical scheme for realizing the purpose of the invention is carried out according to the following steps:
(1) and drawing a metallization graph with a corresponding size in graph editing software according to the size of the surface of the aluminum radiator base to be processed.
(2) The aluminum radiator to be treated is placed on a laser workbench, and is subjected to surface treatment, wherein the surface treatment comprises the steps of oil removal, cleaning and impurity removal, and drying, and the factors such as oil films, impurities and the like are prevented from generating inclusion in a metal layer, so that the binding force between a copper layer and the aluminum radiator is increased.
(3) Laying a copper foil, and carrying out laser scanning according to the drawn metalized pattern, wherein the scanning speed is 10-1000mm/s, and preferably 100-400 mm/s; the scanning power is 1-50W, the power is increased, which is beneficial to improving the bonding strength of the metallization layer, but the excessive power can cause the metal layer to be ablated, so the power is limited in a certain range, and is preferably 20-40W;
the thickness of the copper foil is 0.01-0.1mm, the copper foil with the thickness can be broken down by laser, the thickness is too large, the laser cannot be broken down, a metalized layer cannot be formed, the thickness is too low, the target material cost is increased, and the thickness of the metal layer is reduced.
The wavelength of the laser scanning is 1.06 μm, the laser with the wavelength can strongly act with the metal target, so that the target is gasified and sputtered, and the laser with the increased wavelength, such as the carbon dioxide laser with the wavelength of 10.6 μm, can not excite the target and can not complete metallization.
Compared with the prior art, the invention has the advantages and beneficial effects that:
the traditional heat sink is mostly made of aluminum, and the heat dissipation of the CPU is actually two processes, one is from the CPU to the heat sink, and the other is from the heat sink to the environment (air). The coefficient of thermal conductivity of aluminum is 237W/(m.k), the coefficient of thermal conductivity of copper is 401W/(m.k), it can be seen that the coefficient of thermal conductivity of copper is much larger than that of aluminum, heat is transferred from CPU to heat sink, the heat transfer rate in this process is obviously better than that of aluminum heat sink, so plating a layer of copper on the surface of aluminum heat sink is much better. However, in the second stage, the specific heat capacity of copper is much smaller than that of aluminum when heat is transferred from the heat sink to the air, so that the heat dissipation efficiency of copper is lower than that of aluminum in the process. Overall, the heat dissipation efficiency of the heat sink is much higher than that of a simple aluminum heat sink.
Detailed Description
The invention is described in more detail below with reference to specific examples, without limiting the scope of the invention. Unless otherwise specified, the experimental methods adopted by the invention are all conventional methods, and experimental equipment, materials, reagents and the like used in the experimental method can be obtained from commercial sources.
Example 1
The invention relates to a preparation method of an aluminum-copper radiator, which comprises the following steps:
(1) the size of the aluminum radiator base to be processed is 20 × 40mm, and a metallization graph with a corresponding size is drawn in graph editing software;
(2) placing an aluminum radiator to be processed on a laser workbench, paving a copper foil with the thickness of 0.01mm, setting the laser scanning speed to be 100m/s, carrying out laser scanning according to a drawn metallization graph, clicking a start button to complete metallization, and automatically completing the metallization process by a computer.
Example 2
The invention relates to a preparation method of an aluminum-copper radiator, which comprises the following steps:
(1) the size of the aluminum radiator base to be processed is 25 × 40mm, and a metallized graph with a corresponding size is drawn in graph editing software;
(2) placing an aluminum radiator to be processed on a laser workbench, laying copper foil with the thickness of 0.05mm, setting the laser scanning speed to be 80m/s, carrying out laser scanning according to a drawn metallization graph, clicking a start button to complete metallization, and automatically completing the metallization process by a computer.
Example 3
The invention relates to a preparation method of an aluminum-copper radiator, which comprises the following steps:
(1) the size of the aluminum radiator base to be processed is 30 × 40mm, and a metallized graph with a corresponding size is drawn in graph editing software;
(2) placing an aluminum radiator to be processed on a laser workbench, laying a copper foil with the thickness of 0.1mm, setting the laser scanning speed to be 60m/s, carrying out laser scanning according to a drawn metallization graph, clicking a start button to complete metallization, and automatically completing the metallization process by a computer.
Measured thermal conductivity (110W/ms), adhesion (23MPa), thermal resistance (0.08 ℃/Wcm)2)。
Comparative example 1
The common heat radiator adopts mechanical linkage between the copper column and the aluminum radiating fin, the middle of the common heat radiator is provided with a large number of holes and air holes, the heat conductivity of the common heat radiator is obviously reduced, and the thermal resistance is increased, wherein the heat conductivity of the existing common heat radiator is 110W/ms, and the thermal resistance is 2 ℃/W cm2。
The embodiments described above are only preferred embodiments of the invention, and are not all possible embodiments for the practical implementation of the invention. Any obvious modifications to the above would be obvious to those of ordinary skill in the art, but would not bring the invention so modified beyond the spirit and scope of the present invention.
Claims (6)
1. A preparation method of an aluminum-copper radiator is characterized in that a metal foil is paved on the surface of the aluminum radiator, and metal laser scanning is carried out to realize surface metallization.
2. The method for manufacturing an aluminum-copper heat sink according to claim 1, wherein the metal foil is a copper metal foil with a thickness of 0.01-0.1 mm.
3. The method for preparing an aluminum-copper heat sink as recited in claim 1, wherein the laser wavelength of the laser scanning is 1.06 μm.
4. The method for preparing the aluminum-copper radiator according to claim 1, comprising the following steps:
the method comprises the following steps: drawing a corresponding graph in graph editing software according to the size of the aluminum radiator base to be metallized;
step two: placing an aluminum radiator on a laser workbench, and laying a copper metal foil with the thickness of 0.01-0.1 mm;
step three: and opening the laser, aligning the position of the aluminum radiator to be metallized with the laser area, clicking and scanning, and performing laser scanning sintering.
5. The method for manufacturing an aluminum-copper heat sink as recited in claim 4, wherein the scanning speed in the third step is 10-1000 mm/s.
6. The method for preparing an aluminum-copper heat sink as recited in claim 4, wherein the scanning power in the third step is 1-50W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210229493.0A CN114594845A (en) | 2022-03-09 | 2022-03-09 | Preparation method of aluminum-copper radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210229493.0A CN114594845A (en) | 2022-03-09 | 2022-03-09 | Preparation method of aluminum-copper radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114594845A true CN114594845A (en) | 2022-06-07 |
Family
ID=81818661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210229493.0A Pending CN114594845A (en) | 2022-03-09 | 2022-03-09 | Preparation method of aluminum-copper radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114594845A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005332A (en) * | 2005-06-21 | 2007-01-11 | Kansai Pipe Kogyo Kk | Heat sink and its manufacturing method |
| CN101245459A (en) * | 2007-02-12 | 2008-08-20 | 杜建伟 | Method for coating on high heat conduction metallic face of such as copper and aluminum |
-
2022
- 2022-03-09 CN CN202210229493.0A patent/CN114594845A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005332A (en) * | 2005-06-21 | 2007-01-11 | Kansai Pipe Kogyo Kk | Heat sink and its manufacturing method |
| CN101245459A (en) * | 2007-02-12 | 2008-08-20 | 杜建伟 | Method for coating on high heat conduction metallic face of such as copper and aluminum |
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