CN114577043A - High-efficient heat dissipation loop heat pipe - Google Patents

High-efficient heat dissipation loop heat pipe Download PDF

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Publication number
CN114577043A
CN114577043A CN202210173464.7A CN202210173464A CN114577043A CN 114577043 A CN114577043 A CN 114577043A CN 202210173464 A CN202210173464 A CN 202210173464A CN 114577043 A CN114577043 A CN 114577043A
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CN
China
Prior art keywords
evaporator
condenser
shell
heat pipe
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202210173464.7A
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Chinese (zh)
Inventor
周梓博
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CN202210173464.7A priority Critical patent/CN114577043A/en
Publication of CN114577043A publication Critical patent/CN114577043A/en
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a high-efficiency heat dissipation loop heat pipe which comprises a condenser and an evaporator, wherein the inlet end and the outlet end of the condenser are respectively communicated with the outlet end and the inlet end of the evaporator through pipelines to form an annular pipeline; the condenser comprises a condenser shell, the bottom of the condenser shell is provided with a radiation plate, and a condenser micro-channel is arranged in the condenser shell; the evaporator comprises an evaporator shell, a heat source plate is arranged at the bottom of the evaporator shell, and a microchannel and a capillary core are arranged in the evaporator shell; the invention applies the working medium two-phase flow principle, has high heat dissipation speed, can improve the heat flux density, is a high-efficiency, energy-consumption-free and self-driven small heat dissipation loop heat pipe, and can be applied to small 3C terminals, computer host heat dissipation, servers, data centers, automobile electronic systems and the like.

Description

High-efficient heat dissipation loop heat pipe
Technical Field
The invention relates to the field of radiators, in particular to a high-efficiency heat-dissipation loop heat pipe.
Background
With the advent of the 5G and 6G era, electronic information and communication manufacturing thereof have become important energy consumption fields in China, so that thermal management of miniaturized electronic products is one of the challenges of future electronic technologies, and the traditional heat dissipation mode cannot meet the efficient heat dissipation requirement caused by the improvement of chip performance. Therefore, a new technology is needed to solve the heat dissipation problem in a more sustainable manner, and most of the existing chip radiators adopt an active heat dissipation technology, so that the heat dissipation noise is strong and the effect is not ideal, and therefore, designing an efficient heat dissipation loop heat pipe is a problem that needs to be solved urgently by technicians in the related field.
Disclosure of Invention
In order to solve the technical problems, the technical scheme provided by the invention is as follows: a high-efficiency heat dissipation loop heat pipe comprises a condenser and an evaporator, wherein the inlet end and the outlet end of the condenser are respectively communicated with the outlet end and the inlet end of the evaporator through pipelines to form an annular pipeline; the condenser comprises a condenser shell, the bottom of the condenser shell is provided with a radiation plate, and a condenser micro-channel is arranged in the condenser shell; the evaporator comprises an evaporator shell, a heat source plate is arranged at the bottom of the evaporator shell, and a microchannel and a capillary core are arranged in the evaporator shell; the connecting part of the pipeline and the condenser is provided with a heat radiating fin, and the pipeline connected with the inlet end of the evaporator extends into the evaporator and is provided with a micropore spraying jet head.
Preferably, the condenser micro-channel consists of a plurality of micro-channel plates arranged at intervals, and the micro-channel plates are arranged along the inlet end and the outlet end of the condenser.
Preferably, the microchannel comprises a plurality of grooves arranged on the bottom plate of the evaporator, the grooves are arranged in a direction perpendicular to a connecting line between an inlet end and an outlet end of the evaporator, and the capillary core is embedded in the microchannel.
Preferably, the capillary core comprises end capillary cores embedded at two ends of the microchannel and a middle capillary core embedded in the middle of the microchannel.
Preferably, the evaporator is a donut evaporator.
Preferably, the micro-pore spray jet head is an arc spray jet head corresponding to the evaporator shell.
Preferably, the condenser is a square condenser.
After the scheme is adopted, the invention has the following advantages: the invention applies the working medium two-phase flow principle, has high heat dissipation speed, can improve the heat flux density, is a high-efficiency, energy-consumption-free and self-driven small heat dissipation loop heat pipe, and can be applied to small 3C terminals, computer host heat dissipation, servers, data centers, automobile electronic systems and the like.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a high-efficiency heat-dissipating loop heat pipe according to the present invention.
Fig. 2 is a schematic diagram of an internal structure of a high-efficiency heat-dissipating loop heat pipe according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are usually placed in when used, the orientations or positional relationships are only used for convenience of describing the present invention and simplifying the description, but the terms do not indicate or imply that the devices or elements indicated must have specific orientations, be constructed in specific orientations, and operate, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not require that the components be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present invention, "a plurality" represents at least 2.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Examples
A high-efficiency heat dissipation loop heat pipe comprises a condenser 1 and an evaporator 2, wherein the inlet end and the outlet end of the condenser 1 are respectively communicated with the outlet end and the inlet end of the evaporator 2 through a pipeline 3 to form an annular pipeline; the condenser 1 is a square condenser, the condenser 1 comprises a condenser shell 101, the condenser shell 101 is a hollow shell consisting of a condenser bottom shell and a condenser cover plate, the bottom of the condenser shell 101 is provided with a radiation plate 102, a condenser micro-channel 4 is arranged in the condenser shell 101, the condenser micro-channel 4 consists of a plurality of micro-channel plates 401 arranged at intervals, the micro-channel plates 401 are arranged along the inlet end and the outlet end of the condenser 1, and meanwhile, the two ends of the micro-channel plates are spaced from the two ends of the condenser shell; the evaporator 2 of this embodiment is a circular-ring evaporator, the evaporator 2 includes an evaporator shell 201, the evaporator shell 201 is a hollow shell composed of an evaporator bottom shell and an evaporator cover plate, a heat source plate 202 is arranged at the bottom of the evaporator shell 201, and a microchannel 203 and a capillary core 5 are arranged in the evaporator shell 201; the microchannel 203 comprises a plurality of grooves arranged on the bottom plate of the evaporator 2, the grooves are arranged along the direction vertical to the connecting line of the inlet end and the outlet end of the evaporator 2, the capillary core 5 is embedded in the microchannel 203, the capillary core 5 comprises an end capillary core 501 embedded at the two ends of the microchannel 203 and a middle capillary core 502 embedded in the middle of the microchannel 203, a heat dissipation fin 6 is arranged at the joint of the pipeline 3 and the condenser 1, the pipeline 3 connected with the inlet end of the evaporator 2 extends into the evaporator 2 and is provided with a microporous spray emitter 7, and the microporous spray emitter 7 is an arc spray emitter corresponding to the evaporator shell 201.
When the micro-pore spray nozzle is used, a liquid working medium flows in the annular pipeline, the micro-pore spray nozzle atomizes the liquid working medium and uniformly sprays the liquid working medium into the cavity of the annular evaporator, the capillary core is sintered on the micro-channel in the annular evaporator, the heat of a heat source is transferred to the bottom of the evaporator, the atomized liquid working medium starts absorbing heat in the micro-channel, the capillary core sucks the liquid working medium, the heat exchange efficiency is greatly improved, the liquid working medium is beneficial to latent heat of vaporization to absorb heat and raise the temperature, and the liquid working medium starts vaporizing when the temperature reaches the boiling point, so that the conversion from a liquid phase to a gas phase is realized; simultaneously, due to the suction effect of the capillary core, a driving force of gas phase motion is provided, vaporized working media flow out of the pipeline, primary condensation is achieved through the radiating fins, condensation is achieved through the micro-channel condenser, the micro-channel increases the radiating contact area, meanwhile, the bottom of the condenser is adhered with the radiating plate, heat can be conducted to the surrounding environment rapidly, gaseous working media release heat and are cooled, the gaseous working media are condensed into liquid, conversion from a gas phase to a liquid phase is achieved, the liquid working media continue to flow in the pipeline, flow into the annular evaporator through the spray head, and heat is dissipated in a continuous circulating mode.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. The high-efficiency heat dissipation loop heat pipe is characterized by comprising a condenser and an evaporator, wherein the inlet end and the outlet end of the condenser are respectively communicated with the outlet end and the inlet end of the evaporator through pipelines to form an annular pipeline; the condenser comprises a condenser shell, the bottom of the condenser shell is provided with a radiation plate, and a condenser micro-channel is arranged in the condenser shell; the evaporator comprises an evaporator shell, a heat source plate is arranged at the bottom of the evaporator shell, and a microchannel and a capillary core are arranged in the evaporator shell; the connecting part of the pipeline and the condenser is provided with a heat radiating fin, and the pipeline connected with the inlet end of the evaporator extends into the evaporator and is provided with a micropore spraying jet head.
2. A high efficiency heat dissipating loop heat pipe as claimed in claim 1, wherein the micro flow channel of the condenser is composed of a plurality of micro flow channel plates arranged at intervals, and the micro flow channel plates are arranged along the inlet and outlet ends of the condenser.
3. A high efficiency heat dissipating loop heat pipe as claimed in claim 1, wherein the microchannels comprise a plurality of grooves formed in the bottom plate of the evaporator, the grooves are formed along a direction perpendicular to a line connecting the inlet end and the outlet end of the evaporator, and the capillary wick is embedded in the microchannels.
4. A high efficiency heat dissipating loop heat pipe as claimed in claim 3, wherein the capillary wick includes end capillary wicks embedded at both ends of the microchannel and middle capillary wicks embedded at the middle of the microchannel.
5. A high efficiency heat dissipating loop heat pipe as claimed in claim 1, wherein the evaporator is a donut type evaporator.
6. A high efficiency heat dissipating loop heat pipe as claimed in claim 1, wherein the micro-hole shower head is an arc shower head corresponding to the evaporator case.
7. A high efficiency heat dissipating loop heat pipe as claimed in claim 1, wherein the condenser is a square condenser.
CN202210173464.7A 2022-02-24 2022-02-24 High-efficient heat dissipation loop heat pipe Withdrawn CN114577043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210173464.7A CN114577043A (en) 2022-02-24 2022-02-24 High-efficient heat dissipation loop heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210173464.7A CN114577043A (en) 2022-02-24 2022-02-24 High-efficient heat dissipation loop heat pipe

Publications (1)

Publication Number Publication Date
CN114577043A true CN114577043A (en) 2022-06-03

Family

ID=81773566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210173464.7A Withdrawn CN114577043A (en) 2022-02-24 2022-02-24 High-efficient heat dissipation loop heat pipe

Country Status (1)

Country Link
CN (1) CN114577043A (en)

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Application publication date: 20220603