CN114545668A - Screen impurity processing method, device and system and electronic equipment - Google Patents
Screen impurity processing method, device and system and electronic equipment Download PDFInfo
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- CN114545668A CN114545668A CN202210167483.9A CN202210167483A CN114545668A CN 114545668 A CN114545668 A CN 114545668A CN 202210167483 A CN202210167483 A CN 202210167483A CN 114545668 A CN114545668 A CN 114545668A
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- 239000012535 impurity Substances 0.000 title claims abstract description 59
- 238000003672 processing method Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000012545 processing Methods 0.000 claims abstract description 44
- 230000007547 defect Effects 0.000 claims abstract description 36
- 238000005520 cutting process Methods 0.000 claims abstract description 22
- 230000008439 repair process Effects 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 18
- 238000003780 insertion Methods 0.000 claims description 4
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- 239000004973 liquid crystal related substance Substances 0.000 abstract description 17
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 8
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- 238000009825 accumulation Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
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Abstract
The invention provides a method, a device and a system for processing screen impurities and electronic equipment, and relates to the technical field of liquid crystal screen processing, wherein the method comprises the following steps: cutting a pre-acquired initial screen to obtain a plurality of target screens; repairing the inherent defects of the target screen by laser to obtain a repaired screen; and baking the repaired screen to eliminate screen impurities on the repaired screen. According to the invention, the liquid crystal screen is baked at high temperature, so that the darkness of foreign matters (namely screen impurities) is reduced and even disappears, and the display quality of the liquid crystal screen is improved.
Description
Technical Field
The invention relates to the technical field of liquid crystal screen processing, in particular to a method, a device and a system for processing screen impurities and electronic equipment.
Background
In an LCD (Liquid Crystal Display) process, a Liquid Crystal screen (also called a Panel) generally needs to be laser repaired, and in the laser repair process, bromide ions in the Panel are volatilized after heat generated by laser cutting, and react with Liquid Crystal molecules to form dark foreign matters, which causes Panel degradation and the like, and the Display quality of the Liquid Crystal screen is affected by the dark foreign matters (i.e., screen impurities).
Disclosure of Invention
Based on this, the invention aims to provide a method, a device, a system and an electronic device for processing screen impurities, so as to eliminate the foreign matter darkness in the screen through high-temperature baking, thereby improving the display quality of the liquid crystal screen.
In a first aspect, the present invention provides a method for processing screen impurities, including: cutting a pre-acquired initial screen to obtain a plurality of target screens; repairing the inherent defects of the target screen by laser to obtain a repaired screen; and baking the repaired screen to eliminate screen impurities on the repaired screen.
In an alternative embodiment, the step of baking the repair screen to remove screen impurities on the repair screen comprises: the baking temperature is above 90 ℃ and the baking time is above 3 hours.
In an alternative embodiment, the temperature of the baking is 90 ℃ and the time of baking is 4 hours; or the baking temperature is 120 ℃ and the baking time is 3 hours; alternatively, the baking temperature is 150 ℃ and the baking time is 3 hours.
In an optional embodiment, before the step of repairing the intrinsic defect of the target screen by using the laser to obtain the repaired screen, the method further includes: whether the target screen has inherent defects is detected by a needle insertion driving detection method; and if the target screen has inherent defects, executing a step of repairing the inherent defects of the target screen through laser to obtain a repaired screen.
In an alternative embodiment, after the step of baking the repaired screen to remove screen impurities on the repaired screen, the method further comprises: taking the baked repaired screen as a final screen; detecting screen impurities in the final screen by a needle inserting driving detection method to obtain the screen quality of the final screen; and classifying the final screen according to the screen quality.
In a second aspect, the present invention provides a device for processing screen impurities, the device comprising: the cutting module is used for cutting the pre-acquired initial screen to obtain a plurality of target screens; the laser repairing module is used for repairing the inherent defects of the target screen through laser to obtain a repaired screen; and the baking module is used for baking the repaired screen so as to eliminate screen impurities on the repaired screen.
In a third aspect, the present invention provides a processing system for screen foreign matter, the processing system being configured to execute the processing method for screen foreign matter of any one of the foregoing embodiments; the system for processing screen impurities comprises: cutting structure, laser repairing structure and baking structure; the cutting structure is used for cutting the pre-acquired initial screen to obtain a plurality of target screens; the laser repairing structure is used for repairing the inherent defects of the target screen through laser to obtain a repaired screen; and the baking structure is used for baking the repaired screen so as to eliminate screen impurities on the repaired screen.
In an alternative embodiment, the processing system further comprises: the device comprises a turnover structure, a positioning structure, a bearing structure, a lighting structure and a delivery structure; the overturning structure is used for overturning the screen; the positioning structure is used for positioning and calibrating the screen; the target screen is placed on the bearing structure; the lighting structure is used for detecting whether the screen has defects by a needle inserting driving detection method; and the delivery structure is used for respectively packaging and delivering the screens.
In an alternative embodiment, the lighting structure includes a first lighting structure and a second lighting structure; the first spot light structure is used for detecting whether the target screen has inherent defects or not by a pricking driving detection method; and the second lighting structure is used for checking the screen quality of the final screen by a needle inserting driving detection method.
In a fourth aspect, the present invention provides an electronic device comprising a processor and a memory, the memory storing machine executable instructions capable of being executed by the processor, the processor executing the machine executable instructions to implement the processing method of any one of the preceding embodiments.
The embodiment of the invention has the following beneficial effects:
the invention provides a method, a device and a system for processing screen impurities and electronic equipment, and relates to the technical field of liquid crystal screen processing, wherein the method comprises the following steps: cutting a pre-acquired initial screen to obtain a plurality of target screens; repairing the inherent defects of the target screen by laser to obtain a repaired screen; and baking the repaired screen to eliminate screen impurities on the repaired screen. According to the invention, the liquid crystal screen is baked at high temperature, so that the darkness of foreign matters (namely screen impurities) is reduced and even disappears, and the display quality of the liquid crystal screen is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention as set forth above.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flowchart of a method for processing screen impurities according to an embodiment of the present invention;
FIG. 2 is a flow chart of another method for processing screen impurities according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a device for processing impurities on a screen according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a system for processing screen contaminants according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the LCD process, after a CF (Color Filter) substrate and a TFT (Thin Film Transistor) substrate are laminated, the laminated substrates are cut into small plates by a cutting machine, the small plates are called panels, and then laser repair is performed on the small plates in a box section, in the repair process, heat generated by laser cutting volatilizes bromide ions in the Panel, the bromide ions react with liquid crystal molecules to form dark foreign matters, which causes Panel degradation and the like, and the ratio of the dark degradation of the laser foreign matters caused by laser repair in the industry at present accounts for 30% of the whole repair ratio, and the repair ratio is low.
In the prior art, in order to control the laser machine to generate heat, the laser energy is generally reduced, but the line cannot be cut off, so that the repair fails; if the laser energy is too large, volatilization of bromide ions cannot be avoided; it is impossible to eliminate the foreign matter darkness (i.e., screen impurities) by controlling the laser energy.
Based on the above, the embodiment of the invention provides a screen impurity processing method, device and system and electronic equipment, and the technology is applied to a scene for processing a liquid crystal screen.
Example one
An embodiment of the present invention provides a method for processing screen impurities, as shown in fig. 1, the method includes:
step S102, cutting the pre-acquired initial screen to obtain a plurality of target screens.
Specifically, the initial screen is a screen with a large area, which is inconvenient for subsequent processing, and the consumer generally does not need the screen with a large area, so the initial screen is generally cut into a plurality of target screens. The target screen is here a platelet, also called Panel.
And step S104, repairing the inherent defects of the target screen through laser to obtain a repaired screen.
Specifically, foreign materials such as dust, bubbles, and the like generated in the previous process are generally present on the initial screen and the target screen, which are called intrinsic defects, and therefore, the intrinsic defects are generally removed by the laser, so that the repaired screen is obtained. However, during the laser process, high temperature is inevitably generated, and the excessive temperature may cause the dark of foreign matter (i.e., the screen impurities) on the screen.
And step S106, baking the repaired screen to eliminate screen impurities on the repaired screen.
Specifically, in the operation of the prior art, a lighting detection is performed on the repair screen by a needle insertion driving detection method (also called an S/B lighting mode), and the quality of the repair screen is graded according to the number, size and the like of dark foreign matters on the screen, and the repair screen is packaged and sold. However, this results in a large number of inferior screens, a small number of superior screens, and a high shipping cost.
Specifically, in order to solve the problem of dark foreign matters, the technology bakes the repair screen by means of high-temperature baking so as to eliminate screen impurities on the repair screen. And then, the baked screens are subjected to quality grading and packaged for sale so as to improve the number of the high-class screens.
The invention provides a method for processing screen impurities, which relates to the technical field of liquid crystal screen processing and comprises the following steps: cutting a pre-acquired initial screen to obtain a plurality of target screens; repairing the inherent defects of the target screen by laser to obtain a repaired screen; and baking the repaired screen to eliminate screen impurities on the repaired screen. According to the invention, the liquid crystal screen is baked at high temperature, so that the darkness of foreign matters (namely screen impurities) is reduced and even disappears, and the display quality of the liquid crystal screen is improved.
Example two
An embodiment of the present invention provides another method for processing screen impurities, as shown in fig. 2, the method includes:
step S202, cutting the pre-acquired initial screen to obtain a plurality of target screens.
Specifically, the above target screen is divided into two faces, i.e., a CF face and a TFT face.
And step S204, checking whether the target screen has inherent defects or not by a pricking driving detection method.
Specifically, the following steps (step S204-step S210) are all executed by a laser repairing machine, where the laser repairing machine includes a turning unit, a platform unit, and a laser unit; the overturning unit comprises an overturning structure and a positioning structure; the platform unit comprises a bearing structure and a spot light structure; the lighting mechanism is divided into a first lighting structure and a second lighting structure; both lighting structures can execute the above-mentioned needle insertion driving detection method.
Specifically, the specific operation procedure of step S204 is:
1) the worker places the target screen on a robotic arm (also known as a Robot).
2) The mechanical arm puts the target screen at the corresponding position of the machine table.
3) The flip structure flips the target screen 180 deg. so that the TFT faces up.
4) The positioning structure translates the target screen front and back, left and right so as to ensure that the position of the target screen is accurate.
5) The receiving structure receives the target screen.
6) The first lighting structure illuminates the target screen in an S/B lighting mode and checks whether the target screen has inherent defects. If there is an inherent defect, performing step S206; if the inherent defects do not exist, the target screen is transmitted to a packing station (also called DPK) to be packed and delivered at the grade of a first-class product.
And step S206, repairing the inherent defects of the target screen to obtain a repaired screen.
Specifically, the intrinsic defect is repaired by emitting laser light to the intrinsic defect through the laser unit. The place where the intrinsic defect is repaired is called an NRP site.
Step S208, baking the repaired screen to eliminate screen impurities on the repaired screen.
Specifically, the baking temperature is above 90 ℃, and the baking time is above 3 hours.
Preferably, the baking temperature is 90 ℃ and the baking time is 4 hours; or the baking temperature is 120 ℃ and the baking time is 3 hours; alternatively, the baking temperature is 150 ℃ and the baking time is 3 hours.
Specifically, experiments verify that the activity of bromide ions is related to temperature, and the bromide ions are more active when the temperature is higher, so that for the characteristic, the Panel with dark foreign matters after laser repair is firstly conveyed to a high-temperature furnace for high-temperature baking, and the volatilization of the bromide ions is accelerated, so that the purpose of increasing the content of the bromide ions is achieved.
Specifically, the specific operation procedure of step S208 is:
1) the repair screen after the completion of the NRP repair is sent to the CST.
2) And is transported to a corresponding Port of the high-temperature furnace through Stock.
3) The Panel is taken out by Robot and put on a shelf of a high-temperature furnace, and the furnace door is closed for baking.
4) And after baking is finished, taking out the material from the Robot and placing the material into a discharge CST.
Specifically, 16 groups of experiments are carried out on Panel, namely a high-temperature furnace is set to 16 different experimental conditions, Panel baked under different experimental conditions is centralized and controlled to light up to confirm the baking effect, the number of Panel ascending and the like under 16 groups of experimental data is recorded, and the ascending rate is counted. The test data are shown in table 1.
From experimental data, one can obtain:
1. when the high temperature is 90 ℃, the dark 100% of foreign matters can disappear after baking for 4 hours, and the Panel achieves the effect of rising and the like;
2. when the temperature is raised to 120 ℃, the foreign matter can disappear by 100 percent after being baked for 3 hours;
3. when the temperature is raised to 150 ℃, the baking time is 3 hours, and the foreign matter darkness can disappear by 100 percent;
summary of the experiments: and (3) placing the Panel with dark foreign matters generated by laser repair into a high-temperature furnace for baking, wherein the temperature is higher than 90 ℃, the baking time is longer than 3h, the equivalent rate of the Panel can be improved by 30%, the yield of a screen is improved, and the estimated annual economic efficiency is 350 ten thousand yuan.
Step S210, taking the baked repaired screen as a final screen; detecting screen impurities in the final screen by a needle inserting driving detection method to obtain the screen quality of the final screen; and classifying the final screen according to the screen quality.
Specifically, in order to determine the quality of the screen after baking, secondary lighting is required for confirmation. The situation of screen impurities in the final screen needs to be checked by using a second lighting structure through an S/B lighting mode.
Specifically, the final screen is divided into different quality grades according to the size, the amount and the like of screen impurities, the final screens with different quality grades are placed on a DPK station (namely a packaging station) to be packaged, placed on a PPK station (namely a stacking station) to be stacked, and finally placed on a Shipping station (namely a Shipping station) to be shipped.
According to the embodiment, through the high-temperature baking process, the foreign matter generated by laser repair is reduced or even disappears, so that the quality of the screen is improved, the manufacturing cost is reduced, and the manpower, material resources and financial resources are saved.
EXAMPLE III
An embodiment of the present invention provides a device for processing screen impurities, as shown in fig. 3, the device includes:
the cutting module 31 is configured to cut the pre-acquired initial screen to obtain a plurality of target screens.
And the laser repairing module 32 is used for repairing the inherent defects of the target screen through laser to obtain a repaired screen.
And the baking module 33 is used for baking the repaired screen to eliminate screen impurities on the repaired screen.
The implementation principle and the generated technical effect of the device for processing screen impurities provided by the embodiment of the invention are the same as those of the embodiment of the method for processing screen impurities, and for the sake of brief description, the corresponding contents in the embodiment of the method can be referred to where the embodiment of the device is not mentioned.
Example four
An embodiment of the present invention provides a processing system for processing screen impurities, which is configured to execute the processing method for processing screen impurities in any one of the foregoing embodiments.
As shown in fig. 4, the processing system includes 40: cutting structure 41, laser repairing structure 42 and baking structure 43, further include: a turning structure 44, a positioning structure 45, a receiving structure 46, a lighting structure and a delivery structure; the lighting structure includes a first lighting structure 47 and a second lighting structure 48; the shipping structure includes a packing station 49, an accumulation station 410, and a shipping station 411.
The cutting structure is used for cutting the pre-acquired initial screen to obtain a plurality of target screens; the laser repairing structure is used for repairing the inherent defects of the target screen through laser to obtain a repaired screen; and the baking structure is used for baking the repaired screen so as to eliminate screen impurities on the repaired screen.
The overturning structure is used for overturning the screen; the positioning structure is used for positioning and calibrating the screen; the target screen is placed on the bearing structure; the lighting structure is used for detecting whether the screen has defects by a needle inserting driving detection method; and the delivery structure is used for respectively packaging and delivering the screens.
The lighting structure comprises a first lighting structure and a second lighting structure; the first spot light structure is used for detecting whether the target screen has inherent defects or not by a pricking driving detection method; and the second lighting structure is used for checking the screen quality of the final screen by a needle inserting driving detection method.
The implementation principle and the generated technical effect of the system for processing screen impurities provided by the embodiment of the invention are the same as those of the method for processing screen impurities, and for the sake of brief description, no mention is made in the embodiment of the device, and reference may be made to the corresponding contents in the method embodiment.
EXAMPLE five
An embodiment of the present invention provides an electronic device, which includes a processor and a memory, where the memory stores machine executable instructions capable of being executed by the processor, and the processor executes the machine executable instructions to implement the processing method of any one of the foregoing embodiments.
An embodiment of the present invention further provides an electronic device, which is shown in fig. 5 and includes a processor 101 and a memory 100, where the memory 100 stores machine executable instructions capable of being executed by the processor 101, and the processor executes the machine executable instructions to implement the method for processing the screen impurity.
Further, the electronic device shown in fig. 5 further includes a bus 102 and a communication interface 103, and the processor 101, the communication interface 103, and the memory 100 are connected through the bus 102.
The Memory 100 may include a high-speed Random Access Memory (RAM) and may further include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The communication connection between the network element of the system and at least one other network element is realized through at least one communication interface 103 (which may be wired or wireless), and the internet, a wide area network, a local network, a metropolitan area network, and the like can be used. The bus 102 may be an ISA bus, PCI bus, EISA bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one double-headed arrow is shown in FIG. 5, but this does not indicate only one bus or one type of bus.
The processor 101 may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware or instructions in the form of software in the processor 101. The Processor 101 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the device can also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component. The various methods, steps and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of the method disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in the memory 100, and the processor 101 reads the information in the memory 100, and completes the steps of the method of the foregoing embodiment in combination with the hardware thereof.
The embodiment of the present invention further provides a machine-readable storage medium, where the machine-readable storage medium stores machine-executable instructions, and when the machine-executable instructions are called and executed by a processor, the machine-executable instructions cause the processor to implement the method for processing the screen impurity, and specific implementation may refer to method embodiments, and is not described herein again.
The method, the apparatus, the system and the computer program product for processing screen impurities provided in the embodiments of the present invention include a computer-readable storage medium storing a program code, where instructions included in the program code may be used to execute the method described in the foregoing method embodiments, and specific implementation may refer to the method embodiments, and will not be described herein again.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, an electronic device, or a network device) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for processing screen impurities, which is characterized by comprising the following steps:
cutting a pre-acquired initial screen to obtain a plurality of target screens;
repairing the inherent defects of the target screen through laser to obtain a repaired screen;
and baking the repaired screen to eliminate the screen impurities on the repaired screen.
2. The processing method according to claim 1, wherein the step of baking the repair screen to remove the screen impurities on the repair screen comprises:
the baking temperature is above 90 ℃, and the baking time is above 3 hours.
3. The method of claim 2, wherein the temperature of the baking is 90 ℃ and the time of the baking is 4 hours; or the baking temperature is 120 ℃ and the baking time is 3 hours; alternatively, the temperature of the baking is 150 ℃ and the time of the baking is 3 hours.
4. The method of claim 1, wherein before the step of repairing the intrinsic defects of the target screen by the laser to obtain the repaired screen, the method further comprises:
detecting whether the target screen has inherent defects by a needle insertion driving detection method;
and if the target screen has inherent defects, executing the laser to repair the inherent defects of the target screen to obtain a repaired screen.
5. The method of claim 1, wherein after the step of baking the repair screen to remove the screen contaminants on the repair screen, the method further comprises:
taking the baked repaired screen as a final screen;
detecting screen impurities in the final screen by a needle inserting driving detection method to obtain the screen quality of the final screen;
and classifying the final screen according to the screen quality.
6. A device for processing screen impurities, the device comprising:
the cutting module is used for cutting the pre-acquired initial screen to obtain a plurality of target screens;
the laser repairing module is used for repairing the inherent defects of the target screen through laser to obtain a repaired screen;
and the baking module is used for baking the repaired screen so as to eliminate the screen impurities on the repaired screen.
7. A processing system for screen impurities, wherein the processing system is used for executing the processing method for screen impurities according to any one of claims 1 to 5; the system for processing screen impurities comprises: cutting structure, laser repairing structure and baking structure;
the cutting structure is used for cutting the pre-acquired initial screen to obtain a plurality of target screens;
the laser repairing structure is used for repairing the inherent defects of the target screen through laser to obtain a repaired screen;
and the baking structure is used for baking the repaired screen so as to eliminate the screen impurities on the repaired screen.
8. The processing system of claim 7, further comprising: the device comprises a turnover structure, a positioning structure, a bearing structure, a lighting structure and a delivery structure;
the overturning structure is used for overturning the screen;
the positioning structure is used for positioning and calibrating the screen;
the target screen is placed on the bearing structure;
the lighting structure is used for detecting whether the screen has defects by a needle inserting driving detection method;
and the delivery structure is used for respectively packaging and delivering the screens.
9. The processing system of claim 8, wherein the lighting structure comprises a first lighting structure and a second lighting structure;
the first point light structure is used for detecting whether the target screen has inherent defects or not by a needle inserting driving detection method;
and the second lighting structure is used for checking the screen quality of the final screen by the needle inserting driving detection method.
10. An electronic device comprising a processor and a memory, the memory storing machine executable instructions executable by the processor, the processor executing the machine executable instructions to implement the processing method of any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210167483.9A CN114545668B (en) | 2022-02-23 | 2022-02-23 | Screen impurity processing method, device and system and electronic equipment |
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