CN114544031A - Chip temperature parameter calibration method, device, equipment and storage medium - Google Patents
Chip temperature parameter calibration method, device, equipment and storage medium Download PDFInfo
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Abstract
The invention relates to the technical field of chips, and discloses a method, a device, equipment and a storage medium for calibrating chip temperature parameters, wherein the method comprises the following steps: adjusting the heating power of the chip, and determining the internal temperature of the chip according to the heating power; when the internal temperature reaches thermal equilibrium, acquiring a temperature electric signal output by the chip and corresponding heating power; and determining the temperature parameter of the chip according to the temperature electric signal and the heating power. According to the invention, the heating power of the chip is adjusted, the internal temperature of the chip is determined according to the heating power, and the temperature parameter of the chip is determined according to the temperature electric signal obtained when the internal temperature reaches thermal balance and the corresponding heating power, so that the technical problem that the environmental temperatures of different chips are different due to uneven heat distribution in a large space environment when the chip is tested by a heat transfer method is solved, and the accuracy of the temperature parameter of the chip is improved.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a method, a device, equipment and a storage medium for calibrating chip temperature parameters.
Background
Temperature is a basic physical quantity in the real physical world, many parameters of electronic components and temperatures are closely related, such as offset voltage of operational amplifiers, frequency of oscillators, on-resistance of MOS transistors, and the like, under different temperatures, the electronic components exhibit different parameter performances, and excessively high or excessively low temperatures may cause unrecoverable damage to the electronic components.
At present, a passive heat transfer method is generally adopted to calibrate the temperature parameters of the chip, that is, the ambient temperature is changed, heat is transferred from the environment to the inside of the chip, and the accuracy of the temperature parameters is low due to the difference of the ambient temperatures of different chips caused by uneven heat distribution in the environment with a large space, so how to improve the accuracy of the temperature parameters of the chip becomes a technical problem to be solved urgently.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a method, a device, equipment and a storage medium for calibrating chip temperature parameters, and aims to solve the technical problem of low accuracy of the chip temperature parameters in the prior art.
In order to achieve the above object, the present invention provides a method for calibrating a temperature parameter of a chip, the method comprising the following steps:
adjusting the heating power of a chip, and determining the internal temperature of the chip according to the heating power;
when the internal temperature reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power;
and determining the temperature parameter of the chip according to the temperature electric signal and the heating power.
Optionally, a heating device is integrated on the chip;
the adjusting the heating power of the chip and determining the internal temperature of the chip according to the heating power comprises:
adjusting the heating power of the heating device to the chip, and determining the power consumption of the chip according to the heating power;
and determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relational expression.
Optionally, the adjusting the heating power of the heating device to the chip and determining the power consumption of the chip according to the heating power includes:
acquiring the working power of the chip;
adjusting heating voltage and heating current through a power controller to adjust heating power of the heating device to the chip;
determining the power consumption of the chip according to the heating power, the working power and a preset power consumption relational expression;
wherein the preset power consumption relation is as follows:
P＝Ivdd*Uvdd+Ihot*Uhot
wherein, P is power consumption; ivdd is the working current of the chip; uvdd is the working voltage of the chip; ihot is heating current; uhot is the heating voltage.
Optionally, the determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relation includes:
acquiring the environmental temperature of the environment where the chip is located;
determining the internal temperature of the chip according to the environment temperature and the power consumption through a preset power consumption temperature relational expression;
wherein the preset power consumption temperature relation is as follows:
Tc＝Tj+P*(Rjc+rcs)
wherein Tc is the internal temperature of the chip; tj is the ambient temperature of the environment where the chip is located; p is power consumption; rjc is the thermal resistance from the inside of the chip to the packaging tube shell; rcs is the thermal resistance from the package to the heat sink substrate.
Optionally, a temperature sensor is integrated on the chip, and the temperature sensor and the heating device are arranged adjacent to each other on the chip;
the acquiring of the ambient temperature of the environment where the chip is located includes:
and acquiring the ambient temperature of the environment where the chip is located through the temperature sensor.
Optionally, the obtaining the temperature electrical signal output by the chip and the corresponding heating power when the internal temperature reaches a thermal equilibrium includes:
acquiring the internal temperature of the chip in real time in the process of heating the chip;
traversing a preset calibration temperature set, and comparing the traversed current preset calibration temperature with the internal temperature;
when the internal temperature is equal to the current preset calibration temperature, judging that the chip reaches thermal equilibrium;
when the chip reaches thermal equilibrium, acquiring a temperature electric signal output by the chip and corresponding heating power;
and when the traversal is finished, obtaining a plurality of temperature electric signals output by the chip and a plurality of corresponding heating powers.
Optionally, the determining the temperature parameter of the chip according to the temperature electrical signal and the heating power includes:
determining power consumption corresponding to the chip according to each heating power;
and determining the temperature parameters of the chip according to the power consumptions and the corresponding temperature electric signals.
In addition, in order to achieve the above object, the present invention further provides an apparatus for calibrating a temperature parameter of a chip, the apparatus comprising:
the adjusting module is used for adjusting the heating power of the chip and determining the internal temperature of the chip according to the heating power;
the acquisition module is used for acquiring a temperature electric signal output by the chip and corresponding heating power when the internal temperature reaches thermal balance;
and the determining module is used for determining the temperature parameter of the chip according to the temperature electric signal and the heating power.
In addition, to achieve the above object, the present invention further provides a device for calibrating a temperature parameter of a chip, the device comprising: a memory, a processor and a chip temperature parameter calibration program stored on the memory and executable on the processor, the chip temperature parameter calibration program configured to implement the steps of the chip temperature parameter calibration method as described above.
In addition, to achieve the above object, the present invention further provides a storage medium, in which a chip temperature parameter calibration program is stored, and the chip temperature parameter calibration program implements the steps of the chip temperature parameter calibration method as described above when executed by a processor.
The invention adjusts the heating power of the chip and determines the internal temperature of the chip according to the heating power; when the internal temperature reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power; and determining the temperature parameter of the chip according to the temperature electric signal and the heating power. According to the invention, the heating power of the chip is adjusted, the internal temperature of the chip is determined according to the heating power, and the temperature parameter of the chip is determined according to the temperature electric signal obtained when the internal temperature reaches thermal balance and the corresponding heating power, so that the technical problem that the environmental temperatures of different chips are different due to uneven heat distribution in a large space environment when the chip is tested by a heat transfer method is solved, and the accuracy of the temperature parameter of the chip is improved.
Drawings
FIG. 1 is a schematic structural diagram of a device for calibrating chip temperature parameters in a hardware operating environment according to an embodiment of the present invention;
FIG. 2 is a schematic flowchart illustrating a first embodiment of a method for calibrating temperature parameters of a chip according to the present invention;
FIG. 3 is a schematic diagram illustrating a chip being heated by a power controller according to an embodiment of the method for calibrating temperature parameters of the chip;
FIG. 4 is a graph illustrating the internal temperature and power consumption of a chip according to an embodiment of the method for calibrating the temperature parameter of the chip of the present invention;
FIG. 5 is a schematic diagram of an on-chip integrated temperature sensor and heating device in an embodiment of a method for calibrating temperature parameters of a chip in accordance with the present invention;
FIG. 6 is a flowchart illustrating a second embodiment of a method for calibrating temperature parameters of a chip according to the present invention;
FIG. 7 is a block diagram of a first embodiment of a device for calibrating temperature parameters of a chip according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a device for calibrating chip temperature parameters in a hardware operating environment according to an embodiment of the present invention.
As shown in fig. 1, the chip temperature parameter calibration apparatus may include: a processor 1001, such as a Central Processing Unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Wherein a communication bus 1002 is used to enable connective communication between these components. The user interface 1003 may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a Wireless interface (e.g., a Wireless-Fidelity (WI-FI) interface). The Memory 1005 may be a Random Access Memory (RAM) or a Non-Volatile Memory (NVM), such as a disk Memory. The memory 1005 may alternatively be a storage device separate from the processor 1001.
Those skilled in the art will appreciate that the configuration shown in FIG. 1 does not constitute a limitation of the chip temperature parameter calibration apparatus, and may include more or fewer components than those shown, or some components in combination, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a storage medium, may include therein an operating system, a network communication module, a user interface module, and a chip temperature parameter calibration program.
In the chip temperature parameter calibration apparatus shown in fig. 1, the network interface 1004 is mainly used for data communication with a network server; the user interface 1003 is mainly used for data interaction with a user; the processor 1001 and the memory 1005 of the chip temperature parameter calibration device of the present invention may be disposed in the chip temperature parameter calibration device, and the chip temperature parameter calibration device calls the chip temperature parameter calibration program stored in the memory 1005 through the processor 1001 and executes the chip temperature parameter calibration method provided by the embodiment of the present invention.
An embodiment of the present invention provides a method for calibrating a chip temperature parameter, and referring to fig. 2, fig. 2 is a schematic flow chart of a first embodiment of the method for calibrating a chip temperature parameter of the present invention.
In this embodiment, the method for calibrating the temperature parameter of the chip includes the following steps:
step S10: and adjusting the heating power of the chip, and determining the internal temperature of the chip according to the heating power.
It should be noted that the execution main body of the embodiment may be a computing service device with data processing, network communication and program running functions, such as a personal computer, an upper computer, or an electronic device, a chip temperature parameter calibration device, and the like, which can implement the above functions. The present embodiment and the following embodiments will be described below by taking a chip temperature parameter calibration apparatus (hereinafter, simply referred to as a calibration apparatus) as an example.
It should be understood that, generally, the internal temperature of the chip is monitored by the temperature sensor, and the temperature electrical signal output by the temperature sensor and the internal temperature of the chip have a non-linear relationship, which can be expressed by a polynomial expression, which can be expressed by the following expression (1): y ═ knTn + kn-1Tn-1+ kn-2Tn-2+ … + k1T + k0, where Y is the temperature electrical signal.
It is understood that the coefficients of the above polynomial, i.e., the temperature parameters { kn, kn-1, kn-2, …, k1, k0} are different for different chips, and data { Yn, Yn-1, Yn-2, …, Y1, Y0} corresponding to the internal temperatures of n +1 chips are required to be tested to determine when the temperature parameters of the chips are calibrated.
It is understood that the heating power may be the power for heating a single chip that requires temperature parameter calibration; the heating power of the chip at the position can be adjusted by adjusting the heating current and the heating voltage of the heating device at the position where the chip is placed; the internal temperature of the chip can be determined according to the relationship among the heating power, the power consumption inside the chip, and the internal temperature of the chip.
In a specific implementation, the calibration device adjusts the heating current and the heating voltage of the heating device at the chip placement position to adjust the heating power for heating the chip, and determines the internal temperature of the chip according to the heating power and the relationship between the internal power consumption of the chip and the internal temperature of the chip.
Step S20: and when the internal temperature reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power.
It is understood that the determination condition that the internal temperature reaches the thermal equilibrium may be: predetermining a preset calibration temperature set, wherein the preset calibration temperature set comprises n +1 preset calibration temperatures, and when the internal temperature of the chip is equal to the preset calibration temperature, the chip reaches thermal balance; the temperature electrical signal may be an electrical signal output by a temperature sensor that monitors the internal temperature when the internal temperature of the chip reaches thermal equilibrium; the preset calibration temperature set corresponds to n +1 temperature electrical signals and heating power.
In concrete implementation, the calibration equipment acquires the internal temperature of the chip, compares the acquired internal temperature with the preset calibration temperature concentrated by the preset calibration temperature, judges that the chip reaches thermal balance when the internal temperature is equal to the preset calibration temperature, and acquires the temperature electric signal output by the temperature sensor and the corresponding heating power.
Step S30: and determining the temperature parameter of the chip according to the temperature electric signal and the heating power.
It is understood that determining the temperature parameter of the chip from the temperature electrical signal and the heating power may be: and solving a polynomial relation between the temperature electrical signal and the internal temperature according to the temperature electrical signal and the corresponding heating power to obtain the temperature parameter of the chip.
In the specific implementation, the calibration device adjusts the heating current and the heating voltage of the heating device to adjust the heating power of the chip, the internal temperature of the chip can be determined according to the relation between the heating power, the internal power consumption of the chip and the internal temperature of the chip, when the internal temperature of the chip is equal to the preset calibration temperature in the preset calibration temperature set, the chip is judged to reach thermal balance, the temperature electric signal output by the temperature sensor and the corresponding heating power are obtained, the number of the temperature electric signal and the corresponding heating power obtained in the test process is equal to the number of the preset calibration temperature in the preset calibration temperature set, the polynomial is solved according to the temperature electric signal and the corresponding heating power, and the temperature parameter corresponding to the chip is obtained.
Further, since there may be a problem of uneven heat distribution in a large space environment, in order to accurately control the internal temperature of a chip to improve the accuracy of the temperature parameter of the chip, a heating device is integrated on the chip; the adjusting the heating power of the chip and determining the internal temperature of the chip according to the heating power comprises: adjusting the heating power of the heating device to the chip, and determining the power consumption of the chip according to the heating power; and determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relational expression.
In a specific implementation, in this embodiment, a heating device is integrated on a chip, a heating power of the heating device disposed on the chip is adjusted to heat the chip, power consumption of the chip is determined according to the heating power, and an internal temperature of the chip is determined according to a power consumption and a preset power consumption temperature relation.
Further, in order to accurately determine the internal temperature of the chip, the adjusting the heating power of the heating device to the chip and determining the power consumption of the chip according to the heating power includes:
and acquiring the working power of the chip.
It is understood that the operating power may be the power at which the chip operates normally; the working power of the chip can be determined according to the working current and the working voltage of the chip; the chip also generates heat to raise the internal temperature of the chip when the chip is in normal operation.
And adjusting the heating voltage and the heating current through a power controller to adjust the heating power of the heating device to the chip.
It will be appreciated that the heating voltage and heating current of the heating device may be adjusted by a power controller to adjust the heating power to heat the chip.
Determining the power consumption of the chip according to the heating power, the working power and a preset power consumption relational expression; wherein the preset power consumption relation is as follows:
P＝Ivdd*Uvdd+Ihot*Uhot
wherein, P is power consumption; ivdd is the working current of the chip; uvdd is the working voltage of the chip; ihot is heating current; uhot is the heating voltage.
It is understood that the power consumption of the chip includes the power consumption of the chip when it is normally operating and the power consumption of the heating device.
In a specific implementation, referring to fig. 3, the calibration device adjusts the working voltage and the working current of the chip through the power controller so that the chip works normally, adjusts the heating voltage and the heating current of the heating device through the power controller to adjust the heating power for heating the chip, and the sum of the working power of the chip and the heating power of the heating device is the power consumption of the chip.
Further, in order to determine the internal temperature of the chip through the power consumption of the chip, the determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relation includes:
and acquiring the ambient temperature of the environment where the chip is located.
It will be appreciated that the ambient temperature may be obtained by a temperature sensor located near the chip, or may be obtained by a temperature sensor integrated on the chip.
Determining the internal temperature of the chip according to the environment temperature and the power consumption through a preset power consumption temperature relational expression;
wherein the preset power consumption temperature relation is as follows:
Tc＝Tj+P*(Rjc+rcs)
wherein Tc is the internal temperature of the chip; tj is the ambient temperature of the environment where the chip is located; p is power consumption; rjc is the thermal resistance from the inside of the chip to the packaging tube shell; rcs is the thermal resistance from the package to the heat sink substrate.
It is understood that the relationship between the internal power consumption and the internal temperature of the chip is expressed as Tc ═ Tj + P — (Rjc + Rcs). Tj is the temperature of the environment where the chip is located, P is the power consumption of the chip, Rjc is the thermal resistance from the inside of the chip to the packaging tube shell, Rcs is the thermal resistance from the packaging tube shell to the heat dissipation substrate, Rjc and Rcs are only related to the physical characteristics of the materials, for the same type of chip, the packaging material and the heat dissipation substrate are determined, in the set temperature range, Rjc and Rcs are fixed values, and if the environment temperature Tj is greater than 0, the relation between the internal temperature Tc of the chip and the power consumption of the chip can be referred to fig. 4, namely the internal temperature of the chip and the power consumption of the chip are in a linear relation.
It should be understood that after determining the power consumption of the chip, the ambient temperature, and the value of (Rjc + Rcs), the internal temperature of the chip may be determined.
In specific implementation, the calibration device obtains the ambient temperature through a temperature sensor arranged at the accessory of the chip placing position, and determines the internal temperature of the chip according to the power consumption of the chip, the ambient temperature and the thermal resistance of the chip through a preset power consumption temperature relation.
Further, in order to improve the accuracy of the temperature parameter of the chip, a temperature sensor is integrated on the chip, and the temperature sensor and the heating device are arranged adjacent to each other on the chip; the acquiring of the ambient temperature of the environment where the chip is located includes: and acquiring the ambient temperature of the environment where the chip is located through the temperature sensor.
It will be appreciated that, with reference to fig. 5, a temperature sensor and a heating device are integrated on the chip and are disposed adjacent to each other.
In the specific implementation, a temperature sensor and a heating device are integrated on a chip, the temperature sensor and the heating device are arranged adjacently, a calibration device adjusts the working current and the working voltage of the chip through a power controller to enable the chip to work normally, the working power of the chip is determined according to the working current and the working voltage of the chip, the heating power of the heating device is adjusted through the power controller to heat the chip, the internal temperature of the chip is determined according to the heating power of the heating device and the working power of the chip, when the internal temperature is equal to the preset calibration temperature in the preset calibration temperature set, the chip is judged to reach thermal balance, the power consumption of the chip is determined according to the heating power and the working power when the chip reaches thermal balance, a temperature electric signal corresponding to the power consumption output by the temperature sensor is obtained, and when the test is completed, the method comprises the steps of obtaining temperature electric signals with the same number as preset calibration temperatures and corresponding power consumption, solving a polynomial between the temperature electric signals and the internal temperature of the chip according to the temperature electric signals and the corresponding power consumption, and determining temperature parameters of the chip according to a solving result.
The embodiment adjusts the heating power of the chip, and determines the internal temperature of the chip according to the heating power; when the internal temperature reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power; and determining the temperature parameter of the chip according to the temperature electric signal and the heating power. According to the embodiment, the heating power of the chip is adjusted, the internal temperature of the chip is determined according to the heating power, and the temperature parameter of the chip is determined according to the temperature electrical signal obtained when the internal temperature reaches thermal balance and the corresponding heating power, so that the technical problem that the environmental temperatures of different chips are different due to uneven heat distribution in a large space environment during testing by a heat transfer method is solved, and the accuracy of the temperature parameter of the chip is improved.
Referring to fig. 6, fig. 6 is a schematic flow chart of a method for calibrating chip temperature parameters according to a second embodiment of the present invention.
Based on the first embodiment described above, in the present embodiment, the step S20 includes:
step S201: and acquiring the internal temperature of the chip in real time in the process of heating the chip.
It can be understood that the calibration device heats the chip by adjusting the heating voltage and the heating current output by the power controller, and the internal temperature of the chip can be heated to different target temperatures by adjusting the magnitudes of the heating current and the heating voltage; in the process of heating the chip, the internal temperature of the chip can be determined according to the relation among the heating power, the working power and the preset power consumption temperature.
In specific implementation, the calibration device adjusts the heating power of the heating device to heat the chip to different target temperatures by adjusting the heating current and the heating voltage output by the power controller, and determines the internal temperature of the chip according to the real-time heating power, the working power and the preset power consumption temperature relation in the process of heating the chip.
Step S202: and traversing a preset calibration temperature set, and comparing the traversed current preset calibration temperature with the internal temperature.
It is understood that the preset calibration temperature set may be a set of preset calibration temperatures of the chip, which requires heating the internal temperature of the chip to the preset calibration temperature.
In a specific implementation, the chip calibration device traverses a preset calibration temperature set, and compares the traversed preset calibration temperature with the internal temperature of the chip acquired in real time.
Step S203: and when the internal temperature is equal to the current preset calibration temperature, judging that the chip reaches thermal equilibrium.
It can be understood that the thermal balance may be that the internal temperature of the chip is balanced with a preset calibration temperature, that is, the internal temperature of the chip is equal to the preset calibration temperature, and when the internal temperature of the chip obtained by the calibration device in real time is equal to the traversed current preset calibration temperature, it is determined that the chip reaches the thermal balance.
Step S204: and when the chip reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power.
It will be appreciated that the temperature electrical signal may be an electrical signal output by a temperature sensor integrated on the chip that corresponds to the internal temperature of the chip.
Step S205: and when the traversal is finished, obtaining a plurality of temperature electric signals output by the chip and a plurality of corresponding heating powers.
In specific implementation, the calibration equipment adjusts the heating voltage and the heating current which are output through the power controller so as to adjust the heating power for heating the chip, in the process of heating the chip, the heating power of the heating element can be gradually increased through adjustment so as to gradually increase the internal temperature of the chip, the internal temperature of the chip is determined according to the working power of the chip, the heating power for heating the chip and the preset power consumption temperature relational expression, the preset calibration temperature is compared with the internal temperature one by one from low to high, when the internal temperature is equal to the preset calibration temperature, the chip is judged to reach thermal balance, the temperature electric signal output by the temperature sensor and the corresponding heating power are obtained, and when the comparison of all the preset calibration temperatures is completed, a plurality of temperature electric signals and the corresponding heating power are obtained.
Further, in order to improve the accuracy of the chip temperature parameter, the step S30 includes: determining power consumption corresponding to the chip according to each heating power; and determining the temperature parameters of the chip according to the power consumptions and the corresponding temperature electric signals.
In particular implementations, for example: when the ambient temperature Tj is not changed, formula (2) can be obtained by substituting a ═ Rjc + Rcs and Tc ═ Tj + P × a into formula (1): y ═ kn (Tj + P × a) n + kn-1(Tj + P × a) n-1+ kn-2(Tj + P × a) n-2+ … + k1(Tj + P × a) + k0, for the nth-order polynomial of the temperature electrical signal Y in equation (2), it is necessary to test the respective internal temperatures of (n +3) to determine the temperature parameters { kn, kn-1, kn-2, …, k1, k0} and Tj, a of the chip, i.e.:
Yn+3＝kn(Tj+Pn+3*A)n+kn-1(Tj+Pn+3*A)n-1+kn-2(Tj+Pn+3*A)n-2+...+kn-3(Tj+Pn+3*A)n-3+k0
Yn+2＝kn(Tj+Pn+2*A)n+kn-1(Tj+Pn+2*A)n-1+kn-2(Tj+Pn+2*A)n-2+...+kn-3(Tj+Pn+2*A)n-3+k0
Yn+1＝kn(Tj+Pn+1*A)n+kn-1(Tj+Pn+1*A)n-1+kn-2(Tj+Pn+1*A)n-2+...+kn-3(Tj+Pn+1*A)n-3+k0
Yn＝kn(Tj+Pn*A)n+kn-1(Tj+Pn*A)n-1+kn-2(Tj+Pn*A)n-2+...+kn-3(Tj+Pn*A)n-3+k0
......
Y1＝kn(Tj+P1*A)n+kn-1(Tj+P1*A)n-1+kn-2(Tj+P1*A)n-2+...+kn-3(Tj+P1*A)n-3+k0
Y0＝kn(Tj+P0*A)n+kn-1(Tj+P0*A)n-1+kn-2(Tj+P0*A)n-2+...+kn-3(Tj+P0*A)n-3+k0
and determining the temperature parameter of the chip according to the relational expression.
In the process of heating the chip, the internal temperature of the chip is obtained in real time; traversing a preset calibration temperature set, and comparing the traversed current preset calibration temperature with the internal temperature; when the internal temperature is equal to the current preset calibration temperature, judging that the chip reaches thermal equilibrium; when the chip reaches thermal equilibrium, acquiring a temperature electric signal output by the chip and corresponding heating power; and when the traversal is finished, obtaining a plurality of temperature electric signals output by the chip and a plurality of corresponding heating powers. Because this embodiment is at the in-process that heats the chip, acquires the inside temperature of chip in real time, when inside temperature is equal with predetermineeing calibration temperature, judges that the chip reaches thermal balance, acquires the temperature signal of telecommunication and the heating power that corresponds of integrated temperature sensor output on the chip this moment, can test a plurality of inside temperatures of a chip at every turn, and the test continuity is good, and the accumulative error is little, has improved the degree of accuracy of chip temperature parameter.
In addition, an embodiment of the present invention further provides a storage medium, where a chip temperature parameter calibration program is stored on the storage medium, and when the chip temperature parameter calibration program is executed by a processor, the steps of the chip temperature parameter calibration method described above are implemented.
Referring to fig. 7, fig. 7 is a block diagram illustrating a first embodiment of a device for calibrating chip temperature parameters according to the present invention.
As shown in fig. 7, the apparatus for calibrating temperature parameters of a chip according to an embodiment of the present invention includes: an adjustment module 10, an acquisition module 20 and a determination module 30.
The adjusting module 10 is configured to adjust a heating power of a chip and determine an internal temperature of the chip according to the heating power;
the obtaining module 20 is configured to obtain a temperature electrical signal and a corresponding heating power output by the chip when the internal temperature reaches a thermal equilibrium;
the determining module 30 is configured to determine a temperature parameter of the chip according to the temperature electrical signal and the heating power.
The embodiment adjusts the heating power of the chip and determines the internal temperature of the chip according to the heating power; when the internal temperature reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power; and determining the temperature parameter of the chip according to the temperature electric signal and the heating power. According to the embodiment, the heating power of the chip is adjusted, the internal temperature of the chip is determined according to the heating power, and the temperature parameter of the chip is determined according to the temperature electrical signal obtained when the internal temperature reaches thermal balance and the corresponding heating power, so that the technical problem that the environmental temperatures of different chips are different due to uneven heat distribution in a large space environment during testing by a heat transfer method is solved, and the accuracy of the temperature parameter of the chip is improved.
Based on the first embodiment of the calibration apparatus for chip temperature parameters of the present invention, a second embodiment of the calibration apparatus for chip temperature parameters of the present invention is provided.
In this embodiment, the adjusting module 10 is further configured to adjust a heating power of the chip by the heating device, and determine the power consumption of the chip according to the heating power; determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relational expression; a heating device is integrated on the chip.
The adjusting module 10 is further configured to obtain a working power of the chip; adjusting heating voltage and heating current through a power controller to adjust heating power of the heating device to the chip; determining the power consumption of the chip according to the heating power, the working power and a preset power consumption relational expression; wherein the preset power consumption relation is as follows:
P＝Ivdd*Uvdd+Ihot*Uhot
wherein, P is power consumption; ivdd is the working current of the chip; uvdd is the working voltage of the chip; ihot is heating current; uhot is the heating voltage.
The adjusting module 10 is further configured to obtain an ambient temperature of an environment where the chip is located; determining the internal temperature of the chip according to the environment temperature and the power consumption through a preset power consumption temperature relational expression; wherein the preset power consumption temperature relation is as follows:
Tc＝Tj+P*(Rjc+rcs)
wherein Tc is the internal temperature of the chip; tj is the ambient temperature of the environment where the chip is located; p is power consumption; rjc is the thermal resistance from the inside of the chip to the packaging tube shell; rcs is the thermal resistance from the package to the heat sink substrate.
The adjusting module 10 is further configured to obtain an ambient temperature of an environment where the chip is located through the temperature sensor, the chip is integrated with the temperature sensor, and the temperature sensor and the heating device are adjacently disposed on the chip.
The obtaining module 20 is further configured to obtain an internal temperature of the chip in real time during a process of heating the chip; traversing a preset calibration temperature set, and comparing the traversed current preset calibration temperature with the internal temperature; when the internal temperature is equal to the current preset calibration temperature, judging that the chip reaches thermal equilibrium; when the chip reaches thermal equilibrium, acquiring a temperature electric signal output by the chip and corresponding heating power; and when the traversal is finished, obtaining a plurality of temperature electric signals output by the chip and a plurality of corresponding heating powers.
The determining module 30 is further configured to determine power consumption corresponding to the chip according to each heating power; and determining the temperature parameters of the chip according to the power consumptions and the corresponding temperature electric signals.
Other embodiments or specific implementation manners of the device for calibrating chip temperature parameters of the present invention may refer to the above method embodiments, and are not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., a rom/ram, a magnetic disk, an optical disk) and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for calibrating temperature parameters of a chip is characterized by comprising the following steps:
adjusting the heating power of a chip, and determining the internal temperature of the chip according to the heating power;
when the internal temperature reaches thermal balance, acquiring a temperature electric signal output by the chip and corresponding heating power;
and determining the temperature parameter of the chip according to the temperature electric signal and the heating power.
2. The method of claim 1, wherein a heating device is integrated on the chip;
the adjusting the heating power of the chip and determining the internal temperature of the chip according to the heating power comprises:
adjusting the heating power of the heating device to the chip, and determining the power consumption of the chip according to the heating power;
and determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relational expression.
3. The method of claim 2, wherein said adjusting a heating power of said heating device to said chip and determining a power consumption of said chip based on said heating power comprises:
acquiring the working power of the chip;
adjusting heating voltage and heating current through a power controller to adjust heating power of the heating device to the chip;
determining the power consumption of the chip according to the heating power, the working power and a preset power consumption relational expression;
wherein the preset power consumption relation is as follows:
P＝Ivdd*Uvdd+Ihot*Uhot
wherein, P is power consumption; ivdd is the working current of the chip; uvdd is the working voltage of the chip; ihot is heating current; uhot is the heating voltage.
4. The method of claim 3, wherein determining the internal temperature of the chip according to the power consumption and a preset power consumption temperature relationship comprises:
acquiring the environmental temperature of the environment where the chip is located;
determining the internal temperature of the chip according to the environment temperature and the power consumption through a preset power consumption temperature relational expression;
wherein the preset power consumption temperature relation is as follows:
Tc＝Tj+P*(Rjc+rcs)
wherein Tc is the internal temperature of the chip; tj is the ambient temperature of the environment where the chip is located; p is power consumption; rjc is the thermal resistance from the inside of the chip to the packaging tube shell; rcs is the thermal resistance from the package to the heat sink substrate.
5. The method of claim 4, wherein a temperature sensor is integrated on the chip, the temperature sensor being disposed adjacent to the heating device on the chip;
the acquiring of the ambient temperature of the environment where the chip is located includes:
and acquiring the ambient temperature of the environment where the chip is located through the temperature sensor.
6. The method of any one of claims 1-5, wherein said obtaining an electrical temperature signal and corresponding heating power output by said chip when said internal temperature reaches thermal equilibrium comprises:
acquiring the internal temperature of the chip in real time in the process of heating the chip;
traversing a preset calibration temperature set, and comparing the traversed current preset calibration temperature with the internal temperature;
when the internal temperature is equal to the current preset calibration temperature, judging that the chip reaches thermal equilibrium;
when the chip reaches thermal equilibrium, acquiring a temperature electric signal output by the chip and corresponding heating power;
and when the traversing is finished, obtaining a plurality of temperature electric signals output by the chip and a plurality of corresponding heating powers.
7. The method of claim 6, wherein said determining a temperature parameter of said chip from said temperature electrical signal and said heating power comprises:
determining power consumption corresponding to the chip according to each heating power;
and determining the temperature parameters of the chip according to the power consumptions and the corresponding temperature electric signals.
8. A device for calibrating temperature parameters of a chip, the device comprising:
the adjusting module is used for adjusting the heating power of the chip and determining the internal temperature of the chip according to the heating power;
the acquisition module is used for acquiring a temperature electric signal output by the chip and corresponding heating power when the internal temperature reaches thermal balance;
and the determining module is used for determining the temperature parameter of the chip according to the temperature electric signal and the heating power.
9. A chip temperature parameter calibration apparatus, the apparatus comprising: a memory, a processor and a chip temperature parameter calibration program stored on the memory and executable on the processor, the chip temperature parameter calibration program being configured to implement the steps of the chip temperature parameter calibration method according to any one of claims 1 to 7.
10. A storage medium having a chip temperature parameter calibration program stored thereon, wherein the chip temperature parameter calibration program when executed by a processor implements the steps of the chip temperature parameter calibration method according to any one of claims 1 to 7.
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| CN202210098278.1A CN114544031A (en) | 2022-01-26 | 2022-01-26 | Chip temperature parameter calibration method, device, equipment and storage medium |
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| CN202210098278.1A CN114544031A (en) | 2022-01-26 | 2022-01-26 | Chip temperature parameter calibration method, device, equipment and storage medium |
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