CN114536934A - Bonding equipment and bonding method - Google Patents
Bonding equipment and bonding method Download PDFInfo
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- CN114536934A CN114536934A CN202210228293.3A CN202210228293A CN114536934A CN 114536934 A CN114536934 A CN 114536934A CN 202210228293 A CN202210228293 A CN 202210228293A CN 114536934 A CN114536934 A CN 114536934A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a bonding device and a bonding method, which relate to the technical field of bonding devices, wherein the bonding device comprises: a donor sheet transport system, a bonding system, and a surface activation system; the supply piece transmission system is used for transmitting a supply piece into the bonding system, and the bonding piece transmission system is used for transmitting a bonding piece into the bonding system; the surface activation system carries out surface activation treatment on the surfaces to be bonded of the supply sheet and the bonding sheet through a high-energy light source; the bonding system is used for bonding the activated bonding piece on the activated supply piece and forming a semi-finished piece or a finished piece; the surface activation system can also activate the surface to be bonded of the semi-finished product sheet through a high-energy light source, and the bonding system is also used for bonding the activated bonding sheet on the activated semi-finished product sheet. The scheme provided by the invention is suitable for the composite material needing multilayer bonding, has short preparation period and high efficiency, and is convenient for bonding the material with larger difference of thermal expansion coefficients.
Description
Technical Field
The invention relates to the technical field of bonding equipment, in particular to bonding equipment and a bonding method.
Background
The composite material bonding has wide application in the fields of laser resonant cavities, laser amplifiers, waveguide lasers, high-energy lasers, laser radars, microelectronic manufacturing, micro-electro-mechanical system packaging, multifunctional chip integration and the like. The process of composite bonding is to bond polished substrates together with or without an adhesive to form a usable bonded device. With the wide application of bonding devices, the composite material bonding equipment and the bonding method thereof must efficiently, accurately, stably and reliably complete the bonding operation.
When materials with large difference of thermal expansion coefficients are bonded by the conventional thermal bonding method, the conventional thermal bonding method is not suitable any more, and the conventional thermal bonding equipment needs to adopt high-temperature conditions such as 1200 ℃ and annealing conditions, so that the preparation process is complex and the preparation period is long.
Disclosure of Invention
The invention aims to provide bonding equipment and a bonding method, which are used for solving the problems in the prior art, and are short in preparation period and high in efficiency for a composite material needing to be completed by multilayer bonding and convenient for bonding materials with large thermal expansion coefficient difference.
In order to achieve the purpose, the invention provides the following scheme:
the present invention provides a bonding apparatus comprising: a donor sheet transport system, a bonding system, and a surface activation system; the feeding piece conveying system is used for conveying feeding pieces into the bonding system, and the bonding piece conveying system is used for conveying bonding pieces into the bonding system; the surface activation system carries out surface activation treatment on the surfaces to be bonded of the supply sheet and the bonding sheet through a high-energy light source; the bonding system is used for bonding the activated bonding piece on the activated supply piece and forming a semi-finished piece or a finished piece;
the surface activation system can also activate the surface to be bonded of the semi-finished product sheet through a high-energy light source, and the bonding system is also used for bonding the activated bonding sheet on the activated semi-finished product sheet.
Preferably, the bonding system comprises a feeding piece bonding station, a bonding piece bonding station and a lifting driving device, the feeding piece conveying system is used for conveying the feeding piece to the feeding piece bonding station, the bonding piece conveying system is used for conveying the bonding piece to the bonding piece bonding station, the bonding piece bonding station is positioned right below the feeding piece bonding station, and the lifting driving device can drive the bonding piece bonding station to lift until the bonding piece is pressed on a surface to be bonded of the feeding piece;
the surface activation system comprises two high-energy light sources, one high-energy light source is used for activating the surface to be bonded of the bonding sheet, and the other high-energy light source is used for activating the surfaces to be bonded of the supply sheet and the semi-finished sheet.
Preferably, the bonding device further comprises a position detecting system and a position adjusting system, the position detecting system is used for detecting the positions of the supplied piece located on the supplied piece bonding station and the bonded piece located on the bonded piece bonding station, and the position adjusting system adjusts the positions of the supplied piece bonding station and the bonded piece bonding station to enable the bonded piece and the supplied piece to be opposite up and down according to the position information detected by the position detecting system.
Preferably, the feeding sheet conveying system and the bonding sheet conveying system are respectively positioned at two opposite sides of the bonding system;
the feeding sheet conveying system comprises a feeding sheet sample feeding rod, a feeding sheet support, a feeding sheet bearing frame, a feeding sheet sample feeding rod driving device and a feeding sheet bearing frame driving device, wherein the feeding sheet bearing frame is provided with a plurality of feeding sheet picking stations, the feeding sheet picking stations are sequentially arranged along the height direction, a feeding sheet fixing piece is arranged at each feeding sheet picking station and is adsorbed to the top of the feeding sheet support by using magnetic force, the bottom of the feeding sheet support is used for fixedly arranging the feeding sheet, and the feeding sheet bonding station is parallel to one feeding sheet picking station;
in an initial state, the feeding sheet sample injection rod is positioned on one side of the feeding sheet support, which is far away from the bonding system, the feeding sheet sample injection rod driving device is used for driving the feeding sheet sample injection rod to move the feeding sheet support fixed with the feeding sheet to the feeding sheet bonding station in parallel, and the feeding sheet bonding station can limit the degree of freedom of the feeding sheet support in up-and-down movement; the feeding sheet carrier driving device can drive the feeding sheet carrier to move up and down to switch the position of each feeding sheet picking station;
the bonding piece transmission system comprises a bonding piece sample feeding rod, a bonding piece support, a bonding piece bearing frame, a bonding piece sample feeding rod driving device and a bonding piece bearing frame driving device, wherein a plurality of bonding piece picking stations are arranged on the bonding piece bearing frame, the bonding piece picking stations are sequentially arranged along the height direction, a bonding piece fixing part is arranged at each bonding piece picking station and is adsorbed to the bottom of the bonding piece support by using magnetic force, the top of the bonding piece support is used for arranging bonding pieces, and the bonding piece bonding station is parallel to one bonding piece picking station;
in an initial state, the bonding sheet sample inlet rod is located on one side, away from the bonding system, of the bonding sheet support, the bonding sheet sample inlet rod driving device is used for driving the bonding sheet sample inlet rod to move the bonding sheet support provided with the bonding sheet to the bonding sheet bonding station in parallel, and the bonding sheet bearing frame driving device can drive the bonding sheet bearing frame to move up and down to switch the position of each bonding sheet picking station.
Preferably, the lifting driving device includes a pressure sensor, a pressure control unit, a linear driving motor and a guiding mechanism, the guiding mechanism includes a vertical guide rail, the bonding piece bonding station is connected to the vertical guide rail in a sliding manner along a vertical direction, the linear driving motor is used for driving the bonding piece bonding station to move along the vertical guide rail, the pressure sensor is used for detecting bonding pressure, and the pressure control unit controls the linear driving motor to pressurize the bonding piece bonding station according to the bonding pressure detected by the pressure sensor.
Preferably, the bonding system further comprises an automatic control vacuum system and a vacuum chamber, wherein the feeding piece bonding station, the bonding piece bonding station, the feeding piece bearing frame and the bonding piece bearing frame are all located in the vacuum chamber, the feeding piece bearing frame and the bonding piece bearing frame are respectively located at two opposite sides of the bonding system, and the automatic control vacuum system is used for controlling and adjusting the vacuum degree of the vacuum chamber; the bonding system is characterized in that a vacuum gate valve is arranged between the supply piece bearing frame and the bonding system, a vacuum gate valve is also arranged between the bonding piece bearing frame and the bonding system, the vacuum gate valves can divide the vacuum chamber into three sub-chambers which are isolated from each other, and the vacuum gate valves are pull-out valves.
Preferably, the feeding piece sample feeding rod can adsorb the feeding piece support through magnetic force, and the bonding piece sample feeding rod can adsorb the bonding piece support through magnetic force.
The invention also provides a bonding method based on the bonding equipment, which comprises the following steps:
the feeding piece conveying system is used for conveying feeding pieces into the bonding system, and the bonding piece conveying system is used for conveying bonding pieces into the bonding system;
secondly, the surface activation system carries out surface activation treatment on the surfaces to be bonded of the supply sheet and the bonding sheet through a high-energy light source;
step three, the bonding system bonds the activated bonding piece on the activated supply piece to form a finished piece or a semi-finished piece;
if multiple bonding is needed, the method further comprises the following steps:
step four, the bonding piece transmission system transmits one bonding piece into the bonding system again;
fifthly, activating the surface to be bonded of the bonding sheet and the surface to be bonded of the semi-finished product by the surface activation system through a high-energy light source;
step six, the bonding system bonds the activated bonding piece to the activated supply piece;
and step seven, repeating the step four, the step five and the step six until a finished product sheet is bonded.
Preferably, it is also necessary to measure and correct the transfer errors supplied to the sheet transfer system and the bonding sheet transfer system before performing step one.
Preferably, before the step one, the bonding piece and the supply piece are subjected to double-sided fine polishing and cleaning; then checking the flatness of the two surfaces of the bonding sheet and the supply sheet, and marking the side surface;
before the third step, the up-and-down positions of the bonding sheet and the supply sheet are adjusted to be opposite to each other;
and before the sixth step, the up-and-down positions of the bonding sheet and the semi-finished product sheet are adjusted until the bonding sheet and the semi-finished product sheet are opposite to each other.
Compared with the prior art, the invention has the following technical effects:
the bonding equipment and the bonding method provided by the invention adopt the high-energy light source to carry out surface activation treatment on the supply sheet and the surface to be bonded of the bonding sheet, do not need to heat and activate the surface to be bonded, and are convenient for bonding materials with larger difference of thermal expansion coefficients; in addition, the surface activation system can also activate the surface to be bonded of the semi-finished product sheet through a high-energy light source, and the bonding system is also used for bonding the activated bonding sheet on the activated semi-finished product sheet so as to complete multilayer bonding on the composite material.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a bonding apparatus according to a first embodiment;
FIG. 2 is a schematic view of a bonding apparatus for performing an activation process on the surfaces of a bonding sheet and a donor sheet;
FIG. 3 is a schematic structural diagram of a bonding apparatus for bonding a bonding sheet and a supply sheet;
FIG. 4 is a schematic structural diagram of the bonding apparatus after bonding the bonding sheet and the supply sheet once;
FIG. 5 is a schematic view of the structure of the bonding sheet, the supply sheet, the bonding sheet holder and the supply sheet holder;
FIG. 6 is a schematic view showing a structure of a feeding sheet holder;
FIG. 7 is a schematic view of the structure of the feed sheet;
FIG. 8 is a schematic structural diagram of a bonding pad holder;
fig. 9 is a schematic structural view of a bonding sheet;
FIG. 10 is a schematic view of the spacing bracket and the feed tab bonding station;
in the figure: 1-bonding system, 11-feeding piece bonding station, 111-limiting bracket, 12-bonding piece bonding station, 13-first position detection unit, 14-lifting drive device, 15-second position detection unit, 2-feeding piece transmission system, 21-feeding piece sample injection rod, 22-feeding piece bracket, 23-feeding piece bearing frame, 231-feeding piece picking station, 232-feeding piece fixing member, 3-bonding piece transmission system, 31-bonding piece sample injection rod, 32-bonding piece bracket, 33-bonding piece bearing frame, 331-bonding piece picking station, 332-bonding piece fixing member, 4-surface activation system, 41-high-energy light source, 5-vacuum chamber, 6-vacuum gate valve, 7-side mark, 101-supply sheet, 102-bonding sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide bonding equipment and a bonding method, which are used for solving the problems in the prior art, have short preparation period and high efficiency for a composite material needing to be finished by multilayer bonding and are convenient for bonding materials with larger difference of thermal expansion coefficients.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example one
The present embodiment provides a bonding apparatus, as shown in fig. 1 to 10, including: a supply sheet transport system 2, a bonding sheet transport system 3, a bonding system 1 and a surface activation system 4; the feeding piece conveying system 2 is used for conveying a feeding piece 101 into the bonding system 1, and the bonding piece conveying system 3 is used for conveying a bonding piece 102 into the bonding system 1; the surface activation system 4 performs surface activation treatment on the surfaces to be bonded of the supply sheet 101 and the bonding sheet 102 by the high-energy light source 41; specifically, the high-energy light source 41 performs rapid atom bombardment activation treatment on a surface to be bonded, and the bonding system 1 is used for bonding the activated bonding sheet 102 to the activated supply sheet 101 and forming a semi-finished product sheet or a finished product sheet;
the surface activation system 4 is also capable of activating the to-be-bonded surface of the green sheet by the high-energy light source 41, and the bonding system 1 is also used for bonding the activated bonding sheet 102 to the activated green sheet.
The bonding equipment provided by the embodiment adopts the high-energy light source 41 to perform surface activation treatment on the surfaces to be bonded of the supply sheet 101 and the bonding sheet 102, and does not need to perform heating activation on the surfaces to be bonded, so as to bond materials with large difference of thermal expansion coefficients; in addition, the surface activation system 4 can also activate the surface to be bonded of the semi-finished product sheet through the high-energy light source 41, and the bonding system 1 is also used for bonding the activated bonding sheet 102 to the activated semi-finished product sheet, so that the multi-layer bonding of the composite material is completed, and the preparation efficiency of the composite material needing the multi-layer bonding is improved.
The bonding objects suitable for the bonding apparatus provided in this embodiment include metal (e.g., Al, Cu, etc.) -ceramic, metal-metal, and metal-Si3N4Metal-stainless steel, metal-Si, metal-Al2O3Intermetallic, metal-ceramic, metal-semiconductor, metal-PbSn brazing filler metals; non-metal-non-metal; is notMetal-metal; inorganic compound-inorganic compound; between heterogeneous substrates; bonding between materials with different thermal expansion coefficients, materials with different thermo-optic coefficients, materials with different refractive indexes, materials with different dielectric constants, materials with different nonlinear coefficients and materials with different absorption saturation coefficients.
Further, the bonding system 1 comprises a supply wafer bonding station 11, a bonding wafer bonding station 12 and a lifting driving device 14, the supply wafer conveying system 2 is used for conveying the supply wafer 101 to the supply wafer bonding station 11, the bonding wafer conveying system 3 is used for conveying the bonding wafer 102 to the bonding wafer bonding station 12, the bonding wafer bonding station 12 is located right below the supply wafer bonding station 11, the lifting driving device 14 can drive the bonding wafer bonding station 12 to ascend until the bonding wafer 102 is pressed on the bonding surface of the supply wafer 101, after the pressing and standing are carried out for a period of time, the bonding piece 102 is bonded on the bottom surface of the supply piece 101, at this time, the lifting driving device 14 drives the bonding piece bonding station 12 to reset, when multiple bonding is needed, the bonding piece transmission system 3 transmits the bonding piece 102 to the bonding piece bonding station 12 again, and the activation and bonding steps are repeated until a finished piece is formed by bonding and then taken out;
the surface activation system 4 includes two high-energy light sources 41, the high-energy light sources 41 act on the surface to be bonded to realize the activation treatment of the surface to be bonded, one high-energy light source 41 is used for performing the activation treatment of the surface to be bonded of the bonding sheet 102, and the other high-energy light source 41 is used for performing the activation treatment of the surfaces to be bonded of the supply sheet 101 and the semi-finished product sheet.
Further, the bonding system 1 can also realize the bonding process by an automatically controlled robot.
Further, the bonding apparatus further comprises a position detecting system and a position adjusting system, the position detecting system is used for detecting the positions of the feeding sheet 101 on the feeding sheet bonding station 11 and the bonding sheet 102 on the bonding sheet bonding station 12, specifically, the side walls of the feeding sheet 101 and the bonding sheet 102 are both provided with the side marks 7, the position detecting system achieves the purpose of detecting the positions of the feeding sheet 101 and the bonding sheet 102 by detecting the positions of the side marks 7, the position adjusting system adjusts the positions of the feeding sheet bonding station 11 and the bonding sheet bonding station 12 to the upper and lower opposite positions of the bonding sheet 102 and the feeding sheet 101 according to the position information detected by the position detecting system so as to facilitate accurate bonding, specifically, the position detecting system comprises a first position detecting unit 13 and a second position detecting unit 15, the first position detecting unit 13 is used for detecting the position of the feeding sheet 101 on the feeding sheet bonding station 11, the second position detection unit 15 is used for detecting the position of a bonding sheet 102 on the bonding sheet bonding station 12, the first position detection unit 13 comprises a first X-direction numerical value measurement mechanism, a first rotation angle measurement mechanism and a first Y-direction numerical value measurement mechanism, the first X-direction numerical value measurement mechanism and the first Y-direction numerical value measurement mechanism are respectively used for detecting the X-direction position and the Y-direction position of the supply sheet 101, the second position detection unit 15 comprises a second X-direction numerical value measurement mechanism, a second rotation angle measurement mechanism and a second Y-direction numerical value measurement mechanism, the second X-direction numerical value measurement mechanism and the second Y-direction numerical value measurement mechanism are respectively used for detecting the X-direction position and the Y-direction position of the bonding sheet 102, the position adjustment system can drive the bonding sheet bonding station 12 and the supply sheet bonding station 11 to respectively move back and forth and back and forth, left and right and rotate, and the first X-direction numerical value measurement mechanism and the first Y-direction numerical value measurement mechanism, And the second X-direction numerical value measuring mechanism and the second Y-direction numerical value measuring mechanism both adopt grating ruler measuring mechanisms.
Further, the feeding piece conveying system 2 and the bonding piece conveying system 3 are respectively located at two opposite sides of the bonding system 1, and the feeding piece conveying system 2 and the bonding piece conveying system 3 respectively convey the feeding piece 101 and the bonding piece 102 into the bonding system 1 from two sides of the bonding system 1;
the feeding sheet conveying system 2 comprises a feeding sheet sample feeding rod 21, a feeding sheet support 22, a feeding sheet support frame 23, a feeding sheet sample feeding rod 21 driving device and a feeding sheet support frame 23 driving device, wherein the feeding sheet support frame 23 is provided with a plurality of feeding sheet picking stations 231, the plurality of feeding sheet picking stations 231 are sequentially arranged along the height direction, the plurality of feeding sheet picking stations 231 are stacked, a feeding sheet fixing member 232 is arranged at each feeding sheet picking station 231, the feeding sheet fixing member 232 adsorbs the top of the feeding sheet support 22 by using magnetic force and adsorbs by using weak magnetic force, so that the feeding sheet sample feeding rod 21 can push the feeding sheet support 22 against the magnetic force, the bottom of the feeding sheet support 22 is used for fixedly arranging the feeding sheet 101, and the feeding sheet bonding station 11 is parallel to one feeding sheet picking station 231; in an initial state, the feeding sheet sample injection rod 21 is positioned at one side of the feeding sheet support 22, which is far away from the bonding system 1, the driving device of the feeding sheet sample injection rod 21 is used for driving the feeding sheet sample injection rod 21 to move the feeding sheet support 22 fixed with the feeding sheet 101 to the feeding sheet bonding station 11 in parallel, and after the feeding sheet support 22 is arranged on the feeding sheet bonding station 11, the feeding sheet bonding station 11 can limit the degree of freedom of the feeding sheet support 22 in moving up and down; the supply sheet carrier 23 driving device can drive the supply sheet carrier 23 to move up and down to switch the position of each supply sheet pickup station 231 for the next round of bonding;
the bonding sheet transmission system 3 comprises a bonding sheet sample feeding rod 31, a bonding sheet support 32, a bonding sheet support 33, a bonding sheet sample feeding rod 31 driving device and a support driving device, wherein a plurality of bonding sheet picking stations 331 are arranged on the bonding sheet support 33, the plurality of bonding sheet picking stations 331 are sequentially arranged along the height direction, the plurality of bonding sheet picking stations 331 are stacked, a bonding sheet fixing member 332 is arranged at each bonding sheet picking station 331, the bonding sheet fixing member 332 adsorbs the bottom of the bonding sheet support 32 by using magnetic force and adsorbs by using weak magnetic force, so that the bonding sheet sample feeding rod 31 can overcome the magnetic force to push the bonding sheet support 32, the top of the bonding sheet support 32 is used for arranging a bonding sheet 102, and the bonding sheet picking station 12 is parallel to the bonding sheet picking station 331; in an initial state, the bonding sheet sample introduction rod 31 is located on one side of the bonding sheet support 32 departing from the bonding system 1, the driving device of the bonding sheet sample introduction rod 31 is used for driving the bonding sheet sample introduction rod 31 to move the bonding sheet support 32 provided with the bonding sheet 102 to the bonding sheet bonding station 12 in parallel, and the driving device of the bonding sheet bearing frame 33 can drive the bonding sheet bearing frame 33 to move up and down so as to switch the position of each bonding sheet picking station 331, so that the bonding of a next round is performed.
Further, lift drive 14 includes pressure sensor, the pressure control unit, linear drive motor and guiding mechanism, guiding mechanism includes vertical guide rail, bonding piece bonding station 12 is along vertical sliding connection on vertical guide rail, linear drive motor is used for driving bonding piece bonding station 12 and moves along vertical guide rail, pressure sensor is used for detecting bonding pressure, the pressure control unit controls linear drive motor and pressurizes bonding piece bonding station 12 according to the bonding pressure that pressure sensor detected, and then accurate control bonding pressure, improve the bonding effect, still can set up a universal damping bulb in lift drive 14, universal damping bulb is used for realizing bonding piece 102 surface and supplies the piece 101 surface complete contact.
Further, the bonding apparatus further comprises an automatic control vacuum system and a vacuum chamber 5, wherein the wafer supply bonding station 11, the bonding wafer bonding station 12, the wafer supply carrier 23 and the bonding wafer carrier 33 are all located in the vacuum chamber 5, the wafer supply carrier 23 and the bonding wafer carrier 33 are respectively located at two opposite sides of the bonding system 1, and the automatic control vacuum system is used for controlling and adjusting the vacuum degree of the vacuum chamber 5; supply with and be provided with vacuum gate valve 6 between piece bearing frame 23 and the bonding system 1, also be provided with vacuum gate valve 6 between bonding piece bearing frame 33 and the bonding system 1, two vacuum gate valves 6 can be separated vacuum chamber 5 into three subchambers isolated each other, vacuum gate valve 6 is pull-out valve, when carrying out activation treatment or bonding to supply piece 101 and bonding piece 102 in the bonding system 1, accessible closes vacuum gate valve 6 and isolates bonding piece bearing frame 33 and supply piece bearing frame 23, prevent that bonding process or activation process from bearing frame 33 and supply bonding piece 102 and supply piece 101 on piece bearing frame 23 and producing adverse effect, vacuum gate valve 6 self possesses the drive arrangement of drive pull.
Further, visual operation windows are arranged on the cavity walls of the three sub-cavities, an upper support and a lower support which are opposite up and down are arranged in the middle sub-cavity, the supply wafer bonding station 11 is arranged on the upper support, and the bonding wafer bonding station 12 is arranged on the lower support.
Further, supply with piece and advance kind pole 21 and can supply with piece support 22 through magnetic force adsorption, bonding piece advances kind pole 31 and can pass through magnetic force adsorption bonding piece support 32, and supply with piece and advance kind pole 21 and bonding piece and advance kind pole 31 and all pass through electromagnetic adsorption, realize adsorbing when circular telegram, realize the separation when the outage.
Further, a limit support 111 is fixedly arranged at the position of the supply sheet bonding station 11, the middle of the limit support 111 is arranged in a hollow manner, limit surfaces are respectively arranged at the bottom and the top of the limit support 111, the supply sheet support 22 is in an I shape, the top of the supply sheet support 22 can enter the limit support 111, and the limit surfaces of the limit support 111 can limit the supply sheet support 22 to move up and down.
Further, the various structures in the bonding apparatus may be intelligently controlled via an intelligent control system.
Example two
The embodiment provides a bonding method of bonding equipment based on the first embodiment, which includes the following steps:
step one, a supply piece transmission system 2 is used for transmitting a supply piece 101 into a bonding system 1, and a bonding piece transmission system 3 is used for transmitting a bonding piece 102 into the bonding system 1;
secondly, the surface activation system 4 carries out surface activation treatment on the surfaces to be bonded of the supply sheet 101 and the bonding sheet 102 through the high-energy light source 41;
step three, the bonding system 1 bonds the activated bonding piece 102 on the activated supply piece 101 and forms a finished piece or a semi-finished piece;
if multiple bonding is needed, the method further comprises the following steps:
step four, the bonding piece transmission system 3 transmits one bonding piece 102 into the bonding system 1 again;
step five, the surface activation system 4 activates the surface to be bonded of the bonding sheet 102 and the surface to be bonded of the semi-finished product through the high-energy light source 41;
step six, the bonding system 1 bonds the activated bonding piece 102 on the activated supply piece 101;
and step seven, repeating the step four, the step five and the step six until a finished product sheet is bonded.
In the bonding method provided by this embodiment, the high-energy light source 41 is used to perform surface activation treatment on the surfaces to be bonded of the supply sheet 101 and the bonding sheet 102, and the surfaces to be bonded do not need to be heated and activated, so as to bond materials with large differences in thermal expansion coefficients; in addition, the surface activation system 4 can also activate the surface to be bonded of the semi-finished product sheet through the high-energy light source 41, and the bonding system 1 is also used for bonding the activated bonding sheet 102 to the activated semi-finished product sheet, so that the multi-layer bonding of the composite material is completed, and the preparation efficiency of the composite material needing the multi-layer bonding is improved.
Further, before the step one, it is also required to measure and correct the transfer errors supplied to the wafer transfer system 2 and the bonding wafer transfer system 3, which specifically includes:
measuring and correcting drive deviations supplied to the sheet transport system 2, comprising:
a side mark is arranged on the feeding sheet bracket 22 and is used for matching with a position detection system, the feeding sheet sample introduction rod 21 drives the feeding sheet bracket 22 to move to the feeding sheet bonding station 11, and the position detection system is aligned, identified and tested for the first time for the position of the feeding sheet bracket 22;
repeating the steps, driving the feeding sheet bracket 22 to move to the feeding sheet bonding station 11 for the second time through the feeding sheet sample feeding rod 21, and aligning, identifying and testing the position of the feeding sheet bracket 22 for the second time by the position detection system;
and compensating the transmission deviation of the feeding sheet sample injection rod 21 according to the difference between the position of the feeding sheet bracket 22 measured by the feeding sheet sample injection rod 21 for the second time and the position of the feeding sheet bracket 22 measured by the feeding sheet sample injection rod 21 for the first time.
Similarly, a side mark is arranged on the bonding sheet support 32 and used for matching with a position detection system, the bonding sheet sample introduction rod 31 drives the bonding sheet support 32 to move to the bonding sheet bonding station 12, and the position detection system is used for identifying and testing the position of the bonding sheet support 32 in a first alignment manner;
repeating the steps, driving the bonding sheet bracket 32 to move to the bonding sheet bonding station 12 for the second time through the bonding sheet sample feeding rod 31, and aligning, identifying and testing the position of the bonding sheet bracket 32 for the second time by the position detection system;
and compensating the transmission deviation of the bonding piece sample feeding rod 31 according to the difference between the position of the bonding piece bracket 32 measured by the bonding piece sample feeding rod 31 for the second time and the position of the bonding piece bracket 32 measured by the bonding piece sample feeding rod 31 for the first time.
Further, before the first step, the bonding sheet 102 and the supply sheet 101 need to be subjected to double-sided fine polishing and cleaning; then, the flatness of the two surfaces of the bonding sheet 102 and the supply sheet 101 is checked, and a side mark 7 is made;
before the third step, the up-and-down positions of the bonding sheet 102 and the supply sheet 101 are adjusted until the bonding sheet 102 and the supply sheet 101 are opposite to each other;
before the sixth step, the up-down positions of the bonding sheet 102 and the semi-finished sheet are adjusted to make the bonding sheet 102 and the semi-finished sheet opposite to each other.
The principle and the implementation mode of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (10)
1. A bonding apparatus characterized by: the method comprises the following steps: a donor sheet transport system, a bonding system, and a surface activation system; the feeding piece conveying system is used for conveying feeding pieces into the bonding system, and the bonding piece conveying system is used for conveying bonding pieces into the bonding system; the surface activation system carries out surface activation treatment on the surfaces to be bonded of the supply sheet and the bonding sheet through a high-energy light source; the bonding system is used for bonding the activated bonding piece on the activated supply piece and forming a semi-finished piece or a finished piece;
the surface activation system can also activate the surface to be bonded of the semi-finished product sheet through a high-energy light source, and the bonding system is also used for bonding the activated bonding sheet on the activated semi-finished product sheet.
2. The bonding apparatus of claim 1, wherein: the bonding system comprises a feeding piece bonding station, a bonding piece bonding station and a lifting driving device, wherein the feeding piece conveying system is used for conveying the feeding piece to the feeding piece bonding station, the bonding piece conveying system is used for conveying the bonding piece to the bonding piece bonding station, the bonding piece bonding station is positioned right below the feeding piece bonding station, and the lifting driving device can drive the bonding piece bonding station to ascend until the bonding piece is pressed on a surface to be bonded of the feeding piece;
the surface activation system comprises two high-energy light sources, one high-energy light source is used for activating the surface to be bonded of the bonding sheet, and the other high-energy light source is used for activating the surfaces to be bonded of the supply sheet and the semi-finished sheet.
3. The bonding apparatus of claim 2, wherein: the position detection system is used for detecting the positions of the supplied piece positioned on the supplied piece bonding station and the bonded piece positioned on the bonded piece bonding station, and the position adjustment system adjusts the positions of the supplied piece bonding station and the bonded piece bonding station to enable the bonded piece and the supplied piece to be opposite up and down according to the position information detected by the position detection system.
4. The bonding apparatus of claim 3, wherein: the feeding piece conveying system and the bonding piece conveying system are respectively positioned at two opposite sides of the bonding system;
the feeding sheet conveying system comprises a feeding sheet sample feeding rod, a feeding sheet support, a feeding sheet bearing frame, a feeding sheet sample feeding rod driving device and a feeding sheet bearing frame driving device, wherein the feeding sheet bearing frame is provided with a plurality of feeding sheet picking stations, the feeding sheet picking stations are sequentially arranged along the height direction, a feeding sheet fixing piece is arranged at each feeding sheet picking station and is adsorbed to the top of the feeding sheet support by using magnetic force, the bottom of the feeding sheet support is used for fixedly arranging the feeding sheet, and the feeding sheet bonding station is parallel to one feeding sheet picking station;
in an initial state, the feeding sheet sample injection rod is positioned on one side of the feeding sheet support, which is far away from the bonding system, the feeding sheet sample injection rod driving device is used for driving the feeding sheet sample injection rod to move the feeding sheet support fixed with the feeding sheet to the feeding sheet bonding station in parallel, and the feeding sheet bonding station can limit the degree of freedom of the feeding sheet support in up-and-down movement; the feeding sheet carrier driving device can drive the feeding sheet carrier to move up and down to switch the position of each feeding sheet picking station;
the bonding piece transmission system comprises a bonding piece sample feeding rod, a bonding piece support, a bonding piece bearing frame, a bonding piece sample feeding rod driving device and a bonding piece bearing frame driving device, wherein a plurality of bonding piece picking stations are arranged on the bonding piece bearing frame, the bonding piece picking stations are sequentially arranged along the height direction, a bonding piece fixing part is arranged at each bonding piece picking station and is adsorbed to the bottom of the bonding piece support by using magnetic force, the top of the bonding piece support is used for arranging bonding pieces, and the bonding piece bonding station is parallel to one bonding piece picking station;
in an initial state, the bonding sheet sample inlet rod is located on one side, away from the bonding system, of the bonding sheet support, the bonding sheet sample inlet rod driving device is used for driving the bonding sheet sample inlet rod to move the bonding sheet support provided with the bonding sheet to the bonding sheet bonding station in parallel, and the bonding sheet bearing frame driving device can drive the bonding sheet bearing frame to move up and down to switch the position of each bonding sheet picking station.
5. The bonding apparatus of claim 2, wherein: the lifting driving device comprises a pressure sensor, a pressure control unit, a linear driving motor and a guiding mechanism, the guiding mechanism comprises a vertical guide rail, the bonding piece bonding station is connected to the vertical guide rail in a sliding mode along the vertical direction, the linear driving motor is used for driving the bonding piece bonding station to move along the vertical guide rail, the pressure sensor is used for detecting bonding pressure, and the pressure control unit controls the linear driving motor to pressurize the bonding piece bonding station according to the bonding pressure detected by the pressure sensor.
6. The bonding apparatus of claim 4, wherein: the automatic control vacuum system is used for controlling and adjusting the vacuum degree of the vacuum chamber; the bonding system is characterized in that a vacuum gate valve is arranged between the supply sheet bearing frame and the bonding system, a vacuum gate valve is also arranged between the bonding sheet bearing frame and the bonding system, the vacuum chamber can be divided into three mutually isolated subchambers by the two vacuum gate valves, and the vacuum gate valves are pull-type valves.
7. The bonding apparatus of claim 4, wherein: the feeding piece sample feeding rod can adsorb the feeding piece support through magnetic force, and the bonding piece sample feeding rod can adsorb the bonding piece support through magnetic force.
8. A bonding method based on the bonding apparatus of any one of claims 1 to 7, characterized in that: the method comprises the following steps:
the feeding piece conveying system is used for conveying feeding pieces into the bonding system, and the bonding piece conveying system is used for conveying bonding pieces into the bonding system;
secondly, the surface activation system carries out surface activation treatment on the surfaces to be bonded of the supply sheet and the bonding sheet through a high-energy light source;
step three, the bonding system bonds the activated bonding piece on the activated supply piece to form a finished piece or a semi-finished piece;
if multiple bonding is needed, the method further comprises the following steps:
step four, the bonding piece transmission system transmits one bonding piece into the bonding system again;
fifthly, activating the surface to be bonded of the bonding sheet and the surface to be bonded of the semi-finished product by the surface activation system through a high-energy light source;
step six, the bonding system bonds the activated bonding piece on the activated semi-finished product;
and step seven, repeating the step four, the step five and the step six until a finished product sheet is bonded.
9. The bonding method according to claim 8, wherein: it is also necessary to measure and correct the transfer errors supplied to the sheet transfer system and the bonding sheet transfer system before performing step one.
10. The bonding method according to claim 8, wherein: before the first step, the bonding piece and the supply piece are subjected to double-sided fine polishing and cleaning; then checking the flatness of the two surfaces of the bonding sheet and the supply sheet, and marking the side surface;
before the third step, the up-and-down positions of the bonding sheet and the supply sheet are adjusted to be opposite to each other;
and before the sixth step, the up-and-down positions of the bonding sheet and the semi-finished product sheet are adjusted until the bonding sheet and the semi-finished product sheet are opposite to each other.
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| CN114536934B (en) | 2023-03-24 |
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