CN114528798A - Printed circuit board element inspection method and system thereof - Google Patents
Printed circuit board element inspection method and system thereof Download PDFInfo
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- CN114528798A CN114528798A CN202210149691.6A CN202210149691A CN114528798A CN 114528798 A CN114528798 A CN 114528798A CN 202210149691 A CN202210149691 A CN 202210149691A CN 114528798 A CN114528798 A CN 114528798A
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- G06F30/39—Circuit design at the physical level
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Abstract
A method for inspecting printed circuit board components comprises a data input step, an analysis step and a comparison step. The data input step inputs the circuit board mechanism diagram information and the circuit board layout diagram information to the processor. The analyzing step analyzes the circuit board mechanism diagram information and the circuit board layout diagram information to obtain mechanism element data and layout element data, wherein the mechanism element data comprise mechanism element numbers and mechanism element positions, and the layout element data comprise layout element numbers and layout element positions. The comparing step compares the mechanical component data with the corresponding layout component data according to the layout component number corresponding to the mechanical component number, confirms whether the layout component position is the same as the corresponding mechanical component position, and outputs component comparison information. Therefore, the time cost of manual inspection is reduced.
Description
Technical Field
The present invention relates to a component inspection method and system, and more particularly, to a printed circuit board component inspection method and system capable of inspecting a layout of a printed circuit board.
Background
With the development of technology and the increasing demand of electronic products, the demand of Printed Circuit Boards (PCBs) is increasing. However, in the existing printed circuit board manufacturing process, when the printed circuit board Layout (PCB Layout) is performed, the printed circuit board Layout is transferred to the software of the printed circuit board Layout, and then the differences between the printed circuit board Layout and the printed circuit board Layout are inspected one by one in a manual inspection manner, which usually takes a lot of time and has a risk of missing errors.
In view of the above, a method and a system for inspecting printed circuit board components capable of automatic inspection and comparison are still the common efforts of the related industries.
Disclosure of Invention
According to one embodiment of the present invention, a method for inspecting components of a printed circuit board is provided, which includes a data input step, an analysis step and a comparison step. The data input step inputs a circuit board mechanism diagram information and a circuit board layout diagram information to a processor. The analyzing step enables the processor to analyze the circuit board mechanism diagram information to extract a plurality of mechanism element data and analyze the circuit board layout diagram information to extract a plurality of layout element data, wherein each mechanism element data comprises a mechanism element number and a mechanism element position, and each layout element data comprises a layout element number and a layout element position. Comparing step, according to the layout element number corresponding to each mechanism element number, comparing each mechanism element data with the corresponding layout element data, confirming whether each layout element position is the same as the corresponding mechanism element position, and outputting element comparison information.
In accordance with another embodiment of the present invention, a printed circuit board component inspection system is provided that includes a processor. The processor receives a circuit board mechanism diagram information and a circuit board layout diagram information, and comprises a mechanism analysis module, a layout analysis module and a comparison module. The mechanism analysis module is used for analyzing the circuit board mechanism diagram information to obtain a plurality of mechanism element data, wherein each mechanism element data comprises a mechanism element number and a mechanism element position. The layout analysis module is used for analyzing the circuit board layout diagram information to obtain a plurality of layout element data, wherein each layout element data comprises a layout element number and a layout element position. The comparison module receives the mechanism element data and the layout element data and is used for comparing the mechanism element data with the layout element data, wherein the comparison module compares the mechanism element data with the corresponding layout element data according to the layout element number corresponding to the mechanism element number, confirms whether the position of each layout element is the same as that of the corresponding mechanism element, and outputs element comparison information.
Drawings
FIG. 1 shows a schematic diagram of a printed circuit board component inspection system in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating circuit board configuration diagram information according to the embodiment of FIG. 1;
FIG. 3 is a partially enlarged schematic view of the circuit board configuration diagram information according to the embodiment of FIG. 2;
FIG. 4 is a schematic diagram illustrating circuit board layout information according to the embodiment of FIG. 1;
FIG. 5 is a schematic diagram of a comparison diagram of elements according to the embodiment of FIG. 1;
FIG. 6 is a flow chart illustrating steps of a printed circuit board element inspection method according to another embodiment of the present invention; and
fig. 7 shows a flow chart of the steps of a detailed step of the printed circuit board element inspection method according to the embodiment of fig. 6.
Description of reference numerals:
10: printed circuit board component inspection system
100: processor with a memory having a plurality of memory cells
110: mechanism analysis module
120: layout analysis module
130: comparison module
140: output module
S100: printed circuit board element inspection method
S110: data input step
S120: analytical procedure
S130: comparison step
S200: detailed procedures
S210, S220, S230, S240, S250, S260, S270: substeps of
200: circuit board mechanism picture information
210,220,230: mechanism element data
221: minimum mechanism rectangle
300: circuit board layout information
310,320: layout component data
Ar1, Ar2, Ar3, Ar4, Ar5, Ar 6: arrow sign
t1, t2, t3, t4, t5, t 6: character(s)
D1, D2: indicating frame
X, Y: shaft
θ: mechanism element placing angle
Detailed Description
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, fig. 1 is a schematic diagram of a printed circuit board component inspection system 10 according to an embodiment of the invention, fig. 2 is a schematic diagram of circuit board configuration diagram information 200 according to the embodiment of fig. 1, fig. 3 is a partially enlarged schematic diagram of the circuit board configuration diagram information 200 according to the embodiment of fig. 2, and fig. 4 is a schematic diagram of circuit board layout diagram information 300 according to the embodiment of fig. 1. As shown in fig. 1, 2 and 4, the printed circuit board component inspection system 10 includes a processor 100 that receives a circuit board layout diagram information 200 and a circuit board layout diagram information 300. The processor 100 includes a mechanism analysis module 110, a layout analysis module 120, and a comparison module 130. The mechanism analysis module 110 is used for analyzing the circuit board configuration diagram information 200 to obtain a plurality of mechanism component data 210,220,230, wherein each of the mechanism component data 210,220,230 includes a mechanism component number and a mechanism component position. The layout analysis module 120 is configured to analyze the circuit board layout information 300 to obtain a plurality of layout component data 310 and 320, wherein each of the layout component data 310 and 320 includes a layout component number and a layout component position. The comparison module 130 receives the mechanism component data 210,220,230 and the layout component data 310,320, and compares each mechanism component data 210,220,230 and each layout component data 310,320, wherein the comparison module 130 compares each mechanism component data 210,220,230 with the corresponding layout component data 310,320 according to each layout component number corresponding to each mechanism component number, determines whether each layout component position is the same as the corresponding mechanism component position, and outputs a component comparison information.
In the process of the pcb layout, the pcb component inspection system 10 can check whether the placement of each component is correct by comparing the pcb layout information 300 with the pcb configuration information 200, and output component comparison information for the user to confirm the inspection result. Therefore, the time cost consumed by manual inspection can be reduced, the error of omission of manual inspection is avoided, and the accuracy of the layout of the printed circuit board is improved. Details of the printed circuit board component inspection system 10 will be described later.
As shown in fig. 1-3, the mechanism analysis module 110 receives and analyzes circuit board configuration diagram information 200. Specifically, the circuit board configuration diagram information 200 is drawn by a mechanism design software, and the circuit board configuration diagram information 200 simulates a circuit board which is actually completed and includes components, so that components with actual sizes (namely, mechanism components in the circuit board configuration diagram information 200) are drawn in a circuit board area with a predetermined size shape, and each mechanism component includes its own mechanism component number, which may be a vector diagram file with a dxf (drawing Exchange format) format or a dwg (drawing) format. In this embodiment, the circuit board configuration diagram information 200 is a vector diagram file in DXF format.
Furthermore, the circuit board configuration diagram information 200 may include shapes of components and pins of the components, such as connectors, screw holes, CPUs, heat sinks, and the like. Each element can be regarded as a primitive (Block) of the vector diagram file in the circuit board configuration diagram information 200, wherein the primitive is a basic geometric figure and a character combination to represent the element appearance and the pin composition, and the mechanism analysis module 110 converts each primitive into analyzable element information. In practice, the program instruction "announce-Note" in the mechanism design software can be used to mark the pins on the primitive and make the arrows mark the pins, especially the 1 st pin and the last pin (nth pin). The mechanism analysis module 110 can take note Text (annotation Text) of each graphic element in the circuit board mechanism diagram information 200 as the mechanism component pin name of the mechanism component data 210,220,230, and the arrow position is the mechanism component pin position and the key value can be taken as the mechanism component number. In detail, the position of the tip of the arrow is the position of the pin of the mechanism element. As shown in fig. 2, arrow Ar1 and arrow Ar2 respectively point to two pins in mechanism component data 210, and characters t1 and t2 of corresponding mechanism component pin names are a1 and B1, respectively, arrow Ar3 and arrow Ar4 respectively point to two pins in mechanism component data 220, and characters t3 and t4 of corresponding mechanism component pin names are 1 and N, respectively, arrow Ar5 and arrow Ar6 respectively point to two pins in mechanism component data 230, and characters t5 and t6 of corresponding mechanism component pin names are 1 and N, respectively.
The mechanism component data 210,220,230 may further include a plurality of end points, wherein the mechanism analysis module 110 forms a minimum mechanism rectangle according to the end points of each mechanism component data 210,220,230, and defines the size of the minimum mechanism rectangle of the mechanism component data 210,220,230 as a mechanism component size of each mechanism component data 210,220, 230. As shown in fig. 3, taking the mechanism component data 220 as an example, the end points of the mechanism component data 220 are connected to each other to form four straight lines, and form a minimum mechanism rectangle 221. The mechanism analysis module 110 defines the size of the minimum mechanism rectangle 221 on the X-axis and Y-axis planes as the mechanism element size of the mechanism element data 220, and defines the center point of the minimum mechanism rectangle 221 on the X-axis and Y-axis planes as the mechanism element position of the mechanism element data 220. Specifically, the mechanical element position of the mechanical element data 220 is a coordinate point on the X-axis and Y-axis planes (100, 150). Therefore, the printed circuit board component inspection system 10 can obtain the required information only by analyzing the circuit board configuration diagram information 200 and the circuit board layout diagram information 300 without receiving additional data, thereby improving the convenience of use.
Further, as shown in fig. 3, the mechanism analysis module 110 may define an angle between a long side of the minimum mechanism rectangle 221 and the X-axis as a mechanism element arrangement angle θ of the mechanism element data 220. Similarly, the mechanism analysis module 110 can also define the mechanism component placement angles of the mechanism component data 210 and 230 in the same manner, which is not described herein. Specifically, the mechanical element data 220 has a mechanical element arrangement angle θ of 35 degrees, and the mechanical element data 210 and 230 have a mechanical element arrangement angle of 0 degree.
As shown in fig. 1 and 4, the layout analysis module 120 receives and analyzes the circuit board layout information 300. Specifically, the pcb layout information 300 may be a drawing file in a csv (comma Separated values) format, and is generated by pcb layout software, but the invention is not limited thereto. Each layout component data 310,320 of the circuit board layout information 300 obtained by the layout analysis module 120 may further include a layout component pin position, a layout component size, and a layout component placement angle, and the key value is taken as a layout component number. Specifically, the layout element number of the layout element data 310 is J2, the layout element number of the layout element data 320 is J1, and the layout element pin position is the center position of the PAD (PAD). The layout analysis module 120 can define the mechanical component sizes and the angles of the long sides of the mechanical component data 210,220,230 with respect to the X-axis as the mechanical analysis module 110 to define the layout component sizes and the layout component placement angles of the layout component data 310,320, which will not be described herein. As shown in fig. 4, the layout element placement angles of the layout element data 310 and 320 are both 0 degree.
Referring to fig. 5, a schematic diagram of an element comparison diagram 400 according to the embodiment of fig. 1 is shown. As shown in fig. 1 to 5, the processor 100 may further include an output module 140. The output module 140 receives the component comparison information and the circuit board configuration diagram information 200, wherein the component comparison information includes a component comparison table and a component comparison diagram 400, and the output module 140 outputs the component comparison diagram 400 according to the component comparison information and the circuit board configuration diagram information 200. Further, the component comparison information may further include component increase/decrease information. The comparison module 130 first determines whether there is a layout component number corresponding to the mechanism component number, and when any mechanism component number and the layout component number cannot be corresponding, the comparison module 130 outputs component increase/decrease information. As shown in fig. 5, the mechanism component number of the mechanism component data 230 does not have a corresponding layout component number, that is, the corresponding data of the mechanism component data 230 is absent in the circuit board layout information 300. The comparison module 130 outputs a component increase/decrease information lacking the mechanism component data 230, and the output module 140 marks a mark frame D2 on the mechanism component data 230 on the component comparison diagram 400 drawn with reference to the circuit board configuration diagram information 200. The indication frame D2 may be a circular indication frame, or may be other geometric shapes, and the invention is not limited thereto. In other embodiments, when the layout component number does not have the corresponding mechanism component number, that is, there is layout component data that is more than the circuit board mechanical composition information in the circuit board layout diagram information, the comparison module outputs a component increase/decrease information that increases the layout component data, and the output module marks a mark on a blank position corresponding to the more layout component data on the component comparison diagram drawn with the circuit board mechanical composition information as a reference.
Furthermore, when the component number and the layout component number correspond to each other, taking the component data 220 and the layout component data 320 as an example, the component number of the component data 220 and the layout component number of the layout component data 320 are both J1, i.e. the component data 220 and the layout component data 320 correspond to each other. The comparison module 130 begins comparing the mechanical component data 220 with the layout component data 320. Specifically, the comparison module 130 compares the mechanical component position, the mechanical component pin position, the mechanical component size, and the mechanical component placement angle θ of the mechanical component data 220 with the layout component position, the layout component pin position, the layout component size, and the layout component placement angle of the layout component data 320, respectively. As shown in fig. 5, the component comparison information may further include a component rotation angle comparison information, and the comparison module 130 determines whether each layout component placement angle is the same as the corresponding mechanism component placement angle. When the mechanical component placing angle θ of the mechanical component data 220 is different from the layout component placing angle of the layout component data 320, the comparison module 130 outputs the component rotation angle comparison information, and the output module 140 marks a rectangular mark frame D1 on the mechanical component data 210 on the component comparison diagram 400 drawn with reference to the circuit board configuration diagram information 200.
The output module 140 can output the component comparison table according to the component comparison information, as shown in table one:
in other embodiments, when the position of the mechanism element is different from the position of the corresponding layout element, the comparison module outputs element comparison information of element displacement; when any arrow marking the pin in the mechanism element data can not correspond to all pins of the layout element data, the comparison module outputs element comparison information lacking the pin. In detail, the pins of the layout element data are a range area of the circuit board layout diagram information on the X-axis and Y-axis planes, and the comparison module determines whether the positions of the arrows marking the pins fall within the range area. Specifically, when the coordinates of the arrow position on the X-axis and Y-axis planes are (315,243), the coordinates of the area of the layout component pin position range on the X-axis are 310 and 320, and the coordinates on the Y-axis are 240 and 260, the comparison module determines that the pins of the mechanism component data are the same as the corresponding pins of the layout component data, and replaces the originally marked characters for the pins of the mechanism component pin position with the characters of the pins of the layout component pin position. And the comparison module confirms whether the pin positions of the mechanism element are the same as the corresponding pin positions of the layout element through the coordinates marked by the arrow, and if the distance between the two coordinates is greater than a preset value, the pin positions of the mechanism element and the pin positions of the layout element are judged to be different, and the pin displacement is regarded. When the mechanism component data has a missing pin, an excess pin or a position difference relative to the pins of the corresponding layout component data, the comparison module outputs component comparison information containing the missing pin, the excess pin or the pin displacement, and the output module marks the pins of the mechanism component data by using a geometric marking frame on a component comparison diagram drawn by taking the circuit board mechanism diagram information as a reference.
It should be noted that, when the placement angle of the layout element is different from the placement angle of the corresponding mechanism element, the comparison module may first rotate the layout element data or the corresponding mechanism element data, so that the pin comparison is performed when the placement angle of the layout element is adjusted to be the same as the placement angle of the corresponding mechanism element, but the invention is not limited thereto.
Referring to fig. 6, a flowchart of steps of a printed circuit board element inspection method S100 according to another embodiment of the invention is shown. In the embodiment of fig. 6, the printed circuit board component inspection system 10 of the embodiments of fig. 1 to 5 will be described together, but the invention is not limited thereto. The printed circuit board component inspection method S100 includes a data input step S110, an analysis step S120, and a comparison step S130. The data input step S110 inputs a circuit board configuration diagram information 200 and a circuit board layout diagram information 300 to a processor 100. The analyzing step S120 analyzes the circuit board layout pattern information 200 to obtain a plurality of mechanical component data 210,220,230, and analyzes the circuit board layout pattern information 300 to obtain a plurality of layout component data 310,320, wherein each of the mechanical component data 210,220,230 includes a mechanical component number and a mechanical component position, and each of the layout component data 310,320 includes a layout component number and a layout component position. The comparison step S130 compares the layout component data 210,220,230 with the corresponding layout component data 310,320 according to the layout component numbers corresponding to the mechanism component numbers, determines whether the layout component positions are the same as the corresponding mechanism component positions, and outputs a component comparison message.
Therefore, the difference between the circuit board composition information 200 and the circuit board layout information 300 is automatically compared by the processor 100, and the component comparison information is provided for the user to confirm the inspection result, thereby avoiding the time cost consumed by manual inspection and improving the inspection accuracy, and further improving the efficiency of the user in correcting the layout of the printed circuit board.
Referring also to fig. 7, a flowchart detailing the step S200 of the pcb inspection method S100 according to the embodiment of fig. 6 is shown. As shown in fig. 7, the detailed step S200 of the printed circuit board component inspection method S100 includes a plurality of sub-steps S210, S220, S230, S240, S250, S260, S270. In the substep S210, the circuit board mechanism diagram information 200 and the circuit board layout diagram information 300 are respectively input to the mechanism analysis module 110 and the layout analysis module 120 of the processor 100, and the mechanism analysis module 110 and the layout analysis module 120 respectively execute substep S230 and substep S220. In the sub-step S220, the layout analysis module 120 analyzes the circuit board layout information 300 to extract the layout component data 310 and 320, and transmits the layout component data 310 and 320 to the comparison module 130. In sub-step S230, the mechanism analysis module 110 analyzes the circuit board configuration diagram information 200, and extracts the primitive information representing each mechanism element in the circuit board configuration diagram information 200, and performs sub-step S240. In substep S240, the mechanism analysis module 110 converts the meta information into element information, and performs substep S250. In sub-step S250, the mechanism analysis module 110 extracts the mechanism component data 210,220,230 from the component information, and transmits the mechanism component data 210,220,230 to the alignment module 130. After the sub-steps S220 and S250 are completed, the sub-step S260 is performed. In the substep S260, the comparison module 130 compares each piece of mechanical component data 210,220,230 with the corresponding piece of layout component data 310,320 according to the mechanical component number and the corresponding piece of layout component number, outputs piece comparison information according to the piece difference, transmits the piece comparison information to the output module 140, and performs substep S270. In the sub-step S270, the output module 140 outputs the component comparison table and the component comparison chart 400 according to the component comparison information.
In summary, the present invention has the following advantages: firstly, the comparison module automatically compares the circuit board mechanism diagram information and the circuit board layout diagram information, so that the time cost of manual inspection is reduced. Secondly, the comparison analysis of the elements can be carried out through the minimum rectangle formed by the end points, and no additional element information is needed. Thirdly, the difference of the placing angles of the mechanism element data relative to the layout element data can be compared and confirmed.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A method of inspecting components of a printed circuit board, comprising:
a data input step, inputting a circuit board mechanism diagram information and a circuit board layout diagram information to a processor;
an analyzing step, making the processor analyze the circuit board mechanism diagram information to obtain a plurality of mechanism element data, and analyzing the circuit board layout diagram information to obtain a plurality of layout element data, wherein each mechanism element data comprises a mechanism element number and a mechanism element position, and each layout element data comprises a layout element number and a layout element position; and
a comparison step, comparing each mechanism component data with the corresponding layout component data according to each layout component number corresponding to each mechanism component number, confirming whether each layout component position is the same as the corresponding mechanism component position, and outputting a component comparison information.
2. The method as claimed in claim 1, wherein the component comparison information includes a component comparison table and a component comparison chart.
3. The printed circuit board component inspection method of claim 1,
each mechanism element data further comprises a plurality of end points, wherein the end points of each mechanism element data form a minimum mechanism rectangle, and the size of the minimum mechanism rectangle of each mechanism element data is defined as a mechanism element size of each mechanism element data;
each layout element data further includes a plurality of end points, wherein the end points of each layout element data form a minimum layout rectangle, the size of the minimum layout rectangle of each layout element data is defined as a layout element size, and it is determined whether each layout element size is the same as the mechanical element size corresponding thereto.
4. The method according to claim 3, wherein the component alignment information includes a component rotation angle alignment information, and in the aligning step, the angle between a long side of each of the minimum mechanism rectangles and an X-axis is defined as a mechanism component placement angle of each of the mechanism component data, the angle between a long side of each of the minimum layout rectangles and the X-axis is defined as a layout component placement angle of each of the layout component data, it is determined whether each of the layout component placement angles is the same as the corresponding mechanism component placement angle, and the component rotation angle alignment information is outputted.
5. The method according to claim 1, wherein the component comparison information includes a component addition/subtraction information, and in the comparison step, the component addition/subtraction information is outputted when any of the component numbers of the mechanism and the component numbers of the layout do not correspond to each other.
6. A printed circuit board component inspection system, comprising:
a processor for receiving a circuit board configuration diagram information and a circuit board layout diagram information, comprising:
a mechanism analysis module for analyzing the circuit board mechanism diagram information to obtain a plurality of mechanism element data, wherein each mechanism element data comprises a mechanism element number and a mechanism element position;
a layout analysis module for analyzing the circuit board layout diagram information to obtain a plurality of layout element data, wherein each layout element data comprises a layout element number and a layout element position; and
and the comparison module compares each mechanism element data with the corresponding layout element data according to each layout element number corresponding to each mechanism element number, confirms whether each layout element position is the same as the corresponding mechanism element position, and outputs element comparison information.
7. The printed circuit board component inspection system of claim 6, wherein the processor further comprises:
and the output module receives the element comparison information and the circuit board mechanism diagram information, wherein the element comparison information comprises an element comparison table and an element comparison diagram, and the output module outputs the element comparison diagram according to the element comparison information and the circuit board mechanism diagram information.
8. A printed circuit board component inspection system as in claim 6,
each mechanism element data further comprises a plurality of end points, wherein the mechanism analysis module forms a minimum mechanism rectangle according to the end points of each mechanism element data, and the size of the minimum mechanism rectangle of each mechanism element data is defined as a mechanism element size of each mechanism element data;
each layout element data further comprises a plurality of end points, wherein the layout analysis module forms a minimum layout rectangle according to the end points of each layout element data, and the size of the minimum layout rectangle of each layout element data is defined as a layout element size;
the comparison module confirms whether the size of each layout element is the same as that of the corresponding mechanism element.
9. The PCB component inspection system of claim 8, wherein the component alignment information comprises a component rotation angle alignment information, the mechanism analysis module defines an angle between a long side of each of the minimum mechanism rectangles and an X-axis as a mechanism component placement angle for each of the mechanism component data, the layout analysis module defines an angle between a long side of each of the minimum layout rectangles and the X-axis as a layout component placement angle for each of the layout component data, the alignment module determines whether each of the layout component placement angles is the same as its corresponding mechanism component placement angle, and outputs the component rotation angle alignment information.
10. The PCB component inspection system of claim 6, wherein the component comparison information includes component increase and decrease information, and the comparison module outputs the component increase and decrease information when any of the component numbers of the mechanism and the component numbers of the layout cannot correspond to each other.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210149691.6A CN114528798A (en) | 2022-02-18 | 2022-02-18 | Printed circuit board element inspection method and system thereof |
| TW111108400A TWI801161B (en) | 2022-02-18 | 2022-03-08 | Printed circuit board element inspecting method and system thereof |
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| CN202210149691.6A CN114528798A (en) | 2022-02-18 | 2022-02-18 | Printed circuit board element inspection method and system thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI273460B (en) * | 2005-11-23 | 2007-02-11 | Inventec Corp | Adjusting system for setting component serial number and method thereof |
| TWI329819B (en) * | 2006-12-07 | 2010-09-01 | Inventec Corp | System and method for managing circuit layout files |
| TW200825822A (en) * | 2006-12-07 | 2008-06-16 | Inventec Corp | Method of checking graphics of part |
| TW200921379A (en) * | 2007-11-13 | 2009-05-16 | Inventec Corp | Auto-checking method for layout figure |
| TWI528200B (en) * | 2012-11-09 | 2016-04-01 | 緯創資通股份有限公司 | Circuit layout adjusting method |
| TWI503684B (en) * | 2013-11-29 | 2015-10-11 | Inventec Corp | Device and method for checking printed circuitry |
| TWI640932B (en) * | 2017-08-08 | 2018-11-11 | 富比庫股份有限公司 | Electronic part pattern verification system and method thereof |
| TWI682480B (en) * | 2018-09-19 | 2020-01-11 | 易華電子股份有限公司 | Layout system for a printed circuit board |
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