CN114502520B - Yag陶瓷接合体及其制造方法 - Google Patents

Yag陶瓷接合体及其制造方法 Download PDF

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Publication number
CN114502520B
CN114502520B CN202080069254.2A CN202080069254A CN114502520B CN 114502520 B CN114502520 B CN 114502520B CN 202080069254 A CN202080069254 A CN 202080069254A CN 114502520 B CN114502520 B CN 114502520B
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yag
glass
joint body
yag ceramic
light
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Chinese (zh)
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CN114502520A (zh
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山崎芳树
味谷和之
田子雅宏
三上充
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16Solid materials
    • H01S3/163Solid materials characterised by a crystal matrix
    • H01S3/164Solid materials characterised by a crystal matrix garnet
    • H01S3/1643YAG
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/0602Crystal lasers or glass lasers
    • H01S3/0612Non-homogeneous structure
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    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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    • C04B37/045Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass characterised by the interlayer used
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
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    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/0602Crystal lasers or glass lasers
    • H01S3/0606Crystal lasers or glass lasers with polygonal cross-section, e.g. slab, prism
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/0602Crystal lasers or glass lasers
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    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
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    • H01S3/0619Coatings, e.g. AR, HR, passivation layer
    • H01S3/0625Coatings on surfaces other than the end-faces
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    • H01S3/14Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
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  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Lasers (AREA)
  • Ceramic Products (AREA)
  • Laser Beam Processing (AREA)
  • Joining Of Glass To Other Materials (AREA)
CN202080069254.2A 2020-02-07 2020-10-13 Yag陶瓷接合体及其制造方法 Active CN114502520B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020019898 2020-02-07
JP2020-019898 2020-02-07
PCT/JP2020/038554 WO2021157135A1 (ja) 2020-02-07 2020-10-13 Yagセラミックス接合体及びその製造方法

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CN114502520A CN114502520A (zh) 2022-05-13
CN114502520B true CN114502520B (zh) 2023-12-05

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US (1) US12160081B2 (https=)
EP (1) EP4023621A4 (https=)
JP (2) JP7503579B2 (https=)
CN (1) CN114502520B (https=)
WO (1) WO2021157135A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
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JPH0597530A (ja) * 1991-10-04 1993-04-20 Kobe Steel Ltd セラミツクス焼結体の接合方法
JP2003313083A (ja) * 2002-04-22 2003-11-06 Toshiba Ceramics Co Ltd イットリウム系化合物の接合体及びその接合方法
CN1533370A (zh) * 2001-07-19 2004-09-29 Ҿ쳵���ʽ���� 陶瓷接合体、陶瓷接合体的接合方法和陶瓷结构体
CN1977393A (zh) * 2004-06-03 2007-06-06 皇家飞利浦电子股份有限公司 用于发光器件的发光陶瓷
JP2014519721A (ja) * 2011-06-13 2014-08-14 ローレンス リバモア ナショナル セキュリティー, エルエルシー 極低温冷却レーザー増幅器のための方法及びシステム

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JPS62226838A (ja) * 1986-03-28 1987-10-05 Hoya Corp ガドリニウム・スカンジウム・ガリウム・ガ−ネツト単結晶用クラツデイングガラス及びそのクラツデイング方法
US5846638A (en) * 1988-08-30 1998-12-08 Onyx Optics, Inc. Composite optical and electro-optical devices
US5441803A (en) * 1988-08-30 1995-08-15 Onyx Optics Composites made from single crystal substances
US6650670B1 (en) * 2000-07-13 2003-11-18 Yutaka Shimoji Polycrystalline ceramic laser
US6587488B1 (en) * 2000-11-08 2003-07-01 Maxios Laser Corporation Control of parasitic laser oscillations in solid-state lasers by frustrating total internal reflections
US7200161B2 (en) * 2001-01-22 2007-04-03 The Boeing Company Side-pumped solid-state disk laser for high-average power
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TW200301980A (en) * 2002-01-10 2003-07-16 Hrl Lab Llc Diffusion bonded pump cavity
US7085304B2 (en) * 2003-05-19 2006-08-01 The Boeing Company Diode-pumped solid state disk laser and method for producing uniform laser gain
JPWO2005091447A1 (ja) * 2004-03-24 2008-02-07 独立行政法人科学技術振興機構 レーザー装置
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US7630423B2 (en) 2005-04-12 2009-12-08 Raytheon Company Glaze soldered laser components and method of manufacturing
JP2011146556A (ja) * 2010-01-15 2011-07-28 National Institutes Of Natural Sciences 半導体レーザー励起固体レーザー装置
US8774235B2 (en) * 2011-06-23 2014-07-08 Raytheon Company System and method for suppressing parasitics in an optical device
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US11434143B2 (en) 2018-03-30 2022-09-06 Jx Nippon Mining & Metals Corporation Polycrystalline YAG sintered body and production method thereof
EP3822233A4 (en) * 2019-01-10 2022-06-29 JX Nippon Mining & Metals Corporation Light-absorbing layer and joined body provided with light-absorbing layer
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0597530A (ja) * 1991-10-04 1993-04-20 Kobe Steel Ltd セラミツクス焼結体の接合方法
CN1533370A (zh) * 2001-07-19 2004-09-29 Ҿ쳵���ʽ���� 陶瓷接合体、陶瓷接合体的接合方法和陶瓷结构体
JP2003313083A (ja) * 2002-04-22 2003-11-06 Toshiba Ceramics Co Ltd イットリウム系化合物の接合体及びその接合方法
CN1977393A (zh) * 2004-06-03 2007-06-06 皇家飞利浦电子股份有限公司 用于发光器件的发光陶瓷
JP2014519721A (ja) * 2011-06-13 2014-08-14 ローレンス リバモア ナショナル セキュリティー, エルエルシー 極低温冷却レーザー増幅器のための方法及びシステム

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US12160081B2 (en) 2024-12-03
EP4023621A1 (en) 2022-07-06
EP4023621A4 (en) 2023-11-08
US20220393424A1 (en) 2022-12-08
JPWO2021157135A1 (https=) 2021-08-12
JP2023029447A (ja) 2023-03-03
JP7503579B2 (ja) 2024-06-20
CN114502520A (zh) 2022-05-13
WO2021157135A1 (ja) 2021-08-12

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