CN114501882A - Preparation method of decorative part, decorative part and electronic equipment - Google Patents
Preparation method of decorative part, decorative part and electronic equipment Download PDFInfo
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- CN114501882A CN114501882A CN202210033703.9A CN202210033703A CN114501882A CN 114501882 A CN114501882 A CN 114501882A CN 202210033703 A CN202210033703 A CN 202210033703A CN 114501882 A CN114501882 A CN 114501882A
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- layer
- decorative
- substrate
- film layer
- optical film
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 130
- 238000005034 decoration Methods 0.000 claims abstract description 111
- 239000012788 optical film Substances 0.000 claims abstract description 92
- 239000010408 film Substances 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 11
- 239000012670 alkaline solution Substances 0.000 claims description 11
- 230000003666 anti-fingerprint Effects 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 3
- 239000005007 epoxy-phenolic resin Substances 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 242
- 230000000694 effects Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 238000005498 polishing Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000003086 colorant Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000007781 pre-processing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006018 Li-aluminosilicate Substances 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000010702 perfluoropolyether Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
Abstract
The embodiment of the application provides a preparation method of a decoration, the decoration and electronic equipment. The preparation method of the decoration provided by the embodiment of the application comprises the steps of firstly arranging the shielding layer on the outer surface of the substrate, arranging the shielding layer with the first hollowed-out area, subsequently forming the optical film layer on the shielding layer and the substrate, removing the shielding layer and covering the optical film layer on the shielding layer, and forming the second hollowed-out area on the optical film layer.
Description
Technical Field
The application relates to the field of electronics, in particular to a preparation method of a decoration, the decoration and electronic equipment.
Background
With the development of the scientific and technological industry, electronic products (such as mobile phones or tablet computers) are widely used in daily life. Electronic products are generally equipped with a camera, and in order to decorate and protect the camera, a decoration is generally provided around the camera.
At present, when a consumer purchases electronic products, the aesthetic feeling of the appearance design has gradually become an important purchasing factor besides the functions of software and hardware. However, the appearance effect of the existing decoration is generally single, which is not favorable for improving the appearance aesthetic feeling of the electronic device.
Disclosure of Invention
The embodiment of the application provides a preparation method of a decorative piece, the decorative piece and electronic equipment.
In a first aspect, an embodiment of the present application provides a method for preparing a decorative part, including:
obtaining a substrate having an inner surface and an outer surface disposed opposite one another;
arranging a shielding layer on the outer surface of the base material, wherein a first hollow area is arranged on the shielding layer;
arranging an optical film layer on the shielding layer and the substrate, wherein the optical film layer covers one side of the shielding layer, which is far away from the substrate, and the part of the outer surface of the substrate, which corresponds to the first hollow-out area;
removing the shielding layer and the optical film layer covering the shielding layer to form a second hollow area on the optical film layer;
arranging a first decoration layer on the inner surface of the substrate, wherein a third hollow area is arranged on the first decoration layer;
and arranging a second decorative layer on one side of the inner surface of the base material, wherein the second decorative layer at least covers the third hollow area to prepare the decorative piece.
In a second aspect, embodiments of the present application provide a trim piece, comprising:
a substrate having oppositely disposed inner and outer surfaces;
the optical film layer is arranged on the outer surface of the substrate, and a second hollow-out area is arranged on the optical film layer;
the first decorative layer is arranged on the inner surface of the substrate, a third hollowed-out area is arranged on the first decorative layer, the first decorative layer is arranged corresponding to the optical film layer, and the third hollowed-out area is arranged corresponding to the second hollowed-out area;
the second decorative layer is arranged on one side where the inner surface of the substrate is located, and at least the third hollowed-out area is covered by the second decorative layer.
In a third aspect, an embodiment of the present application provides an electronic device, including:
an apparatus body;
the decoration piece is attached to the equipment body and is the decoration piece manufactured by the preparation method of the decoration piece or the decoration piece.
The method for manufacturing the decoration provided by the embodiment of the application comprises the steps of firstly arranging the shielding layer on the outer surface of the substrate, arranging the first hollowed-out area on the shielding layer, subsequently forming the optical film layer on the shielding layer and the substrate, removing the shielding layer and the optical film layer covering the shielding layer, so that the second hollowed-out area is formed on the optical film layer, arranging the first decoration layer and the second decoration layer on the inner surface of the substrate, arranging the third hollowed-out area on the first decoration layer, and covering the third hollowed-out area by the second decoration layer, namely, on the manufactured decoration, the part corresponding to the optical film layer can show the optical effect of the optical film layer and/or the color and the optical effect of the superposition of the optical film layer and the first decoration layer, and the part corresponding to the third hollowed-out area can show the color and the optical effect of the second decoration layer The position of second decorative layer on the thickness direction of decoration has the difference, consequently can make the appearance effect of different regions demonstrate the stereovision on the decoration to make the decoration have unique outward appearance effect, when this decoration was applied to electronic equipment, can promote electronic equipment's outward appearance aesthetic feeling, and then promoted the market competition of product, in addition, set up the optics rete through the surface at the decoration, because the optics rete has higher hardness, consequently can also promote the wear resistance of decoration.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a flow chart of a method of making a decorative element provided in embodiments of the present application.
Fig. 2 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure.
Fig. 3 is a flowchart of preprocessing a substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic view illustrating a shielding layer disposed on an outer surface of a substrate according to an embodiment of the present disclosure.
Fig. 5 is a schematic view of an optical film layer disposed on a shielding layer and a substrate according to an embodiment of the present disclosure.
Fig. 6 is a schematic diagram illustrating the removal of the shielding layer and the optical film layer covering the shielding layer according to an embodiment of the disclosure.
Fig. 7 is a schematic view illustrating a first decorative layer disposed on an inner surface of a substrate according to an embodiment of the present disclosure.
Fig. 8 is a schematic view of an anti-fingerprint film disposed on an optical film layer and a substrate according to an embodiment of the present disclosure.
Fig. 9 is a schematic view of a second decorative layer disposed on a side where an inner surface of a substrate is located according to an embodiment of the present disclosure, and illustrates a structure of a corresponding decorative part.
Fig. 10 is a schematic view of a second decorative layer disposed on a side where an inner surface of a substrate is located according to another embodiment of the present application, and shows a structure of a corresponding decorative part.
Fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a flowchart of a method for manufacturing a decorative part according to an embodiment of the present disclosure. The preparation method of the decorative piece comprises the following steps:
s100, obtaining a substrate, wherein the substrate is provided with an inner surface and an outer surface which are oppositely arranged.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure, in which a substrate 10 has an inner surface 11 and an outer surface 12 disposed opposite to each other. Illustratively, the substrate 10 may be glass, such as silicate glass or lithium aluminosilicate glass, among others.
Illustratively, the thickness of the substrate 10 may be 0.3mm to 3.0mm, such as 0.3mm, 0.5mm, 0.7mm, 1mm, 1.3mm, 1.5mm, 1.7mm, 2mm, 2.3mm, 2.5mm, 2.7mm, 3.0mm, and the like.
Illustratively, the outer surface 12 of the substrate 10 may be smooth. Illustratively, the outer surface 12 of the substrate 10 may also have a glittering sand anti-glare (AG) texture pattern or a low-glare (AG) texture pattern.
Illustratively, after the substrate 10 is obtained, the substrate 10 may also be pre-processed. Fig. 3 is a flowchart of preprocessing a substrate according to an embodiment of the present disclosure, and as shown in fig. 3, "preprocessing a substrate" may specifically include:
and S110, grinding the base material into a preset shape.
Illustratively, the substrate 10 may be ground to a predetermined shape, such as a rectangular shape or a circular shape, using a CNC machine. When the substrate 10 is a glass plate, the glass plate may also be ground to a 2.5D shape using CNC equipment.
Illustratively, when the substrate 10 is a glass plate, after grinding the substrate 10 into a predetermined shape such as a rectangle, a circle, etc., the substrate 10 may be processed into a 3D shape using a hot bender.
And S120, polishing the base material.
Illustratively, "subjecting the substrate to the polishing treatment" may specifically include:
and S121, polishing the edge of the base material.
It is understood that, after the grinding of the substrate 10, the edge of the substrate 10 is frosted due to the knifes and pocks, and thus the edge of the substrate 10 can be smoothed by polishing the edge of the substrate 10.
And S122, polishing the outer surface of the base material.
It will be appreciated that by polishing the outer surface 12 of the substrate 10, the optical effect and thus the appearance of the subsequently produced decorative element 100 can be enhanced. Note that, when the outer surface 12 of the substrate 10 originally exhibits the glittering and antiglare effect, the outer surface 12 of the substrate 10 may not be subjected to polishing treatment.
It should be noted that the execution sequence of S121 and S122 is not limited, and S121 may precede S122, or S122 may precede S121 and follow, or S121 and S122 may be performed simultaneously.
And S130, forming a through hole on the base material.
For example, after the through hole is formed in the substrate 10, when the decoration member to be subsequently manufactured is used for attaching an electronic device, the through hole may be disposed corresponding to the camera so that the decoration member is decorated around the camera.
S140, strengthening treatment is carried out on the base material.
Illustratively, when the substrate 10 is glass, the glass can be strengthened by ion exchange, so as to improve the strength of the glass, and further improve the strength and wear resistance of the subsequently manufactured decoration 100.
After step S100, the method for preparing a decorative piece provided in the embodiment of the present application further includes:
s200, arranging a shielding layer on the outer surface of the base material, wherein a first hollow-out area is arranged on the shielding layer.
Fig. 4 is a schematic view of disposing a shielding layer on an outer surface of a substrate according to an embodiment of the present disclosure, as shown in fig. 4, the shielding layer 20 is disposed on the outer surface 12 of the substrate 10, and the shielding layer 20 is disposed with a first hollow area 21, that is, the prepared shielding layer 20 has a specific shape, so that the shape of the optical film layer 30 formed subsequently can be controlled by using the pattern of the shielding layer 20.
Illustratively, the material of the shielding layer 20 may be a resin, such as an acrylic resin, an epoxy novolac resin, or the like. For example, when the material of the shielding layer 20 is resin, a wet film layer may be formed by screen printing, and after printing, the wet film layer is baked and cured to obtain the shielding layer 20.
S300, arranging an optical film layer on the shielding layer and the substrate, wherein the optical film layer covers one side of the shielding layer, which is far away from the substrate, and the part, corresponding to the first hollow area, of the outer surface of the substrate.
Fig. 5 is a schematic view of disposing an optical film layer on the masking layer and the substrate according to an embodiment of the present disclosure, and as shown in fig. 5, after disposing the optical film layer 30 on the masking layer 20 and the substrate 10, the optical film layer 30 may cover a side of the masking layer 20 away from the substrate 10 and a portion of the outer surface 12 of the substrate 10 corresponding to the first hollow area 21. In this embodiment, since the thickness of the shielding layer 20 is greater than the thickness of the optical film layer 30, after the optical film layer 30 is disposed on the shielding layer 20 and the substrate 10, the side surface of the shielding layer 20 is exposed, so that when the shielding layer 20 is subsequently immersed in an alkaline solution, the alkaline solution can erode the shielding layer 20 from the side surface thereof, and gradually dissolve the shielding layer 20.
Illustratively, the optical film layer 30 includes a first film layer, a second film layer and a third film layer sequentially stacked on the substrate 10, the material of the first film layer, the material of the second film layer and the material of the third film layer are each selected from one of silicon oxide, silicon nitride and silicon oxynitride, and the material of the first film layer, the material of the second film layer and the material of the third film layer are different from each other. The chemical formula of the silicon oxide is SiO2Silicon nitride of the formula Si3N4The chemical formula of silicon oxynitride is SiOxNy。
Illustratively, the first film layer is made of silicon oxide, the second film layer is made of silicon oxynitride, and the third film layer is made of silicon nitride; or
The first film layer is made of silicon oxide, the second film layer is made of silicon nitride, and the third film layer is made of silicon oxynitride; or
The first film layer is made of silicon nitride, the second film layer is made of silicon oxide, and the third film layer is made of silicon oxynitride; or
The first film layer is made of silicon nitride, the second film layer is made of silicon oxynitride, and the third film layer is made of silicon oxide; or
The first film layer is made of silicon oxynitride, the second film layer is made of silicon oxide, and the third film layer is made of silicon nitride; or
The first film layer is made of silicon oxynitride, the second film layer is made of silicon nitride, and the third film layer is made of silicon oxide.
It should be noted that, because the refractive indexes of the respective materials of the first film layer, the second film layer and the third film layer in the optical film layer 30 are different, a semitransparent optical effect can be shown after the optical film layer 30 is stacked, and a colorful effect can be shown after the optical film layer 30 is stacked with the first decoration layer 40 located at the bottom of the decoration 100, so that the aesthetic feeling of the appearance of the decoration 100 is improved.
The laminated structure of the first film layer, the second film layer and the third film layer not only enables the optical film layer 30 to have a semitransparent optical effect, but also has high hardness, so that the appearance aesthetic feeling of the decoration 100 is improved, and the wear resistance of the outer surface of the decoration 100 is improved.
Illustratively, the thickness of the optical film layer 30 is 500nm to 4000nm, such as 500nm, 800nm, 1000nm, 1500nm, 2000nm, 2500nm, 3000nm, 3500nm, 4000nm, and the like. It should be noted that when the thickness of the laminated structure formed by the first film layer, the second film layer, and the third film layer is within a range of 500nm to 4000nm, the optical film layer 30 and the first decoration layer 40 can achieve a better colorful effect after being stacked.
Illustratively, the optical film layer 30 is disposed on the masking layer 20 and the substrate 10 by Physical Vapor Deposition (PVD).
For example, the optical film 30 may be prepared by a magnetron sputtering coater, wherein before filling the working gas, a reaction chamber in the magnetron sputtering coater is first vacuumized to a vacuum degree of 1.5E-3Pa to 3.0E-3Pa, after vacuumization, the working gas is filled into the reaction chamber to make a working gas pressure in the reaction chamber reach 1.1E-1Pa to 5.5E-1Pa, a working power of the PVD coater may be 5kw to 10kw, a temperature in the reaction chamber may be 80 ℃ to 180 ℃ (e.g., 80 ℃, 120 ℃, 150 ℃, 180 ℃, etc.), the target material may be a Si target, and the working gas may be Ar (argon), N (argon), or the like2(nitrogen), and the like.
For example, before the optical film layer 30 is plated on the substrate 10, the substrate 10 may be pretreated, for example, an ICP (inductively coupled plasma) source is used to clean the surface of the substrate 10.
S400, removing the shielding layer and the optical film layer covering the shielding layer to form a second hollow area on the optical film layer.
Fig. 6 is a schematic view illustrating the removal of the shielding layer and the optical film covering the shielding layer according to the embodiment of the present disclosure, as shown in fig. 6, after the shielding layer 20 and the optical film 30 covering the shielding layer 20 are removed, a second hollow area 32 is formed on the optical film 30, so that the optical film 30 forms a specific texture pattern, thereby enhancing the aesthetic appearance of the optical film 30. It is understood that the second hollow area 32 corresponds to the area where the shielding layer 20 is disposed on the outer surface 12 of the substrate 10 in step S200 (see fig. 4).
Illustratively, when the material of the shielding layer 20 is resin, "removing the shielding layer and the optical film layer covering the shielding layer" may specifically include: the shielding layer 20 is immersed in an alkaline solution, and the shielding layer 20 is dissolved in the alkaline solution by a chemical reaction between the alkaline solution and the shielding layer 20. In some embodiments, the resin material of the shielding layer 20 is saponified with the alkaline solution to dissolve the resin material in the alkaline solution, and the optical film 30 attached to the shielding layer 20 is also peeled off due to the dissolution of the shielding layer 20, and only the portion of the optical film 30 not covered by the shielding layer 20 remains, and the rest of the optical film 30 is directly covered on the substrate 10.
Illustratively, the alkaline solution may be a sodium hydroxide solution, a potassium hydroxide solution, or the like.
It can be understood that, by forming the second hollow-out region 32 on the optical film 30, the optical film 30 can present a certain texture pattern, thereby increasing the aesthetic feeling.
S500, arranging a first decoration layer on the inner surface of the substrate, and arranging a third hollow area on the first decoration layer.
Fig. 7 is a schematic view illustrating a first decoration layer disposed on an inner surface of a substrate according to an embodiment of the present disclosure, as shown in fig. 7, a first decoration layer 40 is disposed on an inner surface 11 of a substrate 10, and a third hollow area 43 is disposed on the first decoration layer 40. In one embodiment, along the thickness direction of the substrate 10, the first decorative layer 40 at least partially overlaps the optical film layer 30 on the outer surface 12 of the substrate 10, and the third hollowed-out area 43 at least partially overlaps the second hollowed-out area 32. Illustratively, the first decorative layer 40 is disposed corresponding to the optical film layer 30 on the outer surface 12 of the substrate 10, and the third hollow area 43 is disposed corresponding to the second hollow area 32. Illustratively, the third hollow area 43 is aligned with the edge of the second hollow area 32 and has the same size.
Exemplarily, "disposing the first decorative layer on the inner surface of the substrate" may specifically include:
arranging a first ink material on a part, corresponding to the optical film layer 30, of the inner surface 11 of the substrate 10;
the first ink material is cured to obtain a first ink layer, and the first decorative layer 40 is formed by the first ink layer.
Illustratively, the first ink material may be disposed on the inner surface 11 of the substrate 10 corresponding to the portion of the optical film layer 30 by screen printing.
For example, the curing of the first ink material may be baking.
Illustratively, the first ink material may include a first resin material (e.g., an acrylic resin) and a first pigment to impart color to the first decorative layer 40.
Illustratively, the first decorative layer 40 has a color and/or texture pattern to enhance the aesthetic appearance of the trim piece 100. The color of the decorative layer may be a color (for example, various colors such as red, orange, yellow, green, cyan, blue, violet, etc.), or may be white or black. In some embodiments, the color of first decorative layer 40 may be a combination of two or more colors. In other embodiments, the first decorative layer 40 may be colorless and transparent. By matching the color and texture pattern of the first decorative layer 40, a colorful effect can be achieved.
Illustratively, after the first decorative layer 40 is disposed on the inner surface 11 of the substrate 10, an anti-fingerprint film 50 may also be disposed on the optical film layer 30 and the substrate 10. Fig. 8 is a schematic view of disposing an anti-fingerprint film on the optical film layer and the substrate according to an embodiment of the present disclosure, and as shown in fig. 8, the anti-fingerprint film 50 covers a side of the optical film layer 30 away from the substrate 10 and a portion of the outer surface of the substrate 10 corresponding to the second hollow area 32. It can be understood that the anti-fingerprint film 50 can make the surface of the decoration 100 prepared subsequently have strong hydrophobic, anti-oil and anti-fingerprint capabilities, so as to maintain the effect of being smooth and bright for a long time.
Illustratively, the anti-fingerprint film 50 may be prepared by vacuum evaporation, and the material of the anti-fingerprint film 50 may be a material that is conventional in the art, such as perfluoropolyether, and will not be described herein again.
S600, arranging a second decoration layer on one side of the inner surface of the base material, wherein the second decoration layer at least covers the third hollow area, and manufacturing the decoration.
Illustratively, the second decorative layer 60 has a color and/or texture pattern to enhance the aesthetic appearance of the trim piece 100. The color of the decorative layer may be a color (for example, various colors such as red, orange, yellow, green, cyan, blue, violet, etc.), or may be white or black. In some embodiments, the color of second decorative layer 60 may be a combination of two or more colors. In other embodiments, the second decorative layer 60 may be colorless and transparent. By matching the color and the texture pattern of the second decorative layer 60, a colorful effect can be realized.
Illustratively, first decorative layer 40 is a different color than second decorative layer 60, thereby rendering decorative piece 100 a colorful color.
Fig. 9 is a schematic view of providing a second decorative layer on a side where an inner surface of a substrate is located according to an embodiment of the present application, and illustrates a structure of a corresponding decorative part, where as shown in fig. 9, "providing a second decorative layer on a side where an inner surface of a substrate is located" may specifically include:
a film is attached to the side of the first decoration layer 40 away from the substrate 10, and covers the third hollow area 43, and the second decoration layer 60 is formed by the film. At this time, the second decoration layer 60 can cover the third hollow area 43 and the surface of the first decoration layer 40 away from the substrate 10.
For example, the film attached to the side of the first decorative layer 40 away from the substrate 10 may be a single-layer film, or may be a multi-layer film (e.g., two, three, four, five, etc.).
For example, the films may be fixed to the side of the first decoration layer 40 away from the substrate 10 by a light-transmitting adhesive layer, and when multiple films are disposed on the side of the first decoration layer 40 away from the substrate 10, the multiple films may also be bonded together by the light-transmitting adhesive layer.
Illustratively, the light transmissive adhesive bondline has a light transmission of greater than 20%, such as 20%, 40%, 60%, 80%, 90%, 95%, 99%, 100%, etc.
Fig. 10 is a schematic view of disposing a second decorative layer on a side where an inner surface of a substrate is located according to another embodiment of the present application, and illustrates a structure of a corresponding decorative part, as shown in fig. 10, "disposing a second decorative layer on a side where an inner surface of a substrate is located" may specifically include:
disposing a second ink material on the inner surface 11 of the substrate 10 corresponding to the third hollow area 43;
the second ink material is cured to obtain a second ink layer, which forms the second decorative layer 60. At this time, the second decoration layer 60 covers only the third hollow area 43, i.e., covers the portion of the inner surface 11 of the substrate 10 corresponding to the third hollow area 43.
For example, the second ink material may be disposed on the inner surface 11 of the substrate 10 corresponding to the third hollow area 43 by screen printing.
For example, the curing of the second ink material may be baking.
Illustratively, the second ink material may include a second resin material (e.g., an acrylic resin) and a second pigment to impart a color to the second decorative layer 60.
Illustratively, the first pigment and the second pigment are different in color, so that the first ink material and the second ink material respectively present different colors, and further the first decorative layer 40 and the second decorative layer 60 respectively present different colors, thereby the decorative piece 100 presents a colorful color.
To sum up, in the preparation method of the decoration provided in the embodiment of the present application, the shielding layer 20 is first disposed on the outer surface 12 of the substrate 10, the shielding layer 20 is disposed with the first hollow area 21, the shielding layer 20 and the optical film 30 covering the shielding layer 20 are subsequently removed after the optical film 30 is formed on the shielding layer 20 and the substrate 10, so as to form the second hollow area 32 on the optical film 30, the first decoration layer 40 and the second decoration layer 60 are disposed on the inner surface 11 of the substrate 10, the third hollow area 43 is disposed on the first decoration layer 40, and the third hollow area 43 is covered by the second decoration layer 60. Illustratively, the first decoration layer 40 is disposed corresponding to the optical film layer 30, and the third hollow area 43 is disposed corresponding to the second hollow area 32. That is, on the prepared decoration 100, the portion corresponding to the optical film 30 may show the color and the optical effect of the superposition of the optical film 30 and the first decoration layer 40, and the portion corresponding to the second hollow area 32 and the third hollow area 43 may show the color and the optical effect of the second decoration layer 60, and because there is a difference in the positions of the optical film 30, the first decoration layer 40 and the second decoration layer 60 in the thickness direction of the decoration 100, the appearance effect of different areas on the decoration 100 may present a layering feeling, so that the decoration 100 has a unique appearance effect. When the decoration 100 is applied to the electronic device 200, the aesthetic appearance of the electronic device 200 can be improved, and further the market competitiveness of the product can be improved, and in addition, the wear resistance of the decoration 100 can also be improved by arranging the optical film layer 30 on the outer surface of the decoration 100.
Referring to fig. 9 and 10, an embodiment of the present application further provides a decoration 100, where the decoration 100 may be manufactured by the manufacturing method in any of the above embodiments, and the decoration 100 may include a substrate 10, an optical film 30, a first decoration layer 40, and a second decoration layer 60; the substrate 10 has an inner surface 11 and an outer surface 12 disposed opposite one another; the optical film 30 is disposed on the outer surface 12 of the substrate 10, and a second hollow area 32 is disposed on the optical film 30; the first decoration layer 40 is disposed on the inner surface 11 of the substrate 10, and a third hollow area 43 is disposed on the first decoration layer 40; the second decoration layer 60 is disposed on the side of the substrate 10 where the inner surface 11 is located, and the second decoration layer 60 at least covers the third hollow area 43.
It can be understood that, when the user views the decoration 100 from the side of the decoration 100 on which the optical film 30 is disposed, the portion of the decoration 100 corresponding to the optical film 30 may exhibit the color and the optical effect of the optical film 30 and the first decoration layer 40 superimposed, the portion corresponding to the second hollow area 32 and the third hollow area 43 may exhibit the color and the optical effect of the second decoration layer, and, because there is a difference in the positions of the optical film 30, the first decoration layer 40, and the second decoration layer 60 in the thickness direction of the decoration 100, the appearance effect of different areas of the decoration 100 may exhibit a hierarchical feeling, so that the decoration 100 has a unique appearance effect.
Illustratively, the first decoration layer 40 is disposed corresponding to the optical film layer 30, and the third hollow area 43 is disposed corresponding to the second hollow area 32. Illustratively, the first decorative layer 40 may be a cured first ink layer covering a portion of the inner surface 11 of the substrate 10 corresponding to the optical film layer 30.
Referring to fig. 9, the second decoration layer 60 may be a film attached to the side of the first decoration layer 40 away from the substrate 10.
Referring to fig. 10, the second decorative layer 60 may also be a cured second ink layer, and the second ink layer covers a portion of the inner surface 11 of the substrate 10 corresponding to the third hollow area 43. When second decorative layer 60 is a cured second ink layer, for example, the thickness of first decorative layer 40 and the thickness of second decorative layer 60 may be equal.
Referring to fig. 9 and 10, the decoration 100 further includes an anti-fingerprint film 50, wherein the anti-fingerprint film 50 covers a side of the optical film layer 30 away from the substrate 10 and a portion of the outer surface of the substrate 10 corresponding to the second hollow area 32.
Illustratively, the decoration 100 may have a planar form or a curved form, for example, when the substrate 10 is 2D glass, the decoration 100 has a planar form, and when the substrate 10 is 2.5D glass or 3D glass, the decoration 100 has a curved form.
Referring to fig. 11, fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The embodiment of the present application further provides an electronic device 200, which includes a device body 300 and a decoration 100, where the decoration 100 is attached to the device body 300, and the decoration 100 may be the decoration 100 manufactured by the manufacturing method in any of the above embodiments or the decoration 100 in any of the above embodiments.
Illustratively, the decoration 100 and the device body 300 may be bonded together by an adhesive glue.
Exemplarily, the camera 400 is arranged on the device body 300, the decoration 100 covers a peripheral region of the camera 400, and a through hole is arranged on the decoration 100 and corresponds to the camera 400 to expose the camera 400.
Exemplarily, the electronic device 200 may be a mobile terminal such as a mobile phone and a tablet computer, and may also be a device having a display screen such as a game device, an Augmented Reality (AR) device, a Virtual Reality (VR) device, a data storage device, an audio playing device, a video playing device, and a wearable device, where the wearable device may be a smart band, smart glasses, a smart watch, a smart decoration, and the like.
The preparation method of the decoration, the decoration and the electronic device provided by the embodiment of the application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and the content of the present specification should not be construed as a limitation to the present application.
Claims (15)
1. A method of making a decorative element, comprising:
obtaining a substrate having an inner surface and an outer surface disposed opposite one another;
arranging a shielding layer on the outer surface of the base material, wherein a first hollow area is arranged on the shielding layer;
arranging an optical film layer on the shielding layer and the substrate, wherein the optical film layer covers one side of the shielding layer, which is far away from the substrate, and the part of the outer surface of the substrate, which corresponds to the first hollow-out area;
removing the shielding layer and the optical film layer covering the shielding layer to form a second hollow area on the optical film layer;
arranging a first decoration layer on the inner surface of the substrate, wherein a third hollow area is arranged on the first decoration layer;
and arranging a second decorative layer on one side of the inner surface of the base material, wherein the second decorative layer at least covers the third hollow area to prepare the decorative piece.
2. A method of manufacturing a decorative member according to claim 1, wherein the optical film layer includes a first film layer, a second film layer and a third film layer which are sequentially stacked, the material of the first film layer, the material of the second film layer and the material of the third film layer are each selected from one of silicon oxide, silicon nitride and silicon oxynitride, and the material of the first film layer, the material of the second film layer and the material of the third film layer are different from each other; the thickness of the optical film layer is 500nm-4000 nm.
3. A method of preparing a decorative item according to claim 1, wherein providing a first decorative layer on the inner surface of the substrate comprises:
along the thickness direction of the substrate, the first decoration layer and the optical film layer are at least partially overlapped, and the third hollowed-out area and the second hollowed-out area are at least partially overlapped.
4. A method of preparing a decorative item according to claim 1, wherein providing a first decorative layer on the inner surface of the substrate comprises:
arranging a first ink material on the inner surface of the substrate corresponding to the part of the optical film layer;
and curing the first ink material to obtain a first ink layer, wherein the first ink layer forms the first decorative layer.
5. A method of producing a decorative item according to claim 1, wherein the providing a second decorative layer on the side of the substrate on which the inner surface is located comprises:
and attaching a membrane to one side of the first decoration layer, which is far away from the substrate, wherein the membrane covers the third hollow area, and the membrane forms the second decoration layer.
6. A method of producing a decorative item according to claim 1, wherein the providing a second decorative layer on the side of the substrate on which the inner surface is located comprises:
arranging a second ink material on the inner surface of the substrate corresponding to the part of the third hollow area;
and curing the second ink material to obtain a second ink layer, wherein the second ink layer forms the second decorative layer.
7. A method of making a decorative item according to claim 1 wherein the optical film layer has a thickness greater than the thickness of the obscuring layer;
the removing the shielding layer and the optical film layer covering the shielding layer comprises: and soaking the shielding layer in an alkaline solution, and dissolving the shielding layer in the alkaline solution through a chemical reaction between the alkaline solution and the shielding layer.
8. A method of manufacturing a decorative item according to claim 7 wherein the material of the obscuring layer comprises an acrylic resin and/or an epoxy phenolic resin.
9. A decorative element, comprising:
a substrate having oppositely disposed inner and outer surfaces;
the optical film layer is arranged on the outer surface of the substrate, and a second hollow-out area is arranged on the optical film layer;
the first decorative layer is arranged on the inner surface of the substrate, and a third hollow area is arranged on the first decorative layer;
the second decorative layer is arranged on one side where the inner surface of the substrate is located, and at least the third hollowed-out area is covered by the second decorative layer.
10. A decorative item according to claim 9 wherein the optical film layer comprises a first film layer, a second film layer and a third film layer arranged one on top of the other, the first film layer, the second film layer and the third film layer each being selected from one of silicon oxide, silicon nitride and silicon oxynitride, and the first film layer, the second film layer and the third film layer each being formed from a different material; the thickness of the optical film layer is 500nm-4000 nm.
11. A decorative item according to claim 9 wherein, in the thickness direction of the substrate, the first decorative layer at least partially overlaps the optical film layer and the third openwork region at least partially overlaps the second openwork region.
12. A decorative item according to claim 9 wherein the first decorative layer is a cured first ink layer covering a portion of the inner surface of the substrate corresponding to the optical film layer.
13. A decorative item according to claim 9 wherein the second decorative layer is a film applied to the first decorative layer on the side remote from the substrate; or
The second decorative layer is a cured second ink layer, and the second ink layer covers the part, corresponding to the third hollowed-out area, of the inner surface of the substrate.
14. A decorative item according to claim 9 further comprising an anti-fingerprint film covering a side of the optical film layer remote from the substrate and a portion of the outer surface of the substrate corresponding to the second hollowed-out area.
15. An electronic device, comprising:
an apparatus body;
a decorative piece attached to the device body, the decorative piece being a decorative piece produced by a method of producing a decorative piece according to any one of claims 1 to 8, or a decorative piece according to any one of claims 9 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210033703.9A CN114501882A (en) | 2022-01-12 | 2022-01-12 | Preparation method of decorative part, decorative part and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210033703.9A CN114501882A (en) | 2022-01-12 | 2022-01-12 | Preparation method of decorative part, decorative part and electronic equipment |
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| CN114501882A true CN114501882A (en) | 2022-05-13 |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102373408A (en) * | 2010-08-25 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Coating processing method |
| CN102929418A (en) * | 2011-08-09 | 2013-02-13 | 群康科技(深圳)有限公司 | Decorative film, image display system and method for manufacturing touch sensing device |
| CN107835276A (en) * | 2017-12-08 | 2018-03-23 | 南昌欧菲光科技有限公司 | Flexible cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN109286711A (en) * | 2018-09-26 | 2019-01-29 | 信利光电股份有限公司 | A kind of preparation method of cover board and a kind of cover board |
| CN209593493U (en) * | 2019-02-20 | 2019-11-05 | 南昌欧菲光科技有限公司 | Handheld terminal rear cover and its decorating film |
| CN110493987A (en) * | 2019-08-12 | 2019-11-22 | Oppo广东移动通信有限公司 | Housing unit, the method and electronic equipment for preparing housing unit |
| CN209767585U (en) * | 2019-03-22 | 2019-12-10 | 南昌欧菲光科技有限公司 | Hand-held terminal rear cover and decorative film thereof |
| CN209767982U (en) * | 2018-11-09 | 2019-12-10 | 苏州欧菲光科技有限公司 | Handheld terminal and colored cover plate thereof |
| CN110996576A (en) * | 2019-11-05 | 2020-04-10 | 维达力实业(深圳)有限公司 | Protective cover plate, preparation method thereof and electronic equipment |
| CN111049959A (en) * | 2019-12-30 | 2020-04-21 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
| WO2020098416A1 (en) * | 2018-11-16 | 2020-05-22 | 昇印光电（昆山）股份有限公司 | Decorative thin film and consumer electronic product cover plate |
-
2022
- 2022-01-12 CN CN202210033703.9A patent/CN114501882A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102373408A (en) * | 2010-08-25 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Coating processing method |
| CN102929418A (en) * | 2011-08-09 | 2013-02-13 | 群康科技(深圳)有限公司 | Decorative film, image display system and method for manufacturing touch sensing device |
| CN107835276A (en) * | 2017-12-08 | 2018-03-23 | 南昌欧菲光科技有限公司 | Flexible cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN109286711A (en) * | 2018-09-26 | 2019-01-29 | 信利光电股份有限公司 | A kind of preparation method of cover board and a kind of cover board |
| CN209767982U (en) * | 2018-11-09 | 2019-12-10 | 苏州欧菲光科技有限公司 | Handheld terminal and colored cover plate thereof |
| WO2020098416A1 (en) * | 2018-11-16 | 2020-05-22 | 昇印光电（昆山）股份有限公司 | Decorative thin film and consumer electronic product cover plate |
| CN209593493U (en) * | 2019-02-20 | 2019-11-05 | 南昌欧菲光科技有限公司 | Handheld terminal rear cover and its decorating film |
| CN209767585U (en) * | 2019-03-22 | 2019-12-10 | 南昌欧菲光科技有限公司 | Hand-held terminal rear cover and decorative film thereof |
| CN110493987A (en) * | 2019-08-12 | 2019-11-22 | Oppo广东移动通信有限公司 | Housing unit, the method and electronic equipment for preparing housing unit |
| CN110996576A (en) * | 2019-11-05 | 2020-04-10 | 维达力实业(深圳)有限公司 | Protective cover plate, preparation method thereof and electronic equipment |
| CN111049959A (en) * | 2019-12-30 | 2020-04-21 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
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