CN111587000B

CN111587000B - Ceramic-like electronic equipment shell, preparation method thereof and electronic equipment

Info

Publication number: CN111587000B
Application number: CN202010411692.4A
Authority: CN
Inventors: 周亮; 董康; 蒋正南
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2022-03-22
Anticipated expiration: 2040-05-15
Also published as: WO2021227634A1; CN111587000A

Abstract

The application provides a ceramic-like electronic equipment shell, a preparation method thereof and electronic equipment, wherein the ceramic-like electronic equipment shell comprises: a non-ceramic substrate, at least a portion of an outer surface of the non-ceramic substrate being a low haze surface, the low haze surface having a haze of less than 2; a brightness enhancing coating disposed on the low haze surface of the non-ceramic substrate; and the ink layer is arranged on the surface of the brightening coating film, which is far away from the non-ceramic substrate. In the shell, the ink layer can realize the ground color of the ceramic appearance, the low haze surface and the brightening coating film can realize the enamel feeling of the ceramic, the appearance effect extremely close to the real ceramic shell is realized by the combined action of the three, the structure is simple, the preparation is easy, the preparation yield is high, and the cost is lower.

Description

Ceramic-like electronic equipment shell, preparation method thereof and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a ceramic-like electronic equipment shell, a preparation method thereof and electronic equipment.

Background

At present, in the field of ceramic-like electronic equipment shells, in order to obtain ceramic feeling, there are 2 types of schemes mainly. One is vacuum-plating ZrO₂(ceramic main component) or thermal-sprayed ZrO₂To obtain a ceramic feel; another type is spray coating of ceramic simulating paint + NCVM (non-conductive plating). But directly plated with ZrO₂The ceramic feeling is only achieved when the coating thickness is more than 1 mu m, the cost is very high, the yield is low, and meanwhile, the effects of the two schemes are greatly different from the real ceramic effect, so that quality problems such as coating/paint falling and the like are easy to occurTherefore, the scheme has complicated lamination or large stress, cannot be used for 3D forming and can only be applied to formed products.

Therefore, the existing technology related to the appearance of ceramic of the ceramic-like electronic device housing still needs to be improved.

Content of application

The present application is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present application is to provide a ceramic-like electronic device housing with good appearance, simple manufacturing process, or low cost.

In one aspect of the present application, a ceramic-like electronic device housing is provided. According to an embodiment of the application, the ceramic-like electronic device housing comprises: a non-ceramic substrate, at least a portion of an outer surface of the non-ceramic substrate being a low haze surface, the low haze surface having a haze of less than 2; a brightness enhancing coating disposed on the low haze surface of the non-ceramic substrate; and the ink layer is arranged on the surface of the brightening coating film, which is far away from the non-ceramic substrate. In the shell, the ink layer can realize the ground color of the ceramic appearance, the low haze surface and the brightening coating film can realize the enamel feeling of the ceramic, the appearance effect extremely close to the real ceramic shell is realized by the combined action of the three, the structure is simple, the preparation is easy, the preparation yield is high, and the cost is lower.

In another aspect of the present application, a method of making a ceramic-like electronic device housing as described above is provided. According to an embodiment of the application, the method comprises: forming a brightening coating on the low haze surface of the non-ceramic substrate; and forming an ink layer on the surface of the brightening coating film far away from the non-ceramic substrate. The appearance effect extremely close to the real ceramic shell can be realized only by coating and forming ink, and the method has the advantages of simple steps and procedures, easy operation, high yield, low cost and capability of saving about 50 percent of cost, and the through-pass rate can reach 70 percent.

In yet another aspect of the present application, an electronic device is provided. According to an embodiment of the present application, the electronic device includes: the ceramic-like electronic equipment shell is characterized in that an accommodating space is defined in the ceramic-like electronic equipment shell; and the display screen is arranged in the accommodating space. The electronic equipment shell has the advantages of good ceramic appearance effect, high attractiveness and good user experience, and is realized by simple preparation procedures and low cost.

The application has at least the following beneficial effects:

1) the process is simple: the ceramic imitation effect is achieved only through coating and silk-screen printing ink, the process is simple and mature, and the through-pass rate can reach more than about 70 percent, which is far higher than other schemes (less than about 50 percent) in the related technology.

2) The cost is low: the cost of brightening plating and silk-screen printing ink is low, and the price of the finished product (3D battery rear cover) is within 20, which is far lower than other solutions in real ceramics and related technologies.

3) The ceramic has good effect: the appearance effect of the shell is extremely close to the real ceramic effect, and the effect is far superior to the ceramic imitation scheme in the related technology.

Drawings

Fig. 1 is a schematic cross-sectional view of a ceramic-like electronic device housing according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of a ceramic-like electronic device housing according to another embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a ceramic-like electronic device housing according to another embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a ceramic-like electronic device housing according to another embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a ceramic-like electronic device housing according to another embodiment of the present application.

FIG. 6 is a schematic flow chart of a method of making a ceramic-like electronic device housing according to an embodiment of the present application.

FIG. 7 is a schematic flow chart of a method of making a ceramic-like electronic device housing according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 9 is a photograph of a black ceramic-like electronic device case and a real black ceramic case according to example 1 of the present application.

Fig. 10 is a photograph of a white ceramic-like electronic device case and a real white ceramic case according to example 2 of the present application.

Fig. 11 is a reflection curve of a real ceramic case.

Fig. 12 is a reflection curve of a ceramic-like electronic device case of example 1.

Fig. 13 is a photograph of a boiled-off film of the electronic device case of comparative example 1.

Fig. 14 is a reflection curve of the electronic apparatus case of comparative example 1.

Fig. 15 is a reflection curve of the electronic device case of comparative example 2.

Detailed Description

Embodiments of the present application are described in detail below. The following description of the embodiments is merely exemplary in nature and is in no way intended to limit the present disclosure. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.

In one aspect of the present application, a ceramic-like electronic device housing is provided. According to an embodiment of the present application, referring to fig. 1, the ceramic-like electronic device case includes: a non-ceramic substrate 10 having at least a portion of an outer surface thereof being a low haze surface 101, the low haze surface 101 having a haze of less than 2; a brightness enhancing coating 20, the brightness enhancing coating 20 being disposed on the low haze surface 101 of the non-ceramic substrate 10; and an ink layer 30, wherein the ink layer 30 is arranged on the surface of the brightness enhancement coating 20 away from the non-ceramic substrate 10. In the shell, the ink layer can realize the ground color of the ceramic appearance, the low-haze surface and the brightening coating film can realize the glaze texture of the ceramic appearance, the appearance effect extremely close to the real ceramic shell is realized by the combined action of the three, the structure is simple, the preparation is easy, the preparation yield is high, and the cost is lower.

Specifically, true ceramic reflection divides diffuse reflection (ground colour) and specular reflection (glaze feel), just two effect combined action obtain the distinctive appearance effect of pottery, in the above-mentioned casing, low fog surface is more smooth, higher glossiness has, more have ceramic "enamel" feel, the product is more clear and bright visually, further combine the brightening coating film, can effectively realize ceramic enamel feel, and can adjust the colour of casing outward appearance through the printing ink layer, realize ceramic ground colour, above-mentioned factor cooperation, the synergism, make this casing have the appearance effect extremely close true ceramic casing, when reduce cost, higher pleasing to the eye degree has been realized, and then provide better use for the user and experience.

Specifically, the haze of the low-haze surface may be less than 1.5, further less than 1, and further less than 0.5, specifically, such as 1.9, 1.8, 1.7, 1.6, 1.5, 1.4, 1.3, 1.2, 1.0, 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, and the like. Within the haze range, the surface is smoother, higher glossiness is achieved, the ceramic shell has a ceramic enamel feeling, and the shell is clearer and brighter to eyes and is closer to the appearance effect of a real ceramic shell.

Specifically, the non-ceramic substrate may have a single-layer structure, or may have a multi-layer structure, specifically, a single-layer plastic plate, a multi-layer plastic composite plate, a glass substrate, or the like. In some embodiments, the low-haze surface on the non-ceramic substrate can be an outer surface of the substrate body, in which case, substrates that meet the low-haze requirement can be used as is, and substrates that do not meet the low-haze requirement can be subjected to suitable surface treatments, such as polishing, and the like. In yet other embodiments, the low haze surface may be formed by forming a coating on a surface of a substrate, and in particular, referring to fig. 2, the non-ceramic substrate 10 includes: a substrate body 11; and a non-textured finishing layer 12, wherein the non-textured finishing layer 12 is disposed on the surface of the substrate body 11, and the surface of the non-textured finishing layer 12 away from the substrate body 11 constitutes the low haze surface 101.

Specifically, the single-layer plastic plate may be polycarbonate (injection-molded PC), polyethylene terephthalate (PET film), or the like, and the multi-layer plastic composite plate may be a polycarbonate/polymethyl methacrylate (PC/PMMA) composite plate (one surface is a PC layer, the other surface is a PMMA layer, and the PC layer and the PMMA layer are combined together in a high-temperature lamination, bonding, or the like). In some embodiments, the thickness of the PC/PMMA composite board can be 330 to 850 micrometers (specifically, 330 micrometers, 350 micrometers, 400 micrometers, 450 micrometers, 500 micrometers, 550 micrometers, 600 micrometers, 650 micrometers, 700 micrometers, 750 micrometers, 800 micrometers, 850 micrometers, etc.), wherein the thickness of the PC layer can be 300-700 micrometers (too thin and not strong enough, too thick to increase the thickness of the shell), specifically, 300 micrometers, 350 micrometers, 400 micrometers, 450 micrometers, 500 micrometers, 550 micrometers, 600 micrometers, 650 micrometers, 700 micrometers, etc., and the thickness of the PMMA layer can be 30 to 150 micrometers (this surface faces to the outside, the too thin steel wool is poor in wear resistance, and too thick and high pressure molding can crack and has poor drop performance), specifically, such as 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, micrometer, 140 microns, 150 microns, etc. Wherein, both sides of the composite board can be provided with protective films for protection so as to protect the composite board from being damaged in the transportation and processing processes.

Specifically, the non-textured smooth layer may be a UV transfer layer or a spray coating layer, and may be specifically selected according to actual needs. The UV transfer printing layer and the spraying layer can generate a leveling effect, so that a smooth and low-haze surface is realized, the haze can be lower than 0.5, the glossiness is higher, and the better ceramic appearance effect is realized.

Specifically, the thickness of the non-textured finish layer is 5 to 15 micrometers, specifically 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers, and the like. Within the thickness range, proper glossiness and haze can be realized, better ceramic appearance effect is favorably realized, if the glossiness effect is too thin, the brittleness is improved if the glossiness effect is too thick, and the poaching hundred grids and the falling performance can be deteriorated after high-pressure molding.

Specifically, referring to fig. 3, the brightness enhancement coating 20 may include a plurality of sub-coating layers 21, the number, thickness and material of the sub-coating layers may be adjusted according to the actual effect to be achieved, and the thickness and material of each sub-coating layer may be the same or different. In some embodiments, referring to fig. 3, the number of sub-coatings may be 2, 3, 4, etc. The sub-coating layers of different layers and different materials are mutually matched, so that the surface optical effects of different colors and different reflectivities can be realized, and the appearance of the shell is closer to a real ceramic shell.

Specifically, the thickness of the brightness enhancement coating is 45-65 nm (specifically, 45nm, 48 nm, 50nm, 52 nm, 55 nm, 58 nm, 60 nm, 62 nm, 65nm, etc.). In the thick bottom range, the reflectivity and the reflected light of the shell are basically consistent with those of a real ceramic shell (wherein, the reflectivity of the real ceramic shell is about 12-16%, the reflected light is pure white light and is expressed as 'enamel'), if the reflectivity is lower than 45nm, the enamel feeling is not enough, and if the reflectivity is larger than 65nm, the enamel feeling is too strong and is partial mirror-like, and the reflected light can be colored, such as yellow, and is different from the reflected white light of the real ceramic shell, so that the ceramic imitation effect is seriously influenced.

Specifically, the plurality of sub-plating films may be formed of a non-conductive oxide, and specifically, a metal oxide having a different high and low refractive index may be selected, such as silicon dioxide, niobium pentoxide, trititanium pentoxide, zirconium dioxide, and SiAlOx, and specifically, ZrO₂A base layer of/SiAlOx, Ti₃O₅/TiO₂(high refractive index layer), Nb₂O₅(high refractive index layer), SiO₂(low index layer) or other non-conductive plating. Therefore, shielding of antenna signals can be effectively avoided.

Specifically, a metal oxide coating with matched high and low refractive indexes can be selected according to the requirements of brightness and color, wherein a brightening coating with 4 sub-coating layers generally needs lower reflection brightness, and meanwhile, the color phase of the reflection is ensured to be warmer, and the method can be specifically used for Nb₂O₅Or Ti₃O₅In which a layer of 0-10nm SiO is inserted₂Different thicknesses can obtain different colors, different laminated structures can obtain different reflectivity effects, and the thickness range and the laminated structures in the application can obtain the appearance closer to a real ceramic shellAnd (5) effect.

In some embodiments, the plurality of sub-coating layers include a zirconium dioxide layer (with a specific thickness of 2-5nm), a niobium pentoxide layer (with a specific thickness of 15-25nm), a silicon dioxide layer (with a specific thickness of 0-10nm), and a niobium pentoxide layer (with a specific thickness of 15-25nm) which are sequentially stacked. In other specific embodiments, the plurality of sub-plating layers include a SiAlOx layer (the specific thickness may be 5 to 10nm), a titanium pentoxide layer (the specific thickness may be 15 to 25nm), a silicon dioxide layer (the specific thickness may be 0 to 10nm), and a titanium pentoxide layer (the specific thickness may be 15 to 25nm) which are sequentially stacked. In still other embodiments, the plurality of sub-plating layers include a SiAlOx layer (with a specific thickness of 5-10nm) and a tri-titanium pentoxide layer (with a specific thickness of 30-50nm) sequentially stacked. In still other embodiments, the plurality of sub-coating layers include a zirconium dioxide layer (with a specific thickness of 2-5nm) and a niobium pentoxide layer (with a specific thickness of 30-50nm) sequentially stacked.

Specifically, referring to fig. 4, the ink layer 30 may include a plurality of ink seed layers 31. The specific number, thickness, material and color of the ink layers can be selected and adjusted according to the actual needs. In some embodiments, the number of ink layers may be 3 or 4; the thickness of each ink-spreading layer is 5-8 micrometers (specifically, 5 micrometers, 5.5 micrometers, 6 micrometers, 6.5 micrometers, 7 micrometers, 7.5 micrometers, 8 micrometers and the like); the total thickness of the ink layer can be 20-30 micrometers (specifically, 20 micrometers, 21 micrometers, 22 micrometers, 23 micrometers, 24 micrometers, 25 micrometers, 26 micrometers, 27 micrometers, 28 micrometers, 29 micrometers, 30 micrometers, etc.). Within the thickness range, the mechanical property and the adhesive force of the ink layer are good, the shading effect is good, if the ink layer is too thick, the brittleness is relatively high, the adhesive force is poor, the shading effect is relatively poor if the ink layer is too thin, and the color expression effect is relatively poor.

It is to be appreciated that, with reference to fig. 5, the ceramic-like electronic device housing may further include: a hardened layer 40, the hardened layer 40 being disposed on a surface of the non-ceramic substrate 10 remote from the brightness enhancing coating 20. Therefore, the wear resistance of the shell can be improved, the shell is not easy to damage, and the service life is longer.

Specifically, the above-mentioned imitative ceramic electronic equipment casing of this application can realize extremely being close to the outward appearance effect of true ceramic casing. Through testing, the difference between the L value of the ceramic-like electronic device housing and the L value of the real ceramic housing is within ± 1 (specifically, ± 1, ± 0.9, ± 0.8, ± 0.7, ± 0.6, ± 0.5, ± 0.4, ± 0.3, ± 0.2, ± 0.1, etc.) compared with a real ceramic housing of the same color, the difference between the a value of the ceramic-like electronic device housing and the a value of the real ceramic housing is within ± 0.5 (specifically, ± 0.5, ± 0.4, ± 0.3, ± 0.2, ± 0.1, etc.), and the difference between the b value of the ceramic-like electronic device housing and the b value of the real ceramic housing is within ± 0.5 (specifically, ± 0.5, ± 0.4, ± 0.3, ± 0.2, ± 0.1, etc.); the difference between the average reflectivity (i.e. the average reflectivity in the wavelength range of 380 nm-780 nm) of the ceramic-like electronic device shell and the average reflectivity of the ceramic shell is within ± 4% (specifically, ± 4, ± 3.5, ± 3, ± 2.5, ± 2, ± 1.5, ± 1, ± 0.5, etc.). Therefore, the color value of the ceramic-like electronic equipment shell is stable, adjustable and controllable, the color difference fluctuation of the real ceramic shell can be achieved, and the appearance effect closer to the real ceramic shell is obtained.

Wherein, the L, a and b refer to an L value, an a value and a b value in Lab color space, wherein the L value represents brightness, the larger the L value, the brighter the brightness (or the whiter the color), the smaller the L value, the darker the L value (or the blacker the color), and the L value range can be 0-100; the value a is a color value, the value a is positive and represents red, the larger the value a is, the more red the color is, the value a is negative and represents green, and the smaller the value a is, the more green the color is, the value a ranges from-120 to 120; b is a color value, b is positive and represents yellow, and the larger the b value is, the more yellow the color is; b is negative and represents blue, the smaller the b value is, the more blue the color is, and the b value ranges from-120 to 120.

It can be understood that the specific structure of the ceramic-like electronic device shell is not particularly limited, and may be a flat plate structure, a 2.5D structure, a 3D structure, or the like, and may be specifically selected according to actual needs, and specific sizes, shapes, and the like may be adjusted according to the sizes and shapes of actual electronic devices, and are not described herein any more.

In another aspect of the present application, a method of making a ceramic-like electronic device housing as described above is provided. According to an embodiment of the present application, referring to fig. 6, the method comprises the steps of:

s100: a brightening coating is formed on the low haze surface of a non-ceramic substrate.

Specifically, the non-ceramic substrate used in this step may be the same as that described above, and is not described in detail here. When the outer surface of the substrate body is used to form the low haze surface, suitable surface treatment, such as polishing, can be performed on the outer surface of the substrate body, although if the outer surface of the substrate body directly meets the low haze requirement, no additional surface treatment operation is required. If the low haze surface is formed by forming an additional film layer on the surface of the substrate body, the non-ceramic substrate may be formed by: forming a non-textured finish layer on the surface of the substrate body by UV transfer printing or spraying, wherein the surface of the non-textured finish layer far away from the substrate body constitutes the low haze surface. Through the UV transfer printing and spraying method, the haze of the surface of the obtained texture-free smooth layer can be less than 0.5, and the ceramic-like appearance effect of the shell is better.

Specifically, the brightness enhancement coating film can be formed by a magnetron sputtering or evaporation coating method. Specifically, the brightness enhancement coating layer can be formed by adopting a magnetic control continuous line device or an electron gun evaporation coating device. The specific steps and parameters can be selected according to actual needs, and are not described in detail herein.

S200: and forming an ink layer on the surface of the brightening coating film far away from the non-ceramic substrate.

Specifically, the ink layer may be formed by a printing method. Specifically, a printing ink layer can be formed by adopting screen printing, and specifically, the printing ink layer can be formed by 3-4 times of screen printing and baking solidification, wherein the thickness of each layer of printing ink is 5-8 micrometers, and the total thickness is 20-30 micrometers. Therefore, the mechanical property and the light leakage prevention property of the ink layer are better.

Specifically, referring to fig. 7, the method for preparing the electronic device housing may further include: and forming a hardened layer on the surface of the non-ceramic substrate far away from the brightness enhancement coating film. Specifically, the hardened layer may be formed by a curtain coating method, in which a hardening liquid (e.g., UV paint) is curtain coated on the surface to form the hardened layer.

It can be understood that when the electronic device housing is in a 2.5D or 3D structure, the housing may be formed into a suitable arc-shaped structure by CNC, hot pressing, or high-pressure molding. In one embodiment, the 2.5D structured housing may be prepared by UV texture transfer, coating, screen printing, CNC printing and curtain coating. In addition, the non-texture surface layer, the brightening coating film and the ink layer can be sequentially and directly formed on the substrate body, or a laminated structure of the non-texture surface layer, the brightening coating film and the ink layer can be formed in advance, and then the laminated structure is attached to the substrate body, or the laminated structure is directly injection-molded to form the substrate body.

In some embodiments, the method of preparing an electronic device housing may include the steps of:

1. preparing a composite board. Cutting the PC + PMMA composite board into required sizes. The thickness of the PC layer of the composite plate is 300-700 microns, the thickness of the PMMA layer is 30-150 microns, the two sides of the plate are protected by protective films, and the PC + PMMA composite mode can be high-temperature lamination or bonding.

2. And (4) UV transfer printing. After the protective film on the PC surface is torn off and electrostatic dust removal treatment is carried out (static electricity is generated during tearing of the film, so that dust particles are adsorbed), a transparent UV coating is transferred and printed on the surface of the PC layer by using UV transfer printing equipment, and the transparent UV coating is cured at the same time of transfer printing, wherein the UV thickness is 6-15 microns.

3. And (5) vacuum coating. 2 or 4 layers of metal oxide coatings with matched high and low refractive indexes are electroplated on the UV transfer printing layer by a magnetron sputtering or evaporation plating method according to the requirements of brightness and color, and the total thickness of the electroplated layers is 45nm-65 nm.

4. And covering the bottom with ink. And printing cover bottom ink on the surface of the electroplated layer to ensure that the plate cannot transmit light, wherein the cover bottom is black ink (or other colors). To obtain good effects, light leakage can be prevented by means of multiple printing and curing. 5-8 microns each time (too thick and brittle and poor in adhesive force), and the total thickness is 20-30 microns (too low to shade light and too high and brittle and poor in adhesive force).

5. And 3D high-pressure forming. And (4) placing the plate into a high-pressure forming machine for 3D forming to obtain the 3D shell with the required radian. The PMMA is the outer surface after hot pressing, and the PC, printing ink and the like are on the inner surface (the PMMA surface is harder and is more wear-resistant after curtain coating, so the outer surface faces outwards, the PC surface has better bonding force with the UV glue, and the printing ink surface is a non-appearance surface and is not wear-resistant, so the inner surface faces inwards), wherein the hot pressing temperature can be 130-250 ℃, the forming pressure can be 60-120bar, and the hot pressing time can be 0.4-1.8 min.

6. And (6) CNC machining. And carrying out CNC (computer numerical control) machining on the 3D hot-bent shell, and milling off redundant leftover materials to obtain the finally required size for assembling and matching.

7. And (4) spray coating. And (3) tearing off the protective film on the PMMA surface, carrying out electrostatic dust removal treatment, and spraying hardening liquid (UV paint) on the surface to form a hardening layer.

The method can achieve the appearance effect which is extremely close to a real ceramic shell only through film coating and ink forming, and is simple in step and procedure, easy to operate, high in yield, low in cost and capable of saving the cost by about 50%, and the through-pass rate can reach 70%.

It is understood that the specific type of the electronic device is not particularly limited, and may be a mobile phone (see fig. 8 for a schematic structural diagram, including the above-mentioned ceramic-like electronic device housing 100), a tablet computer, a game machine, electronic paper, a wearable device, a watch, a battery module, a household appliance, and the like. In addition, in addition to the battery cover plate and the battery described above, the electronic device may further include structures and components that the conventional electronic device must have, for example, a mobile phone, and may further include a display screen, a touch screen, a main board, a storage, a fingerprint identification module, a camera module, and the like, which are not described in detail herein.

Embodiments of the present application are described in detail below.

Example 1

1. Preparing a composite board. Cutting the PC + PMMA composite board into required sizes. The thickness of the PC layer of the composite board is 590 micrometers, the thickness of the PMMA layer is 50 micrometers, the two sides of the board are protected by protective films, and the PC and PMMA composite mode can be high-temperature lamination or bonding.

2. And (4) UV transfer printing. And (3) tearing off the protective film on the PC surface, performing electrostatic dust removal treatment (static electricity is generated during film tearing, so that dust particles are adsorbed), transferring a transparent UV (ultraviolet) smooth coating on the surface of the PC surface by using UV transfer printing equipment, and curing while transferring, wherein the thickness of the UV smooth coating is 10 microns, and the haze is less than 0.5.

3. And (5) vacuum coating. Through a magnetron sputtering or evaporation plating method, 4 metal oxide coating layers with matched high refractive index and low refractive index are plated on the UV transfer printing layer according to the requirements of brightness and color, specifically a zirconium dioxide layer with the thickness of 2nm, a niobium pentoxide layer with the thickness of 16nm, a silicon dioxide layer with the thickness of 10nm and a niobium pentoxide layer with the thickness of 25 nm.

4. And covering the bottom with ink. And printing cover bottom ink on the surface of the electroplated layer to ensure that the plate cannot transmit light, and specifically selecting black ink according to the requirement of the bottom color for carrying out multiple times of printing and curing, wherein each time is 5-8 microns, and the total thickness is 20-30 microns.

5. And 3D high-pressure forming. And (3) placing the plate into a high-pressure forming machine for 3D forming to obtain the 3D shell with the required radian, wherein the high-pressure temperature can be 140 ℃, the forming pressure can be 68bar, and the high-pressure time can be 1.5 min.

6. And (6) CNC machining. And carrying out CNC (computer numerical control) machining on the 3D formed shell, milling redundant leftover materials, and obtaining the size of the final required assembly and matching.

7. And (4) spray coating. And (3) tearing off the protective film on the PMMA surface, performing electrostatic dust removal treatment, and spraying hardening liquid (UV paint) on the surface to form a hardening layer, so as to obtain the imitation ceramic electronic equipment shell, wherein the picture (the right picture in figure 9) and the picture (the left picture in figure 9) of the real black ceramic shell are shown in figure 9.

Example 2

The difference from example 1 is that the ink layer is white ink, and the obtained photograph of the ceramic-like electronic device case (right image in fig. 10) and the photograph of the real white ceramic case (left image in fig. 10) are shown in fig. 10.

Comparative example 1:

ZrO coated on PC/PET composite board with thickness greater than 1 micron by vacuum multi-arc ion plating method₂And (5) film obtaining the electronic equipment shell.

Wherein, the coating has larger stress which can reach more than 500MPa, the thickness of the coating reaches more than 1 mu m, the coating can not be effectively combined with an organic substrate, and the coating is easy to remove and expose the bottom when the temperature changes (the picture is shown in figure 13 after water boiling).

Comparative example 2: and spraying ceramic simulating paint and NCVM (non-conductive metal oxide) on the PC/PET composite board according to a conventional process to obtain the electronic equipment shell. Specifically, the appearance effect of the process is poor, the glaze feeling of the ceramic is too poor, the process is mainly characterized in that the reflectivity is low (within 10%, the reflectivity curve is shown in figure 15), the refractive index of the paint is about 1.6 compared with that of the base material, no high-refractive-index material exists, and the reflectivity cannot be improved to obtain the glaze feeling of the ceramic.

And (3) performance detection:

1. and (3) reflectivity testing: the reflection curves of the pseudo-ceramic electronic device cases obtained in examples 1-2 and comparative examples 1-2 and the real ceramic (zirconium dioxide) cases of different colors were tested by a spectrophotometer test, the reflection curve test results of examples 1 and 2 are shown in fig. 12, the reflection curve test results of the real ceramic cases of different colors are shown in fig. 11, and the reflection curve test results of comparative examples 1 and 2 are shown in fig. 14 and 15, respectively. It can be seen through contrasting the reflection curve, the reflection curve of the imitative ceramic electronic equipment casing of this application and the reflection curve of true ceramic casing are extremely close.

2. And (3) color difference testing: the values of L, a, and b of the cases of the ceramic-like electronic devices obtained in examples 1 to 2 and comparative examples 1 to 2 and the black and white real ceramic cases were measured by a color difference meter. The test results showed that the shells of example 1 (black) had L, a, b values of 40.17, -2 and-0.25, respectively; the L, a, b values of the case of example 2 (white) were 91.24, 1.23, -0.15, respectively, the L, a, b values of the case of comparative example 1 (white) were 89.84, 1.68, 0.36, respectively, the L, a, b values of the case of comparative example 2 (white) were 88.56, 1.21, 0.29, respectively, and the L, a, b values of the real ceramic case black were 40, -1.9, -3, respectively. The values of L, a and b of the white color of the real ceramic shell are 91.54, 1.08 and 0.33 respectively.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. A ceramic-like electronic device housing, comprising:

a non-ceramic substrate, at least a portion of an outer surface of the substrate being a low haze surface having a haze of less than 2;

the brightening coating is arranged on the low-haze surface of the non-ceramic substrate and comprises a plurality of sub coating layers, and the sub coating layers are metal oxide coating layers with different refractive indexes; and

and the ink layer is arranged on the surface of the brightening coating film, which is far away from the non-ceramic substrate.

2. The ceramic-like electronic device housing of claim 1, wherein the non-ceramic substrate comprises:

a substrate body; and

the non-texture surface layer is arranged on the surface of the substrate body, and the surface, far away from the substrate body, of the non-texture surface layer forms the low haze surface.

3. The ceramic-like electronic device housing of claim 1 or 2, wherein the low haze surface has a haze of less than 1.5.

4. The ceramic-like electronic device housing of claim 1 or 2, wherein the low haze surface has a haze of less than 1.

5. The ceramic-like electronic device housing of claim 1 or 2, wherein the low haze surface has a haze of less than 0.5.

6. The ceramic-like electronic device housing of claim 2, wherein the non-textured finish layer has a thickness of 5-15 microns.

7. The ceramic-like electronic device housing of claim 1, wherein the non-ceramic substrate is at least one of a plastic substrate and a glass substrate,

optionally, the plastic substrate comprises at least one of a polycarbonate/polymethyl methacrylate composite sheet, a polycarbonate sheet, and a polyethylene terephthalate sheet;

optionally, the plastic substrate has a thickness of 330 to 850 μm.

8. The ceramic-like electronic device shell as claimed in claim 1, wherein the brightness enhancement coating has a thickness of 45-65 nm;

optionally, a plurality of the sub-plating films are formed of a non-conductive oxide;

optionally, a plurality of the sub-coating layers satisfy any one of the following conditions:

the plurality of sub-coating layers comprise a zirconium dioxide layer, a niobium pentoxide layer, a silicon dioxide layer and a niobium pentoxide layer which are sequentially stacked;

the plurality of sub-coating layers comprise SiAlOx layers, titanium pentoxide layers, silicon dioxide layers and titanium pentoxide layers which are sequentially stacked;

the plurality of sub-coating layers comprise SiAlOx layers and titanium pentoxide layers which are sequentially stacked;

the plurality of sub-coating layers comprise zirconium dioxide layers and niobium pentoxide layers which are sequentially stacked.

9. The ceramic-like electronic device housing of claim 1, wherein the ink layer comprises a plurality of ink layers;

optionally, each of the ink seed layers has a thickness of 5 to 8 microns;

optionally, the thickness of the ink layer is 20-30 microns.

10. The ceramic-like electronic device housing of claim 1, further comprising:

and the hardened layer is arranged on the surface of the brightening coating film, which is far away from the non-ceramic substrate.

11. The ceramic-like electronic device housing of claim 1, wherein at least one of the following conditions is satisfied:

compared with the ceramic shell with the same color, the difference between the L value of the ceramic-like electronic equipment shell and the L value of the ceramic shell is within +/-1, the difference between the a value of the ceramic-like electronic equipment shell and the a value of the ceramic shell is within +/-0.5, and the difference between the b value of the ceramic-like electronic equipment shell and the b value of the ceramic shell is within +/-0.5; the difference between the average reflectivity of the ceramic-like electronic equipment shell and the average reflectivity of the ceramic shell is within +/-4%.

12. A method of making the ceramic-like electronic device casing of any one of claims 1-11, comprising:

forming a brightening coating on the low haze surface of the non-ceramic substrate;

and forming an ink layer on the surface of the brightening coating film far away from the non-ceramic substrate.

13. The method of claim 12, wherein the non-ceramic substrate is formed by:

forming a non-textured finish layer on the surface of the substrate body by UV transfer printing or spraying, wherein the surface of the non-textured finish layer far away from the substrate body constitutes the low haze surface.

14. The method of claim 12, wherein the brightness enhancing coating is formed by magnetron sputtering or evaporation plating,

the ink layer is formed by a printing method.

15. The method of claim 12, further comprising:

forming a hardened layer on the surface of the non-ceramic substrate far away from the brightness enhancement coating,

optionally, the hardened layer is formed by a flow coating method.

16. An electronic device, comprising:

the ceramic simulating electronic device housing of any one of claims 1-11, defining a containment space therein;

the display screen is arranged in the accommodating space.