CN110493988A - Cover board and preparation method thereof and electronic equipment - Google Patents
Cover board and preparation method thereof and electronic equipment Download PDFInfo
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- CN110493988A CN110493988A CN201910746067.2A CN201910746067A CN110493988A CN 110493988 A CN110493988 A CN 110493988A CN 201910746067 A CN201910746067 A CN 201910746067A CN 110493988 A CN110493988 A CN 110493988A
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- layer
- cover board
- transparent
- texture
- transparent ink
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
- B41M5/035—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet by sublimation or volatilisation of pre-printed design, e.g. sublistatic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
The present invention relates to a kind of cover board and preparation method thereof and electronic equipments.The cover board includes transparent substrate, transparent ink layer and texture layer, and transparent ink layer is arranged on a side surface of transparent substrate, and the side of the separate transparent substrate of transparent ink layer is arranged in texture layer, and transparent ink layer is acrylate resin layer.Above-mentioned cover board is a kind of novel cover board with texture.
Description
Technical field
The present invention relates to a kind of cover board and preparation method thereof and electronic equipments.
Background technique
Current cover board with texture is usually all to have high-visible texture, however everyone aesthetic difference,
And the cover board for having texture is less, in order to meet the needs of people, it is necessary to be expanded to the type of cover board with texture.
Summary of the invention
Based on this, it is necessary to provide a kind of novel cover board with texture.
In addition, also providing the production method and electronic equipment of a kind of cover board.
A kind of cover board, including transparent substrate, transparent ink layer and texture layer, the transparent ink layer are arranged described transparent
On one side surface of substrate, the side far from the transparent substrate of the transparent ink layer is arranged in the texture layer, described
Transparent ink layer is acrylic resin ink layer.
Above-mentioned cover board by using acrylic resin ink layer as transparent ink layer so that transparent ink layer can be direct
On the transparent substrate, the side of the separate transparent substrate by the way that texture layer to be arranged in transparent ink layer can make texture for setting
Layer is hidden in transparent ink layer, so as to show the indistinct effect of texture, to obtain a kind of novel having texture
Cover board so that the type of cover board is expanded.
A kind of production method of cover board, includes the following steps:
Transparent ink layer is formed on a side surface of transparent transparent substrate using acrylic resin ink；And
Texture layer is formed in the side far from the transparent substrate of the transparent ink layer.
The production method of above-mentioned cover board is by using acrylic resin ink on a side surface of transparent transparent substrate
Transparent ink layer is formed, texture layer is formed in the side of the separate transparent substrate of transparent ink layer, texture layer can be made to be hidden in
In transparent ink layer, to show the indistinct effect of texture, so that a kind of novel cover board with texture is obtained, so that
The type of cover board is expanded.
A kind of electronic equipment, the prepared cover board of production method including above-mentioned cover board or above-mentioned cover board.
Since the cover board of above-mentioned electronic equipment is a kind of novel cover board with texture, so that electronic equipment has difference
Expression effect.
Detailed description of the invention
Fig. 1 is the partial cutaway view of the cover board of first embodiment；
Fig. 2 is the partial cutaway view of the cover board of second embodiment；
Fig. 3 is the partial cutaway view of the cover board of third embodiment；
Fig. 4 is the production flow diagram of the cover board of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in Figure 1, the cover board 100 of first embodiment, which can be as the cover board 100 of electronic equipment, electricity
Sub- equipment is, for example, mobile phone, tablet computer etc..The cover board 100 include transparent substrate 110, transparent ink layer 120, texture layer 130,
Reflection subassembly 140 and light shield layer 150.
Transparent substrate 110 is glass substrate or organic matter substrate.Wherein, organic matter substrate is, for example, pet substrate or PC/
PMMA composite plate ("/" expression stratiform).Wherein, glass substrate can be for higher-strength and the preferable glass of translucency, example
Such as alumina silicate glass.Transparent substrate 110 can be tabular, or 3D glass.Transparent substrate 110 has opposite the
One surface and second surface.If transparent substrate 110 is 3D glass, first surface is concave surface, and second surface is convex surface.
Transparent ink layer 120 is arranged on a side surface of transparent substrate 110.I.e. transparent ink layer 120 is formed directly into
On transparent substrate 110.Specifically, transparent ink layer 120 is arranged on the first surface.
Wherein, transparent ink layer 120 is acrylic resin ink layer.It studies and finds through inventor: due to using ink straight
It connects and is formed on transparent substrate 110, formation ink layer, which is easy to appear fine defects (bubble, tangerine line, oil accumulation, contracting oil etc.), can all show
Reveal and comes (especially for the special glass substrate of property), in order to keep transparent ink layer 120 very smooth, clean oil
Layer of ink 120 is needed using having preferable wellability and the lesser ink of surface tension, to reduce defect as much as possible, and the propylene
Acid resin ink has preferable wellability and surface tension is smaller, and smooth and defect can be formed on transparent substrate 110
Less film.Specifically, acrylic resin ink can be for example the acrylic resin oil of the model HFSG460 CN of Seiko
Ink, acrylic resin ink of model HF GV3-SA582 of Seiko etc..
Transparent ink layer 120 is colored ink layers arc, translucent black ink layer or translucent white ink layer, is used
These ink layers are so that the texture of texture layer 130 can be showed from the second surface of transparent substrate 110.Wherein, it is formed color
The pigment that the ink of color ink layer uses is usually organic pigment, and therefore, colored ink layers arc is usually translucent.
Further, the thickness of transparent ink layer 120 is at 10 microns or less.In order to enable texture layer 130 from transparent base
The second surface of plate 110 sees that the thickness of transparent ink layer 120 cannot be too thick relatively clearly.It is appreciated that transparent ink layer
120 thickness, which can according to need, to be adjusted.
The side of the separate transparent substrate 110 of transparent ink layer 120 is arranged in texture layer 130.Specifically, texture layer 130
Color it is different from the color of transparent ink layer 120 so that the texture on texture layer 130 can be showed preferably.Wherein,
The material for making texture layer 130 is ink.Texture layer 130 is gradual change texture layer in one of the embodiments,.Specifically illustrating
Embodiment in, texture layer 130 be gradual change site layer.It is appreciated that texture layer 130 can also be the graded bedding of other textures,
The texture of texture layer 130, which can according to need, to be configured.
In one of the embodiments, texture layer 130 with a thickness of 1 micron~10 microns.It is appreciated that texture layer 130
It is limited to for above-mentioned thickness, the thickness of texture layer 130, which can according to need, to be adjusted.
The side of the separate transparent substrate 110 of transparent ink layer 120 is arranged in reflection subassembly 140, and covers texture layer
130.Setting reflection subassembly 140 can achieve the effect that highlight, so that texture layer 130 can preferably be shown.It is illustrating
Embodiment in, reflection subassembly 140 include simple substance silicon layer 142 and reflector element 144.
The side of the separate transparent substrate 110 of transparent ink layer 120 is arranged in simple substance silicon layer 142, and covers texture layer
130.Since adhesive force of the reflector element 144 on texture layer 130, transparent ink layer 120 is poor, simple substance silicon layer 142 and texture
Layer 130, transparent ink layer 120 can be perfectly adhered to together, can be with clean oil because elemental silicon has stronger activity
Layer of ink 120 and texture layer 130 and transparent ink layer 120 form chemical bond, to be preferably attached to transparent ink layer 120 and texture
On layer 130.
Further, simple substance silicon layer 142 with a thickness of 5 nanometers~20 nanometers.The simple substance silicon layer 142 of the thickness can not only
Achieve the effect that increase adhesive force well, and will not have an impact to the color of cover board 100.
Reflector element 144 is formed in the side of the separate texture layer 130 of simple substance silicon layer 142.Reflector element 144 is selected from oxidation
At least one of nitride layer, simple substance layer and alloy-layer.
Reflector element 144 is oxide skin(coating) in one of the embodiments, and reflector element 144 includes the first folding of stacking
Layer 1442 and the second refracting layer 1444 are penetrated, the separate transparent ink layer 120 of simple substance silicon layer 142 is arranged in first refractive layer 1442
Side, and the side far from the second refracting layer 1444 of first refractive layer 1442 is towards simple substance silicon layer 142, the second refracting layer 1444
Refractive index be greater than first refractive layer 1442 refractive index, with formed low high refractive index refracting layer cooperation, realize high reflectance.
First refractive layer 1442 is silicon dioxide layer or magnesium fluoride, the second refracting layer 1444 in one of the embodiments,
Including titanium pentoxide layer 1444a, niobium pentaoxide layer 1444b and titanium dioxide zirconium layer 1444c, titanium pentoxide layer 1444a is set
It sets in the side of the separate simple substance silicon layer 142 of first refractive layer 1442, niobium pentaoxide layer 1444b and titanium dioxide zirconium layer 1444c
It is sequentially laminated on the side of the separate first refractive layer 1442 of titanium pentoxide layer 1444a.The reflector element 144 of the combination has
Preferable reflection brightening effect.
Further, reflector element 144 with a thickness of 30 nanometers~500 nanometers.The reflector element 144 of the thickness can not only
It is enough to realize reflecting effect well, and can make film layer that there is suitable stress, so that 144 local of reflector element is preferably steady
It is qualitative and not easily to fall off.
The side of the separate texture layer 130 of reflection subassembly 140 is arranged in light shield layer 150, by setting light shield layer 150 so that
Cover board 100 is opaque to avoid seeing the internal structure of electronic equipment, while playing the role of protecting reflection subassembly 140, to keep away
Exempt from reflection subassembly 140 to be scratched, be corroded.In the illustrated embodiment, the remote of reflector element 144 is arranged in light shield layer 150
Side from simple substance silicon layer 142.More specifically, light shield layer 150 is arranged in the titanium dioxide zirconium layer 1444c's of first refractive layer 1444
Side far from first refractive layer 1442.Light shield layer 150 is black-out ink layer.Specifically, black-out ink layer is white ink layer
Or black ink layer.
In one of the embodiments, light shield layer 150 with a thickness of 4 microns~27 microns.It should be noted that light shield layer
150 thickness, which can according to need, to be set, as long as the thickness of light shield layer 150 is enough to play shaded effect.
Above-mentioned cover board 100 at least has the advantage that
Above-mentioned cover board 100 by using acrylic resin ink layer as transparent ink layer 120 so that transparent ink layer
120 can be directly disposed on transparent substrate 110, by the separate transparent base that texture layer 130 is arranged in transparent ink layer 120
The side of plate 110 can be such that texture layer 130 is hidden in transparent ink layer 120, and show the indistinct effect of texture,
To obtain a kind of novel cover board with texture 100, so that the type of cover board 100 is expanded.
It should be noted that reflection subassembly 140 is not limited to above-mentioned several forms, for example, reflection subassembly 140 can also be
There is the structure of oxide skin(coating), simple substance layer and alloy-layer simultaneously, or while there is the structure of oxide skin(coating) and alloy-layer,
Alternatively, there is the structure of alloy-layer and simple substance layer simultaneously, alternatively, only with simple substance layer or only with the structure of alloy-layer, each
The substance and the number of plies of the layer of type, which can according to need, to be set, as long as it has preferable reflection brightening effect.
And reflection subassembly 140 is not limited to above structure, in other embodiments, simple substance silicon layer 142 also can be omitted, this
When, reflector element 144 is set up directly on the side of the separate transparent substrate 110 of transparent ink layer 120, and reflector element 144 covers
Texture layer 130.It is the structure of oxide skin(coating) for reflector element 144, first refractive layer 1442 is set up directly on transparent ink layer
The side of 120 separate transparent substrate 110, and first refractive layer 1442 covers texture layer 130.
It should be noted that at least one of reflection subassembly 140 and light shield layer 150 can also be omitted, cover board 100
Can not have reflection subassembly 140 or light shield layer 150, alternatively, not having reflection subassembly 140 and light shield layer 150 simultaneously.
As shown in Fig. 2, the cover board 200 of second embodiment, roughly the same with above-mentioned cover board 100, difference is, this reality
The reflector element 244 for applying the cover board 200 of mode is different, and in the present embodiment, reflector element 244 includes alloy-layer 2442 and list
Matter layer 2444, alloy-layer 2442 are indium stannum alloy layer, and the separate transparent ink layer of simple substance silicon layer 242 is arranged in alloy-layer 2442
The side of the separate transparent ink layer 220 of alloy-layer 2442 is arranged in 220 side, simple substance layer 2444, and simple substance layer 2444 includes
The side direction of the separate silicon layer 2444b of aluminium layer 2444a, silicon layer 2444b and the layers of chrome 2444c stacked gradually, aluminium layer 2444a are closed
Layer gold 2442.The reflector element 244 of the combination has preferable reflection brightening effect.At this point, light shield layer 250 is arranged in layers of chrome
On the side of the separate silicon layer 2444b of 2444c.
When simple substance silicon layer 142 can be omitted, alloy-layer 2442 is set up directly on the separate transparent substrate of transparent ink layer 220
110 side, and cover texture layer 230.
Since the cover board 200 of the embodiment and the cover board 100 of first embodiment are roughly the same, the embodiment party
The cover board 200 of formula is also with the similar effect of cover board 100 of first embodiment, and details are not described herein.
As shown in figure 3, the cover board 300 of third embodiment, roughly the same with above-mentioned cover board 100, difference is, this reality
The reflection subassembly 340 for applying the cover board 300 of mode is different, and in the present embodiment, reflection subassembly 340 is simple substance silicon layer, elemental silicon
Not only itself has preferable adhesive force, chemical bond can be formed with transparent ink layer 320 and texture layer 330, preferably to adhere to
On transparent ink layer 320 and texture layer 330, and the simple substance silicon layer of elemental silicon production also has the effect for preferably reflecting blast
Fruit.
Specifically, reflection subassembly 340 (i.e. simple substance silicon layer) with a thickness of 30 nanometers~500 nanometers.The reflection group of the thickness
Part 340 (i.e. simple substance silicon layer) can not only play the effect for reflecting blast well, and can be avoided the thickness of cover board 300
It is too thick.
At this point, the side of the separate transparent ink layer 320 of reflection subassembly 340 is arranged in light shield layer 350.
Since the cover board 300 of the embodiment and the cover board 100 of first embodiment are roughly the same, the embodiment party
The cover board 300 of formula is also with the similar effect of cover board 100 of first embodiment, and details are not described herein.
As shown in figure 4, the production method of the cover board of an embodiment, can be used in making above-mentioned cover board 100, cover board 200
It is a kind of production method of above-mentioned cover board 100, cover board 200 and cover board 300 with cover board 300, the production method of the cover board includes such as
Lower step:
Step S10: transparent ink is formed on a side surface of transparent transparent substrate using polyacrylic resin ink
Layer.
Wherein, acrylic resin ink has preferable wellability and surface tension is smaller, can be formed on the transparent substrate
Smooth and less defect film, acrylic resin ink can be for example the propylene of the model HFSG460 CN of Seiko
Acid resin ink, acrylic resin ink of model HF GV3-SA582 of Seiko etc..Specifically, transparent ink layer is formed
Step is silk-screen, bat printing, spraying or printing.
Transparent substrate is glass substrate or organic matter substrate.Wherein, organic matter substrate is, for example, pet substrate or PC/PMMA
Composite plate ("/" expression stratiform).Wherein, glass substrate can be for higher-strength and the preferable glass of translucency, such as aluminium
Silicate glass.Transparent substrate can be tabular, or 3D glass.Transparent substrate has opposite first surface and the
Two surfaces.If transparent substrate is 3D glass, first surface is concave surface, and second surface is convex surface.Wherein, transparent ink layer is formed in
On first surface.
Specifically, transparent ink layer be colored ink layers arc, translucent black ink layer or translucent white ink layer,
Using these ink layers so that the texture of texture layer can be showed from the second surface of transparent substrate.Wherein, it is formed colored
The pigment that the ink of ink layer uses is usually organic pigment, and therefore, colored ink layers arc is usually translucent.
Further, the thickness of transparent ink layer is at 10 microns or less.In order to enable texture layer from transparent substrate
See that the thickness of transparent ink layer cannot be too thick relatively clearly in two surfaces.It is appreciated that the thickness of transparent ink layer can root
It is adjusted according to needs.
Step S20: texture layer is formed in the side of the separate transparent substrate of transparent ink layer.
Specifically, texture layer is gradual change texture layer, such as gradual change site layer.It is appreciated that texture layer can also be other
The graded bedding of texture, the texture of texture layer, which can according to need, to be configured.
Specifically, the color of texture layer and the color of transparent ink layer are different, so that texture can be showed preferably.
Specifically, the method for forming texture layer is that silk-screen or yellow light etch.Texture layer is formed in one of the embodiments,
Method be yellow light etching, at this point, formed texture layer the step of are as follows: first transparent ink layer separate transparent substrate side painting
Ink is covered, yellow light etching then is carried out to the ink being formed on transparent ink layer.
Step S30: reflection group is formed in the side magnetron sputtering or evaporation coating of the separate transparent substrate of transparent ink layer
Part.
Specifically, the structure of reflection subassembly can be the reflection subassembly of the structure of cover board 100, cover board 200 or cover board 300
Structure, details are not described herein.
Step S40: light shield layer is formed in the side of the separate texture layer of reflection subassembly using black out ink.
Specifically, black out ink is white ink or black ink.The method for forming light shield layer is silk-screen.
Specifically, have enough thickness to reach shaded effect to make light shield layer not only, but also more smooth, formed
The step of light shield layer are as follows: repeatedly coat black out ink in the side of the separate texture layer of reflection subassembly using black out ink, every time
The thickness and silk-screen number of silk-screen can according to need adjustment.In one of the embodiments, light shield layer with a thickness of 4 microns~
27 microns, each silk-screen with a thickness of 4 microns~9 microns.It should be noted that the thickness of light shield layer can according to need progress
Setting, as long as the thickness of light shield layer is enough to play shaded effect.
The electronic equipment of one embodiment, the electronic equipment are, for example, mobile phone, tablet computer etc..Including above-mentioned cover board or on
State the prepared cover board of production method of cover board.Since the cover board of above-mentioned electronic equipment is a kind of novel lid with texture
Plate, so that electronic equipment has different expression effects.
The following are specific embodiment parts (the solution of the present invention to be illustrated below, and following embodiment is with glass
Glass substrate is that transparent glass substrate is illustrated, but the solution of the present invention is not limited to following embodiment):
Embodiment 1
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HFSG460 CN of Seiko) transparent
The transparent ink layer that silk-screen is formed with a thickness of 5 microns on one surface of glass substrate.Wherein, transparent ink layer is blue ink
Layer.
(2) line with a thickness of 5 microns is formed with ink in the side silk-screen texture of the separate glass substrate of transparent ink layer
Layer (gradual change site layer) is managed, and the color of texture layer is different from the color of transparent ink layer.
(3) the simple substance silicon layer with a thickness of 8 nanometers is formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer,
And simple substance silicon layer covers texture layer；First refractive layer is formed in the side magnetron sputtering of the separate transparent ink layer of simple substance silicon layer,
The second refracting layer is formed in the side magnetron sputtering of the separate simple substance silicon layer of first refractive layer, to be formed on simple substance silicon layer anti-
Unit is penetrated, reflection subassembly is obtained.Wherein, first refractive layer is silicon dioxide layer, and the second refracting layer is titanium pentoxide layer, five oxygen
Change two niobium layers and titanium dioxide zirconium layer, titanium pentoxide layer is formed in the side of the separate silicon dioxide layer of first refractive layer, five oxygen
Change two niobium layers and titanium dioxide zirconium layer be sequentially laminated on titanium pentoxide layer separate first refractive layer side；First refractive layer and
The overall thickness of second refracting layer is 200 nanometers.
(4) it is formed using black out ink (black ink) in the side silk-screen of the separate niobium pentaoxide layer of titanium dioxide zirconium layer
Light shield layer.Light shield layer with a thickness of 21 microns, each silk-screen with a thickness of 7 microns, silk-screen 3 times, obtain cover board.
Embodiment 2
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
A surface of glass substrate move up impression into the transparent ink layer with a thickness of 10 microns.Wherein, transparent ink layer is red
Ink layer.
(2) it using texture ink and etches to form thickness by yellow light in the side of the separate glass substrate of transparent ink layer
The texture layer (gradual change site layer) that degree is 1 micron, and the color of texture layer is different from the color of transparent ink layer.
(3) the simple substance silicon layer with a thickness of 5 nanometers is formed in the side evaporation coating of the separate glass substrate of transparent ink layer,
And simple substance silicon layer covers texture layer；First refractive layer is formed in the side evaporation coating of the separate transparent ink layer of simple substance silicon layer,
The second refracting layer is formed in the side evaporation coating of the separate simple substance silicon layer of first refractive layer, to be formed on simple substance silicon layer anti-
Unit is penetrated, reflection subassembly is obtained.Wherein, first refractive layer is magnesium fluoride, and the second refracting layer is titanium pentoxide layer, five oxidations two
Niobium layer and titanium dioxide zirconium layer, titanium pentoxide layer are formed in the side of the separate silicon dioxide layer of first refractive layer, five oxidations two
Niobium layer and titanium dioxide zirconium layer are sequentially laminated on the side of the separate first refractive layer of titanium pentoxide layer；First refractive layer and second
The overall thickness of refracting layer is 30 nanometers.
(4) it is formed using black out ink (black ink) in the side silk-screen of the separate niobium pentaoxide layer of titanium dioxide zirconium layer
Light shield layer.Light shield layer with a thickness of 4 microns, each silk-screen with a thickness of 4 microns, number is 1 time, obtains cover board.
Embodiment 3
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
Glass substrate a surface on spraying formed with a thickness of 1 micron of transparent ink layer.Wherein, transparent ink layer is translucent
Black ink layer.
(2) it using texture ink and etches to form thickness by yellow light in the side of the separate glass substrate of transparent ink layer
The texture layer (gradual change site layer) that degree is 10 microns, and the color of texture layer is different from the color of transparent ink layer.
(3) elemental silicon with a thickness of 10 nanometers is formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer
Layer, and simple substance silicon layer covers texture layer；First refractive is formed in the side magnetron sputtering of the separate transparent ink layer of simple substance silicon layer
Layer forms the second refracting layer in the side magnetron sputtering of the separate simple substance silicon layer of first refractive layer, thus the shape on simple substance silicon layer
At reflector element, reflection subassembly is obtained.Wherein, first refractive layer be silicon dioxide layer, the second refracting layer be titanium pentoxide layer,
Niobium pentaoxide layer and titanium dioxide zirconium layer, titanium pentoxide layer are formed in the side of the separate silicon dioxide layer of first refractive layer,
Niobium pentaoxide layer and titanium dioxide zirconium layer are sequentially laminated on the side of the separate first refractive layer of titanium pentoxide layer；First refractive
The overall thickness of layer and the second refracting layer is 500 nanometers.
(4) it is formed using black out ink (black ink) in the side silk-screen of the separate niobium pentaoxide layer of titanium dioxide zirconium layer
Light shield layer.Light shield layer with a thickness of 27 microns, each silk-screen with a thickness of 9 microns, number is 3 times, obtains cover board.
Embodiment 4
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
Glass substrate a surface on printing formed with a thickness of 8 microns of transparent ink layer.Wherein, transparent ink layer is translucent
White ink layer.
(2) the side silk-screen texture ink of the separate glass substrate of transparent ink layer and by formed it is micro- with a thickness of 4
The texture layer (gradual change site layer) of rice, and the color of texture layer is different from the color of transparent ink layer.
(3) the simple substance silicon layer with a thickness of 6 nanometers is formed in the side evaporation coating of the separate glass substrate of transparent ink layer,
And simple substance silicon layer covers texture layer；Indium stannum alloy layer is formed in the side evaporation coating of the separate transparent ink layer of simple substance silicon layer,
Aluminium layer is formed in the side evaporation coating of the separate elemental silicon of alloy-layer, in the side evaporation coating shape of the separate alloy-layer of aluminium layer
At silicon layer, layers of chrome is formed in the side evaporation coating of the separate aluminium layer of silicon layer and is obtained to form reflector element on simple substance silicon layer
To reflection subassembly.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome overall thickness be 100 nanometers.
(4) the side silk-screen using black out ink (black ink) in the separate silicon layer of layers of chrome forms light shield layer.Light shield layer
With a thickness of 24 microns, each silk-screen with a thickness of 4 microns, number is 6 times, obtains cover board.
Embodiment 5
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
Glass substrate a surface on silk-screen formed with a thickness of 4 microns of transparent ink layer.Wherein, transparent ink layer is yellow oil
Layer of ink.
(2) it using texture ink and etches to form thickness by yellow light in the side of the separate glass substrate of transparent ink layer
The texture layer (gradual change site layer) that degree is 9 microns, and the color of texture layer is different from the color of transparent ink layer.
(3) elemental silicon with a thickness of 20 nanometers is formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer
Layer, and simple substance silicon layer covers texture layer；Indium stannum alloy is formed in the side magnetron sputtering of the separate transparent ink layer of simple substance silicon layer
Layer forms aluminium layer in the side magnetron sputtering of the separate elemental silicon of alloy-layer, splashes in the side magnetic control of the separate alloy-layer of aluminium layer
It penetrates to form silicon layer, layers of chrome is formed in the side magnetron sputtering of the separate aluminium layer of silicon layer, so that it is single to form reflection on simple substance silicon layer
Member obtains reflection subassembly.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome overall thickness be 30 nanometers.
(4) the side silk-screen using black out ink (black ink) in the separate silicon layer of layers of chrome forms light shield layer.Light shield layer
With a thickness of 12 microns, each silk-screen with a thickness of 4 microns, number is 3 times, obtains cover board.
Embodiment 6
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
Glass substrate a surface on silk-screen formed with a thickness of 10 microns of transparent ink layers below.Wherein, transparent ink layer is
Reddish oil layer of ink.
(2) line with a thickness of 8 microns is formed with ink in the side silk-screen texture of the separate glass substrate of transparent ink layer
Layer (gradual change site layer) is managed, and the color of texture layer is different from the color of transparent ink layer.
(3) elemental silicon with a thickness of 15 nanometers is formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer
Layer, and simple substance silicon layer covers texture layer；Indium stannum alloy is formed in the side magnetron sputtering of the separate transparent ink layer of simple substance silicon layer
Layer forms aluminium layer in the side magnetron sputtering of the separate elemental silicon of alloy-layer, splashes in the side magnetic control of the separate alloy-layer of aluminium layer
It penetrates to form silicon layer, layers of chrome is formed in the side magnetron sputtering of the separate aluminium layer of silicon layer, so that it is single to form reflection on simple substance silicon layer
Member obtains reflection subassembly.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome overall thickness be 300 nanometers.
(4) the side silk-screen using black out ink (black ink) in the separate silicon layer of layers of chrome forms light shield layer.Light shield layer
With a thickness of 25 microns, each silk-screen with a thickness of 5 microns, number is 5 times, obtains cover board.
Embodiment 7
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
A surface of glass substrate move up impression into the transparent ink layer with a thickness of 3 microns.Wherein, transparent ink layer is translucent
White ink layer.
(2) it using texture ink and etches to form thickness by yellow light in the side of the separate glass substrate of transparent ink layer
The texture layer (gradual change site layer) that degree is 6 microns, and the color of texture layer is different from the color of transparent ink layer.
(3) elemental silicon with a thickness of 400 nanometers is formed in the side evaporation coating of the separate glass substrate of transparent ink layer
Layer, and simple substance silicon layer covers texture layer, wherein simple substance silicon layer is reflection subassembly.
(4) the side silk-screen using black out ink (black ink) in the separate transparent ink layer of simple substance silicon layer forms shading
Layer.Light shield layer with a thickness of 20 microns, each silk-screen with a thickness of 4 microns, number is 5 times, obtains cover board.
Embodiment 8
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
Glass substrate a surface on spraying formed with a thickness of 8 microns of transparent ink layer.Wherein, transparent ink layer is blue oil
Layer of ink.
(2) line with a thickness of 2 microns is formed with ink in the side silk-screen texture of the separate glass substrate of transparent ink layer
Layer (gradual change site layer) is managed, and the color of texture layer is different from the color of transparent ink layer.
(3) elemental silicon with a thickness of 250 nanometers is formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer
Layer, and simple substance silicon layer covers texture layer, wherein simple substance silicon layer is reflection subassembly.
(4) the side silk-screen using black out ink (black ink) in the separate transparent ink layer of simple substance silicon layer forms shading
Layer.Light shield layer with a thickness of 27 microns, 9 microns of the thickness of each silk-screen, number is 3 times, obtains cover board.
Embodiment 9
The manufacturing process of the cover board of the present embodiment is as follows:
(1) using acrylic resin ink (the acrylic resin ink of the model HF GV3-SA582 of Seiko) transparent
Glass substrate a surface on printing formed with a thickness of 6 microns of transparent ink layer.Wherein, transparent ink layer is reddish oil
Layer of ink.
(2) it using texture ink and etches to form thickness by yellow light in the side of the separate glass substrate of transparent ink layer
The texture layer (gradual change site layer) that degree is 5 microns, and the color of texture layer is different from the color of transparent ink layer.
(3) elemental silicon with a thickness of 80 nanometers is formed in the side evaporation coating of the separate glass substrate of transparent ink layer
Layer, and simple substance silicon layer covers texture layer, wherein simple substance silicon layer is reflection subassembly.
(4) the side silk-screen using black out ink (black ink) in the separate transparent ink layer of simple substance silicon layer forms shading
Layer.Light shield layer with a thickness of 8 microns, each silk-screen with a thickness of 4 microns, number is 2 times, obtains cover board.
Embodiment 10
The step of manufacturing process of the cover board of the present embodiment is roughly the same with embodiment 1, and difference is, the present embodiment (3)
It is not provided with simple substance silicon layer, i.e. the manufacturing process of the cover board of the present embodiment is as follows:
(1) identical as (1) the step of embodiment 1.
(2) identical as (2) the step of embodiment 1.
(3) first refractive layer, and first refractive are formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer
Layer covering texture layer；It splashes to form the second refracting layer in the side magnetic control of the separate transparent ink layer of first refractive layer, thus saturating
Reflector element is formed on bright ink layer, obtains reflection subassembly.Wherein, first refractive layer is silicon dioxide layer, and the second refracting layer is
Titanium pentoxide layer, niobium pentaoxide layer and titanium dioxide zirconium layer, titanium pentoxide layer are formed in the separate dioxy of first refractive layer
The side of SiClx layer, niobium pentaoxide layer and titanium dioxide zirconium layer are sequentially laminated on the separate first refractive layer of titanium pentoxide layer
Side；The overall thickness of first refractive layer and the second refracting layer is 200 nanometers.
(4) identical as (4) the step of embodiment 1.
Embodiment 11
The step of manufacturing process of the cover board of the present embodiment is roughly the same with embodiment 4, and difference is, the present embodiment (3)
It is not provided with simple substance silicon layer, i.e. the manufacturing process of the cover board of the present embodiment is as follows:
(1) identical as (1) the step of embodiment 4.
(2) identical as (2) the step of embodiment 4.
(3) indium stannum alloy layer, and indium stannum alloy are formed in the side magnetron sputtering of the separate glass substrate of transparent ink layer
Layer covering texture layer；Aluminium layer is formed in the side magnetron sputtering of the separate elemental silicon of alloy-layer, in the separate alloy-layer of aluminium layer
Side magnetron sputtering forms silicon layer, layers of chrome is formed in the side magnetron sputtering of the separate aluminium layer of silicon layer, thus in transparent ink layer
Upper formation reflector element, obtains reflection subassembly.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome overall thickness be 100 nanometers.
(4) identical as (4) the step of embodiment 4.
Embodiment 12
The manufacturing process of the cover board of the present embodiment is roughly the same with embodiment 2, and difference is, the transparent ink of the present embodiment
The thickness of layer is different, the transparent ink layer of the present embodiment with a thickness of 12 microns.
Comparative example 1
The manufacturing process of the cover board of the present embodiment is roughly the same with embodiment 1, and difference is, the formation of the present embodiment is transparent
The ink of ink layer is different, and the ink of the formation transparent ink layer of the present embodiment is epoxy resin ink.
Comparative example 2
The manufacturing process of the cover board of the present embodiment is roughly the same with embodiment 1, and difference is, the formation of the present embodiment is transparent
The ink of ink layer is different, and the ink of the formation transparent ink layer of the present embodiment is saturated polyester ink.
Test:
(1) the texture situation detection of the cover board of embodiment 1~12: under conditions of natural light or light far from cover board
The texture situation of the unilateral observation cover board of transparent ink layer.
(2) adhesive force of the reflection subassembly of testing example 1~12 according to the following method:
First the cover board of embodiment 1~12 is placed in 60 DEG C of chamber, and is 0.63W/m in power2Ultraviolet lamp
Pipe is lower to irradiate 4 hours (side of the separate transparent ink layer of ultraviolet light direct projection glass substrate), then stops ultraviolet light, and
4 hours will be kept the temperature at 50 DEG C of cover board, this is a circulation；Cover board is done to 12 circulations in the manner described above, then takes cover board
Out；Cover board is cooled down 2 hours at normal temperature again, then carries out cross-cut tester test, wherein cross-cut tester testing standard is as follows:
ISO grade: 0；ASTM grade: the edge of 5B, notch are completely smooth, and grid edge does not have any peeling.
ISO grade: 1；ASTM grade: 4B；There is small pieces peeling in the intersection of notch, actual spoilage is no more than in the area Hua Ge
5%.
ISO grade: 2；ASTM grade: 3B；The edge and/or intersection of notch, which have, to be peeled off, area be greater than 5%, but
Less than 15%.
ISO grade: 3；ASTM grade: 2B；There is part to peel off along notching edge or whole sheet peels off and/or person's partitive case
Son is peeled off by full wafer.The area peeled off is more than 15%, but less than 35%.
ISO grade: 4；ASTM grade: 1B；The peeling/of notching edge sheet or some grids partly or entirely peel off,
Area is greater than the 35% of the area Hua Ge, but is no more than 65%.
ISO grade: 5；ASTM grade: 0B；Peeling degree is more than 1B.
(3) quality testing of the transparent ink layer of the cover board of embodiment 1~12 and comparative example 1~2: under strong light observation from
The presentation quality of the unilateral observation transparent ink layer of the separate transparent ink layer of cover board.
Wherein, the texture situation of the cover board of embodiment 1~12, reflection subassembly adhesive force (ASTM etc. of cross-cut tester test
Grade) and transparent ink layer presentation quality and comparative example 1~2 cover board transparent ink layer presentation quality such as 1 institute of table
Show.
Table 1
From table 1 it follows that the adhesive force of the reflection subassembly of the cover board of 1~embodiment of embodiment 12 is at least 1B, show
Adhesive force so than the reflection subassembly of comparative example 1 is big；And the transparent ink layer surface of embodiment 1~12 is smooth, and it is right
The surface of the transparent ink layer of ratio 1 and comparative example 2 is uneven.
Wherein, the adhesive force of the reflection subassembly of the cover board of Examples 1 to 9 and embodiment 12 is 5B, and embodiment 10
Adhesive force with the reflection subassembly of the cover board of embodiment 11 is 1B, this illustrates that simple substance silicon layer has preferable adhesive force.Although implementing
The adhesive force of the reflection subassembly of the cover board of example 12 reaches 5B, but since the thickness of transparent ink layer is thicker, leads to texture more
It is fuzzy.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (23)
1. a kind of cover board, which is characterized in that including transparent substrate, transparent ink layer and texture layer, the transparent ink layer setting
On a side surface of the transparent substrate, the separate transparent substrate of the transparent ink layer is arranged in the texture layer
Side, the transparent ink layer are acrylic resin ink layer.
2. cover board according to claim 1, which is characterized in that the transparent substrate is glass substrate or organic matter substrate.
3. cover board according to claim 1, which is characterized in that the thickness of the transparent ink layer is at 10 microns or less.
4. cover board according to claim 1, which is characterized in that the face of the color of the texture layer and the transparent ink layer
Color is different.
5. cover board according to claim 1, which is characterized in that the texture layer is gradual change texture layer.
6. cover board according to claim 1, which is characterized in that further include be arranged in the transparent ink layer far from described
The reflection subassembly of the side of transparent substrate, and the reflection subassembly covers the texture layer.
7. cover board according to claim 6, which is characterized in that the reflection subassembly includes being arranged in the transparent ink layer
The side far from the transparent substrate reflector element, the reflector element is selected from oxide skin(coating), simple substance layer and alloy-layer
It is at least one.
8. cover board according to claim 7, which is characterized in that the reflector element is oxide skin(coating), the reflector element
The separate described of the transparent ink layer is arranged in first refractive layer and the second refracting layer including stacking, the first refractive layer
The side of transparent substrate, and the side far from second refracting layer of the first refractive layer is towards the transparent ink, institute
The refractive index for stating the second refracting layer is greater than the refractive index of the first refractive layer.
9. cover board according to claim 8, which is characterized in that the first refractive layer be silicon dioxide layer or magnesium fluoride,
Second refracting layer includes titanium pentoxide layer, niobium pentaoxide layer and titanium dioxide zirconium layer, the titanium pentoxide layer setting
In side of the first refractive layer far from the transparent ink layer, the niobium pentaoxide layer and the titanium dioxide zirconium layer according to
The secondary side far from the first refractive layer for being layered in the titanium pentoxide layer.
10. cover board according to claim 7, which is characterized in that the reflector element includes the alloy-layer and the list
Matter layer, the alloy-layer are indium stannum alloy layer, and the separate transparent substrate of the transparent ink layer is arranged in the alloy-layer
Side, the simple substance layer be arranged in the alloy-layer far from the transparent ink layer side, the simple substance layer include according to
Aluminium layer, silicon layer and the layers of chrome of secondary stacking, the side far from the silicon layer of the aluminium layer is towards the alloy-layer.
11. cover board according to claim 7, which is characterized in that the reflector element is received with a thickness of 30 nanometers~500
Rice.
12. according to the described in any item cover boards of claim 7~11, which is characterized in that the reflection subassembly further includes elemental silicon
Layer, the simple substance silicon layer is arranged between the transparent ink layer and the reflector element, and covers the texture layer.
13. cover board according to claim 12, which is characterized in that the simple substance silicon layer with a thickness of 5 nanometers~20 nanometers.
14. cover board according to claim 6, which is characterized in that the reflection subassembly is simple substance silicon layer.
15. cover board according to claim 14, which is characterized in that the reflection subassembly is received with a thickness of 30 nanometers~500
Rice.
16. cover board according to claim 6, which is characterized in that further include light shield layer, the light shield layer setting is described anti-
Penetrate the side far from the texture layer of component.
17. a kind of production method of cover board, which comprises the steps of:
Transparent ink layer is formed on a side surface of transparent transparent substrate using acrylic resin ink；And
Texture layer is formed in the side far from the transparent substrate of the transparent ink layer.
18. the production method of cover board according to claim 17, which is characterized in that the method for forming the transparent ink layer
For silk-screen, bat printing, spraying or printing.
19. the production method of cover board according to claim 17, which is characterized in that the method for forming the texture layer is silk
Print or yellow light etching.
20. the production method of 7~19 described in any item cover boards according to claim 1, which is characterized in that form the texture layer
The step of after, further include in side of the texture layer far from the transparent ink layer using magnetron sputtering or evaporation coating
Method formed reflection subassembly the step of.
21. the production method of cover board according to claim 20, which is characterized in that the step of forming the reflecting layer it
It afterwards, further include forming light shield layer in the side far from the texture layer of the reflection subassembly using black out ink.
22. a kind of electronic equipment, which is characterized in that including the described in any item cover boards of claim 1~16 or claim 17
The prepared cover board of production method of any one of~21 cover boards.
23. electronic equipment according to claim 22, the electronic equipment is mobile phone or tablet computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910746067.2A CN110493988A (en) | 2019-08-13 | 2019-08-13 | Cover board and preparation method thereof and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910746067.2A CN110493988A (en) | 2019-08-13 | 2019-08-13 | Cover board and preparation method thereof and electronic equipment |
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Family
ID=68549818
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Cited By (1)
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|---|---|---|---|---|
| CN111423133A (en) * | 2020-03-30 | 2020-07-17 | RealMe重庆移动通信有限公司 | Mobile terminal, camera lens, base material and manufacturing method thereof |
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