CN110456862A - Substrate with texture and preparation method thereof and electronic equipment - Google Patents
Substrate with texture and preparation method thereof and electronic equipment Download PDFInfo
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- CN110456862A CN110456862A CN201910745348.6A CN201910745348A CN110456862A CN 110456862 A CN110456862 A CN 110456862A CN 201910745348 A CN201910745348 A CN 201910745348A CN 110456862 A CN110456862 A CN 110456862A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
- B44C3/02—Superimposing layers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- Human Computer Interaction (AREA)
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- Life Sciences & Earth Sciences (AREA)
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- Surface Treatment Of Glass (AREA)
Abstract
The present invention relates to a kind of substrate with texture and preparation method thereof and electronic equipments.The production method of the substrate with texture includes the following steps: to form the first ink layer on a side surface of transparent substrate with ink using texture, wherein, texture ink contains matrix resin, matrix resin is epoxy resin or saturated polyester resin, and the grain diameter D98 of texture ink is less than 5 microns；Laser carving processing is carried out to the first ink layer and obtains substrate with texture to form the first ink layer with texture.Above-mentioned production method can obtain the higher substrate with texture of resolution ratio of smaller line width line-spacing and texture.
Description
Technical field
The present invention relates to a kind of substrate with texture and preparation method thereof and electronic equipments.
Background technique
The scheme for forming texture on substrate at present generallys use the mode of silk-screen, the extra fine wire for the texture which is formed
Wide and minimum line can accomplish 80 microns and 80 microns away from minimum respectively, and due to the halftone mesh number of silk screen printing process (web plate mesh number mistake
It is small, it can not silk-screen hachure；Halftone mesh number is excessive, and ink can not play oil) and ink surface tension (adjacent ink can heap after silk-screen
Product shrink) limitation, printing fine line item can exist sawtooth, broken string the problems such as, cause the resolution ratio of texture lower.
Summary of the invention
Based on this, it is necessary to provide that a kind of resolution ratio that can obtain smaller line width line-spacing and texture is higher to have texture
Substrate production method.
In addition, also providing a kind of substrate with texture and electronic equipment.
A kind of production method of substrate with texture, includes the following steps:
The first ink layer is formed on a side surface of transparent substrate with ink using texture, wherein the texture oil
Ink contains matrix resin, and the matrix resin is epoxy resin or saturated polyester resin, the grain diameter of the texture ink
D98 is less than 5 microns；And
Carry out laser carving processing to first ink layer is had to form first ink layer with texture
The substrate of the texture.
The production method of above-mentioned substrate with texture forms the first ink layer with texture, and by using laser carving
The texture ink of one ink layer contains matrix resin, and matrix resin is epoxy resin or saturated polyester resin, both ink
With preferable adhesive force and toughness, can be effectively adhered on transparent substrate, it can transparent substrate is glass substrate
It is enough to adhere to well, thus the texture part formed after being effectively prevented from laser carving fall off and caused by aliasing problems and broken string ask
Topic, by the grain diameter D98 of control texture ink less than 5 microns, so that the granularity of texture ink is thinner, and particle is equal
It is even to form burr to avoid subsequent laser carving, and make laser carving form texture there are sawtooth texture, and be not present using laser carving processing
Traditional silk-screen can accumulate contraction to adjacent ink after influence and silk-screen oily under silk-screen hachure and ink because of web plate mesh number
The problem of, line width and line-spacing can be formed on the transparent substrate respectively in 30 microns or less and 30 microns of textures below, do not deposited
The macroscopic broken string, sawtooth the defects of, clean mark, resolution ratio is higher.
Including transparent substrate and having on a side surface of the transparent substrate is arranged in a kind of substrate with texture
The material of first ink layer of texture, first ink layer includes matrix resin, and the matrix resin is epoxy resin or satisfies
And polyester resin.
The material of first ink layer of above-mentioned substrate with texture includes matrix resin, matrix resin be epoxy resin or
Saturated polyester resin can be effectively adhered on transparent substrate so that the first ink layer has preferable adhesive force and toughness,
Even if transparent substrate be glass substrate can adhere to well, thus be effectively prevented from texture part fall off and caused by sawtooth
Problem and disconnection problem, the line width and line-spacing of the texture of above-mentioned substrate with texture are able to accomplish at 30 microns or less
With 30 microns hereinafter, the defects of macroscopic broken string, sawtooth is not present, clean mark, resolution ratio are higher.
A kind of electronic equipment, including cover board, the cover board are the prepared tool of production method of substrate with texture
Textured substrate is above-mentioned substrate with texture.
The line width and line-spacing of the texture of the cover board of above-mentioned electronic equipment can be able to accomplish at 30 microns or less and 30
Micron is hereinafter, the defects of macroscopic broken string, sawtooth is not present, clean mark, resolution ratio are higher.
Detailed description of the invention
Fig. 1 is the flow chart of the production method of the substrate with texture of an embodiment；
Fig. 2 is the partial cutaway view of the substrate with texture of an embodiment；
Fig. 3 is the Local map of the laser carving grain design pattern of embodiment and comparative example.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in Figure 1, the production method of the substrate with texture of an embodiment, includes the following steps:
Step S10: the first ink layer is formed on a side surface of transparent substrate with ink using texture.
Specifically, transparent substrate is glass substrate or organic matter substrate.Wherein, glass substrate can be for more high-strength
Degree and the preferable glass of translucency, such as alumina silicate glass；Organic matter substrate is, for example, pet substrate or PC/PMMA composite plate
("/" expression stratiform) etc..Transparent substrate can be tabular, or 3D glass.Transparent substrate has the first opposite table
Face and second surface.If transparent substrate is 3D glass, first surface is concave surface, and second surface is convex surface.An implementation wherein
In example, the first ink layer is formed in first surface.
Wherein, texture ink contains matrix resin, and matrix resin is epoxy resin or saturated polyester resin.I.e. texture is used
Ink is epoxy resin ink or saturated polyester resin class ink.Both ink have preferable adhesive force and toughness, energy
It is enough effectively adhered on transparent substrate, can adhere to well transparent substrate is glass substrate, to effectively keep away
The texture part for exempting to be formed after laser carving fall off and caused by aliasing problems.Further, saturated polyester resin is weight average molecular weight
Linear saturated polyester's resin greater than 40000, the resinoid have better flexibility, and can be preferably attached with transparent substrate
Together.Specifically, the vylon270 series plastics that saturated polyester resin can for example spin for Japan.Wherein, texture oil
In ink also containing diluent (such as DCAC), dispersing agent (such as BYK-110), defoaming agent (such as Digao 900), levelling agent (angstrom
Not block FL3600) and curing agent (such as three well D-110N isocyanates) etc..
Specifically, matrix resin be epoxy resin texture with ink be, for example, Seiko company GLV series ink, grant it is color public
CL04-EM-1077 ink of department etc..Matrix resin is that the texture of saturated polyester resin is, for example, the YM- of Ci Cai company with ink
1300-0008 series ink, YM-2000-10076 series ink of Ci Cai company etc., wherein matrix resin is weight average molecular weight
The texture of linear saturated polyester's resin greater than 40000 is, for example, Mitsubishi Chemical's FC1565 series ink, Japan's spinning with ink
BX7000 series ink etc..
Wherein, the grain diameter D98 of texture ink is less than 5 microns, by the grain diameter D98 for controlling texture ink
Less than 5 microns, so that the granularity of texture ink is thinner, and particle uniformly forms burr to avoid subsequent laser carving, and makes radium
Carving forms texture, and there are sawtooth textures.Wherein, D98 referred to herein refers to that accumulative 98% grain diameter is small less than 5 microns
In 5 microns.
In order to ensure texture ink grain diameter D98 less than 5 microns, using texture ink in transparent substrate
Before the step of forming the first ink layer on one side surface, further include the steps that for texture being sieved with ink.
Specifically, the method for forming the first ink layer can be silk-screen, spraying, bat printing etc..
In one of the embodiments, the first ink layer with a thickness of 1 micron~10 microns.It is appreciated that the first ink
The thickness of layer, which can according to need, to be adjusted.
Step S20: laser carving processing is carried out to the first ink layer, to form the first ink layer with texture.
Texture is gradual change texture in one of the embodiments,.Wherein, gradual change texture can be lines gradual change texture, net
Point gradual change texture etc., site gradual change texture can be square grid point, diamond shape site, circular shaped lattice point, annular site etc..It can manage
Solution, texture may not be gradual change texture, or uniform texture.
Wherein, the step of laser carving is handled specifically: carry out textured pattern design using PaintShop, then will design
Textured pattern be transferred in laser engraving machine, laser engraving machine decomposites laser pixel according to textured pattern, is emitted using laser poly-
On burnt laser beam to the first ink layer, so that the first ink layer is vaporized or aoxidizes according to textured pattern, to make the first oil
Layer of ink forms textured pattern.
Specifically, the optical maser wavelength of laser carving processing is 240 nanometers~500 nanometers, and laser frequency is 100Hz~300Hz, arteries and veins
Rushing width is 8 microseconds~15 microseconds.First ink layer has assimilation effect, and above-mentioned wave well to the laser of above-mentioned wavelength
Long laser is smaller to the damage of transparent substrate, and can be effectively prevented from laser carving not by control laser frequency and pulse width
Good problem, and the laser of above-mentioned wavelength is smaller to the damage of transparent substrate.If the too small wind for having laser carving not clean of optical maser wavelength
Danger, if the excessive risk for haveing damage transparent substrate of optical maser wavelength；If laser frequency is too small, laser carving energy is too small, can generate ink
Laser carving is not clean, and texture is unintelligible, if laser frequency is excessive, laser carving energy is excessively high, and it is broken to easily lead to substrate damage；If pulse is wide
Spend small, the peak energy of laser carving is high, easily leads to substrate damage, if pulse width is excessive, laser carving energy can be less than normal, leads to ink
Laser carving is not clean, and texture is unintelligible.
Further, the optical maser wavelength of laser carving processing is 355 nanometers.First ink layer has more the laser of above-mentioned wavelength
Assimilation effect well, and the laser of above-mentioned wavelength is almost not damaged to transparent substrate.
Step S30: forming the second transparent ink layer in the side that the formation of transparent substrate has the first ink layer, and makes
Two ink layers cover the first ink layer with texture.
Wherein, the color of the second ink layer is different from the color of the first ink layer, so that substrate with texture being capable of shape
At two kinds of colors.
Specifically, the method for forming the second ink layer is silk-screen, spraying, bat printing etc..
The second ink layer is semi-transparent ink layer in one of the embodiments,.Specifically, the second ink layer is colored ink
Layer (such as the colored ink of production colored ink layers arc can be the HFSG460 CN series ink of Seiko company), semi-transparent black
Ink layer (such as making the ink of semi-transparent black ink layer can be the GLN-0023 series ink of Ci Cai company) or semi-transparent
White ink layer (such as make semi-transparent white ink layer ink can be Seiko company 1809-2051C ink).Its
In, the pigment that the ink of colored ink layers arc uses is usually organic pigment, and therefore, colored ink layers arc is usually translucent.
In one of the embodiments, the second ink layer with a thickness of 3 microns~10 microns.It should be noted that second
The thickness of ink layer, which can according to need, to be adjusted.
Step S40: reflector element is formed in the side of the separate transparent substrate of the second ink layer.
Specifically, the method for forming reflector element is magnetron sputtering or evaporation coating.
Specifically, reflector element is selected from at least one of oxide skin(coating), simple substance layer and alloy-layer.
Reflector element includes the first refractive layer and the second refracting layer of stacking, first refractive in one of the embodiments,
The side of the separate transparent substrate of the second ink layer, and the side direction far from the second refracting layer of first refractive layer is arranged in layer
Second ink layer, the refractive index of the second refracting layer is greater than the refractive index of first refractive layer, to form the refracting layer of low high refractive index
High reflectance is realized in cooperation.
First refractive layer is silicon dioxide layer or magnesium fluoride in one of the embodiments, and the second refracting layer includes stacking
Titanium pentoxide layer, niobium pentaoxide layer and titanium dioxide zirconium layer, the side of the separate niobium pentaoxide layer of titanium pentoxide layer
Towards first refractive layer.The reflector element of the combination has preferable reflection brightening effect.
In another embodiment, reflector element includes indium stannum alloy layer and simple substance layer, and indium stannum alloy layer is arranged second
The side far from the second ink layer of indium stannum alloy layer, simple substance is arranged in the side of the separate transparent substrate of ink layer, simple substance layer
Layer includes the aluminium layer, silicon layer and the layers of chrome that stack gradually, and the side of the separate silicon layer of aluminium layer is towards indium stannum alloy layer.The combination it is anti-
Penetrating unit has preferable reflection brightening effect.
Further, reflector element with a thickness of 30 nanometers~500 nanometers.
It should be noted that reflector element is not limited to above structure, it can also be other forms, as long as can play anti-
Penetrate the effect of blast.
Step S50: base ink layer is formed in the side far from the second ink layer of reflector element, is obtained with texture
Substrate.
Wherein, reflector element and base ink layer collectively form functional layer.By forming base ink layer so as to have line
The substrate of reason is opaque, to avoid the internal structure of electronic equipment is seen, while playing the role of protecting reflector element, to avoid
Reflector element is scratched, is corroded.When reflector element is the scheme of above-mentioned oxide skin(coating), in titanium dioxide zirconium layer far from five oxygen
The side for changing two niobium layers forms base ink layer；When reflector element is the scheme of above-mentioned indium stannum alloy layer and simple substance layer, in chromium
The side of the separate silicon layer of layer forms base ink layer.Specifically, base ink layer is white ink layer or black ink layer.
In one of the embodiments, base ink layer with a thickness of 4 microns~27 microns.It should be noted that base
The thickness of ink layer, which can according to need, to be set, as long as the thickness of base ink layer is enough to play shaded effect.
Specifically, have enough thickness to reach shaded effect to make base ink layer not only, but also more smooth,
The step of forming base ink layer are as follows: repeatedly coat screening in the side far from the second ink layer of reflector element using black out ink
Light ink, the thickness and silk-screen number of each silk-screen can according to need adjustment.Each silk-screen in one of the embodiments,
With a thickness of 4 microns~9 microns.It should be noted that the thickness of base ink layer can according to need and be set, as long as base
The thickness of ink layer is enough to play shaded effect.
The production method of above-mentioned substrate with texture forms the first ink layer with texture, and by using laser carving
The texture ink of one ink layer contains matrix resin, and matrix resin is epoxy resin or saturated polyester resin, both ink
With preferable adhesive force and toughness, can be effectively adhered on transparent substrate, it can transparent substrate is glass substrate
It is enough to adhere to well, thus the texture part formed after being effectively prevented from laser carving fall off and caused by aliasing problems and broken string ask
Topic, by the grain diameter D98 of control texture ink less than 5 microns, so that the granularity of texture ink is thinner, and particle is equal
It is even to form burr to avoid subsequent laser carving, and make laser carving form texture there are sawtooth texture, and be not present using laser carving processing
Traditional silk-screen can accumulate contraction to adjacent ink after influence and silk-screen oily under silk-screen hachure and ink because of web plate mesh number
The problem of, line width and line-spacing can be formed on the transparent substrate respectively in 30 microns or less and 30 microns of textures below, do not deposited
The macroscopic broken string, sawtooth the defects of, clean mark, resolution ratio is higher.
It should be noted that the production method of above-mentioned substrate with texture is not limited to above-mentioned steps, step S30~
S50 can also be omitted or a step in S30~S50 or two steps are omitted.For example, if step S30 is omitted,
Reflector element directly then is formed in the side that the formation of transparent substrate has the first ink layer, reflector element covers the first ink layer；
If step S40 is omitted, base ink layer directly is formed far from the side of transparent substrate in the second ink layer, at this point, functional layer
For base ink layer；If step S30 and step S40 are omitted, directly have the one of the first ink layer in the formation of transparent substrate
Side forms base ink layer, and base ink layer covers the first ink layer, at this point, functional layer is base ink layer；If step S50 is saved
Slightly, functional layer is reflector element.
As shown in Fig. 2, the substrate with texture 100 of an embodiment, which can be cover board, such as electronics
The cover board of equipment, electronic equipment can be mobile phone or tablet computer.The substrate 100 with texture can be used above-mentioned with texture
The production method of substrate 100 make to obtain.The substrate 100 with texture include transparent substrate 110, the first ink layer 120,
Second ink layer 130, reflector element 140 and base ink layer 150.
Transparent substrate 110 is glass substrate or organic matter substrate.Wherein, glass substrate can for higher-strength and
The preferable glass of translucency, such as alumina silicate glass；Organic matter substrate is, for example, pet substrate or PC/PMMA composite plate ("/"
Indicate stratiform) etc..Transparent substrate 110 can be tabular, or 3D glass.Transparent substrate 110 has opposite first
Surface and second surface.If transparent substrate 110 is 3D glass, first surface is concave surface, and second surface is convex surface.
First ink layer 120 is arranged on a side surface of transparent substrate 110.First oil in one of the embodiments,
Layer of ink 120 is arranged on the first surface of transparent substrate 110.First ink layer 120 has texture.One embodiment wherein
In, texture is gradual change texture.Wherein, gradual change texture can be lines gradual change texture, site gradual change texture etc., site gradual change texture
It can be square grid point, diamond shape site, circular shaped lattice point, annular site etc..It is appreciated that texture may not be gradual change texture,
It can also uniform texture.
The material of first ink layer 120 includes matrix resin, and matrix resin is epoxy resin or saturated polyester resin.I.e.
One ink layer 120 is epoxy resin ink layer or saturated polyester resin class ink layer.Both ink layers have preferable attached
Put forth effort and toughness, can be effectively adhered on transparent substrate 110, it can be fine transparent substrate 110 is glass substrate
Ground attachment, can be effectively prevented from texture part fall off and caused by aliasing problems.Further, saturated polyester resin is attached most importance to
Molecular weight be greater than 40000 linear saturated polyester's resin, the resinoid have better flexibility, and can and transparent substrate
110 are preferably attached together.
Specifically, it is, for example, Seiko company GLV series ink, Ci Cai company that matrix resin, which is the ink of epoxy resin,
CL04-EM-1077 ink etc..Matrix resin is that the ink of saturated polyester resin is, for example, the YM-1300-0008 system of Ci Cai company
Column ink (ink be a kind of matrix resin be linear saturated polyester resin of the weight average molecular weight less than 40000), Ci Cai company
YM-2000-10076 series ink etc., wherein matrix resin is the linear saturated polyester tree that weight average molecular weight is greater than 40000
Rouge is, for example, Mitsubishi Chemical's FC1565 series ink, Japan's spinning BX7000 series ink etc. with ink.
In one of the embodiments, the first ink layer 120 with a thickness of 1 micron~10 microns.It is appreciated that the first oil
The thickness of layer of ink 120, which can according to need, to be adjusted.
The formation that transparent substrate 110 is arranged in second ink layer 130 has the side of the first ink layer 120, and covers first
Ink layer 120.Specifically, the color of the second ink layer 130 is different from the color of the first ink layer 120, so that with texture
There are two types of colors for the tool of substrate 100.
The second ink layer 130 is semi-transparent ink layer in one of the embodiments,.Specifically, specifically, the second ink layer
For colored ink layers arc (such as production colored ink layers arc colored ink can be Seiko company HFSG460 CN series ink),
Semi-transparent black ink layer (such as making the ink of semi-transparent black ink layer can be the GLN-0023 Series Oil of Ci Cai company
Ink) or semi-transparent white ink layer (such as making the ink of semi-transparent white ink layer can be the 1809- of Seiko company
2051C ink).Wherein, the pigment that the ink of colored ink layers arc uses is usually organic pigment, and therefore, colored ink layers arc is usual
It is translucent.
In one of the embodiments, the second ink layer 130 with a thickness of 3 microns~10 microns.It should be noted that the
The thickness of two ink layers 130, which can according to need, to be adjusted.
The side of the separate transparent substrate 110 of the second ink layer 130 is arranged in reflector element 140, and reflector element 140 is arranged
The effect of reflection blast can be played.Specifically, reflector element 140 is selected from least the one of oxide skin(coating), simple substance layer and alloy-layer
Kind.
Reflector element 140 includes the first refractive layer (not shown) and the second refraction of stacking in one of the embodiments,
The side of the separate transparent substrate 110 of the second ink layer 130, and first refractive layer is arranged in layer (not shown), first refractive layer
The side far from the second refracting layer towards the second ink layer 130, the refractive index of the second refracting layer is greater than the folding of first refractive layer
Rate is penetrated, to form the refracting layer cooperation of low high refractive index, realizes high reflectance.
First refractive layer is silicon dioxide layer or magnesium fluoride in one of the embodiments, and the second refracting layer includes successively
Titanium pentoxide layer, niobium pentaoxide layer and the titanium dioxide zirconium layer of stacking, the separate niobium pentaoxide layer of titanium pentoxide layer
Side is towards first refractive layer.The reflector element 140 of the combination has preferable reflection brightening effect.
In another embodiment, reflector element 140 includes indium stannum alloy layer (not shown) and simple substance layer (not shown), indium
The side of the separate transparent substrate 110 of the second ink layer 130 is arranged in tin alloy layers, and the remote of indium stannum alloy layer is arranged in simple substance layer
Side from the second ink layer 130, simple substance layer include the aluminium layer, silicon layer and layers of chrome stacked gradually, and the one of the separate silicon layer of aluminium layer
Side is towards indium stannum alloy layer.The reflector element 140 of the combination has preferable reflection brightening effect.
Further, reflector element 140 with a thickness of 30 nanometers~500 nanometers.
It should be noted that reflector element 140 is not limited to above structure, as long as the effect of reflection blast can be played i.e.
It can.
The side far from the second ink layer 130 of reflector element 140 is arranged in base ink layer 150.Wherein, reflector element
140 and base ink layer 150 collectively form functional layer.
When reflector element 140 is the scheme of above-mentioned oxide skin(coating), in the separate niobium pentaoxide layer of titanium dioxide zirconium layer
Side forms base ink layer 150；When reflector element 140 is the scheme of above-mentioned indium stannum alloy layer and simple substance layer, in layers of chrome
Side far from silicon layer forms base ink layer 150.Specifically, base ink layer 150 is white ink layer or black ink layer.
In one of the embodiments, base ink layer 150 with a thickness of 4 microns~27 microns.It should be noted that lid
The thickness of bottom ink layer 150, which can according to need, to be set, as long as the thickness of base ink layer 150 is enough to play shaded effect
.
The material of first ink layer 120 of above-mentioned substrate with texture 100 includes matrix resin, and matrix resin is epoxy
Resin or saturated polyester resin can be effectively adhered so that the first ink layer 120 has preferable adhesive force and toughness
On bright substrate 110, it can adhere to well transparent substrate 110 is glass substrate, to be effectively prevented from texture part
Fall off and caused by aliasing problems and disconnection problem, the texture of above-mentioned substrate 100 with texture line width and line-spacing difference
It can accomplish at 30 microns or less and 30 microns hereinafter, the defects of there is no macroscopic broken strings, sawtooth, clean mark divide
Resolution is higher.
It should be noted that substrate 100 with texture is not limited to above structure, reflector element 140, the second ink layer
Any of 130 and base ink layer 150 or any two omit or three omit simultaneously.If 130 province of the second ink layer
Slightly, reflector element 140 is set up directly on the side that transparent substrate 110 is formed with the first ink layer 120, and covers the first ink layer
120；If reflector element 140 omits, base ink layer 150 is formed directly on the second ink layer 130, at this point, base ink layer
150 be functional layer；If reflector element 140 and the second ink layer 130 omit, base ink layer 150 is formed directly into transparent base
Plate 110 is formed with the side of the first ink layer 120, and covers the first ink layer 120, at this point, base ink layer 150 is function
Layer；If base ink layer 150 omits, reflector element 140 is functional layer.
The electronic equipment of one embodiment, including cover board, cover board are that the production method of above-mentioned substrate with texture makes
Obtained substrate with texture is above-mentioned substrate with texture.The line width of the texture of the cover board of above-mentioned electronic equipment and
Line-spacing can be able to accomplish at 30 microns or less and 30 microns hereinafter, the defects of there is no macroscopic broken strings, sawtooth,
Clean mark, resolution ratio are higher.
It should be noted that above-mentioned substrate with texture is not limited to use as the cover board of electronic equipment, it may also be used for
Other fields, such as furnishing fields etc..
The following are specific embodiment parts (the solution of the present invention to be illustrated below, and following embodiment is to have
For the structure of textured substrate 100, but the solution of the present invention is not limited to following embodiment):
Wherein, following embodiment and comparative example are for forming rectangular site gradual change texture, following embodiment and comparative example
Laser carving processing grain design pattern (as shown in Figure 3) grid side length a from 0.1 millimeter of gradual change to 0.05 millimeter, line width b from
0 millimeter of gradual change is to 0.15 millimeter, and for line-spacing d from 0.15 millimeter of gradual change to 0 millimeter, whole gradual change width D is 3 millimeters.The texture is set
Meter pattern is for obtaining the texture of maximum line width and max line away from respectively 30 microns and 30 microns.
Embodiment 1
The manufacturing process of the substrate with texture of the present embodiment is as follows:
(1) the texture ink (Seiko company GLV series epoxy resins ink) that matrix resin is epoxy resin is sieved,
So that the grain diameter D98 of texture ink is less than 5 microns.
(2) using the texture ink after sieving, silk-screen is formed with a thickness of 5 on a surface of transparent glass substrate
First ink layer of micron.
(3) laser carving processing is carried out to the first ink layer, to form the first ink layer with texture, the laser of laser carving processing
Wavelength is 355 nanometers, laser frequency 200Hz, and pulse width is 12 microseconds.
(4) there is the first oil in the formation of transparent substrate using colored ink (the HFSG460 CN series ink of Seiko company)
The side silk-screen of layer of ink forms transparent the second ink layer with a thickness of 5 microns, and it is with texture to cover the second ink layer
First ink layer.The color of second ink layer is different from the color of the first ink layer.
(5) first refractive layer is formed in the side magnetron sputtering of the separate glass substrate of the second ink layer, in first refractive
The side magnetron sputtering far from the second ink layer of layer forms the second refracting layer.Wherein, first refractive layer is silicon dioxide layer, the
Two refracting layers are the titanium pentoxide layer, niobium pentaoxide layer and titanium dioxide zirconium layer stacked gradually, titanium pentoxide layer it is separate
The side of niobium pentaoxide layer is towards first refractive layer；The overall thickness of first refractive layer and the second refracting layer is 200 nanometers.
(6) use black out ink (the CL04-EM-1077 black ink of Ci Cai company) in titanium dioxide zirconium layer far from five oxygen
Side silk-screen 3 times for changing two niobium layers, each silk-screen with a thickness of 7 microns, to form the base ink layer with a thickness of 21 microns, obtain
To substrate with texture.
Embodiment 2
The manufacturing process of the substrate with texture of the present embodiment is as follows:
(1) the texture ink (Seiko company GLV series epoxy resins ink) that matrix resin is epoxy resin is sieved
So that the grain diameter D98 of texture ink is less than 5 microns.
(2) formation is sprayed on a surface of transparent glass substrate with a thickness of 1 using the texture ink after sieving
First ink layer of micron.
(3) laser carving processing is carried out to the first ink layer, to form the first ink layer with texture, the laser of laser carving processing
Wavelength is 240 nanometers, laser frequency 300Hz, and pulse width is 15 microseconds.
(4) had using translucent black ink (the GLN-0023 series ink of Ci Cai company) in the formation of transparent substrate
The side of first ink layer sprays to form transparent the second ink layer with a thickness of 3 microns, and has the covering of the second ink layer
First ink layer of texture.The color of second ink layer is different from the color of the first ink layer.
(5) first refractive layer is formed in the side evaporation coating of the separate glass substrate of the second ink layer, in first refractive
The side evaporation coating far from the second ink layer of layer forms the second refracting layer.Wherein, first refractive layer is magnesium fluoride, the second folding
Penetrating layer is the titanium pentoxide layer, niobium pentaoxide layer and titanium dioxide zirconium layer stacked gradually, separate five oxygen of titanium pentoxide layer
Change the sides of two niobium layers towards first refractive layer；The overall thickness of first refractive layer and the second refracting layer is 30 nanometers.
(6) use black out ink (the CL04-EM-1077 black ink of Ci Cai company) in titanium dioxide zirconium layer far from five oxygen
Side silk-screen 1 time for changing two niobium layers, each silk-screen with a thickness of 4 microns, to form the base ink layer with a thickness of 4 microns, obtain
To substrate with texture.
Embodiment 3
The manufacturing process of the substrate with texture of the present embodiment is as follows:
(1) the texture ink (Seiko company GLV series epoxy resins ink) that matrix resin is epoxy resin is sieved
So that the grain diameter D98 of texture ink is less than 5 microns.
(2) impression is moved up at a thickness of 10 on a surface of transparent glass substrate with ink using the texture after sieving
First ink layer of micron.
(3) laser carving processing is carried out to the first ink layer, to form the first ink layer with texture, the laser of laser carving processing
Wavelength is 500 nanometers, laser frequency 100Hz, and pulse width is 8 microseconds.
(4) have the in the formation of transparent substrate using translucent white ink (the 1809-2051C ink of Seiko company)
The side bat printing of one ink layer forms transparent the second ink layer with a thickness of 10 microns, and covers the second ink layer to have line
First ink layer of reason.The color of second ink layer is different from the color of the first ink layer.
(5) indium stannum alloy layer is formed in the side magnetron sputtering of the separate glass substrate of the second ink layer, in indium stannum alloy
The side magnetron sputtering far from the second ink layer of layer forms aluminium layer, in the side magnetron sputtering of the separate indium stannum alloy layer of aluminium layer
Silicon layer is formed, forms layers of chrome in the side magnetron sputtering of the separate aluminium layer of silicon layer.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome
Overall thickness is 500 nanometers.
(6) using black out ink (the CL04-EM-1077 black ink of Ci Cai company) in the side of the separate silicon layer of layers of chrome
Silk-screen 3 times, each silk-screen with a thickness of 9 microns, to form the base ink layer with a thickness of 27 microns.
Embodiment 4
The manufacturing process of the substrate with texture of the manufacturing process and embodiment 1 of the substrate with texture of the present embodiment
Similar, difference is, the transparent substrate of the present embodiment is pet substrate.
Embodiment 5
The manufacturing process of the substrate with texture of the manufacturing process and embodiment 2 of the substrate with texture of the present embodiment
Similar, difference is, the transparent substrate of the present embodiment is PC/PMMA composite plate, wherein the first ink layer is formed in transparent substrate
PC layer far from PMMA layers of side.
Embodiment 6
The manufacturing process of the substrate with texture of the manufacturing process and embodiment 2 of the substrate with texture of the present embodiment
Similar, difference is, the transparent substrate of the present embodiment is pet substrate.
Embodiment 7
The manufacturing process of the substrate with texture of the present embodiment is as follows:
(1) the texture ink (Mitsubishi of linear saturated polyester's resin by matrix resin for weight average molecular weight greater than 40000
Chemical FC1565 series ink) it is sieved so that the grain diameter D98 of texture ink is less than 5 microns.
(2) using the texture ink after sieving, silk-screen is formed with a thickness of 8 on a surface of transparent glass substrate
First ink layer of micron.
(3) laser carving processing is carried out to the first ink layer, to form the first ink layer with texture, the laser of laser carving processing
Wavelength is 355 nanometers, laser frequency 150Hz, and pulse width is 10 microseconds.
(4) there is the first oil in the formation of transparent substrate using colored ink (the HFSG460 CN series ink of Seiko company)
The side of layer of ink sprays to form transparent the second ink layer with a thickness of 6 microns, and it is with texture to cover the second ink layer
First ink layer.The color of second ink layer is different from the color of the first ink layer.
(5) indium stannum alloy layer is formed in the side magnetron sputtering of the separate glass substrate of the second ink layer, in indium stannum alloy
The side magnetron sputtering far from the second ink layer of layer forms aluminium layer, in the side magnetron sputtering of the separate indium stannum alloy layer of aluminium layer
Silicon layer is formed, forms layers of chrome in the side magnetron sputtering of the separate aluminium layer of silicon layer.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome
Overall thickness is 300 nanometers.
(6) using black out ink (the CL04-EM-1077 black ink of Ci Cai company) one of the separate silicon layer in layers of chrome
Lateral filament print 6 times, each silk-screen with a thickness of 4 microns, to form the base ink layer with a thickness of 24 microns, obtain with texture
Substrate.
Embodiment 8
The manufacturing process of the substrate with texture of the present embodiment is as follows:
(1) the texture ink of the saturated linear saturated polyester resin by matrix resin for weight average molecular weight greater than 40000
(Mitsubishi Chemical's FC1565 series ink) is sieved so that the grain diameter D98 of texture ink is less than 5 microns.
(2) using the texture ink after sieving, silk-screen is formed with a thickness of 2 on a surface of transparent glass substrate
First ink layer of micron.
(3) laser carving processing is carried out to the first ink layer, to form the first ink layer with texture, the laser of laser carving processing
Wavelength is 240 nanometers, laser frequency 100Hz, and pulse width is 15 microseconds.
(4) the formation of transparent substrate have the side of the first ink layer spray to be formed it is transparent with a thickness of 8 microns second
Ink layer, and the second ink layer is made to cover the first ink layer with texture.The color of second ink layer and the first ink layer
Color is different.
(5) using translucent black ink (the GLN-0023 series ink of Ci Cai company) in the separate of the second ink layer
The side magnetron sputtering of glass substrate forms indium stannum alloy layer, splashes in the side magnetic control far from the second ink layer of indium stannum alloy layer
It penetrates to form aluminium layer, silicon layer is formed in the side magnetron sputtering of the separate indium stannum alloy layer of aluminium layer, the one of the separate aluminium layer of silicon layer
Side magnetron sputtering forms layers of chrome.Indium stannum alloy layer, aluminium layer, silicon layer and layers of chrome overall thickness be 50 nanometers.
(6) use black out ink (the CL04-EM-1077 black ink of Ci Cai company) in titanium dioxide zirconium layer far from five oxygen
Side silk-screen 3 times for changing two niobium layers, each silk-screen with a thickness of 9 microns, to form the base ink layer with a thickness of 27 microns, obtain
To substrate with texture.
Embodiment 9
The manufacturing process of the substrate with texture of the present embodiment is as follows:
(1) the texture ink of the saturated linear saturated polyester resin by matrix resin for weight average molecular weight greater than 40000
(Mitsubishi Chemical's FC1565 series ink) is sieved so that the grain diameter D98 of texture ink is less than 5 microns.
(2) using the texture ink after sieving, silk-screen is formed with a thickness of 8 on a surface of transparent glass substrate
First ink layer of micron.
(3) laser carving processing is carried out to the first ink layer, to form the first ink layer with texture, the laser of laser carving processing
Wavelength is 500 nanometers, laser frequency 300Hz, and pulse width is 8 microseconds.
(4) have the in the formation of transparent substrate using translucent white ink (the 1809-2051C ink of Seiko company)
The side of one ink layer sprays to form transparent the second ink layer with a thickness of 4 microns, and covers the second ink layer to have line
First ink layer of reason.The color of second ink layer is different from the color of the first ink layer.
(5) first refractive layer is formed in the side evaporation coating of the separate glass substrate of the second ink layer, in first refractive
The side evaporation coating far from the second ink layer of layer forms the second refracting layer.Wherein, first refractive layer is silicon dioxide layer, the
Two refracting layers are the titanium pentoxide layer, niobium pentaoxide layer and titanium dioxide zirconium layer stacked gradually, titanium pentoxide layer it is separate
The side of niobium pentaoxide layer is towards first refractive layer；The overall thickness of first refractive layer and the second refracting layer is 500 nanometers.
(6) use black out ink (the CL04-EM-1077 black ink of Ci Cai company) in titanium dioxide zirconium layer far from five oxygen
Side silk-screen 3 times for changing two niobium layers, each silk-screen with a thickness of 6 microns, to form the base ink layer with a thickness of 18 microns, obtain
To substrate with texture.
Embodiment 10
The manufacturing process of the substrate with texture of the present embodiment is roughly the same with embodiment 7, and difference is, texture is used
YM-1300-0008 series ink.
Embodiment 11
The manufacturing process of the substrate with texture of the present embodiment is roughly the same with embodiment 7, and difference is, the present embodiment
Transparent substrate be the transparent substrate of the present embodiment be PC/PMMA composite plate, wherein the first ink layer is formed in transparent substrate
PC layers of separate PMMA layers of side.
Embodiment 12
The manufacturing process of the substrate with texture of the manufacturing process and embodiment 8 of the substrate with texture of the present embodiment
Similar, difference is, the transparent substrate of the present embodiment is pet substrate.
Embodiment 13
The manufacturing process of the substrate with texture of the manufacturing process and embodiment 9 of the substrate with texture of the present embodiment
Similar, difference is, the transparent substrate of the present embodiment is that the transparent substrate of the present embodiment is PC/PMMA composite plate, wherein first
Ink layer is formed in separate PMMA layers of the side of PC layer of transparent substrate.
Comparative example 1
The manufacturing process of the substrate with texture of comparative example 1 is roughly the same with embodiment 1, and difference is, comparative example 1 does not have
There is carry out step (1), but unsifted texture is directly moved up into impression on a surface of transparent glass substrate with ink
At the first ink layer.
Comparative example 2
The manufacturing process of the substrate with texture of comparative example 2 is roughly the same with embodiment 1, and difference is, comparative example 2
Texture is acrylic ink (the GLT335-6579 ink of Ge Laite company) with ink.
Comparative example 3
The manufacturing process of the substrate with texture of comparative example 3 is roughly the same with embodiment 4, and difference is, comparative example 3
Texture is acrylic ink (Seiko company GV3 series ink) with ink.
Test:
Using 100 times of optical microphotograph sem observation testing example 1~13 and the substrate with texture of comparative example 1~3
Texture resolution ratio (broken string and sawtooth situation), as shown in table 1.
Table 1
| Break situation | Sawtooth situation | |
| Embodiment 1 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 2 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 3 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 4 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 5 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 6 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 7 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 8 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 9 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 10 | It is visible by naked eyes broken string phenomenon | For sawtooth within 20 microns, naked eyes are invisible |
| Embodiment 11 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 12 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Embodiment 13 | It is visible by naked eyes broken string phenomenon | For sawtooth within 10 microns, naked eyes are invisible |
| Comparative example 1 | It is visible by naked eyes broken string phenomenon | For sawtooth at 30 microns or more, naked eyes are visible |
| Comparative example 2 | Visually visible broken string phenomenon | For sawtooth at 30 microns or more, naked eyes are visible |
| Comparative example 3 | Visually visible broken string phenomenon | For sawtooth at 30 microns or more, naked eyes are visible |
From table 1 it follows that the substrate with texture of 1~embodiment of embodiment 13 is visible by naked eyes broken string now
As, and the size of sawtooth, within 20 microseconds, naked eyes are invisible；Although the texture of the substrate of comparative example 1 is visible by naked eyes broken string
Phenomenon, but the size of sawtooth, at 30 microns or more, naked eyes are as it can be seen that and the texture of the substrate of comparative example 2 and comparative example 3 not only goes out
Macroscopic broken string phenomenon is showed, and the size of sawtooth, at 30 microns or more, naked eyes are visible.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (16)
1. a kind of production method of substrate with texture, which comprises the steps of:
The first ink layer is formed on a side surface of transparent substrate with ink using texture, wherein the texture is contained with ink
There is matrix resin, the matrix resin is epoxy resin or saturated polyester resin, and the grain diameter D98 of the texture ink is small
In 5 microns；And
Laser carving processing is carried out to first ink layer, to form first ink layer with texture, obtains having described
The substrate of texture.
2. the production method of substrate with texture according to claim 1, which is characterized in that the saturated polyester resin
It is greater than 40000 linear saturated polyester's resin for weight average molecular weight.
3. the production method of substrate with texture according to claim 1, which is characterized in that the transparent substrate is glass
Glass substrate or organic matter substrate；And/or the texture is gradual change texture.
4. the production method of substrate with texture according to claim 1, which is characterized in that the laser carving processing swashs
A length of 240 nanometers~500 nanometers of light wave, laser frequency is 100Hz~300Hz, and pulse width is 8 microseconds~15 microseconds.
5. the production method of substrate with texture according to claim 4, which is characterized in that the optical maser wavelength is
355 nanometers.
6. the production method of described in any item substrates with texture according to claim 1~5, which is characterized in that form institute
It further include having first ink in the formation of the transparent substrate after the step of stating first ink layer with texture
The side of layer forms the second transparent ink layer, and second ink layer is made to cover first ink with texture
The step of layer, the color of second ink layer is different from the color of first ink layer.
7. the production method of substrate with texture according to claim 6, which is characterized in that forming second oil
It further include forming the step of functional layer in the side far from the transparent substrate of second ink layer after the step of layer of ink
Suddenly, the functional layer is selected from least one of reflector element and base ink layer.
8. the production method of substrate with texture according to claim 7, which is characterized in that described in second oil
The step of side far from the transparent substrate of layer of ink forms functional layer includes: in second ink layer far from described
The side of bright substrate forms the reflector element, is formed in the side far from second ink layer of the reflector element described
Base ink layer.
9. a kind of substrate with texture, which is characterized in that including transparent substrate and be arranged in the side table of the transparent substrate
The first ink layer with texture on face, the material of first ink layer includes matrix resin, and the matrix resin is ring
Oxygen resin or saturated polyester resin.
10. substrate with texture according to claim 9, which is characterized in that the saturated polyester resin is attached most importance to respectively
Son amount is greater than 40000 linear saturated polyester's resin.
11. substrate with texture according to claim 9, which is characterized in that the transparent substrate be glass substrate or
Organic matter substrate；And/or the texture is gradual change texture.
12. substrate with texture according to claim 9, which is characterized in that further include being arranged in the transparent substrate
Formation have first ink layer side the second transparent ink layer, second ink layer covers first ink
Layer, the color of second ink layer are different from the color of first ink layer.
13. substrate with texture according to claim 12, which is characterized in that further include being arranged in second ink
Layer far from the transparent substrate side functional layer, the functional layer in reflector element and base ink at least one
Kind.
14. substrate with texture according to claim 13, which is characterized in that the functional layer include reflector element and
The side far from the transparent substrate of second ink layer, the base is arranged in base ink layer, the reflector element
The side far from second ink layer of the reflector element is arranged in ink layer.
15. according to the described in any item substrates with texture of claim 9~14, which is characterized in that described with texture
Substrate is cover board.
16. a kind of electronic equipment, including cover board, which is characterized in that the cover board is tool according to any one of claims 1 to 8
The prepared substrate with texture of the production method of textured substrate is the described in any item tools of claim 9~15
Textured substrate.
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| CN111423133A (en) * | 2020-03-30 | 2020-07-17 | RealMe重庆移动通信有限公司 | Mobile terminal, camera lens, base material and manufacturing method thereof |
| CN111808507A (en) * | 2020-07-07 | 2020-10-23 | Oppo广东移动通信有限公司 | Coating with high reflectivity, battery rear cover, preparation method of battery rear cover and electronic equipment |
| CN114501872A (en) * | 2020-10-23 | 2022-05-13 | 深圳市万普拉斯科技有限公司 | Texture preparation method of cover plate, cover plate and electronic equipment |
| CN114801379A (en) * | 2022-02-25 | 2022-07-29 | 维达力实业（赤壁）有限公司 | End product shell and preparation method thereof |
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Application publication date: 20191115 |