CN114496865A - Wafer rewinding device - Google Patents
Wafer rewinding device Download PDFInfo
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- CN114496865A CN114496865A CN202111603305.8A CN202111603305A CN114496865A CN 114496865 A CN114496865 A CN 114496865A CN 202111603305 A CN202111603305 A CN 202111603305A CN 114496865 A CN114496865 A CN 114496865A
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- 210000002421 cell wall Anatomy 0.000 claims description 7
- 210000004027 cell Anatomy 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 137
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000003860 storage Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
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- 229920002449 FKM Polymers 0.000 description 1
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- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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Abstract
The invention relates to the technical field of semiconductor equipment, in particular to a wafer rewinding device. The wafer pushing device comprises a bottom plate, a wafer clamping plug and a pushing assembly, wherein the wafer clamping plug is symmetrically arranged on the bottom plate, the pushing assembly is connected onto the bottom plate in a sliding mode, a placing groove is formed in the side wall of the wafer clamping plug, at least one clamping groove is formed in the groove wall of the placing groove, the pushing groove for the pushing assembly to pass through is formed in the groove bottom of the placing groove in a penetrating mode, the groove width of the pushing groove is smaller than that of the placing groove, and the pushing assembly transfers wafers through the pushing groove. The wafer transfer device has the effect of reducing the operation difficulty of transferring wafers.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a wafer rewinding device.
Background
During semiconductor fabrication, wafers need to be circulated between processes or in different areas of the same process. In order to reduce the contamination of the wafer caused by external contamination sources during the transportation and storage of the wafer, the wafer is usually placed in a wafer chuck and then placed in a storage box in order to provide the wafer with high cleanliness.
Currently, in order to improve the storage utilization of the wafer card plug, a plurality of wafers are usually stored in the wafer card plug. In order to separate and support a plurality of wafers, a plurality of slots are usually formed in the wafer chuck plug, so as to reduce mutual abrasion between the wafers. However, when the wafer in the wafer card plug needs to be transferred into another empty wafer card plug, a worker is usually required to manually take and transfer the wafer, and the operation of transferring the wafer is complicated.
Disclosure of Invention
In order to overcome the defect that the operation of transferring the wafer is complicated, the application provides a wafer reversing device.
The application provides a wafer flip-chip device adopts following technical scheme:
the utility model provides a wafer rewinding device, includes that bottom plate, symmetry set up the wafer card stopper on the bottom plate and slide the propelling movement subassembly of connecting on the bottom plate, the standing groove has been seted up to the lateral wall of wafer card stopper, at least one draw-in groove has been seted up to the cell wall of standing groove, the cell bottom of standing groove runs through the propelling movement groove of seting up the confession propelling movement subassembly and passing, the groove width of propelling movement groove is less than the groove width of standing groove, the propelling movement subassembly passes through the propelling movement groove shifts the wafer.
Through adopting above-mentioned technical scheme, when needs shift the wafer, the staff can with a wafer card stopper filled with the wafer with an empty wafer card stopper each other the lid close to make the standing groove of two wafer card stoppers communicate each other, as long as control push assembly passes the push tank of the wafer card stopper of assembly wafer afterwards, push assembly alright shift in the standing groove of another wafer card stopper with all wafers, thereby save the artifical operation of taking alone the transfer wafer of staff, effectively reduce the operation degree of difficulty that shifts the wafer.
Optionally, the wafer card plug is one of a card plug i, a card plug ii and a card plug iii, and the card slots on the card plug i, the card plug ii and the card plug iii are all located on the same plane;
the lower end face of the first clamping plug is provided with a first limiting strip, the upper end face of the bottom plate is symmetrically provided with a first limiting frame, the first limiting frame is provided with a first limiting groove, and the first limiting strip is inserted into the first limiting groove; a second limiting strip is arranged on the lower end face of the second clamping plug, a second limiting groove is formed in the limiting frame, and the second limiting strip is inserted into the second limiting groove; the lower end face of the third clamping plug is provided with a third limiting strip, the limiting frame is provided with a third limiting groove, and the third limiting strip is inserted into the third limiting groove.
By adopting the technical scheme, the clamping grooves of the first clamping plug, the second clamping plug and the third clamping plug are all positioned on the same plane, so that the wafer is transferred among the first clamping plug, the second clamping plug and the third clamping plug, and the operation difficulty of transferring the wafer is further reduced.
In addition, due to the arrangement of the first limiting strip, the second limiting strip, the third limiting strip, the first limiting groove and the third limiting groove, when the wafer is transferred among the first clamping plug, the second clamping plug and the third clamping plug, the first limiting groove can limit the movement of the first clamping plug through the first limiting strip, the second limiting groove can limit the movement of the second clamping plug through the second limiting strip, and the third limiting groove can limit the movement of the third clamping plug through the third limiting strip, so that the stability of wafer transfer is effectively improved, and the operation difficulty of wafer transfer is further reduced.
Optionally, the propelling movement subassembly includes push pedal, U type connecting rod and sliding block, the lower terminal surface symmetry of bottom plate is provided with the sliding frame, the sliding block slide connect in on the sliding frame, the push pedal reciprocal slide in the up end of bottom plate passes the propelling movement groove, the one end of U type connecting rod with push pedal fixed connection, the other end of U type connecting rod with sliding block fixed connection.
Through adopting above-mentioned technical scheme, because the setting of U type connecting rod, so when the wafer shifts to empty wafer card stopper in, the bottom plate can pass through the removal of U type connecting plate restriction push pedal to make the staff can judge whether the wafer inversion targets in place, effectively reduce the push pedal and excessively move and lead to the wafer to take place damaged possibility, further reduce the operation degree of difficulty that shifts the wafer.
Optionally, the lower end surface of the bottom plate is provided with a static electricity removing structure, and the U-shaped connecting rod penetrates through the static electricity removing structure.
By adopting the technical scheme, the wafer is sensitive to static electricity, so that the static electricity can easily damage circuits in the wafer once the static electricity is too large, the static electricity removing structure can effectively reduce the influence of the static electricity on the wafer, and the operation difficulty of transferring the wafer is further reduced.
Optionally, one side of the push plate, which is far away from the U-shaped connecting rod, is provided with an elastic gasket.
Through adopting above-mentioned technical scheme, because the push pedal is kept away from one side of U type connecting rod and is provided with the elastic gasket, so at the in-process that the push pedal promoted the wafer, the elastic gasket can carry out elastic buffer to the wafer, effectively reduces the wafer and takes place damaged possibility, further reduces the operation degree of difficulty that shifts the wafer.
Optionally, the pushing assembly further comprises a driving member for pushing the sliding block to move, the driving member comprises a driving cylinder fixedly connected to the lower end surface of the bottom plate, and the sliding block is connected to a piston rod of the driving cylinder; when the piston rod of the driving cylinder contracts inwards, the push plate slides towards the direction close to the wafer, and when the piston rod of the driving cylinder extends outwards, the push plate slides towards the direction far away from the wafer.
Through adopting above-mentioned technical scheme, owing to drive the setting of actuating cylinder, so when needs shift the wafer, drive actuating cylinder and can order about the push pedal automatically through sliding block and U type connecting rod and slide to save the operation of staff's manual control sliding block, further reduce the operation degree of difficulty that shifts the wafer.
In addition, if the mode that the piston rod of the driving cylinder extends outwards and the push plate slides towards the direction close to the wafer is adopted, once the piston rod is separated from the cylinder, the push plate excessively moves, and therefore the wafer is easily damaged.
And if adopt when the piston rod of drive actuating cylinder inwards shrink, when the push pedal was to the mode that slides of the direction of being close to the wafer, when the wafer shifts to in the empty wafer card stopper, the cylinder itself of drive actuating cylinder can also carry on spacingly to the piston rod, effectively reduces the excessive possibility that slides of push pedal, further reduces the wafer and takes place damaged possibility.
Optionally, the driving member further includes a driving rack fixedly connected to the piston rod of the driving cylinder, a transmission gear rotatably connected to the lower end face of the bottom plate, and a driven rack fixedly connected to the sliding block, the driving rack is parallel to the driven rack, and the driving rack and the driven rack are engaged with the transmission gear.
Through adopting above-mentioned technical scheme, when the piston rod and the sliding block lug connection of drive actuating cylinder, in order to make the sliding block have sufficient stroke, need will drive actuating cylinder and install the outside at the bottom plate usually to greatly increased wafer rewinding device occupied space.
And if the piston rod of the driving cylinder is in transmission connection with the sliding block through the driving rack, the transmission gear and the driven rack, the sliding block still has enough stroke even if the driving cylinder is fixedly connected to the lower end face of the bottom plate, so that the space occupied by the wafer rewinding device is effectively reduced.
Optionally, the pushing assembly further includes a positioning element for limiting the movement of the sliding block, the positioning element includes a positioning base, a compression spring and a positioning block, the positioning base is fixedly connected to the piston rod of the driving cylinder, the compression spring is connected to the upper end surface of the positioning base, and the positioning block is connected to one end of the compression spring, which is far away from the positioning base; a guide surface is arranged on one side of the positioning block close to the driving cylinder, and a positioning groove for the positioning block to penetrate out is formed in the lower end surface of the bottom plate in a penetrating manner;
when the wafer clamping plug is not placed on the bottom plate, the compression spring drives the positioning block to penetrate out of the positioning groove, and the guide surface is positioned outside the positioning groove; when the wafer clamping plug is placed on the bottom plate, the wafer clamping plug drives the positioning block to be contained in the positioning groove, and the guide surface is located in the positioning groove.
Through adopting above-mentioned technical scheme, because when not placing the wafer card stopper on the bottom plate, the locating piece is worn out the constant head tank, and the spigot surface is located outside the constant head tank, so even when the staff opened drive actuating cylinder because of the maloperation, the cell wall of constant head tank also can be through the removal of locating piece restriction sliding block, effectively reduces the wafer and shifts in advance and take place the possibility that drops.
And because when placing the wafer card stopper on the bottom plate, the locating piece holding is in the constant head tank, and the spigot surface is located the constant head tank, so when the staff opened drive actuating cylinder, the locating piece can shift out the constant head tank through the automatic cunning of spigot surface to reduce the hindrance of locating piece to the removal of sliding block, make the removal of push pedal more smooth stable.
Optionally, an accommodating groove is formed in the upper end surface of the positioning base, a sliding groove is formed in the groove wall of the accommodating groove in a penetrating manner, the compression spring is accommodated in the accommodating groove, and the positioning block slides in the accommodating groove in a reciprocating manner; the lateral wall of locating piece can be dismantled and is connected with the reference column, the reference column reciprocal slide in the sliding groove.
Through adopting above-mentioned technical scheme, because the lateral wall of locating piece is provided with the reference column, the groove of sliding has been seted up to the cell wall of storage tank, so when the locating piece reciprocates to slide in the storage tank, the cell wall of groove of sliding can carry on spacingly to the locating piece through the reference column, effectively reduces the locating piece and breaks away from the possibility of storage tank completely, indirectly improves the spacing effect of locating piece to the sliding block.
Optionally, a first positioning hole is formed in the bottom of the accommodating groove, a second positioning hole is formed in one side, close to the compression spring, of the positioning block, and two ends of the compression spring are embedded in the first positioning hole and the second positioning hole respectively.
By adopting the technical scheme, because the two ends of the compression spring are respectively embedded in the first positioning hole and the second positioning hole, the first positioning hole and the second positioning hole can continuously limit the compression spring in the process that the positioning block slides in the accommodating groove in a reciprocating manner, the possibility of deflection of the compression spring is effectively reduced, and the service life of the compression spring is effectively prolonged.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the wafer clamping plug filled with the wafers and the empty wafer clamping plug are mutually covered, a worker can transfer all the wafers into the placing groove of the other wafer clamping plug through the pushing assembly, so that the operation that the worker independently takes and transfers the wafers is omitted;
2. the clamping grooves of the first clamping plug, the second clamping plug and the third clamping plug are all positioned on the same plane, so that the wafer is transferred among the first clamping plug, the second clamping plug and the third clamping plug;
3. the static electricity removing structure can effectively reduce the influence of static electricity on the wafer, and further reduce the operation difficulty of transferring the wafer.
Drawings
Fig. 1 is a schematic structural diagram of a wafer flipping device.
Fig. 2 is an exploded view of a wafer flipping apparatus.
Fig. 3 is an exploded view of the first card plug and the second card plug in cooperation with each other.
Fig. 4 is an exploded view of the second and third phases of the jam.
Fig. 5 is a schematic structural diagram of the pushing assembly.
FIG. 6 is a schematic diagram of the pusher assembly before wafer transfer.
FIG. 7 is a schematic view of the pusher assembly after wafer transfer.
Figure 8 is an exploded view of the spacer.
Fig. 9 is a cross-sectional view of the positioning member when no wafer chuck is placed on the base plate.
Fig. 10 is a cross-sectional view of the retainer when the wafer chuck is placed on the base plate.
Description of reference numerals: 1. a base plate; 2. a wafer stopper; 3. a push assembly; 11. a limiting frame; 12. a first limiting groove; 13. a second limiting groove; 14. a third limiting groove; 15. a sliding frame; 16. positioning a groove; 21. blocking a first plug; 22. a second plug is clamped; 23. blocking; 31. pushing the plate; 32. a U-shaped connecting rod; 33. a sliding block; 34. a drive member; 35. a positioning member; 151. a slide bar; 152. a rubber seat; 211. a placement groove; 212. a card slot; 213. a push tank; 214. a first limiting strip; 221. a second limiting strip; 231. a third limiting strip; 311. an elastic pad; 331. a sliding hole; 332. a static electricity eliminating structure; 341. a driving cylinder; 342. a driving rack; 343. a transmission gear; 344. a driven rack; 351. positioning a base; 352. a compression spring; 353. positioning blocks; 3511. a containing groove; 3512. a first positioning hole; 3513. a sliding groove; 3531. a second positioning hole; 3532. a positioning column; 3533. a guide surface.
Detailed Description
The present application is described in further detail below with reference to figures 1-10.
The embodiment of the application discloses a wafer rewinding device. Referring to fig. 1 and 2, the wafer rewinding device includes a bottom plate 1, wafer stoppers 2 symmetrically disposed on an upper end surface of the bottom plate 1, and a pushing assembly 3 slidably connected to the bottom plate 1. The wafer chuck 2 is used for storing wafers, the bottom plate 1 is used for supporting the wafer chuck 2 and the pushing assembly 3, and the pushing assembly 3 is used for transferring the wafers from one of the wafer chuck 2 to the other wafer chuck 2.
It should be noted that, in the present embodiment, the wafer card plug 2 is any one of the first card plug 21, the second card plug 22, and the third card plug 23, taking the first card plug 21 as an example, a placing groove 211 is formed on a side wall of the first card plug 21, a plurality of arc-shaped card slots 212 for placing and separating wafers are formed on a wall of the placing groove 211, and the number of the card slots 212 may be arbitrarily set according to actual circumstances.
The bottom of the placing groove 211 is penetrated by a pushing groove 213 through which the pushing assembly 3 passes, and the width of the pushing groove 213 is smaller than that of the placing groove 211, so that when the two first clamping plugs 21 are covered with each other, the pushing assembly 3 can pass through the pushing groove 213 to transfer the wafer from one of the first clamping plugs 21 to the other one of the first clamping plugs 21. Since the width of the pushing groove 213 is smaller than that of the placing groove 211, the wall of the placing groove 211 can limit the movement of the wafer, thereby reducing the possibility of the wafer falling.
Referring to fig. 2 and 3, in order to reduce the possibility of slippage of the first chuck plug 21 during wafer transfer, in the present embodiment, a first limit strip 214 is fixedly connected to a lower end surface of the first chuck plug 21. Limiting frames 11 are symmetrically fixed on the upper end face of the bottom plate 1, a limiting groove I12 is formed in the upper end face of each limiting frame 11, and a limiting strip I214 is inserted into the limiting groove I12, so that in the process of transferring wafers, the groove wall of the limiting groove I12 can continuously limit a clamping plug I21 through the limiting strip I214, and the possibility of deviation of the clamping plug I21 is effectively reduced.
Referring to fig. 2 and 4, the first, second, and third chucking holes 21, 22, and 23 have substantially the same structure, and the chucking grooves 212 of the first, second, and third chucking holes 21, 22, and 23 are all located on the same plane, so that the wafer can be switched back and forth between the first, second, and third chucking holes 21, 22, and 23 while transferring the wafer.
The difference from the first jamming block 21 lies in that the lower end face of the second jamming block 22 is fixedly connected with a second limiting strip 221, the lower end face of the third jamming block 23 is fixedly connected with a third limiting strip 231, the upper end face of each limiting frame 11 is provided with a second limiting groove 13 for the second limiting strip 221 to be inserted and a third limiting groove 14 for the third limiting strip 231 to be inserted, and the first limiting groove 12, the second limiting groove 13 and the third limiting groove 14 are arranged at intervals, so that the first jamming block 21, the second jamming block 22 and the third jamming block 23 can be limited independently by the limiting frame 11.
In addition, in the embodiment, the first card plug 21 is a teflon card plug, the second card plug 22 is a black PP card plug, and the third card plug 23 is not sputtered by the iron card plug of the machine, so that the first card plug 21, the second card plug 22, and the third card plug 23 are suitable for different processes of semiconductor manufacturing.
Referring to fig. 1 and 5, the pushing assembly 3 includes a pushing plate 31, a U-shaped connecting rod 32, a sliding block 33 and a driving member 34, wherein the driving member 34 is disposed on the lower end surface of the bottom plate 1, the sliding block 33 is fixedly connected to an output end of the driving member 34, and the sliding block 33 is slidably connected to the lower end surface of the bottom plate 1. The push plate 31 is slidably connected to the upper end surface of the base plate 1, the push plate 31 can pass through the pushing groove 213, one end of the U-shaped connecting rod 32 is fixedly connected to the push plate 31, and the other end of the U-shaped connecting rod 32 is fixedly connected to the sliding block 33.
When the wafer needs to be transferred, the operator can directly open the driving member 34, the driving member 34 drives the sliding block 33 to slide in the direction a, and the sliding block 33 drives the pushing plate 31 to synchronously slide in the direction a through the U-shaped connecting rod 32 and pass through the pushing groove 213, so that the pushing plate 31 is prompted to transfer the wafer from one of the first stoppers 21 to the other one of the first stoppers 21. After the wafer is transferred, the operator can open the driving member 34 again, and the driving member 34 drives the pushing plate 31 to slide in the direction b through the sliding block 33 and the U-shaped connecting rod 32, so as to drive the pushing plate 31 to be separated from the first jam 21.
Specifically, the lower end surface of the bottom plate 1 is symmetrically fixed with the sliding frame 15, and the sliding frame 15 includes a sliding rod 151 and rubber seats 152 symmetrically fixed at two ends of the sliding plate, and the rubber seats 152 are fixedly connected with the bottom plate 1. The two ends of the sliding block 33 are provided with sliding holes 331, and the sliding rod 151 penetrates through the sliding holes 331, so that the sliding block 33 is caused to slide on the lower end surface of the bottom plate 1 in a reciprocating manner through the sliding frame 15.
Referring to fig. 5 and 6, the driving member 34 includes a driving cylinder 341 fixedly coupled to the lower end surface of the base plate 1, a driving rack 342 fixedly coupled to a piston rod of the driving cylinder 341, a driving gear 343 rotatably coupled to the lower end surface of the base plate 1 through a bearing, and a driven rack 344 fixedly coupled to the slider 33.
In the present embodiment, two driving racks 342 are provided, and the two driving racks 342 are symmetrically provided at both sides of the driving cylinder 341. Two transmission gears 343 are also provided, and the two transmission gears 343 are engaged with the two driving racks 342. Two driven racks 344 are also provided, and the two driven racks 344 are respectively provided at both ends of the sliding block 33. The two driven racks 344 are engaged with the two driving gears 343, respectively, and the two driven racks 344 are parallel to the two driving racks 342.
Referring to fig. 6 and 7, when a wafer needs to be transferred, a worker may start the driving cylinder 341, at this time, the piston rod of the driving cylinder 341 is retracted inward along the direction b, the driving rack 342 drives the driven rack 344 to slide along the direction a through the transmission gear 343, and the driven rack 344 drives the push plate 31 to slide along the direction a through the sliding block 33 and the U-shaped connecting rod 32, thereby completing the pushing operation of the wafer.
And after the wafer propelling movement finishes, bottom plate 1 can also carry out primary spacing to push pedal 31 through U type connecting rod 32, and it can also carry out secondary spacing to push pedal 31 through the cylinder that drives actuating cylinder 341 to drive rack 342 to reduce push pedal 31 and excessively slide and cause the possibility of damage to the wafer. And due to the arrangement of the driving rack 342, the transmission gear 343 and the driven rack 344, the occupied space can be reduced to a certain extent on the premise of ensuring the stroke.
After the wafer is transferred, the worker can start the driving cylinder 341 and cause the piston rod of the driving cylinder 341 to extend outward along the direction a, so as to cause the pushing plate 31 to slide along the direction b, and when the pushing plate 31 is completely separated from the first card plug 21, the first card plug 21 can be taken.
Referring to fig. 5 and 7, in the present embodiment, an elastic pad 311 is fixedly connected to a side of the push plate 31 away from the U-shaped connecting rod 32, and the elastic pad 311 is made of viton, so that when the push plate 31 transfers a wafer, the wafer can be protected by the elastic pad 311.
The lower end surface of the bottom plate 1 is provided with a static electricity removing structure 332, and the U-shaped connecting rod 32 penetrates through the static electricity removing structure 332. In the embodiment, the static removing structure 332 is a grounding metal wire, so that static electricity is removed when a wafer is transferred, and the influence of the static electricity on the wafer is effectively reduced.
However, when the driving cylinder 341 is opened without the first jam 21 being placed by the worker, the wafer is transferred in advance by the push plate 31, so that the wafer falls and is even damaged.
Referring to fig. 2 and 8, therefore, in order to reduce the possibility of the driving cylinder 341 being started in advance, in the present embodiment, the pushing assembly 3 further includes a positioning member 35 for limiting the movement of the sliding block 33. Specifically, the positioning member 35 includes a positioning base 351, two compression springs 352, and a positioning block 353. The positioning base 351 is fixedly connected to the piston rod of the driving cylinder 341, and an accommodating groove 3511 is formed on the upper end surface of the positioning base 351, and the two compression springs 352 are accommodated in the accommodating groove 3511. The upper end surface of the bottom plate 1 is provided with a position limiting frame 11 which is provided with a positioning groove 16 in a penetrating way, and the positioning block 353 slides between the accommodating groove 3511 and the positioning groove 16 in a reciprocating way.
Referring to fig. 8 and 9, it should be noted that, in the present embodiment, two first positioning holes 3512 are formed at the bottom of the accommodating groove 3511, two second positioning holes 3531 are formed at one side of the positioning block 353 close to the compression spring 352, one end of the compression spring 352 is fixedly connected in the first positioning hole 3512, and the other end of the compression spring 352 is fixedly connected in the second positioning hole 3531, so that the hole wall of the first positioning hole 3512 and the hole wall of the second positioning hole 3531 can cooperate to limit the compression spring 352, and the possibility of the compression spring 352 being deflected is effectively reduced.
Two relative lateral wall threaded connection of locating piece 353 has reference column 3532, and two relative cell walls of storage groove 3511 run through and have seted up sliding groove 3513, and reference column 3532 reciprocates to slide in sliding groove 3513 to at the reciprocal in-process that slides in storage groove 3511 of locating piece 353, the cell wall of sliding groove 3513 can carry on spacingly to locating piece 353 through reference column 3532, effectively reduces the possibility that locating piece 353 breaks away from storage groove 3511 completely.
Referring to fig. 9 and 10, a guide surface 3533 is disposed on a side of the positioning block 353 close to the driving cylinder 341, specifically, in this embodiment, the guide surface 3533 gradually inclines upward in a direction away from the driving cylinder 341, and when the first blocking plug 21 is not disposed on the bottom plate 1, the positioning block 353 passes through the positioning groove 16, and the guide surface 3533 is located in the positioning groove 16.
When the first blocking plug 21 is placed on the bottom plate 1, the first blocking plug 21 forces the positioning block 353 to slide downwards and urges the guiding surface 3533 to be located in the positioning slot 16. Then, if the driving cylinder 341 is turned on, the piston rod of the driving cylinder 341 will move along the direction b, and the positioning block 353 continues to slide downward under the guiding action of the guiding surface 3533 and is completely accommodated in the accommodating groove 3511, and then the driving cylinder 341 can drive the push plate 31 to normally slide.
In this embodiment, the fixed connection may be implemented by a conventional fixed connection manner, such as a threaded connection, an integral molding, a welding fixation, a fastening by a bolt, and an interference fit.
The implementation principle of the wafer rewinding device in the embodiment of the application is as follows:
when the wafer needs to be transferred, a worker may first place two wafer stoppers 2 on the limiting frame 11, then directly start the driving cylinder 341, and the driving cylinder 341 drives the sliding block 33 to slide along the direction a through the driving rack 342, the transmission gear 343 and the transmission rack, and the sliding block 33 drives the pushing plate 31 to synchronously slide towards the direction a through the U-shaped connecting rod 32 and pass through the pushing groove 213, so as to cause the pushing plate 31 to transfer the wafer from one of the first stoppers 21 to the other first stopper 21.
After the wafer is transferred, the worker can start the driving cylinder 341 again, and the driving cylinder 341 drives the pushing plate 31 to slide in the direction b, so that the pushing plate 31 is separated from the wafer chuck 2, and then the wafer chuck 2 can be taken.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. A wafer flip chip device is characterized in that: set up wafer card stopper (2) on bottom plate (1) and slide propelling movement subassembly (3) of connecting on bottom plate (1) including bottom plate (1), symmetry, standing groove (211) have been seted up to the lateral wall of wafer card stopper (2), at least one draw-in groove (212) have been seted up to the cell wall of standing groove (211), the cell bottom of standing groove (211) runs through and sets up propelling movement groove (213) that supply propelling movement subassembly (3) to pass, the groove width of propelling movement groove (213) is less than the groove width of standing groove (211), propelling movement subassembly (3) pass through propelling movement groove (213) shift the wafer.
2. The wafer flipping apparatus of claim 1, wherein: the wafer clamping plug (2) is one of a clamping plug I (21), a clamping plug II (22) and a clamping plug III (23), and clamping grooves (212) in the clamping plug I (21), the clamping plug II (22) and the clamping plug III (23) are all located on the same plane;
the lower end face of the first clamping plug (21) is provided with a first limiting strip (214), the upper end face of the bottom plate (1) is symmetrically provided with a first limiting frame (11), the first limiting frame (11) is provided with a first limiting groove (12), and the first limiting strip (214) is inserted into the first limiting groove (12); a second limiting strip (221) is arranged on the lower end face of the second clamping plug (22), a second limiting groove (13) is formed in the limiting frame (11), and the second limiting strip (221) is inserted into the second limiting groove (13); the lower end face of the third clamping plug (23) is provided with a third limiting strip (231), the limiting frame (11) is provided with a third limiting groove (14), and the third limiting strip (231) is inserted into the third limiting groove (14).
3. The wafer flipping apparatus of claim 1, wherein: propelling movement subassembly (3) are including push pedal (31), U type connecting rod (32) and sliding block (33), the lower terminal surface symmetry of bottom plate (1) is provided with sliding frame (15), sliding block (33) slide connect in on sliding frame (15), push pedal (31) reciprocal slide in the up end of bottom plate (1) passes propelling movement groove (213), the one end of U type connecting rod (32) with push pedal (31) fixed connection, the other end of U type connecting rod (32) with sliding block (33) fixed connection.
4. The wafer flipping device of claim 3, wherein: the lower end face of the bottom plate (1) is provided with a static electricity removing structure (332), and the U-shaped connecting rod (32) penetrates through the static electricity removing structure (332).
5. The wafer flipping device of claim 3, wherein: and an elastic gasket (311) is arranged on one side of the push plate (31) far away from the U-shaped connecting rod (32).
6. The wafer rewinding device as claimed in claim 3, wherein: the pushing assembly (3) further comprises a driving piece (34) for pushing the sliding block (33) to move, the driving piece (34) comprises a driving cylinder (341) fixedly connected to the lower end face of the bottom plate (1), and the sliding block (33) is connected to a piston rod of the driving cylinder (341); when the piston rod of the driving cylinder (341) contracts inwards, the push plate (31) slides towards the direction close to the wafer, and when the piston rod of the driving cylinder (341) extends outwards, the push plate (31) slides towards the direction far away from the wafer.
7. The wafer flipping device of claim 6, wherein: the driving piece (34) further comprises a driving rack (342) fixedly connected to a piston rod of the driving cylinder (341), a transmission gear (343) rotatably connected to the lower end face of the bottom plate (1) and a driven rack (344) fixedly connected to the sliding block (33), the driving rack (342) and the driven rack (344) are parallel to each other, and the driving rack (342) and the driven rack (344) are meshed with the transmission gear (343).
8. The wafer flipping apparatus of claim 7, wherein: the pushing assembly (3) further comprises a positioning element (35) for limiting the movement of the sliding block (33), the positioning element (35) comprises a positioning base (351), a compression spring (352) and a positioning block (353), the positioning base (351) is fixedly connected to a piston rod of the driving cylinder (341), the compression spring (352) is connected to the upper end face of the positioning base (351), and the positioning block (353) is connected to one end, away from the positioning base (351), of the compression spring (352); a guide surface (3533) is arranged on one side, close to the driving cylinder (341), of the positioning block (353), and a positioning groove (16) for the positioning block (353) to penetrate through is formed in the lower end surface of the bottom plate (1);
when the wafer plug (2) is not placed on the bottom plate (1), the compression spring (352) drives the positioning block (353) to penetrate out of the positioning groove (16), and the guide surface (3533) is located outside the positioning groove (16); when the wafer blocking plug (2) is placed on the bottom plate (1), the wafer blocking plug (2) drives the positioning block (353) to be accommodated in the positioning groove (16), and the guide surface (3533) is located in the positioning groove (16).
9. The wafer flipping apparatus of claim 8, wherein: an accommodating groove (3511) is formed in the upper end face of the positioning base (351), a sliding groove (3513) is formed in the groove wall of the accommodating groove (3511) in a penetrating mode, the compression spring (352) is accommodated in the accommodating groove (3511), and the positioning block (353) slides in the accommodating groove (3511) in a reciprocating mode; the side wall of the positioning block (353) is detachably connected with a positioning column (3532), and the positioning column (3532) slides in the sliding groove (3513) in a reciprocating mode.
10. The wafer flipping apparatus of claim 9, wherein: the bottom of the accommodating groove (3511) is provided with a first positioning hole (3512), one side, close to the compression spring (352), of the positioning block (353) is provided with a second positioning hole (3531), and two ends of the compression spring (352) are embedded in the first positioning hole (3512) and the second positioning hole (3531) respectively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111603305.8A CN114496865A (en) | 2021-12-24 | 2021-12-24 | Wafer rewinding device |
| PCT/CN2022/127673 WO2023116187A1 (en) | 2021-12-24 | 2022-10-26 | Wafer sorting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111603305.8A CN114496865A (en) | 2021-12-24 | 2021-12-24 | Wafer rewinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114496865A true CN114496865A (en) | 2022-05-13 |
Family
ID=81496305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111603305.8A Pending CN114496865A (en) | 2021-12-24 | 2021-12-24 | Wafer rewinding device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114496865A (en) |
| WO (1) | WO2023116187A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023116187A1 (en) * | 2021-12-24 | 2023-06-29 | 宁波芯健半导体有限公司 | Wafer sorting device |
| CN116504697A (en) * | 2023-06-29 | 2023-07-28 | 日月新半导体(昆山)有限公司 | Apparatus for integrated circuit package product operation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117410214B (en) * | 2023-12-14 | 2024-02-20 | 山东强茂电子科技有限公司 | Spin drying equipment after wafer manufacturing and cleaning |
| CN118629921A (en) * | 2024-08-15 | 2024-09-10 | 珠海埃克斯智能科技有限公司 | Wafer rewinding flow generating method and device, electronic equipment and readable storage medium |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2023116187A1 (en) | 2023-06-29 |
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