CN114481035B - Vapor deposition device and method for recovering vapor deposition material - Google Patents
Vapor deposition device and method for recovering vapor deposition material Download PDFInfo
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- CN114481035B CN114481035B CN202210036032.1A CN202210036032A CN114481035B CN 114481035 B CN114481035 B CN 114481035B CN 202210036032 A CN202210036032 A CN 202210036032A CN 114481035 B CN114481035 B CN 114481035B
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 100
- 239000000463 material Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000001704 evaporation Methods 0.000 claims abstract description 153
- 230000008020 evaporation Effects 0.000 claims abstract description 153
- 230000000903 blocking effect Effects 0.000 claims abstract description 111
- 230000008021 deposition Effects 0.000 claims abstract description 50
- 230000004888 barrier function Effects 0.000 claims abstract description 43
- 238000003860 storage Methods 0.000 claims description 77
- 230000007246 mechanism Effects 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 5
- 238000000151 deposition Methods 0.000 description 42
- 230000008569 process Effects 0.000 description 21
- 230000017525 heat dissipation Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application provides a vapor deposition device and a method for recovering vapor deposition materials. The at least two limiting plates are respectively arranged at two sides of the evaporation hole in the second direction, and the first direction is intersected with the second direction; the blocking piece is positioned on one side of the limiting plate, which is close to the evaporation hole, and one side of the blocking piece, which faces the evaporation hole, is provided with a plurality of deposition holes concavely formed along the second direction. The limiting plate comprises a first part positioned in the preset evaporation area, and the orthographic projection of the blocking piece on the limiting plate is at least partially overlapped with the first part, so that at least part of the evaporation material is deposited on the blocking piece. According to the embodiment of the application, at least part of the evaporation material can be deposited on the barrier, so that the deposition amount of the evaporation material on the limiting plate is reduced.
Description
Technical Field
The application relates to the technical field of vapor deposition equipment, in particular to a vapor deposition device and a recovery method of vapor deposition materials.
Background
Among the existing display device technologies, display panels are mainly classified into two main technologies, i.e., a liquid crystal display panel and an organic self-luminous display panel. The organic self-luminous display panel adopts an organic electroluminescent material, and when current passes through the organic electroluminescent material, the luminescent material emits light, so that the display function of the display panel is realized.
The light-emitting layer of the organic light-emitting display panel is a light-emitting device formed by stacking a plurality of functional layers, and is usually manufactured by an evaporation process, i.e., each functional layer in the display panel is evaporated by the evaporation process.
Disclosure of Invention
The embodiment of the application provides a vapor deposition device and a method for recovering vapor deposition materials, which can reduce the accumulation of the vapor deposition materials on a limiting plate.
In a first aspect, an embodiment of the present application provides an evaporation device, including an evaporation source, a limiting plate, and a blocking member, where the evaporation source includes an evaporation cavity for placing an evaporation material, and at least one evaporation hole located at one side of the evaporation cavity in a first direction and communicating with the evaporation cavity.
The at least two limiting plates are respectively arranged at two sides of the evaporation hole in the second direction, and the first direction is intersected with the second direction; the blocking piece is positioned on one side of the limiting plate, which is close to the evaporation hole, and one side of the blocking piece, which faces the evaporation hole, is provided with a plurality of deposition holes concavely formed along the second direction.
The limiting plate comprises a first part positioned in the preset evaporation area, and the orthographic projection of the blocking piece on the limiting plate is at least partially overlapped with the first part, so that at least part of the evaporation material is deposited on the blocking piece.
In some embodiments, the vapor deposition device further includes a storage box disposed at an end of the barrier facing the vapor deposition source in the first direction, the storage box being provided with an opening facing the barrier, the barrier being movably disposed at the opening in the first direction so that the barrier can enter or leave the storage box in the first direction.
In some embodiments, the vapor deposition device further includes a heat dissipation mechanism disposed on at least one side of the storage box, where the heat dissipation mechanism is used for dissipating heat from the storage box.
In some embodiments, the heat dissipation mechanism is a water-cooled cooling mechanism, and the heat dissipation mechanism is disposed in a spaced apart relationship from the storage box.
In some embodiments, the heat dissipation mechanism is disposed around a peripheral side of the storage box.
In some embodiments, the vapor deposition device further comprises a sliding member disposed on a side of the opening facing the blocking member, the sliding member being movably disposed along the second direction to be capable of covering the opening
In some embodiments, the vapor deposition device further includes a storage chamber disposed in the storage chamber, the storage chamber including a first through hole, the blocking member extending into the storage chamber from the first through hole, and the sliding member being movably disposed in the first through hole along the second direction so that the sliding member can cover the first through hole.
In some embodiments, the restrictor plate is connected to and moves synchronously with the slider.
In some embodiments, the restrictor plate is the same length as the barrier in the first direction.
In some embodiments, the barrier includes a first barrier portion extending along the first direction and a second barrier portion disposed on a side of the first barrier portion facing away from the limiting plate, the second barrier portion being at least partially located within the predetermined evaporation area and extending along the second direction.
In some embodiments, the second blocking portion is adjustably disposed in length in the second direction.
In some embodiments, the barrier includes a baffle plate and a deposition plate positioned on a side of the baffle plate adjacent to the evaporation hole, and the deposition hole is disposed on the deposition plate and penetrates the deposition plate along the second direction.
In some embodiments, the deposition plate is removably coupled to the baffle.
In some embodiments, the deposition plate has a thickness D, where 2 mm.ltoreq.D.ltoreq.8 mm.
In a second aspect, an embodiment of the present application provides a method for recovering an evaporation material, including:
s100, providing a vapor deposition source, wherein the vapor deposition source comprises a vapor deposition cavity for placing a vapor deposition material and at least one vapor deposition hole which is positioned on one side of the vapor deposition cavity in the first direction and communicated with the vapor deposition cavity.
S110, limiting components are arranged on two sides of the evaporation source and comprise limiting plates which are respectively arranged on two sides of the evaporation hole along the second direction, a blocking piece which is arranged between the limiting plates and the evaporation hole along the second direction, and a storage box which is arranged at one end of the blocking piece, facing the evaporation source, in the first direction.
S120, acquiring preset condition information, wherein the preset condition information comprises time information and/or deposition amount information of the evaporation material on the barrier.
And S130, when the preset condition information reaches a threshold value, driving the blocking member to enter the storage box along the first direction.
And S140, when the blocking piece is positioned in the storage box, the driving limiting plate moves to a position corresponding to the blocking piece along the second direction.
According to the evaporation device and the recovery method of the evaporation material, a blocking piece is added on the basis of a traditional evaporation device, the blocking piece is arranged between an evaporation hole and a limiting plate, and the front projection of the blocking piece on the limiting plate is at least partially overlapped with a first part of the limiting plate. At least part of the vapor deposition material can be deposited on the blocking piece, the deposition amount of the vapor deposition material on the limiting plate is reduced, the influence on the thickness and uniformity of the vapor deposition film layer is reduced, and the yield of products is improved.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of an evaporation device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of an evaporation device according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of an evaporation device according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an evaporation device according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of an evaporation device according to an embodiment of the present application;
fig. 6 is a flowchart of a method for recovering vapor deposition material according to an embodiment of the present application;
fig. 7a to fig. 7d are schematic process diagrams of a method for recovering evaporation materials according to an embodiment of the present application.
Marking:
1. a vapor deposition source; 11. an evaporation cavity; 12. vapor deposition holes;
2. a limiting plate; 21. a first portion;
3. a blocking member; 31. a deposition hole; 32. a first blocking portion; 33. a second blocking portion; 34. a baffle; 35. a deposition plate;
4. a storage box; 41. an opening;
6. a heat dissipation mechanism;
7. a slider;
8. a housing cavity; 81. a first through hole;
A. presetting an evaporation area;
x, a first direction; y, second direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the particular embodiments described herein are meant to be illustrative of the application only and not limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
The conventional evaporation process uses an evaporation source to perform evaporation treatment on the display panel, and limiting plates are further arranged on two sides of the evaporation source and used for controlling the evaporation range of the evaporation source. In the evaporation process, the evaporation material sprayed out of the evaporation source can be continuously deposited on the limiting plate, and after a period of time, the accumulation of the material on the limiting plate reaches a certain thickness, so that the size of the evaporation range can be influenced, the processing precision is further influenced, and the yield is reduced. And more serious, the evaporation source is blocked due to the falling of the evaporation material, the production is forced to stop, and the related lining is required to be replaced by opening a cavity, so that the consumption of manpower and material resources is caused.
In order to solve the above-mentioned problems, an embodiment of the present application provides an evaporation device, referring to fig. 1, including an evaporation source 1, a limiting plate 2 and a blocking member 3, where the evaporation source 1 includes an evaporation cavity 11 for placing an evaporation material and at least one evaporation hole 12 located at one side of the evaporation cavity 11 in a first direction X and communicating with the evaporation cavity 11.
At least two limiting plates 2 are respectively arranged on two sides of the vapor deposition hole 12 in the second direction Y, and the first direction X is intersected with the second direction Y; the stopper 3 is located on a side of the limiting plate 2 close to the vapor deposition hole 12, and a side of the stopper 3 facing the vapor deposition hole 12 has a plurality of deposition holes 31 concavely formed in the second direction Y.
Wherein, the evaporation material is puffed outwards through the evaporation holes 12 to form a preset evaporation area a, the limiting plate 2 comprises a first portion 21 located in the preset evaporation area a, and the orthographic projection of the blocking member 3 on the limiting plate 2 at least partially overlaps the first portion 21, so that at least part of the evaporation material is deposited on the blocking member 3.
The vapor deposition material is stored in the vapor deposition chamber 11 and is ejected through the vapor deposition hole 12, and the vapor deposition material ejected from the vapor deposition hole 12 forms a tapered preset evaporation area a, and the area indicated by the broken line in the figure is the range of the preset evaporation area a. In order to limit the vapor deposition position of the vapor deposition material on the display panel, limiting plates 2 are generally disposed on two sides of the vapor deposition hole 12, wherein the limiting plates 2 are configured to have a plate-like structure extending along the first direction X and disposed side by side along the second direction Y, and a first portion 21 of the limiting plate 2 is located in the preset vapor deposition area a for controlling the vapor deposition area. Alternatively, the first direction X is arranged perpendicular to the second direction Y.
According to the embodiment of the application, the blocking piece 3 is further arranged between the limiting plate 2 and the vapor deposition hole 12, the blocking piece 3 and the limiting plate 2 extend along the first direction X, a plurality of deposition holes 31 are formed in one side, facing the vapor deposition hole 12, of the blocking piece 3 for depositing vapor deposition materials, the orthographic projection of the blocking piece 3 on the limiting plate 2 is at least partially overlapped with the first part 21, and in the vapor deposition process, at least part of the vapor deposition materials can be blocked by the blocking piece 3, so that the vapor deposition materials cannot be deposited on the limiting plate 2, excessive deposition of the vapor deposition materials on the limiting plate 2 can be avoided, and the product yield is improved.
Optionally, the blocking member 3 is detachably connected with the evaporation device, and the blocking member 3 is initially located between the limiting plate 2 and the evaporation hole 12, and in the early stage of the evaporation process, the blocking member 3 can replace the limiting plate 2 to control the evaporation range, and can deposit part of the evaporation material. When the deposition amount of the vapor deposition material on the barrier 3 reaches a certain value, the barrier 3 is removed from the vapor deposition device, and the limiting plate 2 controls the vapor deposition range. The specific connection manner between the barrier 3 and the vapor deposition device is determined according to the actual vapor deposition condition, and the embodiment of the present application is not limited too much.
The embodiment of the application adds the blocking member 3 on the basis of the conventional vapor deposition device, the blocking member 3 is arranged between the vapor deposition hole 12 and the limiting plate 2, and the front projection of the blocking member 3 on the limiting plate 2 at least partially overlaps the first portion 21 of the limiting plate 2. So that at least part of the vapor deposition material can be deposited on the blocking piece 3, the deposition amount of the vapor deposition material on the limiting plate 2 is reduced, the influence on the thickness and uniformity of the vapor deposition film layer is reduced, and the yield of products is improved.
In some embodiments, as shown in fig. 1, the evaporation device further includes a storage box 4, the storage box 4 is disposed at an end of the barrier 3 facing the evaporation source 1 in the first direction X, the storage box 4 is provided with an opening 41 facing the barrier 3, and the barrier 3 is movably disposed at the opening 41 along the first direction X, so that the barrier 3 can enter or leave the storage box 4 along the first direction X.
The number of the storage boxes 4 corresponds to the number of the blocking pieces 3, and the storage boxes 4 are respectively arranged at two sides of the evaporation cavity 11 along the second direction Y, and a storage space capable of at least partially accommodating the blocking pieces 3 is formed in the storage boxes 4 so that the blocking pieces 3 can enter or leave the storage boxes 4 through the openings 41. In the early stage of the evaporation process, the barrier 3 is located outside the storage case 4 and the front projection of the barrier 3 on the limiting plate 2 at least partially overlaps the first portion 21, the barrier 3 functioning to deposit the evaporation material instead of the limiting plate 2. When the deposition amount of the evaporation material on the barrier 3 reaches a certain value, the barrier 3 may be driven into the storage box 4 through the opening 41, so that the front projection of the barrier 3 on the limiting plate 2 is no longer overlapped with the first portion 21, i.e. the barrier 3 leaves the preset evaporation area a. Alternatively, the material recovery and cleaning process may be performed on the barrier 3 while the evaporation process is performed, and the evaporation material may be blocked again using the barrier 3 after the cleaning is completed.
According to the embodiment of the application, the blocking piece 3 is placed through the storage box 4, and after the deposition amount of the evaporation material on the blocking piece 3 reaches a certain value, the blocking piece 3 can be driven to enter the storage box 4 so as to timely recover and clean the evaporation material on the blocking piece 3, and the utilization rate of the evaporation material is improved.
Referring to fig. 2, in some embodiments, the evaporation device further includes a heat dissipation mechanism 6 disposed on at least one side of the storage box 4, where the heat dissipation mechanism 6 is used for dissipating heat from the storage box 4.
The vicinity of the evaporation cavity 11 is usually at a higher temperature in the evaporation process, and the storage box 4 is located at one side of the evaporation cavity 11 in the second direction Y, so that under the influence of the evaporation cavity 11, the storage box 4 is easy to form a higher temperature condition, when the blocking member 3 enters the storage box 4, the evaporation material located on the blocking member 3 is heated and melted, and the subsequent recovery and cleaning treatment are not facilitated.
In some embodiments, the heat dissipation mechanism 6 is a water-cooled cooling mechanism, and the heat dissipation mechanism 6 is disposed at a partition from the storage box 4. Compared with air cooling, the water cooling can be faster, the embodiment of the application ensures the cooling efficiency of the storage box 4 through the water cooling mechanism, avoids the phenomenon that the evaporation material is heated and melted, and improves the overall reliability.
In some embodiments, the heat dissipation mechanism 6 is disposed around the periphery of the storage box 4, the storage box 4 is a hollow structure, and the heat dissipation mechanism 6 is disposed around the periphery of the storage box 4 according to the shape structure of the storage box 4, so that the storage box 4 can dissipate heat uniformly, and local overheating or supercooling phenomenon is avoided.
Referring to fig. 3, in some embodiments, the vapor deposition apparatus further includes a slider 7 disposed on a side of the opening 41 facing the barrier 3, where the slider 7 is movably disposed along the second direction Y so as to be capable of covering the opening 41.
The slider 7 has a plate-like structure and extends in the second direction Y for preventing the evaporation material from entering into the storage case 4 through the opening 41. Specifically, the blocking member 3 in the embodiment of the present application can completely enter the storage box 4 through the opening 41, and the moving process and the evaporation process of the blocking member 3 are performed synchronously, when the blocking member 3 enters the storage box 4, at least part of the evaporation material falls to the position where the opening 41 is located, so that blocking is easily generated, and the extension of the blocking member 3 is affected. In more serious cases, the vapor deposition material also enters the storage box 4 through the opening 41, which affects the normal use of the storage box 4.
Therefore, in the embodiment of the application, the sliding member 7 is arranged near the opening 41, and when the blocking member 3 enters the storage box 4, the sliding member 7 moves to block the position of the opening 41, so that the evaporation material is prevented from entering the storage box 4, and the use reliability is improved.
As shown in fig. 3, in some embodiments, the evaporation device further includes a receiving cavity 8, the storage box 4 is disposed in the receiving cavity 8, the receiving cavity 8 includes a first through hole 81, the blocking member 3 is extended into the storage box 4 from the first through hole 81, and the sliding member 7 is movably disposed in the first through hole 81 along the second direction Y, so that the sliding member 7 can cover the first through hole 81.
According to the embodiment of the application, the accommodating cavity 8 is added, the storage box 4 is positioned in the accommodating cavity 8, the accommodating cavity 8 plays a role in protecting the storage box 4, the vapor deposition material is prevented from directly contacting the outer side of the storage box 4, the first through hole 81 of the accommodating cavity 8 is communicated with the opening 41 of the storage box 4, and the blocking piece 3 firstly enters the position of the opening 41 through the first through hole 81 and then enters the inside of the storage box 4 through the opening 41. Alternatively, the heat dissipation mechanism 6 may be disposed in the accommodating cavity 8 and isolated from the storage box 4.
In some embodiments, the restrictor plate 2 is connected to the slider 7 and moves in synchronization with the slider 7.
In the vapor deposition apparatus, the limiting plate 2 is used to control the vapor deposition range, and it is understood that the farther the limiting plate 2 is from the vapor deposition holes 12, the higher the height of the limiting plate 2 is. Therefore, the limiting plate 2 in the embodiment of the application can move synchronously with the sliding piece 7, and after the blocking piece 3 enters the storage box 4, the limiting plate 2 can move along with the sliding piece 7 and gradually approach the evaporation hole 12, and the control of the evaporation range is realized through the limiting plate 2. This design makes it possible to reduce the length dimension of the limiting plate 2 in the first direction X to a certain extent, reducing the production costs.
In some embodiments, the restrictor plate 2 is the same length as the barrier 3 in the first direction X. In the embodiment of the application, after the blocking member 3 enters the storage box 4, the limiting plate 2 can be moved to the position above the position of the blocking member 3 by the sliding member 7, so that the evaporation material can be further prevented from entering the storage box 4, and meanwhile, the moving distance of the limiting plate 2 in the first direction X can be adjusted according to the position of the blocking member 3, so that the moving accuracy is improved.
Referring to fig. 4, in some embodiments, the blocking member 3 includes a first blocking portion 32 extending along the first direction X, and a second blocking portion 33 disposed on a side of the first blocking portion 32 away from the limiting plate 2, where the second blocking portion 33 is at least partially located in the predetermined evaporation area a and extends along the second direction Y.
The first blocking portion 32 extends along the first direction X, and the deposition hole 31 is disposed on the first blocking portion 32, and is mainly used for depositing evaporation material instead of the limiting plate 2; the second blocking portion 33 extends along the second direction Y and is mainly used for limiting the evaporation range. The second blocking portion 33 is provided on a side of the first blocking portion 32 facing away from the limiting plate 2, i.e., on a side of the first blocking portion 32 facing toward the vapor deposition hole 12. The first barrier portion 32 may be used to define the vapor deposition range, and the embodiment of the present application further controls the vapor deposition range and improves the vapor deposition accuracy by controlling the length of the first barrier portion 32 in the first direction X and the length of the second barrier portion 33 in the second direction Y.
In some embodiments, the second blocking portion 33 is adjustably disposed in length in the second direction Y. It can be understood that the larger the length of the second blocking portion 33 in the second direction Y, the smaller the vapor deposition range of the vapor deposition source 1, so in the embodiment of the present application, the second blocking portion 33 is set to be adjustable in length, and the length of the second blocking portion 33 in the second direction Y is changed to realize adjustment of the vapor deposition range, thereby meeting the actual production requirement. Alternatively, the second blocking portion 33 may be movable in the second direction Y with respect to the first blocking portion 32.
Referring to fig. 5, in some embodiments, the blocking member 3 includes a baffle 34 and a deposition plate 35 disposed on a side of the baffle 34 adjacent to the evaporation hole 12, and the deposition hole 31 is disposed on the deposition plate 35 and penetrates the deposition plate 35 along the second direction Y. The baffle 34 and the deposition plate 35 are both arranged along the first direction X, the evaporation material is deposited on the deposition plate 35 through the deposition holes 31, and in the deposition process, the baffle 34 plays a role in blocking, so that more evaporation material is blocked in the deposition holes 31, and the blocking effect is improved.
In some embodiments, the deposition plate 35 is removably coupled to the baffle 34. The deposition plate 35 can be detached from the baffle 34 for subsequent recovery and cleaning of the evaporation material, so that the difficulty in recovering the material can be reduced, and the recovery efficiency can be improved.
In some embodiments, the thickness of the deposition plate 35 is D, where 2 mm.ltoreq.D.ltoreq.8 mm. The thickness of the deposition plate 35 refers to the dimension of the deposition plate 35 in the second direction Y, and when the deposition plate 35 is in use, it is required to ensure that the deposition holes 31 have a certain length in the second direction Y so that the evaporation material can be deposited in the deposition holes 31; the thickness of the second deposition plate 35 in the second direction Y cannot be too thick, which is unfavorable for the movement of the subsequent barrier 3, so that the thickness of the deposition plate 35 is limited to 2 mm-8 mm in the embodiment of the application, so as to meet the actual use requirement.
In a second aspect, referring to fig. 6 and 7, an embodiment of the present application provides a method for recovering an evaporation material, including:
s100, providing a vapor deposition source, wherein the vapor deposition source comprises a vapor deposition cavity for preventing vapor deposition materials and at least one vapor deposition hole which is positioned on one side of the vapor deposition cavity in the first direction and communicated with the vapor deposition cavity.
S110, limiting components are arranged on two sides of the evaporation source and comprise limiting plates which are respectively arranged on two sides of the evaporation hole along the second direction, a blocking piece which is arranged between the limiting plates and the evaporation hole along the second direction, and a storage box which is arranged on one side of the blocking piece, facing the evaporation source, along the first direction.
S120, acquiring preset condition information, wherein the preset condition information comprises time information and/or deposition amount information of the evaporation material on the barrier.
And S130, when the preset condition information reaches a threshold value, driving the blocking member to enter the storage box along the first direction.
And S140, when the blocking piece is positioned in the storage box, the driving limiting plate moves to the position corresponding to the blocking piece along the second direction Y.
Referring to fig. 7a, the evaporation source 1 in step S100 is the evaporation source 1 in the foregoing embodiment, and the embodiment of the present application will not be repeated.
Referring to fig. 7b, the limiting component in step S110 is used to limit the evaporation range of the evaporation source 1 on the display panel, wherein the barrier 3 is located between the evaporation hole 12 and the limiting plate 2 along the second direction Y, and during the evaporation process, the evaporation material in the evaporation cavity 11 is continuously deposited on the barrier 3 through the evaporation hole 12 first.
In step S120, the preset condition information may be time information or deposition amount information, specifically, the vapor deposition device may control the vapor deposition time of the vapor deposition material on the barrier by using a timing system, or may determine the vapor deposition amount of the vapor deposition material on the barrier by using a sensor or other elements, and determine whether to perform the next operation according to the size of the vapor deposition amount, which is not limited in the embodiment of the present application.
Referring to fig. 7c, in step S130, when the preset condition reaches the threshold, that is, the evaporation process reaches the preset time, or the deposition amount on the barrier 3 reaches a certain value, the barrier 3 enters the storage box 4, and the driving mode may be through driving the electronic devices such as the motor or the lifting cylinder. It should be noted that, during the process of gradually entering the storage box 4 by the blocking member 3, the evaporation process is still performed synchronously, and at this time, the limiting plate 2 and at least part of the blocking member 3 simultaneously play a role in limiting the evaporation range.
Referring to fig. 7d, in step S140, after the blocking member 3 enters the storage box 4, the limiting plate 2 moves to the position of the blocking member 3 along the second direction Y, and the blocking member 3 located in the storage box 4 can perform the collection or cleaning process of the evaporation material for recycling.
Although the embodiments of the present application are disclosed above, the embodiments are only used for the convenience of understanding the present application, and are not intended to limit the present application. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is still subject to the scope of the present disclosure as defined by the appended claims.
In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, substitution of other connection modes described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.
Claims (12)
1. An evaporation device, comprising:
the evaporation source comprises an evaporation cavity for placing an evaporation material and at least one evaporation hole which is positioned at one side of the evaporation cavity in the first direction and communicated with the evaporation cavity;
the limiting plates are respectively arranged on two sides of the evaporation hole in the second direction, and the first direction is intersected with the second direction;
the blocking piece is positioned at one side of the limiting plate, which is close to the vapor deposition hole, and one side of the blocking piece, which faces the vapor deposition hole, is provided with a plurality of deposition holes concavely formed along the second direction;
the limiting plate comprises a first part positioned in the preset evaporation area, and the orthographic projection of the blocking piece on the limiting plate is at least partially overlapped with the first part, so that at least part of the evaporation material is deposited on the blocking piece;
the storage box is arranged at one end of the blocking piece, facing the evaporation source, in the first direction, and is provided with an opening, and the blocking piece is movably arranged at the opening along the first direction so that the blocking piece can enter or leave the storage box along the first direction, and the storage box is used for recycling and cleaning evaporation materials;
the sliding piece is arranged on one side of the opening, which faces the blocking piece, and is movably arranged along the second direction so as to cover the opening, and the limiting plate is connected with the sliding piece and moves synchronously with the sliding piece.
2. The vapor deposition device according to claim 1, further comprising a heat radiation mechanism provided on at least one side of the storage case, the heat radiation mechanism being configured to radiate heat from the storage case.
3. The vapor deposition device according to claim 2, wherein the heat radiation mechanism is a water-cooling mechanism, and the heat radiation mechanism is disposed in a state of being blocked from the storage case.
4. The vapor deposition device according to claim 2, wherein the heat radiation mechanism is disposed around a peripheral side of the storage case.
5. The vapor deposition device according to claim 1, further comprising a housing chamber, wherein the storage case is provided in the housing chamber, the housing chamber includes a first through hole, the blocking member extends from the first through hole into the storage case, and the sliding member is movably provided in the first through hole in the second direction so that the sliding member can cover the first through hole.
6. The vapor deposition device according to claim 1, wherein the limiting plate has a length in the first direction that is the same as the stopper.
7. The vapor deposition device according to claim 1, wherein the blocking member includes a first blocking portion extending in a first direction and a second blocking portion provided on a side of the first blocking portion facing away from the limiting plate, the second blocking portion being at least partially located in the preset evaporation region and extending in the second direction.
8. The vapor deposition device according to claim 7, wherein a length of the second blocking portion in the second direction is adjustable.
9. The vapor deposition device according to claim 1, wherein the blocking member includes a baffle plate and a deposition plate positioned on a side of the baffle plate adjacent to the vapor deposition hole, and the deposition hole is provided in the deposition plate and penetrates the deposition plate in the second direction.
10. The vapor deposition device according to claim 9, wherein the deposition plate is detachably connected to the baffle plate.
11. The vapor deposition apparatus according to claim 9, wherein the thickness of the deposition plate is D, and wherein 2 mm.ltoreq.d.ltoreq.8 mm.
12. A method for recovering a vapor deposition material, characterized by using the vapor deposition apparatus according to any one of claims 1 to 11, comprising:
providing an evaporation source, wherein the evaporation source comprises an evaporation cavity for placing an evaporation material and at least one evaporation hole which is positioned on one side of the evaporation cavity in a first direction and communicated with the evaporation cavity;
limiting components are arranged on two sides of the evaporation source, each limiting component comprises limiting plates which are arranged on two sides of the evaporation hole in a separated mode along a second direction, a blocking piece which is arranged between the limiting plate and the evaporation hole along the second direction, and a storage box which is arranged at one end, facing the evaporation source, of the blocking piece along the first direction;
acquiring preset condition information, wherein the preset condition information comprises time information and/or deposition amount information of the evaporation material on the barrier;
when the preset condition information reaches a threshold value, driving the blocking piece to enter the storage box along the first direction;
when the blocking piece is positioned in the storage box, the limiting plate is driven to move to a position corresponding to the blocking piece along the second direction.
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| CN115449756A (en) * | 2022-09-21 | 2022-12-09 | 京东方科技集团股份有限公司 | Evaporation plating device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103866237A (en) * | 2012-12-13 | 2014-06-18 | 三星显示有限公司 | Thin film depositing apparatus and thin film deposition method using the same |
| CN204417579U (en) * | 2014-12-30 | 2015-06-24 | 上海天马有机发光显示技术有限公司 | A kind of evaporation coating device |
| CN205774772U (en) * | 2016-05-13 | 2016-12-07 | 鄂尔多斯市源盛光电有限责任公司 | A kind of deposition unit and evaporation coating device |
| CN205999474U (en) * | 2016-09-19 | 2017-03-08 | 京东方科技集团股份有限公司 | Vacuum deposition apparatus |
| CN106958007A (en) * | 2017-05-12 | 2017-07-18 | 武汉华星光电技术有限公司 | Vaporising device |
| CN106978589A (en) * | 2017-04-20 | 2017-07-25 | 京东方科技集团股份有限公司 | Retaining device and evaporated device for evaporated device |
| CN112301312A (en) * | 2019-07-25 | 2021-02-02 | 杭州纤纳光电科技有限公司 | Evaporation device and recovery method of evaporation raw material thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102525328B1 (en) * | 2015-11-17 | 2023-05-24 | 주식회사 선익시스템 | Apparatus of deposition having radiation angle controlling plate |
-
2022
- 2022-01-12 CN CN202210036032.1A patent/CN114481035B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103866237A (en) * | 2012-12-13 | 2014-06-18 | 三星显示有限公司 | Thin film depositing apparatus and thin film deposition method using the same |
| CN204417579U (en) * | 2014-12-30 | 2015-06-24 | 上海天马有机发光显示技术有限公司 | A kind of evaporation coating device |
| CN205774772U (en) * | 2016-05-13 | 2016-12-07 | 鄂尔多斯市源盛光电有限责任公司 | A kind of deposition unit and evaporation coating device |
| CN205999474U (en) * | 2016-09-19 | 2017-03-08 | 京东方科技集团股份有限公司 | Vacuum deposition apparatus |
| CN106978589A (en) * | 2017-04-20 | 2017-07-25 | 京东方科技集团股份有限公司 | Retaining device and evaporated device for evaporated device |
| CN106958007A (en) * | 2017-05-12 | 2017-07-18 | 武汉华星光电技术有限公司 | Vaporising device |
| CN112301312A (en) * | 2019-07-25 | 2021-02-02 | 杭州纤纳光电科技有限公司 | Evaporation device and recovery method of evaporation raw material thereof |
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