CN115449756A - Evaporation plating device - Google Patents

Evaporation plating device Download PDF

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Publication number
CN115449756A
CN115449756A CN202211151501.0A CN202211151501A CN115449756A CN 115449756 A CN115449756 A CN 115449756A CN 202211151501 A CN202211151501 A CN 202211151501A CN 115449756 A CN115449756 A CN 115449756A
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CN
China
Prior art keywords
window
side wall
nozzle
evaporation
vapor deposition
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Pending
Application number
CN202211151501.0A
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Chinese (zh)
Inventor
张�杰
何信儒
刘昭林
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Mianyang BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202211151501.0A priority Critical patent/CN115449756A/en
Publication of CN115449756A publication Critical patent/CN115449756A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

An evaporation apparatus comprising: the device comprises a shell, a first side wall, a second side wall, a third side wall and a fourth side wall, wherein the first side wall and the second side wall are oppositely arranged, and the third side wall and the fourth side wall are oppositely arranged; the nozzle is positioned at the bottom of the evaporation cavity; the first protective window is arranged on the first side wall; the second protective window is arranged on the second side wall; the first protection window and the second protection window are in an opening state and a closing state, and in the closing state, the first protection window and the second protection window are positioned on one side close to the nozzle, and the evaporation chamber is closed; in an opening state, the first protection window and the second protection window are positioned on one side far away from the nozzle, and the evaporation coating cavity is opened.

Description

Evaporation plating device
Technical Field
The embodiment of the disclosure relates to the technical field of evaporation, in particular to an evaporation device.
Background
In an evaporation process of an Organic Light Emitting Diode (OLED), a protective window is disposed on an evaporation path to accurately control evaporation time, and the on-off state of the evaporation path is switched between an open state and a closed state by controlling the protective window, so as to accurately control the start-stop time of evaporation.
The inventor of the application discovers that in the existing evaporation process, when the evaporation time is long or the evaporation rate is high, the protective window cannot be completely opened, and the stability of evaporation can be affected.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the disclosure provides an evaporation device, which aims to solve the problem that a protective window cannot be completely opened when the evaporation time is long or the evaporation amount is large.
The embodiment of the present disclosure provides an evaporation apparatus, including: the device comprises a shell, a first side wall, a second side wall, a third side wall and a fourth side wall, wherein the first side wall and the second side wall are arranged oppositely, and the third side wall and the fourth side wall are arranged oppositely; the nozzle is positioned at the bottom of the evaporation cavity; the first protection window is arranged on the first side wall; the second protective window is arranged on the second side wall; the first protection window and the second protection window have an opening state and a closing state, in the closing state, the first protection window and the second protection window are positioned on one side close to the nozzle, and the evaporation cavity is closed; in the open state, the first protection window and the second protection window are located on one side away from the nozzle, and the evaporation cavity is opened.
In an exemplary embodiment, a first rotating shaft is arranged on the first side wall, the first protective window is arranged on the first rotating shaft, and the first protective window is driven by the first rotating shaft to move; and a second rotating shaft is arranged on the second side wall, the second protection window is arranged on the second rotating shaft, and the second protection window moves under the driving of the second rotating shaft.
In an exemplary embodiment, there is no overlap between an orthographic projection of the closed positions of the first and second window guards at the bottom of the evaporation chamber and an orthographic projection of the nozzle at the bottom of the evaporation chamber.
In an exemplary embodiment, an orthographic projection of the nozzle on the bottom of the evaporation chamber is located within a range of an orthographic projection of the first protection window on the bottom of the evaporation chamber.
In an exemplary embodiment, the nozzle is located at a geometric center of a bottom of the evaporation chamber, and the first protective window and the second protective window are rectangles with different sizes.
In an exemplary embodiment, the first protective window is provided with a first lap joint, and the second protective window is provided with a second lap joint; in the closed state, the first overlapping part and the second overlapping part are matched with each other to realize the sealing at the closed position.
In an exemplary embodiment, an orthographic projection of the first overlapping part on the bottom of the evaporation chamber is overlapped with an orthographic projection of the second overlapping part on the bottom of the evaporation chamber.
In an exemplary embodiment, in the closed state, a sealing strip or a magnetic component is disposed on a surface of the first overlapping part opposite to the second overlapping part.
In an exemplary embodiment, a first baffle is arranged on a first side wall of the first rotating shaft close to the direction of the nozzle, the first baffle is arranged close to the first rotating shaft, and the orthographic projection of the first rotating shaft at the bottom of the evaporation cavity is located in the range of the orthographic projection of the first baffle at the bottom of the evaporation cavity; the second rotating shaft is close to a second side wall in the nozzle direction, a second baffle is arranged on the second side wall, the second baffle is close to the second rotating shaft, and the orthographic projection of the bottom of the evaporation cavity is located in the range of the orthographic projection of the bottom of the evaporation cavity.
In an exemplary embodiment, the first baffle plate includes a first connecting portion and a first extending portion, one end of the first connecting portion is connected to the first sidewall, the other end of the first connecting portion is connected to the first extending portion, and the first extending portion extends from the other end of the first connecting portion to a side away from the nozzle; the second baffle comprises a second connecting portion and a second extending portion, one end of the second connecting portion is connected with the second side wall, the other end of the second connecting portion is connected with the second extending portion, and the second extending portion extends from the other end of the second connecting portion to one side far away from the nozzle.
The evaporation device that this disclosed embodiment provided upwards opens through setting up first protecting window and second protecting window, helps reducing the accumulated amount of coating by vaporization material at first protecting window and second protecting window, even if when the coating by vaporization time is longer or the coating by vaporization volume is great, also can guarantee that the protecting window can normally switch, makes whole coating by vaporization process more stable, helps promoting the product yield. The problem that the protective window cannot be completely opened when the evaporation time is long or the evaporation amount is large is solved.
Other aspects will be apparent upon reading and understanding the attached drawings and detailed description.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the example serve to explain the principles of the disclosure and not to limit the disclosure.
Fig. 1 is a schematic structural view of an evaporation device according to an exemplary embodiment of the present disclosure in a state where a protective window is closed;
fig. 2 is a schematic structural view of an evaporation device according to an exemplary embodiment of the present disclosure in a state where a protective window is opened;
fig. 3 is a plan view of the vapor deposition device in the state shown in fig. 1;
FIG. 4 is a plan view of the vapor deposition device shown in FIG. 2;
FIG. 5 is a schematic illustration of the positional relationship of a first shield, a second shield, and a nozzle in an exemplary embodiment;
FIG. 6 is a schematic illustration of a positional relationship of a first shield window, a second shield window, and a nozzle in yet another exemplary embodiment;
FIG. 7 is a schematic illustration of a positional relationship of a first shield window, a second shield window, and a nozzle in yet another exemplary embodiment;
FIG. 8 is a schematic illustration of a positional relationship of a first shield window, a second shield window, and a nozzle in yet another exemplary embodiment;
FIG. 9 is a schematic view of the structure of a first baffle in an exemplary embodiment;
FIG. 10 is a schematic structural view of a second baffle in an exemplary embodiment;
fig. 11 is an enlarged view of a dotted line region C in fig. 1.
Description of reference numerals:
10-a nozzle; 11 — a first side wall; 12 — a second side wall;
13-a third side wall; 14 — a fourth side wall; 15-a first protective window;
16-a second protective window; 17 — a first shaft; 18-a second shaft;
19 — a first baffle; 20-a second baffle; 151 — a first lap joint;
161 — a second lap joint; 191 — a first connection; 192 — a first extension;
201-a second connection portion; 202 — a second extension.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that the embodiments may be implemented in a plurality of different forms. Those skilled in the art can readily appreciate the fact that the manner and content may be varied into a variety of forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be construed as being limited to the contents described in the following embodiments. The embodiments and features of the embodiments in the present disclosure may be arbitrarily combined with each other without conflict.
The present disclosure includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements of the present disclosure that have been disclosed may also be combined with any conventional features or elements to form unique inventive aspects as defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other inventive aspects to form yet another unique inventive aspect, as defined by the claims. Thus, it should be understood that any features shown and/or discussed in this disclosure may be implemented alone or in any suitable combination. Accordingly, the embodiments are not limited except as by the appended claims and their equivalents. Furthermore, various modifications and changes may be made within the scope of the appended claims.
Further, in describing representative embodiments, the specification may have presented the method and/or process as a particular sequence of steps. However, to the extent that the method or process does not rely on the particular order of steps set forth herein, the method or process should not be limited to the particular sequence of steps described. Other sequences of steps are possible as will be appreciated by those of ordinary skill in the art. Therefore, the particular order of the steps set forth in the specification should not be construed as limitations on the claims. Further, the claims directed to the method and/or process should not be limited to the performance of their steps in the order written, and one skilled in the art can readily appreciate that the sequences may be varied and still remain within the spirit and scope of the embodiments of the present disclosure.
In the drawings, the size of one or more constituent elements, the thickness of layers, or regions may be exaggerated for clarity. Accordingly, one aspect of the disclosure is not necessarily limited to the dimensions, and the shapes and sizes of one or more components in the drawings are not to reflect a true scale. Further, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes, numerical values, and the like shown in the drawings.
The ordinal numbers such as "first", "second", "third", and the like in the present specification are provided for avoiding confusion among the constituent elements, and are not limited in number.
In this specification, for convenience, words such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating orientations or positional relationships are used to explain positional relationships of constituent elements with reference to the drawings, only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present disclosure. The positional relationship of the components is changed as appropriate in accordance with the direction in which each component is described. Therefore, the words described in the specification are not limited to the words described in the specification, and may be replaced as appropriate.
In this specification, the terms "mounted," "connected," and "connected" are to be construed broadly unless otherwise explicitly specified or limited. For example, it may be a fixed connection, or a removable connection, or an integral connection; can be a mechanical connection, or an electrical connection; either directly or indirectly through intervening components, or both may be interconnected. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.
In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having some kind of electrical action. The "element having some kind of electrical action" is not particularly limited as long as it can transmit an electrical signal between connected components. Examples of the "element having some kind of electric function" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.
In the present specification, "parallel" means a state in which an angle formed by two straight lines is-10 ° or more and 10 ° or less, and therefore, includes a state in which the angle is-5 ° or more and 5 ° or less. The term "perpendicular" refers to a state in which the angle formed by two straight lines is 80 ° or more and 100 ° or less, and therefore includes a state in which the angle is 85 ° or more and 95 ° or less.
In this specification, a triangle, a rectangle, a trapezoid, a pentagon, a hexagon, or the like is not strictly defined, and may be an approximate triangle, a rectangle, a trapezoid, a pentagon, a hexagon, or the like, and some small deformations due to tolerances may exist, and a lead angle, a curved edge, deformation, or the like may exist.
"about" in this disclosure means that the limits are not strictly defined, and that values within the tolerances of the process and measurement are allowed.
In some techniques, an evaporation source in an evaporation apparatus is located at a lower side, a material to be evaporated is evaporated upward through a nozzle (puzzle), a member to be film-coated such as a display substrate is located above the nozzle, and a protective window is provided on an evaporation path between the nozzle and the member to be film-coated. The shutter has an open state in which the shutter closes the deposition path to intercept the material discharged from the nozzle, and a closed state in which the shutter opens the deposition path to enable deposition on the display substrate. The inventor of the present application discovers through research that what present protecting window adopted is Rotation type protecting window (Rotation Shutter), protecting window downwardly rotating is the open mode, upwards rotate to the level for the closed condition, under the closed condition, protecting window is close to the surface of nozzle one side and can accumulate coating by vaporization material, when the coating by vaporization time is longer or the coating by vaporization rate is great, protecting window is close to the thickness of the surface accumulation coating by vaporization material of nozzle one side and is thicker, when opening downwards, the coating by vaporization material of accumulation keeps off between protecting window and the lateral wall of coating by vaporization device, lead to protecting window can not open completely, thereby influence the stability of coating by vaporization. Because the protective window is opened downwards, the protective window tends to move downwards under the action of gravity, and the problem of untight sealing can exist in a closed state, and the problem is more obvious after the protective window works for a long time.
The embodiment of the present disclosure provides an evaporation apparatus, including: the device comprises a shell, a first side wall, a second side wall, a third side wall and a fourth side wall, wherein the first side wall and the second side wall are arranged oppositely, and the third side wall and the fourth side wall are arranged oppositely; the nozzle is positioned at the bottom of the evaporation cavity; the first protection window is arranged on the first side wall; the second protective window is arranged on the second side wall; the first protection window and the second protection window have an opening state and a closing state, in the closing state, the first protection window and the second protection window are positioned on one side close to the nozzle, and the evaporation cavity is closed; in the open state, the first protection window and the second protection window are located on one side away from the nozzle, and the evaporation cavity is opened.
According to the evaporation device provided by the embodiment of the disclosure, in a closed state, the first protection window and the second protection window are located on one side close to the nozzle, the evaporation cavity is closed, in an open state, the first protection window and the second protection window are located on one side far away from the nozzle, the evaporation cavity is opened, and the first protection window and the second protection window move upwards along the side wall and then are switched to the open state. Upwards open through setting up first protecting window and second protecting window, help reducing the accumulated amount of coating by vaporization material at first protecting window and second protecting window, even if when the coating by vaporization time is longer or the coating by vaporization volume is great, also can guarantee that the protecting window can normally switch, make whole coating by vaporization process more stable, help promoting the product yield. The problem that the protective window can not be completely opened when the evaporation time is long or the evaporation amount is large is solved.
In an exemplary embodiment, a first rotating shaft is arranged on the first side wall, the first protective window is arranged on the first rotating shaft, and the first protective window is driven by the first rotating shaft to move; and a second rotating shaft is arranged on the second side wall, the second protection window is arranged on the second rotating shaft, and the second protection window moves under the driving of the second rotating shaft.
In an exemplary embodiment, there is no overlap between an orthographic projection of the closed positions of the first and second window guards at the bottom of the evaporation chamber and an orthographic projection of the nozzle at the bottom of the evaporation chamber.
In an exemplary embodiment, an orthographic projection of the nozzle on the bottom of the evaporation chamber is located within a range of an orthographic projection of the first protection window on the bottom of the evaporation chamber.
In an exemplary embodiment, the nozzle is located at a geometric center of a bottom of the evaporation chamber, and the first protective window and the second protective window are rectangles with different sizes.
In an exemplary embodiment, the first protective window is provided with a first lap joint, and the second protective window is provided with a second lap joint; in the closed state, the first overlapping part and the second overlapping part are matched with each other to realize the sealing at the closed position.
In an exemplary embodiment, an orthographic projection of the first overlapping part on the bottom of the evaporation chamber is overlapped with an orthographic projection of the second overlapping part on the bottom of the evaporation chamber.
In an exemplary embodiment, in the closed state, a sealing strip or a magnetic component is disposed on a surface of the first overlapping part opposite to the second overlapping part.
In an exemplary embodiment, a first baffle plate is arranged on a first side wall of the first rotating shaft close to the nozzle direction, the first baffle plate is arranged close to the first rotating shaft, and the orthographic projection of the first rotating shaft at the bottom of the evaporation cavity is located in the range of the orthographic projection of the first baffle plate at the bottom of the evaporation cavity; the second rotating shaft is close to a second side wall in the nozzle direction, a second baffle is arranged on the second side wall, the second baffle is close to the second rotating shaft, and the orthographic projection of the bottom of the evaporation cavity is located in the range of the orthographic projection of the bottom of the evaporation cavity.
In an exemplary embodiment, the first baffle plate includes a first connection portion and a first extension portion, one end of the first connection portion is connected to the first side wall, the other end of the first connection portion is connected to the first extension portion, and the first extension portion extends from the other end of the first connection portion to a side away from the nozzle; the second baffle comprises a second connecting portion and a second extending portion, one end of the second connecting portion is connected with the second side wall, the other end of the second connecting portion is connected with the second extending portion, and the second extending portion extends from the other end of the second connecting portion to one side far away from the nozzle.
Fig. 1 is a schematic structural view of a vapor deposition device according to an exemplary embodiment of the present disclosure in a state where a protective window is closed. As shown in fig. 1, a vapor deposition device according to an exemplary embodiment of the present disclosure includes a housing, a vapor deposition chamber provided in the housing, and a nozzle 10 provided at a bottom of the vapor deposition chamber, where the nozzle 10 may eject vapor deposition material upward. A first protection window 15 and a second protection window 16 are provided on a side wall of the casing on the upper side of the nozzle 10, the first protection window 15 and the second protection window 16 may be provided so as to face each other, the first protection window 15 and the second protection window 16 have an open state and a closed state, in fig. 1, the first protection window 15 and the second protection window 16 are in the closed state, a dotted line region C is a closed position of the first protection window 15 and the second protection window 16, and in the closed state, the vapor deposition material ejected from the nozzle 10 is blocked by the first protection window 15 and the second protection window 16, the vapor deposition path is cut off, the vapor deposition chamber is closed, and the vapor deposition process is stopped. In the closed state, the surfaces of the first and second protection windows 15 and 16 on the side close to the nozzle 10 may be first surfaces, and the surfaces of the first and second protection windows 15 and 16 on the side away from the nozzle 10 may be second surfaces.
Fig. 2 is a schematic structural view of a vapor deposition device according to an exemplary embodiment of the present disclosure in a state where a protective window is opened. In fig. 2, the first protective window 15 and the second protective window 16 are in an open state, in which the evaporation path is open, the evaporation chamber is opened, and the evaporation material ejected from the nozzle 10 can reach a member to be coated (not shown). As shown in fig. 2, the first window 15 and the second window 16 can be switched from the closed state to the open state after rotating upward along the side wall of the housing. In the open state, the first window 15 and the second window 16 are located on the side away from the nozzle 10, and the closed position of the first window 15 and the second window 16 in the open state is further away from the nozzle 10 than in the closed state. In an exemplary embodiment, in the closed state, a large distance may be provided between the first and second protection windows 15 and 16 and the nozzle 10 to reduce the accumulation of the evaporation material, however, the distance between the first and second protection windows 15 and 16 and the nozzle 10 may be provided as needed, which is not limited by the present disclosure.
In the evaporation process, the evaporation material moves upwards from the nozzle 10 to reach a part to be coated, and under the influence of gravity, the distribution rule of evaporation airflow in the evaporation cavity is gradually rarefied along the direction from bottom to top, and the evaporation material is easier to accumulate at a position closer to the lower side of the evaporation cavity. In some techniques, the shutter is configured to rotate downward to an open state, such that in the open state, the shutter and the nozzle are closer to each other in the direction of gravity, and the deposition material tends to accumulate on the shutter surface under the influence of gravity. The back is being opened downwards to the safety window, and the position of coating by vaporization material accumulation is for the safety window surface (the second surface) of keeping away from nozzle one side under the closed condition, and under the closed condition, the position of coating by vaporization material accumulation is for the surface (the first surface) that the safety window is close to nozzle one side, and this makes the surface of safety window both sides all can accumulate coating by vaporization material, and the safety window is opening and the motion in-process of closing, and the tiny granule that has more coating by vaporization material assembles the closed position at the safety window, and two protection windows take place the position of contact under the closed condition promptly. Further, when the deposition time is long or the deposition rate is high, the thickness of the deposition material accumulated on the first surface of the shield window is thick, and when the shield window is opened downward, the deposition material accumulated on the first surface is blocked between the shield window and the sidewall of the deposition device case, so that the shield window cannot be completely opened, thereby affecting the stability of deposition.
In contrast, in the embodiment of the present disclosure, by providing the first protection window 15 and the second protection window 16 to be opened upward, in the opened state, the first protection window 15 and the second protection window 16 are farther from the nozzle 10 in the direction of gravity, and under the influence of gravity, the amount of vapor deposition material moving to the first protection window 15 and the second protection window 16 is less, which helps to reduce the amount of vapor deposition material accumulated in the first protection window 15 and the second protection window 16, and can ensure smoother movement of the first protection window 15 and the second protection window 16 when the state is switched. Set up first protecting window 15 and second protecting window 16 to upwards opening for opening and closing the state under, the evaporation material all accumulates at the first surface, can guarantee towards the cleanness on the second surface of casing lateral wall, even if under the more condition of evaporation material accumulation, can not bring the influence to the open mode of first protecting window 15 and second protecting window 16 yet, whole coating by vaporization process is more stable, helps promoting the product yield. Further, the first protection window 15 and the second protection window 16 are opened upward, and the closed state is more closed by the gravity of the first protection window 15 and the second protection window 16, so that the vapor deposition material discharged from the nozzle 10 can be blocked more effectively.
In an exemplary embodiment, as shown in fig. 1 and 2, the housing includes a first side wall 11 and a second side wall 12 which are oppositely arranged, a first rotating shaft 17 may be arranged on the first side wall 11 on the upper side of the nozzle 10, a first protective window 15 may be arranged on the first rotating shaft 17, and the first rotating shaft 17 rotates to drive the first protective window 15 to move; the second sidewall 12 may be provided with a second rotating shaft 18, and the second window protector 16 may be disposed on the second rotating shaft 18, where the second rotating shaft 18 can rotate to drive the second window protector 16 to move. The first rotating shaft 17 and the second rotating shaft 18 can be driven by respective motors to rotate, and the first protective window 15 and the second protective window 16 can be switched between an open state and a closed state through the matching of the first rotating shaft 17 and the second rotating shaft 18.
In the exemplary embodiment, the dashed area C in fig. 1 is the closed position of the first and second protective windows 15, 16, and there is no overlap between the orthographic projection of the closed position of the first and second protective windows 15, 16 on the bottom of the evaporation chamber and the orthographic projection of the nozzle 10 on the bottom of the evaporation chamber. For example, the bottom of the evaporation chamber may be rectangular, the position of the nozzle 10 may be set at the geometric center of the bottom of the evaporation chamber, the first window protector 15 and the second window protector 16 may be asymmetrically arranged, and in the closed state, the distance between the closed position and the first sidewall 11 may be greater than the distance between the closed position and the second sidewall 12, so that the closed position avoids the geometric center of the bottom of the evaporation chamber. The size of the first protective window 15 in fig. 1 may be larger than the size of the second protective window 16, and in other embodiments, the size of the second protective window 16 may also be set larger than the size of the first protective window 15, which is not limited by the present disclosure.
Fig. 3 is a plan view of the vapor deposition device shown in fig. 1. The dashed area in fig. 3 shows the closed position of the first protective window 15 and the second protective window 16, and in conjunction with fig. 1 and 3, the orthographic projection of the nozzle 10 on the bottom of the evaporation chamber can be within the range of the orthographic projection of the first protective window 15 on the bottom of the evaporation chamber. In the direction of gravity, there may be no overlap of the orthographic projection of the closed positions of the first and second protection windows 15, 16 on the bottom of the evaporation chamber and the orthographic projection of the nozzle 10 on the bottom of the evaporation chamber.
In some technologies, a protective window of an evaporation device is designed symmetrically, and the closed position of the protective window is located right above a nozzle, so that evaporation materials sprayed out by the nozzle are easy to accumulate at the closed position of the protective window in the closed state, when the protective window is switched from the closed state to the open state, the protective window is changed from a static state to a moving state, the accumulated evaporation materials are easy to drop, the dropping position is right opposite to the nozzle, the nozzle has a risk of blocking, and the completion of an evaporation process is not facilitated. When the protective window is switched from the open state to the closed state, the protective window is changed from the moving state to the static state, the moving distance at the closed position is longest in the moving process of the protective window, the accumulated moving speed is maximum, the evaporation materials accumulated at the closing time are easy to drop, and the risk of blocking a nozzle exists. In these techniques, the position on the protective window where the deposition material is most accumulated coincides with the position where the deposition material is most likely to fall, and is located directly above the nozzle, which greatly increases the risk of clogging of the nozzle. In the present exemplary embodiment, by providing the closed positions of the first protection window 15 and the second protection window 16 so as to avoid the position of the nozzle 10, on the one hand, the deposition material is less likely to accumulate at the closed positions of the first protection window 15 and the second protection window 16, and the amount of the deposition material accumulated at the position where the deposition material most likely drops is reduced, which contributes to reducing the amount of the deposition material dropping on the first protection window 15 and the second protection window 16. On the other hand, the orthographic projection of the nozzle 10 on the bottom of the evaporation chamber is positioned in the range of the orthographic projection of the first protective window 15 on the bottom of the evaporation chamber, the position which is opposite to the nozzle 10 in the gravity direction is positioned in the middle of the first protective window 15, the moving speed of the position is not high in the moving process of the first protective window 15, and even if the accumulated evaporation materials exist in the position, the position is not easy to fall. It can be seen that the closed positions of the first protection window 15 and the second protection window 16 are arranged to avoid the position of the nozzle 10, so that the falling probability of the evaporation material facing the position of the nozzle 10 is reduced, the evaporation material can be effectively prevented from falling, and the risk of nozzle blockage is reduced.
Fig. 4 is a plan view of the vapor deposition device in the state shown in fig. 2. With reference to fig. 2 and 4, a casing of the evaporation apparatus includes a first sidewall 11, a second sidewall 12, a third sidewall 13, and a fourth sidewall 14, which are disposed opposite to each other, where the first sidewall 11, the second sidewall 12, the third sidewall 13, and the fourth sidewall 14 enclose an evaporation chamber, and a nozzle 10 is disposed at a bottom of the evaporation chamber. As shown in fig. 2 and fig. 4, in the open state, the first window protector 15 may be tightly attached to the first sidewall 11, and the second window protector 16 may be tightly attached to the second sidewall 12, so as to ensure the smoothness of the evaporation path to the maximum extent, which is helpful for the smooth completion of the evaporation process.
In fig. 1 to 4, the first window protector 15 and the second window protector 16 are illustrated as being rectangular, and in practical use, the first window protector 15 and the second window protector 16 may be shaped as needed. For example, the first window shield 15 and the second window shield 16 may be provided in a triangular shape, and the orthographic projection of the nozzle 10 on the bottom of the evaporation chamber may be located within the range of the orthographic projection of the first window shield 15 on the bottom of the evaporation chamber, so that the closed positions of the first window shield 15 and the second window shield 16 may be shifted from the position of the nozzle 10, as shown in fig. 5. Alternatively, the first window 15 and the second window 16 may be trapezoidal, and the orthographic projection of the nozzle 10 on the bottom surface of the evaporation chamber may be within the range of the orthographic projection of the first window 15 on the bottom surface of the evaporation chamber, so that the closed positions of the first window 15 and the second window 16 may be shifted from the position of the nozzle 10, as shown in fig. 6. Alternatively, the first window protector 15 may be configured as a rectangle with a first notch, the second window protector 16 may be configured as a rectangle with a second notch, the first notch and the second notch are complementary, and the orthographic projection of the nozzle 10 on the bottom surface of the evaporation chamber may be within the range of the orthographic projection of the first window protector 15 on the bottom surface of the evaporation chamber, so that the closed positions of the first window protector 15 and the second window protector 16 may be staggered from the position of the nozzle 10, as shown in fig. 7. Alternatively, the first window 15 may be provided in a circular shape, the second window 16 may be provided in a rectangular shape with a circular notch, and the orthographic projection of the nozzle 10 on the bottom surface of the evaporation chamber may be within the range of the orthographic projection of the first window 15 on the bottom surface of the evaporation chamber, so that the closed positions of the first window 15 and the second window 16 may be shifted from the position of the nozzle 10, as shown in fig. 8. Fig. 5 to 8 only illustrate the positions of the first window protector 15, the second window protector 16 and the nozzle 10, and the contact details at the closed positions of the first window protector 15 and the second window protector 16 may be set as needed, and the present disclosure is not limited thereto. The shape of the first protection window 15 and the second protection window 16 is not limited in the present disclosure, as long as the first protection window 15 and the second protection window 16 can block the vapor deposition material ejected from the nozzle 10 from moving upward in the closed state, and the closed position is shifted from the position of the nozzle 10.
Fig. 9 is a schematic structural view of a first baffle plate in an exemplary embodiment, and fig. 10 is a schematic structural view of a second baffle plate in an exemplary embodiment. In an exemplary embodiment, referring to fig. 1 to 4, a first baffle 19 may be disposed on the first sidewall 11 between the first rotating shaft 17 and the nozzle 10, the first baffle 19 may be disposed at a position close to the first rotating shaft 17, and an orthographic projection of the first rotating shaft 17 at the bottom of the deposition chamber may be within a range of an orthographic projection of the first baffle 19 at the bottom of the deposition chamber. As shown in fig. 9, the first baffle 19 may include a first connection portion 191 and a first extension portion 192, one end of the first connection portion 191 may be connected to the first sidewall 11, the other end of the first connection portion 191 may be connected to the first extension portion 192, and the first extension portion 192 may extend from the other end of the first connection portion 191 to a side away from the nozzle 10. A second baffle 20 can be arranged on the side wall between the second rotating shaft 18 and the nozzle 10, the second baffle 20 can be arranged at a position close to the second rotating shaft 18, and the orthographic projection of the second rotating shaft 18 at the bottom of the evaporation cavity can be within the range of the orthographic projection of the second baffle 20 at the bottom of the evaporation cavity. As shown in fig. 10, the second barrier 20 may include a second connection portion 201 and a second extension portion 202, one end of the second connection portion 201 may be connected to the second sidewall 12, the other end of the second connection portion 201 may be connected to the second extension portion 202, and the second extension portion 202 may extend from the other end of the second connection portion 201 to a side away from the nozzle 10.
In the vapor deposition process, the vapor deposition material may drift to the position of the rotation shaft, and particularly in the state where the protection window is closed, the vapor deposition material is blocked by the first protection window 15 and the second protection window 16, and is likely to move laterally to reach the first rotation shaft 17 and the second rotation shaft 18, and if a large amount of vapor deposition material is accumulated at the first rotation shaft 17 and the second rotation shaft 18, the movement of the first protection window 15 and the second protection window 16 may be affected. In this exemplary embodiment, through set up the baffle structure between nozzle and pivot, can effectually block the accumulation of coating by vaporization material in pivot department, through the extension that sets up the baffle, can effectively block lateral motion's coating by vaporization material, avoid coating by vaporization material to locate the accumulation in the pivot. In addition, in the open state, the evaporation material attached to the protective window may fall off, and the falling evaporation material can be blocked by the baffle and cannot fall to the lower part of the evaporation device due to the fact that the protective window is opened upwards, and the risk of blocking the nozzle can be further avoided.
In an exemplary embodiment, the first and second baffles 19 and 20 may be shaped and sized as desired. The distance between the first baffle 19 and the first rotating shaft 17, and the distance between the second baffle 20 and the second rotating shaft 18 can be set as required; the distance between the first extension 192 and the first sidewall 11, and the distance between the second extension 202 and the second sidewall 12 may be set as desired, which is not limited by the present disclosure. On the basis that can shelter from the pivot, the distance between extension and the lateral wall can set up as far as possible little, can avoid bringing the influence to the coating by vaporization process.
In some techniques, the shield window is opened downward, and in an opened state, a closed position of the shield window is closer to a center line of the nozzle, thereby restricting ejection of the vapor deposition material from the nozzle and reducing a vapor deposition angle. In the exemplary embodiment, the first protective window and the second protective window are arranged to be opened upwards, so that the evaporation angle is improved or increased; in addition, only the original evaporation device needs to be slightly changed, and the rotation direction and the rotation time sequence of the motor can be adaptively adjusted, so that the change of the existing evaporation device is small, the realization is easy, and the method is suitable for popularization.
Fig. 11 is an enlarged view of a dotted line region C in fig. 1. As shown in fig. 11, at the closing position, the first louver 15 may be provided with a first overlapping portion 151, the second louver 16 may be provided with a second overlapping portion 161, the first overlapping portion 151 and the second overlapping portion 161 may be farther from the nozzle 10 in the open state than in the closed state, and the first overlapping portion 151 and the second overlapping portion 161 may cooperate with each other to achieve the hermetic sealing at the closing position. For example: the first overlapping portion 151 may be smaller than the thickness of the first protection window 15 at other positions; the second strap 161 may be less than the thickness of the second window shield 16 elsewhere. The first and second overlapping portions 151 and 161 are overlapped in the direction in which the vapor deposition material is discharged from the nozzle 10 and then closed, and this is designed to control the closing of the vapor deposition material more effectively.
In some embodiments, as shown in fig. 11 in conjunction with fig. 1 and 2, the first overlap 151 and the second overlap 161 are both located on a side of the first rotating shaft 17 away from the nozzle 10 in the open state; and the second bridging portion 161 is adjacent to the second side wall 12 in the open state, and the first bridging portion 151 is adjacent to the first side wall 11 in the open state; or the second overlapping portion 161 is away from the second side wall 12 in the closed state, and the first overlapping portion 151 is away from the first side wall 11 in the closed state; by the design, the evaporation angle can be improved or increased better. (for example, as shown in FIG. 2, the deposition angle includes a first deposition angle a formed by a line connecting the center of the nozzle to the side of the first window 15 away from the center of the nozzle in the open state and the center line of the nozzle, and a second deposition angle b formed by a line connecting the center of the nozzle to the side of the second window 16 away from the center of the nozzle in the open state and the center line of the nozzle).
In some exemplary embodiments, the first evaporation angle a may be set to be smaller than the second evaporation angle b. For example: the second evaporation angle b may be set to be greater than or equal to 20 ° and less than or equal to 45 °; the first evaporation angle a can be smaller than the second evaporation angle b, the size of the first evaporation angle a can be about greater than or equal to 5 degrees and less than or equal to 15 degrees, and the arrangement can ensure that the evaporation conditions of two sides of the component to be coated are not different too much. In practical applications, the first evaporation angle a and the second evaporation angle b may be set according to needs, which is not limited in the present disclosure.
In some exemplary embodiments, a sealing strip or a magnetically attractive member may be disposed on the opposing surfaces of the first and second overlapping portions 151 and 161 to achieve sealing in the closed position, which is not limited by the present disclosure. In other embodiments, the first window guard 15 and the second window guard 16 may adopt other structural designs in the closed position, such as a snap-fit, and the like, and the disclosure is not limited thereto.
In some embodiments, the first bridge 151 and the second bridge 161 may be serrated and may engage each other when closed to cooperate to provide a seal in the closed position.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. An evaporation apparatus, comprising:
the device comprises a shell, a first side wall, a second side wall, a third side wall and a fourth side wall, wherein the first side wall and the second side wall are arranged oppositely, and the third side wall and the fourth side wall are arranged oppositely;
the nozzle is positioned at the bottom of the evaporation cavity;
the first protection window is arranged on the first side wall;
the second protective window is arranged on the second side wall;
the first protection window and the second protection window have an opening state and a closing state, in the closing state, the first protection window and the second protection window are positioned on one side close to the nozzle, and the evaporation cavity is closed; in the open state, the first protection window and the second protection window are located on one side away from the nozzle, and the evaporation cavity is opened.
2. The vapor deposition apparatus according to claim 1, wherein a first rotating shaft is provided on the first side wall, the first protective window is provided on the first rotating shaft, and the first protective window is driven by the first rotating shaft to move; and a second rotating shaft is arranged on the second side wall, the second protection window is arranged on the second rotating shaft, and the second protection window is driven by the second rotating shaft to move.
3. The vapor deposition device according to claim 1, wherein an orthographic projection of the closed positions of the first protective window and the second protective window on the bottom of the vapor deposition chamber does not overlap with an orthographic projection of the nozzle on the bottom of the vapor deposition chamber.
4. The evaporation device according to claim 3, wherein an orthographic projection of the nozzle on the bottom of the evaporation chamber is within a range of an orthographic projection of the first protection window on the bottom of the evaporation chamber.
5. The vapor deposition apparatus according to claim 4, wherein the nozzle is located at a geometric center of a bottom of the vapor deposition chamber, and the first window protector and the second window protector are rectangles having different sizes.
6. The vapor deposition device according to claim 3, wherein the first protective window is provided with a first bridging portion, and the second protective window is provided with a second bridging portion; in the closed state, the first overlapping part and the second overlapping part are matched with each other to realize the sealing at the closed position.
7. The vapor deposition device according to claim 6, wherein an orthographic projection of the first overlapping part on the bottom of the vapor deposition chamber overlaps with an orthographic projection of the second overlapping part on the bottom of the vapor deposition chamber.
8. The vapor deposition device according to claim 7, wherein a sealing strip or a magnetically attracting member is provided on a surface of the first contact portion facing the second contact portion in the closed state.
9. The evaporation device according to claim 2, wherein a first baffle is disposed on a first side wall of the first rotation shaft in a direction close to the nozzle, the first baffle is disposed close to the first rotation shaft, and an orthographic projection of the first rotation shaft on the bottom of the evaporation chamber is within a range of an orthographic projection of the first baffle on the bottom of the evaporation chamber;
the second rotating shaft is close to a second side wall in the nozzle direction, a second baffle is arranged on the second side wall, close to the second rotating shaft, and the orthographic projection of the bottom of the evaporation cavity is located in the range of the orthographic projection of the bottom of the evaporation cavity.
10. The vapor deposition apparatus according to claim 9, wherein the first baffle plate includes a first connecting portion and a first extending portion, one end of the first connecting portion is connected to the first sidewall, the other end of the first connecting portion is connected to the first extending portion, and the first extending portion extends from the other end of the first connecting portion to a side away from the nozzle;
the second baffle comprises a second connecting portion and a second extending portion, one end of the second connecting portion is connected with the second side wall, the other end of the second connecting portion is connected with the second extending portion, and the second extending portion extends from the other end of the second connecting portion to one side far away from the nozzle.
CN202211151501.0A 2022-09-21 2022-09-21 Evaporation plating device Pending CN115449756A (en)

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Application Number Priority Date Filing Date Title
CN202211151501.0A CN115449756A (en) 2022-09-21 2022-09-21 Evaporation plating device

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CN112301313A (en) * 2019-07-29 2021-02-02 佳能特机株式会社 Nozzle unit, crucible, evaporation source, and vapor deposition apparatus
CN114481035A (en) * 2022-01-12 2022-05-13 合肥维信诺科技有限公司 Vapor deposition apparatus and method for recovering vapor deposition material
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Publication number Priority date Publication date Assignee Title
JPH0665465U (en) * 1993-02-26 1994-09-16 株式会社島津製作所 Vapor deposition equipment
JP2006249541A (en) * 2005-03-14 2006-09-21 Hitachi Zosen Corp Vapor deposition apparatus
JP2007277645A (en) * 2006-04-07 2007-10-25 Ulvac Japan Ltd Vapor deposition apparatus, vapor deposition method and method of forming inorganic alignment layer
JP2008088464A (en) * 2006-09-29 2008-04-17 Seiko Epson Corp Vapor deposition apparatus, vapor deposition method, and manufacturing method of organic electroluminescent apparatus
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CN114481035A (en) * 2022-01-12 2022-05-13 合肥维信诺科技有限公司 Vapor deposition apparatus and method for recovering vapor deposition material

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