CN114473108B

CN114473108B - Wave soldering apparatus

Info

Publication number: CN114473108B
Application number: CN202210295546.9A
Authority: CN
Inventors: 肖建勇; 白小双
Original assignee: Dongguan Slow Industry Chengpin Technology Co ltd; Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Current assignee: Dongguan Slow Industry Chengpin Technology Co ltd; Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2023-07-25
Anticipated expiration: 2042-03-23
Also published as: CN114473108A

Abstract

The application relates to the technical field of wave soldering and provides wave soldering equipment. The wave soldering apparatus includes a frame; the nozzle is arranged on the frame and is suitable for extending along the transverse direction of the frame; the movable rail and the fixed rail are arranged on the rack and are suitable for extending along the longitudinal direction of the rack, and the movable rail is suitable for transversely acting along the rack relative to the fixed rail; the baffle plate assembly is movably arranged on the frame along the transverse direction of the frame, and the baffle plate assembly is suitable for being driven by the movable rail to stay on at least one side of the nozzle. According to the wave soldering equipment, the baffle assembly is driven to move to at least one side of the nozzle through the movable rail, so that the baffle assembly shields part of tin liquid which is not required to be welded in a specific area, and the tin liquid sprayed out of the nozzle which is not required to be welded does not need to be in excessive contact with air when flowing into the specific area, so that the possibility of oxidation of the tin liquid is reduced, and the generation of tin slag is reduced.

Description

Wave soldering apparatus

Technical Field

The application relates to the technical field of wave soldering, in particular to wave soldering equipment.

Background

Wave soldering is a process of forming a solder wave with a specific shape on the liquid surface of a solder tank by molten liquid solder under the action of a pump, placing a PCB (printed Circuit Board) with components inserted on a conveying chain, and penetrating the solder wave through a certain specific angle and a certain immersion depth to realize welding of welding spots. However, in the actual production process, the solder in liquid state is extremely easy to oxidize and form tin slag due to the flow of tin waves and the contact of the solder with oxygen in air, so that not only can the welding quality be reduced, but also the tin slag needs to be cleaned regularly, and the starting rate of wave soldering equipment is reduced.

Disclosure of Invention

The present application aims to solve at least one of the technical problems existing in the related art. Therefore, the wave soldering equipment can effectively reduce the generation of tin slag.

The embodiment of the application provides wave soldering equipment, including:

a frame;

the nozzle is arranged on the frame and is suitable for extending along the transverse direction of the frame;

the movable rail and the fixed rail are arranged on the rack and are suitable for extending along the longitudinal direction of the rack, and the movable rail is suitable for transversely acting along the rack relative to the fixed rail;

the baffle plate assembly is movably arranged on the rack along the transverse direction of the rack, and the movable rail is used for driving the baffle plate assembly to move relative to the side part of the nozzle.

According to the wave soldering equipment provided by the embodiment of the application, the baffle plate assembly is movably arranged on the rack and connected with the movable rail, and when the movable rail acts to transport the welded piece, the baffle plate assembly can be synchronously driven to move to at least one side of the nozzle. By the arrangement, the baffle plate assembly can shield part of tin liquid which is not required to be welded in a specific area, such as a tin bath, so that the tin liquid sprayed out of the nozzle which is not required to be welded does not need to be in excessive contact with air when flowing into the specific area, the possibility of oxidizing the tin liquid is further reduced, and the generation of tin slag is reduced. Meanwhile, the movable rail drives the baffle assembly to move along the transverse direction of the frame, and an additional driving mechanism is not required to be arranged to drive the baffle assembly, so that the structure of the wave soldering equipment is simplified, and the design and manufacturing cost and the later maintenance cost of the wave soldering equipment are reduced. Meanwhile, the baffle assembly moves relative to the side part of the nozzle, so that the nozzle is not blocked from normally spraying tin liquid, and the spraying stability of the wave soldering equipment is ensured.

According to one embodiment of the present application, the baffle assembly includes:

the first baffle is arranged on the first side of the nozzle along the longitudinal direction of the frame;

a second baffle plate arranged on a second side of the nozzle along the longitudinal direction of the frame;

the connecting plate is connected between the first baffle plate and the second baffle plate.

According to one embodiment of the present application, the movable rail is provided with a connecting rod, and the connecting rod is connected to the connecting plate, so that the movable rail drives the first baffle and the second baffle to act through the connecting plate.

According to one embodiment of the application, the rack is provided with an elongated slot, the elongated slot is suitable for extending along the longitudinal direction of the rack, and the connecting rod is inserted into the elongated slot.

According to an embodiment of the application, the frame is provided with a coaming, and the coaming is provided with a slot suitable for being inserted into the first baffle and/or the second baffle.

According to one embodiment of the application, a tin bath is provided on at least one side of the nozzle in the longitudinal direction of the frame.

According to one embodiment of the application, a deflector adapted to introduce tin dross into the tin bath is arranged on the side of the frame close to the tin bath.

According to one embodiment of the application, the spacing between the first baffle and the second baffle gradually decreases from the bottom of the rack to the top of the rack.

According to one embodiment of the present application, the first baffle and the second baffle are both stainless steel baffles.

According to one embodiment of the application, a plurality of groups of nozzles are arranged on the rack along the longitudinal direction of the rack, and each group of nozzles is provided with the baffle assembly.

The above technical solutions in the embodiments of the present application have at least one of the following technical effects:

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for a person having ordinary skill in the art.

FIG. 1 is a schematic block diagram of one angle of a wave soldering apparatus provided in an embodiment of the present application;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a schematic block diagram of a shroud and nozzle provided in an embodiment of the present application;

FIG. 4 is a schematic top view of a wave soldering apparatus provided in an embodiment of the present application;

FIG. 5 is a schematic block diagram of another angle of a wave soldering apparatus provided in an embodiment of the present application;

fig. 6 is a partial enlarged view at B in fig. 5.

Reference numerals:

100. a frame; 102. a nozzle; 104. a movable rail; 106. a fixed rail; 108. a baffle assembly; 110. a first baffle; 112. a second baffle; 114. a connecting plate; 116. a connecting rod; 118. a long groove; 120. coaming plate; 122. a slot; 124. a tin bath; 126. and a deflector.

Detailed Description

Embodiments of the present application are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the present application but are not intended to limit the scope of the present application.

In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on those shown in the drawings, are merely for convenience in describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the embodiments of the present application will be understood by those of ordinary skill in the art in a specific context.

In the examples herein, a first feature "on" or "under" a second feature may be either the first and second features in direct contact, or the first and second features in indirect contact via an intermediary, unless expressly stated and defined otherwise. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

As shown in fig. 1-6, embodiments of the present application provide a wave soldering apparatus comprising a frame 100, a nozzle 102, a movable rail 104, a fixed rail 106, and a baffle assembly 108; wherein the nozzle 102 is disposed on the frame 100 along a lateral direction of the frame 100; the movable rail 104 and the fixed rail 106 are disposed on the frame 100 along the longitudinal direction of the frame 100, and the movable rail 104 is adapted to move relative to the fixed rail 106 along the lateral direction of the frame 100; the baffle assembly 108 is movably disposed on the frame 100 along a transverse direction of the frame 100, and the baffle assembly 108 is adapted to rest on at least one side of the nozzle 102 by being driven by the movable rail 104.

According to the wave soldering apparatus provided in the embodiment of the application, the baffle assembly 108 is movably disposed on the rack 100, and the baffle assembly 108 is connected with the movable rail 104, so that when the movable rail 104 acts to transport a soldered piece, the baffle assembly 108 can be synchronously driven to move to at least one side of the nozzle 102. By this arrangement, the baffle assembly 108 is able to shield a portion of the molten tin that is not being soldered from a particular area, such as the tin bath 124, which eliminates the need for excessive contact with air when flowing to the particular area for molten tin ejected from the soldering nozzle 102, thereby reducing the likelihood of oxidation of the molten tin and the creation of tin dross. Meanwhile, the movable rail 104 drives the baffle assembly 108 to move along the transverse direction of the rack 100, and an additional driving mechanism is not required to be arranged to drive the baffle assembly 108, so that the structure of the wave soldering equipment is simplified, and the design and manufacturing cost and the later maintenance cost of the wave soldering equipment are reduced. Meanwhile, the baffle assembly 108 moves relative to the side part of the nozzle 102, so that the nozzle 102 is not blocked from normally spraying tin liquid, and the spraying stability of the wave soldering equipment is ensured.

With continued reference to fig. 1-6, the frame 100 is used to mount a movable rail 104, a fixed rail 106, a baffle assembly 108, and the like. The frame 100 has a substantially rectangular frame-shaped structure, and by providing the frame 100, stable support can be provided for each of the above-described components.

The lateral direction of the stent mentioned above refers to the up-down direction as shown in fig. 4, and the longitudinal direction of the stent mentioned above refers to the left-right direction as shown in fig. 4.

The movable rail 104 and the fixed rail 106 are disposed on the frame 100 along a longitudinal direction of the frame 100, wherein the fixed rail 106 is fixed relative to the position of the frame 100, and the movable rail 104 is movable relative to the position of the frame 100. It is understood that the movable rail 104 may act in a lateral direction of the frame 100 relative to the fixed rail 106. By the arrangement, the welded parts with different specifications can be transmitted by changing the relative positions of the movable rail 104 and the fixed rail 106.

The nozzles 102 are disposed on the frame 100 along a lateral direction of the frame 100, and in one embodiment, the width of the nozzles 102 may be set to be the same width as the frame 100, and in other embodiments, the width of the nozzles 102 may be set to be slightly smaller than the width of the frame 100.

It will be appreciated that the weldment may enter the wave soldering apparatus along the length of the frame 100 and that the nozzle 102 may spray solder along the width of the weldment as the weldment passes the nozzle 102. In this process, since the sizes of the welded parts are different, when the welded parts with relatively smaller sizes enter the rack 100, not all the molten tin sprayed from the nozzles 102 needs to be sprayed onto the welded parts, so that the molten tin which is not sprayed onto the welded parts will contact with air, the molten tin contacted with air will be oxidized by air to form tin slag, and the tin slag will fall into the tin bath 124 to cause the molten tin in the tin bath 124 to splash, thereby causing more molten tin to contact with air to form tin slag. Moreover, since the dross does not re-melt, it can only be cleaned out of the tin bath 124 on a regular basis, which can result in frequent cleaning of the wave soldering apparatus and reduced start-up rates.

Therefore, in the embodiment of the present application, the shutter assembly 108 that is movable relative to the frame 100 is provided to block the nozzle 102 that does not need to be sprayed, and it should be noted that, the blocking mentioned herein refers to blocking at least one side of the nozzle 102, and by this arrangement, the probability that the tin liquid sprayed from the nozzle 102 that does not need to be sprayed contacts with air can be reduced, so that the probability that the tin liquid sprayed from the nozzle 102 that does not need to be sprayed forms tin slag is reduced, and the generation of tin slag is reduced.

Referring to fig. 2, in the embodiment of the present application, a tin bath 124 is provided on at least one side of the nozzle 102 in the longitudinal direction of the frame 100.

By providing the tin bath 124 on at least one side of the nozzle 102, the tin liquid can be stored and the excess tin liquid after the spraying can be recovered.

In other embodiments, a tin bath 124 may also be provided on both sides of the nozzle 102. Note that, the two sides of the nozzle 102 mentioned here means that tin baths 124 are provided on both front and rear sides of the nozzle 102 along the longitudinal direction of the frame 100.

According to one embodiment of the present application, a deflector 126 is provided on the side of the rack 100 adjacent to the tin bath 124, which is adapted to introduce tin dross into the tin bath 124.

By providing the baffle 126 on the side of the frame 100 adjacent to the tin bath 124, the oxidized tin dross can be guided into the tin bath 124 by the baffle 126. It can be appreciated that by providing the baffle 126 on one side of the tin bath 124, the speed of the tin dross entering the tin bath 124 can be slowed down, or the angle of the tin dross entering the tin bath 124 can be adjusted, so that the tin dross is prevented from falling vertically into the tin bath 124 to splash tin liquid in the tin bath 124. In the embodiment of the present application, the deflector 126 may be provided in various shapes such as an arc surface, a plane surface, etc., as long as the purpose of introducing the tin dross into the tin bath 124 can be achieved.

In the embodiment of the present application, the shutter assembly 108 is driven by the movable rail 104 to complete the shielding of a part of the nozzle 102. By this arrangement, the shutter assembly 108 can be moved to the corresponding position by the driving of the movable rail 104. Because the distance between the movable rail 104 and the fixed rail 106 is adapted to the structural dimension of the welded piece when the movable rail 104 moves relative to the fixed rail 106, the baffle assembly 108 can be guaranteed to stay at the position where the nozzle 102 is shielded without operation when the baffle assembly 108 is driven to move by the movable rail 104, and the purpose of driving the baffle assembly 108 to move can be achieved without setting an additional driving mechanism for the baffle assembly 108.

According to one embodiment of the present application, the baffle assembly 108 includes a first baffle 110, a second baffle 112, and a connecting plate 114; the first baffle 110 is disposed on a first side of the nozzle 102 along a longitudinal direction of the frame 100; the second baffle 112 is disposed on a second side of the nozzle 102 along the longitudinal direction of the frame 100; the connection plate 114 is connected between the first barrier 110 and the second barrier 112.

Referring to fig. 2, the baffle assembly 108 includes a first baffle 110 and a second baffle 112 that are interconnected, it being understood that the first baffle 110 and the second baffle 112 are connected by a connecting plate 114. As shown in fig. 2, the first barrier 110 is disposed at the front side of the nozzle 102 along the longitudinal direction of the frame 100, and the second barrier 112 is disposed at the rear side of the nozzle 102 along the longitudinal direction of the frame 100. By providing the first baffle 110 and the second baffle 112 on the front and rear sides of the nozzle 102, the separation effect of the baffle assembly 108 on the molten tin and air can be effectively improved, so that the contact probability of the molten tin and air is further reduced, and the possibility of generating tin slag is reduced.

The first baffle 110 and the second baffle 112 are connected by the connecting plate 114, so that the synchronization rate of the first baffle 110 and the second baffle 112 is higher, and the first baffle 110 and the second baffle 112 can act together to realize shielding of the nozzle 102 without working.

According to an embodiment of the present application, the movable rail 104 is provided with a connecting rod 116, and the connecting rod 116 is connected to the connecting plate 114, so that the movable rail 104 drives the first baffle 110 and the second baffle 112 to act.

Referring to fig. 6, a connecting rod 116 connected to the baffle assembly 108 is disposed on the movable rail 104, the connecting rod 116 is connected to the connecting plate 114 described above, and the connecting rod 116 and the connecting plate 114 can be connected by inserting, bolting, etc.

According to one embodiment of the present application, an elongated slot 118 is provided on the connection plate 114 along the longitudinal direction of the frame 100, and the connection rod 116 is inserted into the elongated slot 118.

As shown in fig. 6, the connecting plate 114 is provided with an elongated slot 118 extending in the longitudinal direction of the frame 100, one end of the connecting rod 116 is connected to the movable rail 104, and the other end of the connecting rod 116 is inserted into the elongated slot 118 of the connecting plate 114. By this arrangement, not only connection of the link 116 with the connection plate 114 is achieved, but also connection stability of the movable rail 104 with the connection plate 114 can be ensured even if the movable rail 104 has a certain offset with respect to the connection plate 114 in the longitudinal direction of the frame 100.

According to one embodiment of the present application, the chassis 100 is provided with a shroud 120, and the shroud 120 is provided with slots 122 adapted to receive the first baffle 110 and/or the second baffle 112.

Referring to fig. 2, the shroud 120 is disposed on the rack 100, and by disposing the shroud 120 on the rack 100 and disposing the shroud 120 in a form surrounding the nozzle 102, tin liquid sprayed by the spray set and air can be isolated to a certain extent, so that tin slag formed by oxidation of tin liquid sprayed by the nozzle 102 and air in contact can be avoided.

It will be appreciated that the shroud 120 may be wrapped around the nozzle 102 to form a fully enclosed structure. Slots 122 are also provided in the shroud 120 at the locations where it meets the first and second baffles 110, 112. That is, the first and second baffles 110 and 112 can form a plug-in fit with the shroud 120 through the slots 122, and by this arrangement, the restriction and guiding actions of the first and second baffles 110 and 112 can be achieved through the slots 122 provided on the shroud 120, so that the first and second baffles 110 and 112 are prevented from being deviated in the process of following the movement of the movable rail 104.

In accordance with one embodiment of the present application, there are at least two sets of nozzles 102 along the longitudinal direction of the frame 100, and the baffle assemblies 108 are in one-to-one correspondence with the nozzles 102.

Referring to fig. 2, in the wave soldering apparatus provided in the embodiment of the present application, at least two groups of nozzles 102 are provided, where the two groups of nozzles 102 are disposed at intervals along the longitudinal direction of the frame 100, and along the direction from left to right as shown in fig. 4, the two groups of nozzles 102 are defined as a first group of nozzles 102 and a second group of nozzles 102, respectively, where the tin liquid ejected from the first group of nozzles 102 is a turbulent wave, and is used to prevent a cold solder joint in wave soldering from occurring; the molten tin ejected from the second set of nozzles 102 is a smooth wave that serves to help eliminate burrs and solder bridges. Accordingly, in order to prevent tin liquid ejected from the first group of nozzles 102 and the second group of nozzles 102 from being oxidized by air to form tin dross, a baffle assembly 108 is provided at each of the positions corresponding to the first group of nozzles 102 and the second group of nozzles 102.

It will be appreciated that a first baffle 110 and a second baffle 112 are provided on the front and rear sides of the first set of nozzles 102 and the front and rear sides of the second set of nozzles 102, respectively. By the arrangement, tin liquid sprayed by the first group of nozzles 102 and the second group of nozzles 102 can be prevented from being contacted with air to form tin slag, and the opening rate of the wave soldering equipment is improved.

According to one embodiment of the present application, the spacing between the first baffle 110 and the second baffle 112 gradually decreases from the bottom of the rack 100 toward the top of the rack 100.

In this embodiment, the first baffle 110 and the second baffle 112 taper from the bottom of the rack 100 to the top of the rack 100, that is, from the bottom of the rack 100 to the top of the rack 100, and the second baffle 112 gradually approaches to the first baffle 110. By this arrangement, the molten tin sprayed from the nozzle 102 can be concentrated, and the formation of the tin slag can be further avoided.

According to one embodiment of the present application, the first baffle 110 and the second baffle 112 are made of stainless steel.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. A wave soldering apparatus, comprising:

a frame (100);

-a nozzle (102) arranged in the frame (100) and adapted to extend in a transversal direction of the frame (100);

a movable rail (104) and a fixed rail (106) arranged on the frame (100) and adapted to extend in the longitudinal direction of the frame (100), the movable rail (104) being adapted to move in the transverse direction of the frame (100) relative to the fixed rail (106);

the baffle assembly (108) is movably arranged on the rack (100) along the transverse direction of the rack (100), and the movable rail (104) is used for driving the baffle assembly (108) to move relative to the side part of the nozzle (102) so as to reduce the contact probability of molten tin and air;

the baffle assembly (108) includes:

a first baffle (110) disposed on a first side of the nozzle (102) along a longitudinal direction of the frame (100);

a second baffle (112) disposed on a second side of the nozzle (102) along a longitudinal direction of the frame (100);

a connection plate (114) connected between the first baffle (110) and the second baffle (112);

a connecting rod (116) is arranged on the movable rail (104), the connecting rod (116) is connected to the connecting plate (114), and the movable rail (104) drives the first baffle (110) and the second baffle (112) to act through the connecting plate (114);

a coaming (120) is arranged along the circumferential direction of the nozzle (102), and slots (122) which are suitable for being inserted into the first baffle (110) and/or the second baffle (112) are formed in the coaming (120).

2. The wave soldering apparatus as claimed in claim 1, wherein the connection plate (114) is provided with an elongated slot (118), and the elongated slot (118) is adapted to extend in a longitudinal direction of the frame (100), and the connection rod (116) is inserted into the elongated slot (118).

3. Wave soldering apparatus according to claim 1, wherein a tin bath (124) is provided on at least one side of the nozzle (102) in the longitudinal direction of the frame (100).

4. A wave soldering apparatus according to claim 3, characterized in that a deflector (126) is provided on the side of the frame (100) adjacent to the tin bath (124) adapted to introduce tin dross into the tin bath (124).

5. The wave soldering apparatus of any one of claims 1 to 4, wherein a spacing between the first baffle (110) and the second baffle (112) gradually decreases from a bottom of the rack (100) to a top of the rack (100).

6. The wave soldering apparatus of any one of claims 1 to 4, wherein the first baffle (110) and the second baffle (112) are both stainless steel baffles.

7. Wave soldering apparatus according to any one of claims 1 to 4, wherein a plurality of sets of said nozzles (102) are provided on said frame (100) in a longitudinal direction of said frame (100), each set of said nozzles (102) being provided with said baffle assembly (108).