CN218193042U

CN218193042U - Wave crest width adjusting device for wave crest welding equipment

Info

Publication number: CN218193042U
Application number: CN202222261953.6U
Authority: CN
Inventors: 黄志军; 范国良; 余允红; 徐茂增
Original assignee: LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Current assignee: LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date: 2022-08-26
Filing date: 2022-08-26
Publication date: 2023-01-03
Anticipated expiration: 2032-08-26

Abstract

The application discloses a wave width adjusting device for wave soldering equipment, the wave soldering equipment comprises a guide rail for transporting electronic components and a solder groove for containing solder, the wave width adjusting device is detachably connected with the guide rail, the wave width adjusting device comprises a blocking part, and the blocking part covers the area of the solder which is positioned outside the guide rail and is not contacted with the electronic components. This eliminates excessive contact with air for solder that does not participate in soldering, thereby reducing the possibility of solder oxidation.

Description

Wave crest width adjusting device for wave crest welding equipment

Technical Field

The application belongs to the field of wave soldering, and relates to a wave crest width adjusting device for wave crest soldering equipment.

Background

Wave soldering is one of the most widely used techniques in electronics manufacturing, and is widely used for soldering electronic components such as Printed Circuit Boards (PCBs) or for tinning terminals or pins of electronic components. In wave soldering apparatus, molten solder (e.g., lead-tin alloy, tin-copper alloy, tin-silver-copper alloy, etc.) is sprayed by an electric or electromagnetic pump into a solder wave meeting design requirements. The printed circuit board achieves mechanical and electrical connection between the terminals or leads of the electronic component and the printed circuit board through the solder wave.

The continuous impact of the solder wave brings oxygen in the air into the solder bath, and the oxygen and the molten solder in the solder bath undergo oxidation reaction, thereby generating a large amount of oxidation slag, i.e., tin slag. The tin slag floats on the surface of the solder, which affects the soldering quality. Therefore, reducing the generation of solder dross is an important issue in wave soldering technology.

The prior art has disclosed methods for reducing the tin dross. The Chinese patent with the publication number CN101323064A discloses an oxidation-resistant Sn-Cu lead-free solder. The oxidation-resistant Sn-Cu lead-free solder is obtained by adding trace elements, and compared with the traditional solder, the oxidation-resistant Sn-Cu lead-free solder has the advantages of high oxidation resistance, low slag, low cost and excellent service performance. Chinese utility model patent publication No. CN 213318203U discloses a wave soldering protection device and a wave soldering machine. The wave-soldering protection device introduces inert gas during soldering, reduces the oxygen content in the soldering environment, thereby reducing tin slag and prolonging the normal operation time of the wave soldering machine.

The width of the printed circuit board is typically between 3cm and 40 cm. The width of the wave or the width of the solder groove of a commonly used wave soldering machine is fixed. Each production line is typically used to produce printed circuit boards of a fixed size. When the width of the printed circuit board is smaller than the width of the wave crest, for example, the width of the PCB only occupies 1/2 to 1/3 of the width of the tin bath, a certain waste will be caused. The wider the width of the wave, the greater the area of solder exposed to the air and the more dross is formed by the excess solder that continues to splash.

In view of the above, the inventor of the present application has devised a wave width adjusting apparatus that controls unnecessary flow and splash of solder according to the width of a printed circuit board to be soldered, thereby greatly reducing the generation of solder dross.

Disclosure of Invention

In order to overcome the technical problems in the prior art, the application provides a wave width adjusting device for wave soldering equipment.

In order to achieve the above object, the present application discloses a wave width adjusting device for a wave soldering apparatus including a guide rail for transporting electronic components and a solder bath for containing solder, the wave width adjusting device being detachably attached to the guide rail, the wave width adjusting device including a blocking member that covers an area of the solder that is outside the guide rail and that is not in contact with the electronic components.

Further, the blocking member is a brush.

Further, the brush comprises bristles and a handle.

Furthermore, the bristles are arranged in the mounting holes, and the mounting holes are uniformly distributed on the brush handle.

Further, the material of the bristles is aluminum alloy, stainless steel or titanium alloy, preferably stainless steel.

Further, the length of the bristles ranges from 1 to 100mm, preferably from 5 to 60mm, more preferably from 10 to 30mm, and most preferably from 10 to 14 mm.

Further, the cross-sectional diameter of each bristle is between 0.01 and 0.5mm, preferably between 0.05 and 0.4mm, and more preferably between 0.1 and 0.3 mm.

Compared with the prior art, the technical scheme that this application provided has following advantage:

by providing a wave width adjusting device mounted on the wave soldering apparatus, the dam member covers the area of the solder wave not in contact with the electronic component. This eliminates excessive contact with air for solder that does not participate in soldering, thereby reducing the possibility of solder oxidation. Compared with a method for changing the solder composition, the wave crest width adjusting device is simpler and easier to install, and meanwhile, the problem that the welding quality is influenced by changing the solder composition is avoided.

Drawings

The advantages and spirit of the present application can be further understood by the following detailed description and the accompanying drawings.

FIG. 1 is a top view of a brush provided herein;

FIG. 2 is a schematic view of a brush according to the present application;

FIG. 3 is a schematic view of the installation of the brush provided herein;

FIG. 4 shows the effect of the presence or absence of brush attachment on the weight of dross formed;

fig. 5 shows the effect of bristle length on the weight of the dross formed.

Detailed Description

Specific embodiments of the present application are described in detail below with reference to the accompanying drawings. However, the present application should be understood as not being limited to such an embodiment described below, and the technical idea of the present application may be implemented in combination with other known techniques or other techniques having the same functions as those of the known techniques.

In the following description of the embodiments, for purposes of clarity of illustration of the structure and operation of the present application, directional terms are used, and the terms "front", "rear", "left", "right", "outer", "inner", "outward", "inward", "axial", "radial", and the like are to be construed as words of convenience and not as words of limitation.

In the following description of specific embodiments, it is understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

The terms "upward," "downward," "above," and "below" are made with reference to the central longitudinal axis of the tube. Thus, the terms "upward" and "downward" should be understood to refer to directions away from and toward the longitudinal axis. Further, when a first structure is described as being positioned "above" or "below" a second structure, this should be understood to mean that the first structure is positioned farther or closer to the longitudinal axis.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not intended to limit the temporal order, magnitude, or importance, but are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated, but merely to distinguish one technical feature from another technical feature in the present technical solution. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically stated otherwise. Similarly, the appearances of the phrases "a" or "an" in various places herein are not necessarily all referring to the same quantity, but rather to the same quantity, and are intended to cover all technical features not previously described. Similarly, unless a specific number of a claim recitation is intended to cover both the singular and the plural, and embodiments may include a single feature or a plurality of features. Similarly, modifiers similar to "about", "approximately" or "approximately" that occur before a numerical term herein typically include the same number, and their specific meaning should be read in conjunction with the context.

It should be understood that in the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" is used to describe the association relationship of the associated objects, meaning that there may be three relationships, for example, "a and/or B" may mean: only A, only B and both A and B are present, wherein A and B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single item(s) or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.

In this application, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise specifically indicated and limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. "fixedly connected" or "non-movably connected" is understood to mean that the connection between two or more structural members is not configured to provide relative movement. An example of a fixed connection is a welded joint or a bolted joint, and in some cases a welded joint and a bolted joint. "movably connected" or "movable" or "movably connected" is understood to mean a connection between two or more structural members that allows for horizontal and/or vertical relative movement between the members under extreme dynamic loads. Such connections are generally not permitted to move under static or generally dynamic loads (e.g., as imposed by wind forces from mild/moderate).

The terms "unit", "piece", "object", and "module" described in the present specification denote units for processing at least one of functions and operations, and may be implemented by hardware components or software components, and a combination thereof.

Unless clearly indicated to the contrary, each aspect or embodiment defined herein may be combined with any other aspect or embodiments or embodiment or embodiments. In particular, any feature indicated as being preferred or advantageous may be combined with any other feature indicated as being preferred or advantageous.

Most wave soldering devices now use dual wave soldering, where the two wave crests of the dual wave soldering are called advection wave and turbulence wave, respectively. The turbulent wave impacts the welding surface of the PCB at certain pressure and speed, and can well penetrate into a dense welding area. The turbulent wave is beneficial to overcoming the welding dead zone formed by exhausting and shielding, the capability of the solder reaching the welding dead zone is improved, and the defects of missing welding and insufficient vertical filling are greatly reduced. And the turbulent wave has high impact speed and short action time, so that the heating of a welding area and the wetting and spreading of the solder are not uniform, redundant solder can be bridged or clamped at a welding point, and burrs and welding bridges generated by the turbulent wave need to be eliminated by the advective wave.

In wave soldering, not all of the solder material needs to be sprayed onto the electronic components after the electronic components of different sizes enter the wave soldering apparatus. This causes the excess solder that is not sprayed onto the electronic component to be constantly in contact with the air, and to be constantly oxidized by the air to form dross. The tin dross can drop to cause splashing of molten tin in the molten tin bath, and then make more molten tin contact with the air and form the tin dross. Because the tin dross can not be melted again, the tin dross can only be cleaned from the tin bath regularly by workers, so that wave soldering equipment is cleaned frequently, and the efficiency is reduced.

The wave crest width adjusting device in the application is installed on a guide rail for transporting electronic components. And a blocking component can be arranged on the outer side of the guide rail as a wave crest width adjusting device according to requirements. And setting the guide rail to a position meeting the requirement according to the width of the electronic element, and starting the wave crest. Therefore, the blocking component of the application blocks the redundant tin liquid, and equivalently divides the tin liquid into two parts of flowing tin and static tin. The blocking member is moved to the proper position and height to block the flow of the "still tin" level. The flowing tin still flows along with the movement of the electronic element, and the static tin is kept relatively static, so that the possibility of forming tin dross by the tin liquid which is not in contact with the electronic element is reduced, and the generation of the tin dross is reduced. Illustratively, the amount of dross can be reduced by about 30% to 40% using the peak width modulation device of the present application.

For example, in the application, the brush is used as a blocking part, and the solder breaks through the blocking of the brush and needs a large tension. It is difficult for the solder to pass through the gap between the brushes. According to the width of the electronic element needing to be welded, the width adjusting device can shield part of the tin liquid which does not need to be welded in a specific area, so that the tin liquid which does not need to be welded does not need to be in excessive contact with air when flowing to the specific area, and the possibility of oxidation of the tin liquid is further reduced.

Specific embodiments of the present application will be described in detail below with reference to fig. 1-5.

The whole blocking component can be integrally formed or can be made into a detachable split structure. When the blocking means is a brush, as shown in fig. 1 and 2, comprising a bristle 101 and a handle 102, the bristle 101 and the handle 102 may be connected together by means of a screw hole 103. The entire barrier member is mounted to the rails of the wave soldering apparatus via the brush mounting holes 104. The blocking member can move along with the adjustment of the guide rail, so that the brush bristles 101 cover the channel of the tin bath into which the part of the tin bath which is positioned outside the guide rail and is not in contact with the electronic element flows, thereby reducing the unnecessary flow of the tin bath.

The brush bristles 101 and the brush holder 102 can be made of metal materials which cannot be soaked by tin liquid, are not easy to dissolve and are high-temperature resistant. At the same time, the bristles 101 and handle 102 also maintain good mechanical properties at the process temperatures of wave soldering. The metal material includes, but is not limited to, aluminum alloy, stainless steel, titanium alloy, and the like.

The length of the bristles ranges from 1 to 100mm, preferably from 5 to 60mm, more preferably from 10 to 30mm, and most preferably from 10 to 14 mm. The cross-sectional diameter of each bristle is in the range of 0.01 to 0.5mm, preferably 0.05 to 0.4mm, more preferably 0.1 to 0.3 mm. If the cross-section of the bristle is not circular, the "diameter of the cross-section of the bristle" refers to the diameter of the circumscribed circle of the largest cross-section of the bristle.

According to the general flow of fishing out the tin dross, a ladle is used for fishing out the tin dross, and the cooled tin dross is weighed by an electronic balance. Illustratively, varying different bristle lengths resulted in the results shown in FIG. 5. The longer the length of the bristles in a certain range, the smaller the weight of the dross generated by the wave soldering apparatus.

The brush hair in this application only need satisfy can block the requirement that tin liquid flows can, consequently this application does not do the special limitation to the holistic cross sectional shape of brush hair. Specifically, the cross-sectional shape of the entire bristle may be square, U-shaped, or the like.

Specifically, a stop member 306 is mounted to the guide rail of the wave soldering apparatus, as shown in FIG. 3. The rail 301 is adjusted to the appropriate position according to the width of the electronic component 305 and the brush in the blocking part 306 is moved to the appropriate position to block the flow of "static tin" that does not directly participate in the soldering process. A thin metal oxide film is formed on the surface of the molten tin in the "static tin" region, thereby further preventing the oxidation of the molten tin.

The brush is made of stainless steel 316 and is arranged on the movable guide rail 301. The advection wave 304 and the spoiler wave 303 are turned on. There is a portion of the tin that is not in contact with the electronic components and the bristles can cover the path of the portion of the tin that is outside the rail 301 and that flows into the tin bath 302. The flow of tin is reduced, oxidation is reduced and the formation of dross is correspondingly reduced. Illustratively, taking the length of the brush bristles as 14mm as an example, according to a general tin dross scooping procedure of a person skilled in the art, the tin dross is scooped out by using an iron spoon, and is weighed by using an electronic balance after being cooled. As shown in fig. 4, the use of the brush can effectively reduce the generation of the dross.

Through simple transformation equipment, the production of tin dross has been significantly reduced in this application, compares in the production that changes the solder composition and reduce the welding slag, has avoided changing the composition and has influenced welding quality's problem.

The embodiments described in this specification are only preferred embodiments of the present application, and the above embodiments are only used to illustrate the technical solutions of the present application and not to limit the present application. Any technical solutions that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments according to the concepts of the present application shall fall within the scope of the present application.

Claims

1. A wave width adjusting device for a wave soldering apparatus, characterized in that the wave soldering apparatus comprises a guide rail for transporting electronic components and a solder bath for containing solder, the wave width adjusting device being detachably connected to the guide rail, the wave width adjusting device comprising a blocking member which covers an area of the solder which is located outside the guide rail and which is not in contact with the electronic components.

2. The wave width adjustment device of claim 1, wherein the blocking member is a brush.

3. The wave width adjustment device for a wave soldering apparatus according to claim 2, wherein the brush includes bristles and a handle.

4. The wave width adjustment device for a wave soldering apparatus according to claim 3, wherein the bristles are disposed in mounting holes which are evenly distributed on the handle.

5. The wave width adjusting device for wave soldering apparatus according to claim 3, wherein the bristles are made of aluminum alloy, stainless steel or titanium alloy.

6. The wave width adjusting device for a wave soldering apparatus according to claim 3, wherein the length of the bristles ranges from 1 to 100 mm.

7. The wave width adjusting device for a wave soldering apparatus according to claim 3, wherein the length of the brush is in a range of 5 to 60 mm.

8. The wave width adjusting device for a wave soldering apparatus according to claim 3, wherein the length of the bristles ranges from 10 to 14 mm.

9. The wave width adjusting device for a wave soldering apparatus according to claim 3, wherein the cross-sectional diameter of each bristle is between 0.01 and 0.5 mm.

10. The wave width adjusting device for a wave soldering apparatus according to claim 3, wherein the cross-sectional diameter of each bristle is between 0.05 and 0.4 mm.