CN113369622A - Selective wave-soldering nozzle plate - Google Patents
Selective wave-soldering nozzle plate Download PDFInfo
- Publication number
- CN113369622A CN113369622A CN202110853507.1A CN202110853507A CN113369622A CN 113369622 A CN113369622 A CN 113369622A CN 202110853507 A CN202110853507 A CN 202110853507A CN 113369622 A CN113369622 A CN 113369622A
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- CN
- China
- Prior art keywords
- nozzle
- tin
- plate
- soldering
- selective wave
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a selective wave-soldering nozzle plate, which comprises: the tin plate, deposit tin board, nozzle mounting panel, nozzle connecting plate, nozzle and fender tin board, the cavity sets up in the below of depositing the tin board, the nozzle mounting panel sets up in the top of depositing the tin board, the nozzle connecting plate sets up in the top of nozzle mounting panel, the nozzle sets up on the nozzle connecting plate, keep off the tin plate cover and locate in order to shelter from the backward flow tin that splashes on the nozzle, the integral type structure that the nozzle comprises first nozzle portion, second nozzle portion and third nozzle portion, a plurality of round pass type stream tin mouths have been seted up on first nozzle portion, second nozzle portion and the third nozzle portion. The selective wave-soldering nozzle plate simplifies the structure of the nozzle plate and reduces the time for disassembly, assembly and maintenance; the integral nozzle is made, the problem of multiple alignment of the nozzle in the production process is avoided, the relative precision of the nozzle is greatly improved, the maintenance time is greatly shortened, and the working efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of selective wave soldering of PCBA (printed circuit board assembly), in particular to a selective wave soldering nozzle plate.
Background
In the selective wave soldering production process, the product melts soldering tin firstly, and then the melted tin flows out from the nozzle of the nozzle disc by the tin pump to solder the product. The structure of the original selective wave-soldering nozzle plate is too complex, the locking screws are not uniform and standard enough, and the nozzles are originally a plurality of independent nozzles, so that the disassembly, installation and maintenance time is too long, and the alignment is difficult; the nozzle tin flow port is a V-shaped port, so that the phenomena of poor welding leakage, poor package welding, poor tin penetration and the like are easily caused in the welding process, the production efficiency is low, and the quality is poor; soldering tin flows back the in-process of soldering tin groove from the spout, and liquid soldering tin falls the soldering tin liquid level from the eminence and can produce the phenomenon of splashing, because there is not the law of splashing, on the product has just been fallen to the soldering tin that the part splashed or the tin pot outside, forms the foreign matter to the product and influences the product outward appearance, or causes the part short circuit bad.
Disclosure of Invention
The invention mainly solves the technical problem of providing a selective wave-soldering nozzle plate, which simplifies the structure of the nozzle plate and reduces the time for disassembly, assembly and maintenance; the integral nozzle is made, the problem of multiple alignment of the nozzle in the production process is avoided, the relative precision of the nozzle is greatly improved, the maintenance time is greatly shortened, and the working efficiency is greatly improved.
In order to solve the technical problems, the invention adopts a technical scheme that: a selective wave soldering nozzle tray comprising: the tin plate is arranged below the tin plate, the nozzle mounting plate is arranged above the tin plate, the nozzle connecting plate is arranged above the nozzle mounting plate, the nozzle is arranged on the nozzle connecting plate, the tin plate sleeve is arranged on the nozzle to shield the splashing backflow tin, the nozzle is of an integrated structure consisting of a first nozzle part, a second nozzle part and a third nozzle part, and a plurality of round hole type tin flowing openings are formed in the first nozzle part, the second nozzle part and the third nozzle part.
In a preferred embodiment of the present invention, the first nozzle portion, the second nozzle portion and the third nozzle portion are integrally formed.
In a preferred embodiment of the present invention, the first nozzle portion, the second nozzle portion and the third nozzle portion form an "L" -shaped nozzle structure, a "U" -shaped nozzle structure, an "S" -shaped nozzle structure or a straight nozzle structure.
In a preferred embodiment of the present invention, the solder storage plate and the nozzle mounting plate, and the nozzle mounting plate and the nozzle connecting plate are all fastened and connected by screws.
The invention has the beneficial effects that: the structure of the nozzle plate is simplified, and the time for disassembly, assembly and maintenance is reduced; the integral nozzle is manufactured, so that the problem of multiple alignment of the nozzle in the production process is avoided, the relative precision of the nozzle is greatly improved, the maintenance time is greatly shortened, and the working efficiency is greatly improved; the original V-shaped groove tin flow port is changed into a circular hole structure, so that the phenomena of poor welding leakage, poor solder coating, poor tin penetration and the like in the welding process are greatly reduced, and the production efficiency and the product quality are improved; the tin blocking plate is sleeved on the nozzle, when soldering tin flows back to the tin bath along the direction of the guide plate, the splashing caused by the impact force of the reflowing tin can be blocked by the tin blocking plate, the splashing production of the soldering tin is avoided, and the quality of a product is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic structural view of a selective wave soldering nozzle plate of the present invention;
FIG. 2 is a schematic diagram showing a comparison of the improvement of the flow of solder in the selective wave soldering nozzle disk of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the selective wave-soldering nozzle plate of the invention comprises a cavity 1, a tin storage plate 2, a nozzle mounting plate 3, a nozzle connecting plate 4, a nozzle 5 and a tin baffle plate 6, wherein the cavity is arranged below the tin storage plate, the nozzle mounting plate is arranged above the tin storage plate, the nozzle is arranged on the nozzle connecting plate through a screw to form a whole, then the nozzle connecting plate is arranged above the nozzle mounting plate through a screw, the dismounting and the maintenance are more convenient, the tin baffle plate is sleeved on the nozzle to shield the splashed reflow tin, specifically, the tin baffle plate is sleeved on the nozzle, when the soldering tin reflows to a tin bath along the direction of a flow guide plate, the splashed splash caused by the impact force of the reflow tin can be shielded by the tin baffle plate, the generation of the soldering tin splash is avoided, the defect of the soldering tin splash on the product is effectively avoided, and the yield is improved, the nozzle 5 is composed of a first nozzle part 51, The first nozzle part, the second nozzle part and the third nozzle part are provided with a plurality of round hole type tin flowing openings 54, the tin flowing openings of the original V-shaped groove are changed into the round hole type tin flowing openings, the phenomena of welding leakage, package welding, poor tin penetration and the like in the welding process are greatly reduced, the round hole type tin flowing openings are less in tin dust adhesion and easy to clean, and the height of tin wave welding can be improved; the round hole type tin flowing port enables tin in the nozzle to flow fast, the temperature drop speed in the nozzle is relatively low, tin can be fed more easily, the phenomena of poor tin penetration and welding leakage are reduced, and the production efficiency and the product quality are improved.
Specifically, the first nozzle portion, the second nozzle portion and the third nozzle portion are integrally formed, the structural arrangement of the nozzle is not limited to a specific shape, the structural arrangement of the nozzle is determined according to the position of a part to be welded on a PCBA board, and the nozzle can be a U-shaped nozzle structure, an S-shaped nozzle structure, a straight nozzle structure or other irregular nozzle structures.
Specifically, deposit between tin board and the nozzle mounting panel, all through screw fastening connection between nozzle mounting panel and the nozzle connecting plate, standardize the locking screw, reduce the time of dismantling, installation maintenance, improve work efficiency.
The selective wave-soldering nozzle plate has the beneficial effects that: the structure of the nozzle plate is simplified, and the time for disassembly, assembly and maintenance is reduced; the integral nozzle is manufactured, so that the problem of multiple alignment of the nozzle in the production process is avoided, the relative precision of the nozzle is greatly improved, the maintenance time is greatly shortened, and the working efficiency is greatly improved; the original V-shaped groove tin flow port is changed into a circular hole structure, so that the phenomena of poor welding leakage, poor solder coating, poor tin penetration and the like in the welding process are greatly reduced, and the production efficiency and the product quality are improved; the tin blocking plate is arranged on the nozzle in a sleeved mode, when soldering tin flows back to the tin bath along the direction of the guide plate, the splashing caused by the impact force of the reflowing tin can be blocked by the tin blocking plate, the splashing production of the soldering tin is avoided, the splashing of the soldering tin to the product is effectively avoided, and the yield is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. A selective wave soldering nozzle tray, comprising: the tin plate is arranged below the tin plate, the nozzle mounting plate is arranged above the tin plate, the nozzle connecting plate is arranged above the nozzle mounting plate, the nozzle is arranged on the nozzle connecting plate, the tin plate sleeve is arranged on the nozzle to shield the splashing backflow tin, the nozzle is of an integrated structure consisting of a first nozzle part, a second nozzle part and a third nozzle part, and a plurality of round hole type tin flowing openings are formed in the first nozzle part, the second nozzle part and the third nozzle part.
2. The selective wave soldering nozzle plate according to claim 1, wherein the first nozzle portion, the second nozzle portion and the third nozzle portion are integrally formed.
3. The selective wave soldering nozzle plate according to claim 1, wherein the first nozzle portion, the second nozzle portion and the third nozzle portion form an L-shaped nozzle structure, a U-shaped nozzle structure, an S-shaped nozzle structure or a straight nozzle structure.
4. The selective wave soldering nozzle plate as claimed in claim 1, wherein the tin storage plate and the nozzle mounting plate and the nozzle connecting plate are fixedly connected through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110853507.1A CN113369622A (en) | 2021-07-28 | 2021-07-28 | Selective wave-soldering nozzle plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110853507.1A CN113369622A (en) | 2021-07-28 | 2021-07-28 | Selective wave-soldering nozzle plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113369622A true CN113369622A (en) | 2021-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110853507.1A Pending CN113369622A (en) | 2021-07-28 | 2021-07-28 | Selective wave-soldering nozzle plate |
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| Country | Link |
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| CN (1) | CN113369622A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113894376A (en) * | 2021-11-15 | 2022-01-07 | 江西鹰高科技有限公司 | Method for preventing tin bead from being generated in PCB welding process |
-
2021
- 2021-07-28 CN CN202110853507.1A patent/CN113369622A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113894376A (en) * | 2021-11-15 | 2022-01-07 | 江西鹰高科技有限公司 | Method for preventing tin bead from being generated in PCB welding process |
| CN113894376B (en) * | 2021-11-15 | 2022-11-15 | 江西鹰高科技有限公司 | Method for preventing tin bead from being generated in PCB welding process |
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