CN201312425Y - L-shaped upflow side-stream kettle spout - Google Patents
L-shaped upflow side-stream kettle spout Download PDFInfo
- Publication number
- CN201312425Y CN201312425Y CN 200820216464 CN200820216464U CN201312425Y CN 201312425 Y CN201312425 Y CN 201312425Y CN 200820216464 CN200820216464 CN 200820216464 CN 200820216464 U CN200820216464 U CN 200820216464U CN 201312425 Y CN201312425 Y CN 201312425Y
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- tin
- kou
- kettle
- spilling
- utility
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Abstract
The utility model relates to a tin stove part for soldering PCBA board, in particular to an L-shaped upflow side-stream kettle spout. The L-shaped structure is formed by splicing two kettle spouts, tin-spilling openings are provided on the rim of each kettle spout, tin-spilling holes are provide on the side wall of each kettle spout, each tin-spilling opening is a rectangular cut with a depth of 3 to 6mm, and each tin-spilling hole is a rectangular hole. The utility model with a simple structure is capable of effectively improving soldering efficiency and adaptable to large-scale automatic production. The utility model can effectively prevent oxide layer on the surface layer of tin liquids from remaining on the surface of PCBA board, thereby guaranteeing the quality of soldering joints.
Description
Technical field
The utility model relates to a kind of tin stove parts of the PCBA of being used for boards solder, especially a kind of L type upstream side flowing spout.
Background technology
Common wave-soldering adopts manual operations usually, and production efficiency is lower, for the comparatively intensive PCBA plate of need pad, this welding manner is more inadequate, in addition, because stannum export too small (generally long 2 millimeters), can bring the obstruction of scruff, thereby cause the large tracts of land of rosin joint to produce Hu Kou; At the comparatively intensive PCBA plate of pad, the kettle of employing mouth structure is also arranged, but common tin furnace kettle mouth is flat mouthful design, in order to realize scolding tin operation to the PCBA plate, generally need maintenance distance once between PCBA plate and kettle mouth, guarantee to make tin liquor can the electric elements on the PCBA plate of top be welded on the one hand from the Hu Kou ejection, guarantee simultaneously can in time discharge Hu Kou from the tin liquor of Hu Kou ejection subsequently, prevent that the kettle mouth pressure is excessive, influence welding quality, but also there is fault of construction in this structure: when tin liquor when Hu Kou sprays, because the tin liquor of upper space is owing to directly contact the formation oxide layer with air, this part oxide layer at first contacts with the PCBA plate of top along with tin liquor is gushed out from Hu Kou, in the wings under the frontal impact of tin liquor, make this part oxide layer oppressed on PCBA plate face, Xiao Yi is taken away it by the kettle mouth tin liquor of gushing out subsequently, makes oxide layer remain between solder joint and the PCBA plate, has a strong impact on welding quality.In addition, when usually some being had the welding of PBCA plate electronic devices and components of connector, often be not easy to the position of Hu Kou is fixed, thereby influence welding effect.
Summary of the invention
In order to overcome the deficiency that above-mentioned various scolding tin exists, when especially adopting the intensive PCBA plate of the point-to-point wave-soldering butt welding point of automatic selectivity to weld, inefficiency, be unsuitable for extensive batch machining, and contact easily forms the deficiency of rosin joint, it is a kind of simple in structure that the utility model provides, and can effectively improve welding efficiency, guarantees the tin furnace kettle mouth of the quality of welded contact.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of L type upstream side flowing spout, piece together L type structure by two Hu Kou, and be provided with the Xi Kou that overflows at the bead of Hu Kou, be provided with the tin hole of overflowing at the sidewall of Hu Kou.Excessive Xi Kou is used for upper reaches tin, and the tin hole of overflowing is used for effluent tin.The effect of release water conservancy diversion has all been played in excessive Xi Kou and excessive tin hole, the tin mouth that overflows can be realized the electronic devices and components near the small area kettle mouth periphery are welded, and the tin hole of overflowing then can utilize the Hu Koucebi of its top that the electronic devices and components of the periphery, tin hole of overflowing are exempted from the weldering shielding.
For the ease of the processing of the Xi Kou that overflows, guarantee the tin liquor Xi Kou outflow of can overflowing equably simultaneously, further: described excessive Xi Kou is a rectangle gap.
For the degree of depth of the Xi Kou that overflows rationally is set, cross shallow may rising and come the Xi Kou that overflows excessive tin effect should be arranged, cross may cause deeply tin liquor before the kettle mouth of emerging just from the Xi Kou outflow of overflowing, make the emerge height of Hu Kou of tin ripple on the low side, influence welding quality, more further: the degree of depth of described excessive Xi Kou is 3~6mm.
For the ease of the processing in tin liquor hole, one go on foot ground again: described excessive tin hole is a rectangular opening.
The existence of excessive Xi Kou can effectively change the flow direction of tin liquor behind ejection Hu Kou.After tin liquor sprays from Hu Kou, tin liquor can preferentially flow out from the Xi Kou that overflows, so just form certain tin stream that flows to, making the oxide layer of the superiors can directly do not impacted is adsorbed onto on the PCBA plate, even there is the partial oxidation layer to be adsorbed onto on the PCBA plate, can be washed away by the tin liquor that sprays from Hu Kou subsequently, having guaranteed can residual oxide layer not influence the soldering quality between scolding tin and PCBA plate yet; On the other hand, because surface tension, tin liquor upper surface in the kettle mouth is spherical shape, make under the not high situation of furnace pressure, may appear at kettle mouth edge and form rosin joint, influence welding quality, the existence of excessive Xi Kou, change the flow direction of kettle mouth tin liquor, made tin liquor can maximum possible cover the PCBA plate of kettle mouth top, guaranteed the adequacy and the fastness of welding.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the utility model kettle mouth structure schematic diagram.
Fig. 2 is the placement location schematic diagram of the utility model on the PCBA plate.
1. excessive tin mouths, 2. excessive tin holes, 3. electronic devices and components 4.PCBA plates among the figure
Embodiment
A kind of L type upstream side flowing spout as shown in Figure 1 pieces together L type structure by two Hu Kou, is provided with the tin mouth 1 that overflows at the bead of Hu Kou, sidewall at Hu Kou is provided with the tin hole 2 of overflowing, described excessive tin mouth 1 is a rectangle gap, and its degree of depth is 3~6mm, and the tin hole 2 of overflowing is a rectangular opening.
As shown in Figure 2, determine the position that is provided with at kettle mouth bead in excessive tin mouth 1 and excessive tin hole 2 according to the distribution situation of the electronic devices and components on the PCBA plate 43, guarantee on the PCBA plate 4 in the outside of the tin mouth 2 that overflows no electronic devices and components 3 or from far away relatively, the tin liquor that flows out from overflow tin mouth 1 and excessive tin hole 2 can not be spread and excessive Xi Kou other electronic devices and components 3 on every side on.
During use, the PCBA plate is placed on the precalculated position of kettle mouth top, and board plane and kettle mouth stannum export are maintained a certain distance, generally be controlled at 2~4mm.The shape of Hu Kou can determine that Hu Kou is designed to rectangular shape usually according to the distribution situation of PCBA plate welding position, and its length is 6~11mm.For the welding position is irregular concentrated distribution, can adopt a plurality of rectangle Hu Kou to piece together required welding shape.Tin liquor keeps earlier certain liquid level to store in the kettle mouth 1~3 minute, the PCBA plate to be welded of top is carried out preheating, so that preceding operation is removed the oxide layer on the PCBA plate at the scaling powder generation chemical reaction of PCBA plate position to be welded spraying.Afterwards, the electronic startup of tin stove, push to Hu Kou by the tin liquor of exerting pressure the tin furnace interior, the continuous lifting of tin liquor face in the kettle mouth, and tin liquor ejects kettle mouth stannum export the most at last, contacts with the PCBA plate of top and welds, and is guaranteeing that tin liquor and PCBA plate fully weld, unnecessary tin liquor can be discharged from the Xi Kou that overflows, and takes away the oxide layer and the impurity of tin liquor top layer.At last, take off the PCBA plate, finish the welding of ground PCBA plate from kettle mouth top.
Because adopted kettle mouth method for designing flexibly, enlarged effective solder side, thereby made speed of welding fast on year-on-year basis more than three times with international " automatic selectivity welding tin stove ".
Because Hu Kou has adopted excessive tin mouth design, this scheme has just been removed the main scruff of welding quality and the oxide skin on tin liquor surface of influencing before welding, the qualification rate of welding is reached more than 99.9%.
Claims (4)
1. L type upstream side flowing spout is characterized in that: piece together L type structure by two Hu Kou, be provided with the Xi Kou (1) that overflows at the bead of Hu Kou, be provided with the tin hole (2) of overflowing at the sidewall of Hu Kou.
2. L type upstream side flowing spout according to claim 1 is characterized in that: described excessive Xi Kou (1) is a rectangle gap.
3. L type upstream side flowing spout according to claim 2 is characterized in that: the degree of depth of described excessive Xi Kou (1) is 3~6mm.
4. L type upstream side flowing spout according to claim 1 is characterized in that: described excessive tin hole (2) is made as a rectangular opening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820216464 CN201312425Y (en) | 2008-11-25 | 2008-11-25 | L-shaped upflow side-stream kettle spout |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820216464 CN201312425Y (en) | 2008-11-25 | 2008-11-25 | L-shaped upflow side-stream kettle spout |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201312425Y true CN201312425Y (en) | 2009-09-16 |
Family
ID=41109681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820216464 Expired - Fee Related CN201312425Y (en) | 2008-11-25 | 2008-11-25 | L-shaped upflow side-stream kettle spout |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201312425Y (en) |
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2008
- 2008-11-25 CN CN 200820216464 patent/CN201312425Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20101125 |