CN201312435Y - Lateral tin-spilling temperature compensation kettle spout - Google Patents
Lateral tin-spilling temperature compensation kettle spout Download PDFInfo
- Publication number
- CN201312435Y CN201312435Y CN 200820216475 CN200820216475U CN201312435Y CN 201312435 Y CN201312435 Y CN 201312435Y CN 200820216475 CN200820216475 CN 200820216475 CN 200820216475 U CN200820216475 U CN 200820216475U CN 201312435 Y CN201312435 Y CN 201312435Y
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- tin
- kou
- mouth
- spilling
- temperature compensation
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Abstract
The utility model relates to a tin stove part for soldering PCBA board, in particular to a lateral tin-spilling temperature compensation kettle spout. At least one tin-spilling opening is provided on lateral surfaces of the kettle spout, a temperature compensation opening is provided on the outer wall of the middle of the kettle spout, and each tin-spilling opening is a triangle opening. The utility model with a simple structure is capable of effectively improving soldering efficiency and adaptable to large-scale automatic production. The utility model can effectively prevent oxide layer on the surface layer of tin liquids from remaining on the surface of PCBA board, thereby guaranteeing the quality of soldering joints.
Description
Technical field
The utility model relates to a kind of tin stove parts of the PCBA of being used for boards solder, especially a kind of tin-overflowing temperature-supplement type pot.
Background technology
Common wave-soldering adopts manual operations usually, and production efficiency is lower, for the comparatively intensive PCBA plate of need pad, this welding manner is more inadequate, in addition, because stannum export too small (generally long 2 millimeters), can bring the obstruction of scruff, thereby cause the large tracts of land of rosin joint to produce Hu Kou; At the comparatively intensive PCBA plate of pad, the kettle of employing mouth structure is also arranged, but common tin furnace kettle mouth is flat mouthful design, in order to realize scolding tin operation to the PCBA plate, generally need maintenance distance once between PCBA plate and kettle mouth, guarantee to make tin liquor can the electric elements on the PCBA plate of top be welded on the one hand from the Hu Kou ejection, guarantee simultaneously can in time discharge Hu Kou from the tin liquor of Hu Kou ejection subsequently, prevent that the kettle mouth pressure is excessive, influence welding quality, but also there is fault of construction in this structure: when tin liquor when Hu Kou sprays, because the tin liquor of upper space is owing to directly contact the formation oxide layer with air, this part oxide layer at first contacts with the PCBA plate of top along with tin liquor is gushed out from Hu Kou, in the wings under the frontal impact of tin liquor, make this part oxide layer oppressed on PCBA plate face, be difficult for it being taken away, make oxide layer remain between solder joint and the PCBA plate, have a strong impact on welding quality by the kettle mouth tin liquor of gushing out subsequently.In addition, when usually some being had the welding of PBCA plate electronic devices and components of connector, often be not easy to the position of Hu Kou is fixed, thereby influence welding effect.
Summary of the invention
In order to overcome the deficiency that above-mentioned various scolding tin exists, when especially adopting the intensive PCBA plate of the point-to-point wave-soldering butt welding point of automatic selectivity to weld, inefficiency, be unsuitable for extensive batch machining, and contact easily forms the deficiency of rosin joint, it is a kind of simple in structure that the utility model provides, and can effectively improve welding efficiency, guarantees the tin furnace kettle mouth of the quality of welded contact.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of tin-overflowing temperature-supplement type pot, the side of described Hu Kou offer at least one excessive Xi Kou, and the outer wall at kettle mouth middle part is provided with temperature and replenishes mouth.Utilize temperature to replenish mouth kettle mouth temperature is constantly heated up compensation to guarantee welding quality.
The water conservancy diversion that overflows for the ease of tin liquor, further: described excessive Xi Kou is a triangle open mouth, make tin liquor after go out the tin hole and overflow, utilize the most advanced and sophisticated drainage of triangle open mouth, make tin liquor flow out naturally and enter the tin stove along the backflow of kettle mouth outer wall from triangle perforate most advanced and sophisticated.
The existence of excessive Xi Kou can effectively change the flow direction of tin liquor behind ejection Hu Kou.After tin liquor sprays from Hu Kou, tin liquor can preferentially flow out from the Xi Kou that overflows, so just form certain tin stream that flows to, making the oxide layer of the superiors can directly do not impacted is adsorbed onto on the PCBA plate, even there is the partial oxidation layer to be adsorbed onto on the PCBA plate, can be washed away by the tin liquor that sprays from Hu Kou subsequently, having guaranteed can residual oxide layer not influence the soldering quality between scolding tin and PCBA plate yet; On the other hand, because surface tension, tin liquor upper surface in the kettle mouth is spherical shape, make under the not high situation of furnace pressure, may appear at kettle mouth edge and form rosin joint, influence welding quality, the existence of excessive Xi Kou, change the flow direction of kettle mouth tin liquor, made tin liquor can maximum possible cover the PCBA plate of kettle mouth top, guaranteed the adequacy and the fastness of welding.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the utility model kettle mouth structure schematic diagram.
Fig. 2 is the placement location schematic diagram of the utility model on the PCBA plate.
1. excessive tin mouth 2. temperature are replenished mouthful 3. electronic devices and components 4.PCBA plates among the figure
Embodiment
A kind of tin-overflowing temperature-supplement type pot as shown in Figure 1, the side of described Hu Kou offer at least one excessive tin mouth 1, and the outer wall at kettle mouth middle part is provided with temperature and replenishes mouth 2, and described excessive tin mouth 1 is a triangle open mouth.
As shown in Figure 2, determine the position that is provided with at Hu Kou of excessive tin mouth 1 according to the distribution situation of the electronic devices and components on the PCBA plate 43, guarantee on the PCBA plate 4 in the outside of the tin mouth 2 that overflows no electronic devices and components 3 or from far away relatively, the tin liquor that flows out from the tin mouth 1 that overflows can not be spread and excessive Xi Kou other electronic devices and components 3 on every side on.The tin mouth 1 that overflows is pressed decision from the height and the openings of sizes of kettle mouth bead according to the tin of kettle mouth inside, and leg-of-mutton excessive tin mouth 1 has played good guide functions.
During use, the PCBA plate is placed on the precalculated position of kettle mouth top, and board plane and kettle mouth stannum export are maintained a certain distance, generally be controlled at 2~4mm.The shape of Hu Kou can determine that Hu Kou is designed to rectangular shape usually according to the distribution situation of PCBA plate welding position, and its length is 6~11mm.For the welding position is irregular concentrated distribution, can adopt a plurality of rectangle Hu Kou to piece together required welding shape.Tin liquor keeps earlier certain liquid level to store in the kettle mouth 1~3 minute, the PCBA plate to be welded of top is carried out preheating, so that preceding operation is removed the oxide layer on the PCBA plate at the scaling powder generation chemical reaction of PCBA plate position to be welded spraying.Afterwards, the electronic startup of tin stove, push to Hu Kou by the tin liquor of exerting pressure the tin furnace interior, the continuous lifting of tin liquor face in the kettle mouth, and tin liquor ejects kettle mouth stannum export the most at last, contacts with the PCBA plate of top and welds, and is guaranteeing that tin liquor and PCBA plate fully weld, unnecessary tin liquor can be discharged from the Xi Kou that overflows, and takes away the oxide layer and the impurity of tin liquor top layer.At last, take off the PCBA plate, finish the welding of ground PCBA plate from kettle mouth top.
Because adopted kettle mouth method for designing flexibly, enlarged effective solder side, thereby made speed of welding fast on year-on-year basis more than three times with international " automatic selectivity welding tin stove ".
Because Hu Kou has adopted excessive tin mouth design, this scheme has just been removed the main scruff of welding quality and the oxide skin on tin liquor surface of influencing before welding, the qualification rate of welding is reached more than 99.9%.
Claims (2)
1. tin-overflowing temperature-supplement type pot, it is characterized in that: the side of described Hu Kou offers at least one excessive Xi Kou (1), and the outer wall at kettle mouth middle part is provided with temperature and replenishes mouthful (2).
2. tin-overflowing temperature-supplement type pot according to claim 1 is characterized in that: described excessive Xi Kou (1) is a triangle open mouth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820216475 CN201312435Y (en) | 2008-11-25 | 2008-11-25 | Lateral tin-spilling temperature compensation kettle spout |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820216475 CN201312435Y (en) | 2008-11-25 | 2008-11-25 | Lateral tin-spilling temperature compensation kettle spout |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201312435Y true CN201312435Y (en) | 2009-09-16 |
Family
ID=41109691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820216475 Expired - Fee Related CN201312435Y (en) | 2008-11-25 | 2008-11-25 | Lateral tin-spilling temperature compensation kettle spout |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201312435Y (en) |
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2008
- 2008-11-25 CN CN 200820216475 patent/CN201312435Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20101125 |