CN201115038Y - Open kettle mouth at the corner of tin overflow mouth - Google Patents

Open kettle mouth at the corner of tin overflow mouth Download PDF

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Publication number
CN201115038Y
CN201115038Y CNU2007200755469U CN200720075546U CN201115038Y CN 201115038 Y CN201115038 Y CN 201115038Y CN U2007200755469 U CNU2007200755469 U CN U2007200755469U CN 200720075546 U CN200720075546 U CN 200720075546U CN 201115038 Y CN201115038 Y CN 201115038Y
Authority
CN
China
Prior art keywords
tin
kou
mouth
kettle mouth
pcba plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200755469U
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Chinese (zh)
Inventor
庄春明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Mingfu Automation Equipment Co Ltd
Original Assignee
Suzhou Mingfu Automation Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Mingfu Automation Equipment Co Ltd filed Critical Suzhou Mingfu Automation Equipment Co Ltd
Priority to CNU2007200755469U priority Critical patent/CN201115038Y/en
Application granted granted Critical
Publication of CN201115038Y publication Critical patent/CN201115038Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a tinning furnace component used for a PCBA plate soldering, in particular to a tinning furnace spout. The spout has a rectangular shape; a tin overflowing port 1 is arranged on at least an angle of a tin discharging port of the spout; a tin overflowing port 1 which is a rectangular opening with a depth of 2 to 8 mm. The tinning furnace spout of the utility model has the advantages of simple structure, can effectively improve the soldering efficiency, and applies to large-scaled automatic production; in addition, the tinning furnace spout effectively prevents the oxidation layer on the tin fluid surface from remaining on the surface of the PCBA plate, thus guaranteeing the quality of soldering spots.

Description

Open kettle mouth at tin overflow corner
Technical field
The utility model relates to a kind of tin stove parts of the PCBA of being used for boards solder, especially a kind of tin furnace kettle mouth.
Background technology
Common wave-soldering adopts manual operations usually, and production efficiency is lower, for the comparatively intensive PCBA plate of need pad, this welding manner is more inadequate, in addition, because stannum export too small (generally long 2 millimeters), can bring the obstruction of scruff, thereby cause the large tracts of land of rosin joint to produce Hu Kou; At the comparatively intensive PCBA plate of pad, the kettle of employing mouth structure is also arranged, but common tin furnace kettle mouth is flat mouthful design, in order to realize scolding tin operation to the PCBA plate, generally need maintenance distance once between PCBA plate and kettle mouth, guarantee to make tin liquor can the electric elements on the PCBA plate of top be welded on the one hand from the Hu Kou ejection, guarantee simultaneously can in time discharge Hu Kou from the tin liquor of Hu Kou ejection subsequently, prevent that the kettle mouth pressure is excessive, influence welding quality, but also there is fault of construction in this structure: when tin liquor when Hu Kou sprays, because the tin liquor of upper space is owing to directly contact the formation oxide layer with air, this part oxide layer at first contacts with the PCBA plate of top along with tin liquor is gushed out from Hu Kou, in the wings under the frontal impact of tin liquor, make this part oxide layer oppressed on PCBA plate face, be difficult for it being taken away, make oxide layer remain between solder joint and the PCBA plate, have a strong impact on welding quality by the kettle mouth tin liquor of gushing out subsequently.
Summary of the invention
In order to overcome the deficiency that above-mentioned various scolding tin exists, when especially adopting the intensive PCBA plate of the point-to-point wave-soldering butt welding point of automatic selectivity to weld, inefficiency, be unsuitable for extensive batch machining, and contact easily forms the deficiency of rosin joint, it is a kind of simple in structure that the utility model provides, and can effectively improve welding efficiency, guarantees the tin furnace kettle mouth of the quality of welded contact.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of open kettle mouth at tin overflow corner, and described Hu Kou is shaped as rectangle, and at least one angle of kettle mouth stannum export is provided with the Xi Kou that overflows.This structure is mainly used in the welding of L-shaped lead-in wire.
For the ease of the processing of the Xi Kou that overflows, guarantee the tin liquor Xi Kou outflow of can overflowing equably simultaneously, further: described excessive Xi Kou is a rectangle gap.
For the degree of depth of the Xi Kou that overflows rationally is set, cross shallow may rising and come the Xi Kou that overflows excessive tin effect should be arranged, cross may cause deeply tin liquor before the kettle mouth of emerging just from the Xi Kou outflow of overflowing, make the emerge height of Hu Kou of tin ripple on the low side, influence welding quality, more further: the degree of depth of described excessive Xi Kou is 2~8mm.
The existence of excessive Xi Kou can effectively change the flow direction of tin liquor behind ejection Hu Kou.After tin liquor sprays from Hu Kou, tin liquor can preferentially flow out from the Xi Kou that overflows, so just form certain tin stream that flows to, making the oxide layer of the superiors can directly do not impacted is adsorbed onto on the PCBA plate, even there is the partial oxidation layer to be adsorbed onto on the PCBA plate, can be washed away by the tin liquor that sprays from Hu Kou subsequently, having guaranteed can residual oxide layer not influence the soldering quality between scolding tin and PCBA plate yet; On the other hand, because surface tension, tin liquor upper surface in the kettle mouth is spherical shape, make under the not high situation of furnace pressure, may appear at kettle mouth edge and form rosin joint, influence welding quality, the existence of excessive Xi Kou, change the flow direction of kettle mouth tin liquor, made tin liquor can maximum possible cover the PCBA plate of kettle mouth top, guaranteed the adequacy and the fastness of welding.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the utility model kettle mouth structure schematic diagram.
Fig. 2 is the placement location schematic diagram of the utility model on the PCBA plate.
1. excessive tin mouth 2.PCBA plate 3. electronic devices and components among the figure
Embodiment
A kind of open kettle mouth at tin overflow corner as shown in Figure 1, described Hu Kou is shaped as rectangle, and at least one angle of kettle mouth stannum export is provided with the tin mouth 1 that overflows, and described excessive tin mouth 1 is a rectangle gap, and its degree of depth is 2~8mm.
As shown in Figure 2, Hu Kou described in the utility model is mainly used in the welding of L-shaped lead-in wire, heavy line among the figure is partly represented the Xi Kou that overflows, the lead wire set length decision that the length of excessive tin mouth 1 will be welded according to kettle mouth top, take into account other electronic devices and components 3 in tin mouth 1 outside of overflowing simultaneously, guarantee that the tin liquor that flows out can not have influence near other electronic devices and components that need not the weld 3 kettle mouth periphery from the tin mouth 1 that overflows.
During use, the PCBA plate is placed on the precalculated position of kettle mouth top, and board plane and kettle mouth stannum export are maintained a certain distance, generally be controlled at 2~6mm.The shape of Hu Kou can determine that Hu Kou is designed to rectangular shape usually according to the distribution situation of PCBA plate welding position, and its width is 8~10mm.For the welding position is irregular concentrated distribution, can adopt a plurality of rectangle Hu Kou to piece together required welding shape.Tin liquor keeps earlier certain liquid level to store in the kettle mouth 1~3 minute, the PCBA plate to be welded of top is carried out preheating, so that preceding operation is removed the oxide layer on the PCBA plate at the scaling powder generation chemical reaction of PCBA plate position to be welded spraying.Afterwards, the electronic startup of tin stove, push to Hu Kou by the tin liquor of exerting pressure the tin furnace interior, the continuous lifting of tin liquor face in the kettle mouth, and tin liquor ejects kettle mouth stannum export the most at last, contacts with the PCBA plate of top and welds, and is guaranteeing that tin liquor and PCBA plate fully weld, unnecessary tin liquor can be discharged from the Xi Kou that overflows, and takes away the oxide layer and the impurity of tin liquor top layer.At last, take off the PCBA plate, finish the welding of ground PCBA plate from kettle mouth top.
Because adopted kettle mouth method for designing flexibly, enlarged effective solder side, thereby made speed of welding fast on year-on-year basis more than three times with international " automatic selectivity welding tin stove ".
Because Hu Kou has adopted excessive tin mouth design, this scheme has just been removed the main scruff of welding quality and the oxide skin on tin liquor surface of influencing before welding, make the qualification rate of welding reach 99.More than 9%.

Claims (3)

1. open kettle mouth at tin overflow corner, it is characterized in that: described Hu Kou is shaped as rectangle, and at least one angle of kettle mouth stannum export is provided with the Xi Kou (1) that overflows.
2. open kettle mouth at tin overflow corner according to claim 1 is characterized in that: described excessive Xi Kou (1) is a rectangle gap.
3. open kettle mouth at tin overflow corner according to claim 2 is characterized in that: the degree of depth of described excessive Xi Kou (1) is 2~8mm.
CNU2007200755469U 2007-10-18 2007-10-18 Open kettle mouth at the corner of tin overflow mouth Expired - Fee Related CN201115038Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200755469U CN201115038Y (en) 2007-10-18 2007-10-18 Open kettle mouth at the corner of tin overflow mouth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200755469U CN201115038Y (en) 2007-10-18 2007-10-18 Open kettle mouth at the corner of tin overflow mouth

Publications (1)

Publication Number Publication Date
CN201115038Y true CN201115038Y (en) 2008-09-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200755469U Expired - Fee Related CN201115038Y (en) 2007-10-18 2007-10-18 Open kettle mouth at the corner of tin overflow mouth

Country Status (1)

Country Link
CN (1) CN201115038Y (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: Suzhou province Jiangsu City Industrial Park to and West Road No. 16 (Suzhou Mingfu Automatic Equipment Co Ltd), zip code: 215123

Patentee after: Suzhou Mingfu Automatic Equipment Co., Ltd.

Address before: Suzhou City, Jiangsu province Suzhou Industrial Park trichosanthis turnip East Dongjing industrial square No. 20 building, zip code: 215123

Patentee before: Suzhou Mingfu Automatic Equipment Co., Ltd.

C56 Change in the name or address of the patentee

Owner name: SUZHOU MINGFU AUTOMATION EQUIPMENT CO., LTD.

Free format text: NEW ADDRESS: JIANGSU PROVINCE, SUZHOU CITY, INDUSTRIAL PARK, NO.16 ZHIHE ROAD,(SUZHOU MINGFU AUTOMATION EQUIPMENT CO., LTD.), ZIP CODE:215123

C57 Notification of unclear or unknown address
DD01 Delivery of document by public notice

Addressee: Zhao Feng

Document name: Notification of Termination of Patent Right

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080910