CN201349368Y - Chip element dodging double-opening type spout - Google Patents

Abstract

The utility model relates to a tin furnace part for soldering a PCBA board, in particular to a tin furnace spout for welding a chip element of a computer main board, wherein the shape of the spout is of a rectangular, the edge of one side surface of a rectangular side is provided with a tin overflow port, and the other side surface of the rectangular side is provided with a groove. The tin furnace part for soldering the PCBA board has simple structure, can effectively increase the welding efficiency, and is suitable for large-scale automation production. Furthermore, the tin furnace part for soldering the PCBA board effectively prevents an oxide layer on the tin fluid surface from remaining on the surface of the PCBA board, and guarantees the quality of welded contacts.

Description

The chip element is dodged double open kettle opening

Technical field

The utility model relates to a kind of tin stove parts of the PCBA of being used for boards solder, especially a kind of tin furnace kettle mouth that is used to weld computer main board chip element.

Background technology

Common wave-soldering adopts manual operations usually, and production efficiency is lower, for the comparatively intensive PCBA plate of need pad, this welding manner is more inadequate, in addition, because stannum export too small (generally long 2 millimeters), can bring the obstruction of scruff, thereby cause the large tracts of land of rosin joint to produce Hu Kou; At the comparatively intensive PCBA plate of pad, the kettle of employing mouth structure is also arranged, but common tin furnace kettle mouth is flat mouthful design, in order to realize scolding tin operation to the PCBA plate, generally need maintenance distance once between PCBA plate and kettle mouth, guarantee to make tin liquor can the electric elements on the PCBA plate of top be welded on the one hand from the Hu Kou ejection, guarantee simultaneously can in time discharge Hu Kou from the tin liquor of Hu Kou ejection subsequently, prevent that the kettle mouth pressure is excessive, influence welding quality, but also there is fault of construction in this structure: when tin liquor when Hu Kou sprays, because the tin liquor of upper space is owing to directly contact the formation oxide layer with air, this part oxide layer at first contacts with the PCBA plate of top along with tin liquor is gushed out from Hu Kou, in the wings under the frontal impact of tin liquor, make this part oxide layer oppressed on PCBA plate face, be difficult for it being taken away, make oxide layer remain between solder joint and the PCBA plate, have a strong impact on welding quality by the kettle mouth tin liquor of gushing out subsequently.

Summary of the invention

In order to overcome the deficiency that above-mentioned various scolding tin exists, when especially adopting the intensive PCBA plate of the point-to-point wave-soldering butt welding point of automatic selectivity to weld, inefficiency, be unsuitable for extensive batch machining, and contact easily forms the deficiency of rosin joint, it is a kind of simple in structure that the utility model provides, and can effectively improve welding efficiency, guarantees the tin furnace kettle mouth of the quality of welded contact.

The technical scheme that its technical problem that solves the utility model adopts is: a kind of chip element is dodged double open kettle opening, and described Hu Kou is shaped as rectangle, is respectively arranged with overflow Xi Kou and inner groovy on two groups of opposite side of rectangular edges.Excessive Xi Kou is used for the tin that overflows, and inner groovy is used to hold the chip element.This structure is mainly used in the welding of long single lead-in wire.

For the ease of the processing of the Xi Kou that overflows, guarantee the tin liquor Xi Kou outflow of can overflowing equably simultaneously, further: described excessive Xi Kou is a rectangle gap.

For the degree of depth of the Xi Kou that overflows rationally is set, cross shallow may rising and come the Xi Kou that overflows excessive tin effect should be arranged, cross may cause deeply tin liquor before the kettle mouth of emerging just from the Xi Kou outflow of overflowing, make the emerge height of Hu Kou of tin ripple on the low side, influence welding quality, more further: the degree of depth of described excessive Xi Kou is 3～4mm.

Damaging in kettle mouth position adjustment for fear of the knuckle of inner groovy, other is positioned at the chip element of kettle mouth inside, and more further: the bottom of described inner groovy is the semicircle cambered surface.In addition, the semicircle cambered surface also is convenient to Hu Kou punch forming in the course of processing.

The existence of excessive Xi Kou can effectively change the flow direction of tin liquor behind ejection Hu Kou.After tin liquor sprays from Hu Kou, tin liquor can preferentially flow out from the Xi Kou that overflows, so just form certain tin stream that flows to, making the oxide layer of the superiors can directly do not impacted is adsorbed onto on the PCBA plate, even there is the partial oxidation layer to be adsorbed onto on the PCBA plate, can be washed away by the tin liquor that sprays from Hu Kou subsequently, having guaranteed can residual oxide layer not influence the soldering quality between scolding tin and PCBA plate yet; On the other hand, because surface tension, tin liquor upper surface in the kettle mouth is spherical shape, make under the not high situation of furnace pressure, may appear at kettle mouth edge and form rosin joint, influence welding quality, the existence of excessive Xi Kou, change the flow direction of kettle mouth tin liquor, made tin liquor can maximum possible cover the PCBA plate of kettle mouth top, guaranteed the adequacy and the fastness of welding.

Description of drawings

Below in conjunction with drawings and Examples the utility model is further specified.

Fig. 1 is the utility model kettle mouth structure schematic diagram.

Fig. 2 is the placement location schematic diagram of the utility model on the PCBA plate.

1. excessive tin mouth 2. inner groovies 3. electronic devices and components 4.chip element 5.PCBA plates among the figure

Embodiment

A kind of chip element is as shown in Figure 1 dodged double open kettle opening, and described Hu Kou is shaped as rectangle, is provided with the tin mouth 1 that overflows in a lateral edge of rectangular edges, is provided with inner groovy 2 in the another side of rectangular edges.Described excessive tin mouth 1 is a rectangle gap, and its degree of depth is 3～4mm, and the bottom of inner groovy 2 is the semicircle cambered surface

As shown in Figure 2, Hu Kou described in the utility model is mainly used in the welding of the electronic devices and components 3 of short single lead-in wire, and the hatching among the figure is partly represented the Xi Kou that overflows.On this PCBA plate 5, the outside of single lead-in wire does not have other electronic devices and components 3 or far away relatively from getting, so that can not trickle to these electronic devices and components 3 from the tin liquor of tin mouth 1 outflow of overflowing.The chip element is positioned at inner groovy 2.

During use, the PCBA plate is placed on the precalculated position of kettle mouth top, and board plane and kettle mouth stannum export are maintained a certain distance, generally be controlled at 2～4mm.The shape of Hu Kou can determine that Hu Kou is designed to rectangular shape usually according to the distribution situation of PCBA plate welding position, and its length is 6～11mm.For the welding position is irregular concentrated distribution, can adopt a plurality of rectangle Hu Kou to piece together required welding shape.Tin liquor keeps earlier certain liquid level to store in the kettle mouth 1～3 minute, the PCBA plate to be welded of top is carried out preheating, so that preceding operation is removed the oxide layer on the PCBA plate at the scaling powder generation chemical reaction of PCBA plate position to be welded spraying.Afterwards, the electronic startup of tin stove, push to Hu Kou by the tin liquor of exerting pressure the tin furnace interior, the continuous lifting of tin liquor face in the kettle mouth, and tin liquor ejects kettle mouth stannum export the most at last, contacts with the PCBA plate of top and welds, and is guaranteeing that tin liquor and PCBA plate fully weld, unnecessary tin liquor can be discharged from the Xi Kou that overflows, and takes away the oxide layer and the impurity of tin liquor top layer.At last, take off the PCBA plate, finish the welding of ground PCBA plate from kettle mouth top.

Because adopted kettle mouth method for designing flexibly, enlarged effective solder side, thereby made speed of welding fast on year-on-year basis more than three times with international " automatic selectivity welding tin stove ".

Because Hu Kou has adopted excessive tin mouth design, this scheme has just been removed the main scruff of welding quality and the oxide skin on tin liquor surface of influencing before welding, the qualification rate of welding is reached more than 99.9%.

Claims (4)

1. a chip element is dodged double open kettle opening, it is characterized in that: described Hu Kou is shaped as rectangle, is respectively arranged with overflow Xi Kou (1) and inner groovy (2) on two groups of opposite side of rectangular edges.

2. chip element according to claim 1 is dodged double open kettle opening, it is characterized in that: described excessive Xi Kou (1) is a rectangle gap.

3. chip element according to claim 2 is dodged double open kettle opening, it is characterized in that: the degree of depth of described excessive Xi Kou (1) is 3～4mm.

4. chip element according to claim 1 is dodged double open kettle opening, it is characterized in that: the bottom of described inner groovy (2) is the semicircle cambered surface.

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