CN214815506U - Solder splash prevention nozzle for wave soldering - Google Patents
Solder splash prevention nozzle for wave soldering Download PDFInfo
- Publication number
- CN214815506U CN214815506U CN202120873019.2U CN202120873019U CN214815506U CN 214815506 U CN214815506 U CN 214815506U CN 202120873019 U CN202120873019 U CN 202120873019U CN 214815506 U CN214815506 U CN 214815506U
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- CN
- China
- Prior art keywords
- soldering tin
- nozzle
- spout
- nozzle support
- splashes
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Abstract
The utility model discloses a wave-soldering tin splash prevention nozzle, include: the nozzle support, set up in the preceding spout of nozzle support front side and set up in the back spout of nozzle support rear side, the outside that lies in preceding spout on the nozzle support is provided with the front shroud, the front shroud is used for sheltering from the soldering tin liquid that preceding spout splashes, the outside that lies in the back spout on the nozzle support is provided with the back guide plate of downward sloping, the back guide plate is used for flowing back to the soldering tin groove with the soldering tin liquid guide that the back spout splashes, the outside that lies in the soldering tin groove of back guide plate is provided with the water conservancy diversion upper cover plate. The utility model discloses a wave-soldering tin nozzle that splashes is prevented to wave-soldering, and the effectual soldering tin of having avoided splashes the harmfulness that causes the PCB product, promotes the yield.
Description
Technical Field
The utility model relates to a PCBA wave-soldering welded technical field especially relates to a wave-soldering prevents soldering tin nozzle that splashes.
Background
The product must melt soldering tin in wave-soldering production process, will melt tin and flow out from the soldering tin spout by the tin pump, welds the product. The high distance soldering tin liquid level of wave-soldering tin spout has 6-8CM, soldering tin flows back the in-process of soldering tin groove from the spout, liquid soldering tin falls the soldering tin liquid level from the eminence and can produce the phenomenon of splashing, owing to there is not the law of splashing, the soldering tin that the part splashed just fallen on the product, it is tiny to splash soldering tin, colour shape and solder joint are similar, the visual inspection is difficult to detect, the soldering tin that splashes gets into circuit part can short circuit burn out the product, form the foreign matter to the product and influence product appearance, or cause the part short circuit bad.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a wave-soldering tin nozzle that splashes is prevented, the backward flow position of back spout increases guide plate behind the 45 degrees slopes, soldering tin liquid can flow back the soldering tin groove along the direction of back guide plate, reduce the high drop that soldering tin flows back the soldering tin groove, reduce splashing that liquid soldering tin backward flow impact force brought, and increase front apron and water conservancy diversion upper cover plate in front and back backward flow position, cover the region that the production splashes, stop soldering tin liquid and splash the production, effectually soldering tin of having avoided splashes the harmfulness that causes the product, promote the yield.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a wave-soldering prevents soldering tin nozzle that splashes, uses with the cooperation of wave-soldering tin injection apparatus, includes: the nozzle support, set up in the preceding spout of nozzle support front side and set up in the back spout of nozzle support rear side, the outside that lies in preceding spout on the nozzle support is provided with the front shroud, the front shroud is used for sheltering from the soldering tin liquid that preceding spout splashes, the outside that lies in the back spout on the nozzle support is provided with the back guide plate of downward sloping, the back guide plate is used for flowing back to the soldering tin groove with the soldering tin liquid guide that the back spout splashes, the outside that lies in the soldering tin groove of back guide plate is provided with the water conservancy diversion upper cover plate.
In a preferred embodiment of the present invention, the rear baffle is welded to the nozzle holder, and the upper edge is tangential to the rear nozzle.
In a preferred embodiment of the present invention, the rear deflector is inclined at 45 degrees.
In a preferred embodiment of the present invention, the deflector upper plate is connected to the nozzle holder and the cover is downwardly inclined above the solder bath.
The utility model has the advantages that: the utility model discloses a wave-soldering tin nozzle that splashes is prevented to wave-soldering, the backward flow position of back spout increases 45 degrees slopes back guide plate, soldering tin liquid can flow back the soldering tin groove along the direction of back guide plate, reduce the high drop that soldering tin flows back the soldering tin groove, reduce splashing that liquid soldering tin backward flow impact force brought, and increase front shroud and water conservancy diversion upper cover plate in back backward flow position, cover the region that produces and splash, stop soldering tin liquid and splash the production, effectually avoided soldering tin to splash the bad that causes the product, promote the yield.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
FIG. 1 is a schematic structural view of a solder splash prevention nozzle for wave soldering of the present invention;
fig. 2 is a schematic diagram of the solder splash prevention nozzle and the PCB product of the utility model.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-2, the nozzle for preventing solder splash in wave soldering of the present invention is used in cooperation with a wave soldering device, including: the nozzle comprises a nozzle support 1, a front nozzle 2 arranged on the front side of the nozzle support and a rear nozzle 3 arranged on the rear side of the nozzle support, wherein a front cover plate 4 is arranged on the nozzle support and positioned on the outer side of the front nozzle, the front cover plate is used for shielding soldering tin liquid splashed by the front nozzle, as shown in figure 2, the tin flowing direction of the front nozzle for soldering tin is arc, the front cover plate is additionally arranged above the backflow falling point of the front nozzle and used for covering the backflow stroke of the soldering tin, and when the soldering tin flows back through a front flow guide plate 8 on the inclined surface of the front nozzle, the generated splashing can be blocked by the front cover plate and cannot splash onto a product; the outside that lies in the back spout on the nozzle bracket is provided with the back guide plate 5 of downward sloping, back guide plate is used for flowing back to the soldering tin groove with the soldering tin liquid guide that the back spout splashes, and the top that the outside of back guide plate lies in the soldering tin groove is provided with water conservancy diversion upper cover plate 6.
It is specific, back guide plate welds on nozzle holder and is the slope setting of 45 degrees, the top edge of back guide plate and the tangent setting of back spout, what soldering tin liquid produced splashes, mainly be produced by the impact force, for reducing the impact dynamics, flow the back guide plate that the tin orientation increased a slope 45 degrees behind the soldering tin spout, let soldering tin flow back to the soldering tin groove along back guide plate, back guide plate downward sloping sets up, can reduce the perpendicular impact force that falls to the soldering tin groove of soldering tin, behind the guide plate after the increase, soldering tin splashes and can reduce more than 80%.
In addition, the top in soldering tin groove is located to the water conservancy diversion upper cover plate and the nozzle support is connected and the downward sloping lid, and the soldering tin that the soldering tin liquid that flows back to the soldering tin groove when guide plate guide after produces the soldering tin of fractional part and splashes, through the water conservancy diversion upper cover plate that the water conservancy diversion upper cover plate top was add after, covers the soldering tin liquid that all splashes and flows back to the soldering tin inslot, and what spout backward flow produced like this splashes just can all be blockked by the apron, and soldering tin can not splash again on PCB product 7.
The utility model relates to a wave-soldering prevents that soldering tin splashes nozzle's beneficial effect is: the utility model discloses a flow guide plate after the backward flow position of back spout increases 45 degrees slopes, and soldering tin liquid can flow back the soldering tin groove along the direction of back flow guide plate, reduces the height drop that soldering tin flows back the soldering tin groove, reduces the splash that liquid soldering tin backward flow impact force brought, and increase front cover plate and water conservancy diversion upper cover plate in front and back flow position, cover the region that produces the splash, stop soldering tin liquid to splash and produce, avoided the maintenance manpower man-hour that soldering tin splashes and the unexpected damage to the product in the maintenance process; the bad that the product caused is splashed to effectual soldering tin of having avoided, promotes the yield.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (4)
1. The utility model provides a wave-soldering prevents soldering tin nozzle that splashes, uses with the cooperation of wave-soldering tin injection apparatus, its characterized in that includes: the nozzle support, set up in the preceding spout of nozzle support front side and set up in the back spout of nozzle support rear side, the outside that lies in preceding spout on the nozzle support is provided with the front shroud, the front shroud is used for sheltering from the soldering tin liquid that preceding spout splashes, the outside that lies in the back spout on the nozzle support is provided with the back guide plate of downward sloping, the back guide plate is used for flowing back to the soldering tin groove with the soldering tin liquid guide that the back spout splashes, the outside that lies in the soldering tin groove of back guide plate is provided with the water conservancy diversion upper cover plate.
2. The solder splash prevention nozzle of claim 1, wherein the rear deflector is welded to the nozzle support and the upper edge is tangential to the rear nozzle.
3. The wave soldering tin spatter prevention nozzle as claimed in claim 1, wherein the rear deflector is inclined at 45 degrees.
4. The nozzle of claim 1, wherein the flow guiding upper cover plate is connected to the nozzle support and covers the solder bath in a downward inclined manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120873019.2U CN214815506U (en) | 2021-04-26 | 2021-04-26 | Solder splash prevention nozzle for wave soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120873019.2U CN214815506U (en) | 2021-04-26 | 2021-04-26 | Solder splash prevention nozzle for wave soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214815506U true CN214815506U (en) | 2021-11-23 |
Family
ID=78768891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120873019.2U Active CN214815506U (en) | 2021-04-26 | 2021-04-26 | Solder splash prevention nozzle for wave soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214815506U (en) |
-
2021
- 2021-04-26 CN CN202120873019.2U patent/CN214815506U/en active Active
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