CN117655455A - Wave crest width adjusting device for wave crest welding equipment - Google Patents
Wave crest width adjusting device for wave crest welding equipment Download PDFInfo
- Publication number
- CN117655455A CN117655455A CN202211034701.8A CN202211034701A CN117655455A CN 117655455 A CN117655455 A CN 117655455A CN 202211034701 A CN202211034701 A CN 202211034701A CN 117655455 A CN117655455 A CN 117655455A
- Authority
- CN
- China
- Prior art keywords
- wave
- solder
- crest
- tin
- wave crest
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 238000005476 soldering Methods 0.000 claims abstract description 33
- 230000000903 blocking effect Effects 0.000 claims abstract description 19
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 52
- 239000002893 slag Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Abstract
The application discloses a wave crest width adjusting device for wave crest soldering equipment, the wave crest width adjusting device comprises a guide rail for transporting electronic components and a solder trough for containing solder, the wave crest width adjusting device is detachably connected with the guide rail, the wave crest width adjusting device comprises a blocking part, and the blocking part covers a region which is positioned outside the guide rail and is not contacted with the electronic components. This allows for the solder that does not need to participate in soldering to be free from excessive contact with air, thereby reducing the likelihood of solder oxidation.
Description
Technical Field
The application belongs to the wave soldering field, and relates to a wave crest width adjusting device for wave soldering equipment.
Background
Wave soldering technology is one of the most widely used technologies in electronics manufacturing, and is widely used for soldering electronic components such as Printed Circuit Boards (PCBs) or for tin plating terminals or pins of electronic components. In wave soldering apparatus, molten solder (e.g., lead-tin alloy, tin-copper alloy, tin-silver-copper alloy, etc.) is sprayed by an electric or electromagnetic pump to form a wave of solder meeting design requirements. The printed circuit board is mechanically and electrically connected to the printed circuit board by solder wave peaks between terminals or pins of the electronic component and the printed circuit board.
The constant impact of the solder wave crest brings oxygen in the air into the solder pot, and the oxygen and the molten solder in the solder pot are subjected to oxidation reaction, so that a large amount of oxide slag, namely tin slag, is generated. The tin slag floats on the surface of the solder to influence the quality of the solder. Therefore, reducing the occurrence of tin dross has become an important issue in wave soldering technology.
The prior art has disclosed some methods of reducing tin dross. Chinese patent publication No. CN101323064a discloses an oxidation resistant Sn-Cu lead free solder. The lead-free solder is prepared by adding trace elements, and has the advantages of high oxidation resistance, low slag discharge, low cost and excellent use performance compared with the traditional solder. Chinese patent publication No. CN 213318203U discloses a wave soldering apparatus and a wave soldering machine. The wave-soldering protection device introduces inert gas during soldering, and reduces the oxygen content in the soldering environment, thereby reducing tin slag and prolonging the normal operation time of the wave-soldering machine.
The width of the printed circuit board is typically between 3cm and 40 cm. The wave width or solder pot width of the wave soldering machine typically used is fixed. Each production line is typically used to produce printed circuit boards of a fixed size. When the width of the printed circuit board is smaller than the width of the wave crest, for example, the width of the PCB only occupies 1/2 to 1/3 of the width of the tin bath, a certain waste is caused. The wider the width of the wave, the larger the area of solder exposed to the air and the more solder residue is formed by the continuous splashing of excess solder.
In view of this, the inventors of the present application devised a wave width adjusting apparatus that controls the flow and splash of unnecessary solder according to the width of a printed circuit board to be soldered, thereby greatly reducing the generation of tin dross.
Disclosure of Invention
In order to overcome the technical problems in the prior art, the application provides a wave crest width adjusting device for wave crest welding equipment.
In order to achieve the above object, the present application discloses a wave width adjusting device for a wave soldering apparatus including a rail for transporting electronic components and a solder bath for holding solder, the wave width adjusting device being detachably connected to the rail, the wave width adjusting device including a blocking member covering an area of solder located outside the rail and not in contact with the electronic components.
Further, the blocking member is a brush.
Further, the brush includes bristles and a handle.
Further, each bristle is disposed in each mounting hole, which is evenly distributed on the handle.
Further, the bristles are made of aluminum alloy, stainless steel or titanium alloy, preferably stainless steel.
Further, the length of the bristles ranges between 1 and 100mm, preferably between 5 and 60mm, more preferably between 10 and 30mm, most preferably between 10 and 14 mm.
Further, the cross-sectional diameter of each bristle is between 0.01 and 0.5mm, preferably between 0.05 and 0.4mm, more preferably between 0.1 and 0.3 mm.
Compared with the prior art, the technical scheme provided by the application has the following advantages:
by installing a wave width adjusting device on the wave soldering apparatus, the blocking member covers the area of the solder wave which is not in contact with the electronic component. This allows for the solder that does not need to participate in soldering to be free from excessive contact with air, thereby reducing the likelihood of solder oxidation. Compared with the method for changing the solder composition, the wave crest width adjusting device is simpler and easier to install, and meanwhile the problem that the welding quality is influenced by changing the solder composition is avoided.
Drawings
The advantages and spirit of the present application will be further understood from the following detailed description and drawings.
FIG. 1 is a top view of a brush provided herein;
FIG. 2 is a schematic view of a brush provided herein;
FIG. 3 is a schematic view of the installation of a brush provided herein;
FIG. 4 shows the effect of the presence or absence of a mounted brush on the weight of the tin dross formed;
fig. 5 shows the effect of bristle length on the weight of tin dross formed.
Detailed Description
Specific embodiments of the present application are described in detail below with reference to the accompanying drawings. However, the present application should be understood not to be limited to such an embodiment described below, and the technical idea of the present application may be implemented in combination with other known technologies or other technologies having functions identical to those of the known technologies.
In the following description of the specific embodiments, for the sake of clarity in explaining the structure and operation of the present application, description will be given by way of directional terms, but words of front, rear, left, right, outer, inner, outer, inner, axial, radial, etc. are words of convenience and are not to be construed as limiting terms.
In the following description of the specific embodiments, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operate in a specific orientation, and are therefore not to be construed as limiting the present application.
The terms "upward", "downward", "above" and "below" are made with reference to the central longitudinal axis of the tube. Thus, the terms "upward" and "downward" should be understood to refer to directions away from and toward the longitudinal axis. Furthermore, when a first structure is described as being positioned "above" or "below" a second structure, this should be understood to mean that the first structure is positioned further or closer to the longitudinal axis.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not intended to be limiting with respect to time sequence, number, or importance, but are not to be construed as indicating or implying a relative importance or implicitly indicating the number of features indicated, but merely for distinguishing one feature from another in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly specified otherwise. Likewise, the appearances of the phrase "a" or "an" in this document are not meant to be limiting, but rather describing features that have not been apparent from the foregoing. Likewise, unless a particular quantity of a noun is to be construed as encompassing both the singular and the plural, both the singular and the plural may be included in this disclosure. Likewise, modifiers similar to "about" and "approximately" appearing before a number in this document generally include the number, and their specific meaning should be understood in conjunction with the context.
It should be understood that in this application, "at least one" means one or more, and "a plurality" means two or more. "and/or" is used to describe association relationships of associated objects, meaning that there may be three relationships, e.g., "a and/or B" may mean: only a, only B and both a and B are present, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b or c may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
In this application, the terms "mounted," "connected," "secured," and the like are to be construed broadly, unless otherwise specifically indicated and defined. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements or interaction relationship between the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be. "fixedly connected" or "non-movably connected" is understood to mean that the connection between two or more structural members is not configured to provide relative movement. One example of a fixed connection is a welded connection or bolted connection, and in some cases a welded seam and bolted connection. "movably connected" or "movable" or "mobile connection" is understood to mean a connection between two or more structural members that allows for horizontal and/or vertical relative movement between the members under extreme dynamic loads. Such a connection typically does not allow movement under static or generally dynamic loads (e.g., as applied from light/medium wind).
The terms "unit", "article", "module" and "module" described in the present specification mean a unit for processing at least one function and operation, and may be implemented by hardware components or software components and combinations thereof.
Each aspect or embodiment defined herein may be combined with any other aspect or embodiment unless clearly indicated to the contrary. In particular, any feature indicated as being preferred or advantageous may be combined with any other feature or features indicated as being preferred or advantageous.
Most wave soldering apparatuses now use twin wave soldering, wherein the two wave peaks of the twin wave soldering are called a smoothing wave and a turbulent wave, respectively. The turbulent wave impacts the welding surface of the PCB with certain pressure and speed, and can well penetrate into a dense welding area. The turbulent wave is beneficial to overcoming the welding dead zone formed by exhaust and shielding, improving the capacity of the welding flux to reach the welding dead zone, and greatly reducing the defects of welding leakage and insufficient vertical filling. The impact speed of the turbulent wave is high, the action time is short, so that the heating of a welding area and the wetting and spreading of the solder are uneven, the redundant solder can bridge or be blocked at a welding point, and burrs and welding bridges generated by the turbulent wave are eliminated by the advection wave.
In wave soldering, not all solder material may need to be sprayed onto electronic components after electronic components of different sizes enter the wave soldering apparatus. This causes the excess solder that is not sprayed onto the electronic component to be constantly in contact with air and to be constantly oxidized by the air to form solder residue. Tin slag can fall into a tin bath to cause tin liquid to splash, so that more tin liquid contacts with air to form tin slag. Since the tin dross cannot be remelted, the tin dross can only be cleaned from the tin bath by personnel on a regular basis, resulting in frequent cleaning of the wave soldering apparatus and reduced efficiency.
The peak width adjusting apparatus in the present application is mounted on a guide rail for transporting electronic components. A blocking member may be provided as a peak width adjusting means on the outer side of the guide rail as needed. And setting the guide rail to a position meeting the requirement according to the width of the electronic element, and starting the wave crest. Therefore, the blocking component of the present application blocks the excessive molten tin, which is equivalent to dividing the molten tin into two parts of "flowing tin" and "stationary tin". The blocking member is moved to the proper position and height to block the flow of the "stationary tin" liquid level. The "flowing tin" still flows with the movement of the electronic component, and the "stationary tin" remains relatively stationary, thus reducing the likelihood of tin liquor not in contact with the electronic component forming tin dross, and thus reducing the production of tin dross. Illustratively, the peak width adjusting unit can reduce the amount of tin dross by about 30% -40%.
Illustratively, the brushes are used as the blocking members in the present application, and the solder requires a great deal of tension to break through the blocking of the brushes. Solder hardly passes through the gap between the brushes. According to the width of the electronic component to be welded, the width adjusting device can shield part of tin liquid which is not required to be welded in a specific area, so that the tin liquid which is not required to be welded does not need to be in excessive contact with air when flowing into the specific area, and the possibility of oxidizing the tin liquid is reduced.
Specific embodiments of the present application are described in detail below with reference to fig. 1-5.
The whole blocking part can be integrally formed, and can also be made into a detachable split structure. As shown in fig. 1 and 2, when the blocking member is a brush, it includes bristles 101 and a handle 102, and the bristles 101 and the handle 102 may be coupled together through screw holes 103. The entire blocking member is mounted to the rail of the wave soldering apparatus through the brush mounting holes 104. The blocking member can be moved in response to the adjustment of the guide rail such that the bristles 101 cover the passage of the portion of the tin liquid outside the guide rail that is not in contact with the electronic components into the tin bath, thereby reducing unnecessary flow of the tin liquid.
Both the brush hair 101 and the brush handle 102 can be made of metal materials which can not be infiltrated by tin liquid, are not easy to dissolve and are resistant to high temperature. At the same time, the bristles 101 and handle 102 also maintain good mechanical properties at the process temperatures of wave soldering. The metallic material includes, but is not limited to, aluminum alloy, stainless steel, titanium alloy, and the like.
The length of the bristles ranges between 1 and 100mm, preferably between 5 and 60mm, more preferably between 10 and 30mm, most preferably between 10 and 14 mm. The cross-sectional diameter of each bristle ranges from 0.01 to 0.5mm, preferably from 0.05 to 0.4mm, and more preferably from 0.1 to 0.3 mm. If the cross-section of the bristle is not circular, the "cross-sectional diameter of the bristle" refers to the diameter of the circumscribed circle of the largest cross-section of the bristle.
According to a general tin slag dragging flow for a person skilled in the art, tin slag is dragged by using an iron ladle, cooled and then weighed by using an electronic balance. Illustratively, different bristle lengths are varied, the result being shown in fig. 5. The longer the length of the bristles in the application is within a certain range, the smaller the weight of tin dross generated by the wave soldering apparatus is.
The bristles in the present application are required to satisfy the requirement of blocking the flow of the tin liquid, and therefore the cross-sectional shape of the entire bristles is not particularly limited. Specifically, the cross-sectional shape of the entire bristle may be square, U-shaped, or the like.
Specifically, a blocking member 306 is mounted on the rail of the wave soldering apparatus, as shown in FIG. 3. The guide rail 301 is adjusted to the proper position according to the width of the electronic component 305, and the brushes in the blocking member 306 are moved to the proper position to block the flow of "stationary tin" that does not directly participate in the soldering process. A thin metal oxide film is formed on the surface of the molten tin in the 'stationary tin' region to further prevent oxidation of the molten tin.
The brush is made of stainless steel 316 and is mounted on the movable rail 301. The advection wave 304 and the turbulence wave 303 are turned on. There is a portion of the molten tin that does not contact the electronic components and the bristles can cover the path through which the portion of the molten tin outside the rail 301 flows into the tin bath 302. The flow of tin liquid is reduced, oxidation is reduced, and slag formation is correspondingly reduced. Illustratively, taking a bristle length of 14mm as an example, tin dross is fished using a ladle according to a tin dross scooping procedure commonly used by those skilled in the art, and is weighed using an electronic balance after cooling. As shown in fig. 4, the use of the brush can effectively reduce the generation of tin dross.
The welding flux has the advantages that the production of tin slag is obviously reduced through simple transformation equipment, the production of the welding slag is reduced compared with that of the welding flux, and the problem that the welding quality is influenced by the changed components is avoided.
The preferred embodiments of the present application are described in this specification, which are intended to be illustrative of the technical aspects of the present application and not limiting. All technical solutions that can be obtained by logic analysis, reasoning or limited experiments according to the conception of the present application by a person skilled in the art are within the scope of the present application.
Claims (10)
1. A wave width adjustment device for a wave soldering apparatus comprising a rail for transporting electronic components and a solder bath for holding solder, the wave width adjustment device being detachably connected to the rail, the wave width adjustment device comprising a blocking member covering an area of solder located outside the rail and not in contact with the electronic components.
2. The peak width adjustment unit for a wave soldering apparatus according to claim 1, wherein the blocking member is a brush.
3. The peak width adjustment unit for a wave soldering apparatus according to claim 2, wherein the brush includes bristles and a handle.
4. A peak width adjustment unit for a wave soldering apparatus according to claim 3, wherein each bristle is disposed in a respective mounting hole, said mounting holes being evenly distributed on the handle.
5. A crest width adjusting apparatus for a crest welder as claimed in claim 3, wherein the bristles are made of aluminum alloy, stainless steel or titanium alloy.
6. A crest width-adjusting apparatus for a crest welder as claimed in claim 3, wherein the length of said bristles ranges between 1-100 mm.
7. A crest width-adjusting apparatus for a crest welder as claimed in claim 3, wherein the length of said bristles ranges between 5 and 60 mm.
8. A crest width-adjusting apparatus for a crest welder as claimed in claim 3, wherein the length of said bristles ranges between 10 and 14 mm.
9. A crest width-adjusting apparatus for crest welder as claimed in claim 3, wherein each bristle has a section diameter of between 0.01 and 0.5 mm.
10. A crest width-adjusting apparatus for crest welder as claimed in claim 3, wherein each bristle has a section diameter of between 0.05 and 0.4 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211034701.8A CN117655455A (en) | 2022-08-26 | 2022-08-26 | Wave crest width adjusting device for wave crest welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211034701.8A CN117655455A (en) | 2022-08-26 | 2022-08-26 | Wave crest width adjusting device for wave crest welding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117655455A true CN117655455A (en) | 2024-03-08 |
Family
ID=90075620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211034701.8A Pending CN117655455A (en) | 2022-08-26 | 2022-08-26 | Wave crest width adjusting device for wave crest welding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117655455A (en) |
-
2022
- 2022-08-26 CN CN202211034701.8A patent/CN117655455A/en active Pending
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