CN114465430A - 一种陶瓷刮板及其制备方法 - Google Patents
一种陶瓷刮板及其制备方法 Download PDFInfo
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- CN114465430A CN114465430A CN202210142789.9A CN202210142789A CN114465430A CN 114465430 A CN114465430 A CN 114465430A CN 202210142789 A CN202210142789 A CN 202210142789A CN 114465430 A CN114465430 A CN 114465430A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000440 bentonite Substances 0.000 claims abstract description 8
- 229910000278 bentonite Inorganic materials 0.000 claims abstract description 8
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims abstract description 8
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 8
- 239000010436 fluorite Substances 0.000 claims abstract description 8
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 8
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 8
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 8
- 239000000454 talc Substances 0.000 claims abstract description 8
- 229910052623 talc Inorganic materials 0.000 claims abstract description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 10
- 238000001354 calcination Methods 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000008188 pellet Substances 0.000 claims description 7
- 235000012222 talc Nutrition 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000008187 granular material Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 4
- 238000003837 high-temperature calcination Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 4
- 239000011118 polyvinyl acetate Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000011152 fibreglass Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000007790 scraping Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052573 porcelain Inorganic materials 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
本发明涉及机电设备加工技术领域,且公开了一种陶瓷刮板,包括外基板,外基板的内部包覆有芯板,芯板包括外部固定连接有芯网板,外基板的设置有刮板口;所述外基板和刮板口设置为陶瓷材料:硅粉、氧化铝、滑石、氧化镁、氧化钛、膨润土、钨粉、萤石、锌粉、二氧化钼、二氧化硅、碳化硅。该陶瓷刮瓷板通过陶瓷材料制备,从而满足耐磨刚强度的特性,有效减少在刮线工程中产生的磨损,保证该陶瓷刮板的使用寿命,避免刮板口磨损,从而保证刮线工作的安全性,同时通过内置芯板,进一步保证该刮板的机械性能,增加该刮板的抗折弯性能,提高自身强度,有效保证使用效果,同时利用芯板开设连通孔和芯网板结构,保证陶瓷外基板和芯板的复合连接效果。
Description
技术领域
本发明涉及机电设备加工技术领域,具体为一种陶瓷刮板及其制备方法。
背景技术
刮板又称划线板,用竹片或层压板制成,是小型电机嵌线时的使用工具。在嵌线时用刮板分开槽口的绝缘纸,将已经下槽的导线理齐,并推向槽内两侧,使后嵌的导线容易入槽。在制作刮板时,刮线的部分(前端及前端两侧)要用锉刀倒圆,并用砂纸打光,以免刮线时刮破导线的绝缘层和槽底的绝缘纸,其宽度为2cm~3cm。
现有的刮板由于其自身材质原因,从而导致其本身强度不高,耐磨性差,在长时间工作时,其刮线部分往往会因为长时间工作而受损,导致对导线部分造成损伤,影响工作效果。
发明内容
针对现有技术的不足,本发明提供了一种陶瓷刮板及其制备方法,具备本身性能优越,有效满足刮线需求,使用寿命长,且本身制备工艺简单,有效保证刮板的强度和硬度,同时满足耐磨耐用的优点。
为实现上述目的,本发明提供如下技术方案:一种陶瓷刮板,包括外基板,外基板的内部包覆有芯板,芯板包括外部固定连接有芯网板,外基板的设置有刮板口;
所述外基板和刮板口设置为陶瓷材料,其按重量组份数比为:
硅粉7-8份、氧化铝6-9份、滑石5-6份、氧化镁3-5份、氧化钛2-5份、膨润土3-6份、钨粉2-4份、萤石7-11份、锌粉3-4份、二氧化钼0.1-0.3份、二氧化硅5-8份、碳化硅4-7份;
所述芯板和芯网板的材料为镍基高温合金钢,芯板和芯网板一体成型,芯网板设计为网状。
进一步优选的,所述芯板的表面开设有贯穿连通孔。
一种陶瓷刮板制备方法,包括以下步骤:
S1、备料硅粉、氧化铝、滑、氧化镁、氧化钛、膨润土、钨粉、萤石、锌粉、二氧化钼、二氧化硅和碳化硅;
S2、将原料分开进行煅烧预处理,其中,氧化铝预烧温度为1400-1450℃,保1-3h,氧化镁预烧温度大于1400℃,滑石预烧温度在1300-1500℃,其余材料预烧温度在1270-1390℃;
S3、将预烧后材料加入球磨破碎混合;
S4、将混合后原料加入塑化剂,通过喷雾造粒机制备成团粒;
S5、将球团颗粒添加高温粘接剂,并将芯板为衬板压制成型;
S6、将成型件进行高温煅烧,先控制温度从室温提升至300℃,升温时间为5-8h;再控制温度从300升至950℃,升温时间为10-13h,再控制温度提升至1600-1700℃,保温4-6h;
S7、在煅烧完成后,控制降温,降温时长为10-15h;
S8、将烧结后陶瓷刮板坯料按照设计尺寸进行磨削加工处理;
S9、将磨削处理后的陶瓷进行施釉处理,得到成品陶瓷刮板。
进一步优选的,所述氧化铝为α-Al2O3、β-Al2O3、γ-Al2O3的任意比例混合,将氧化铝经过高温预烧中加入H3BO3添加剂,保温时间2-3h。
进一步优选的,所述S4步骤化剂为聚醋酸乙烯酯,制备团粒为20-80目。
进一步优选的,所述S5步骤高温粘接剂采用GWJ-350型高温粘接剂。
有益效果:
该陶瓷刮板及其制备方法,该陶瓷刮瓷板通过陶瓷材料制备,从而满足耐磨刚强度的特性,有效减少在刮线工程中产生的磨损,保证该陶瓷刮板的使用寿命,避免刮板口磨损,从而保证刮线工作的安全性,同时通过内置芯板,进一步保证该刮板的机械性能,增加该刮板的抗折弯性能,提高自身强度,有效保证使用效果,同时利用芯板开设连通孔和芯网板结构,保证陶瓷外基板和芯板的复合连接效果。
该陶瓷刮板及其制备方法,该制备工艺整体过程简单易控,提高刮板的制备效率和制备效果,同时有效保证陶瓷刮板成型后的机械性能,提高该陶瓷刮板的整体使用效果。
该陶瓷刮板及其制备方法,通过对原料预烧处理,有效提高原料的性能和效果,通过预烧氧化铝,使β-Al2O3和γ-Al2O3转换为α-Al2O3,利用α-Al2O3三方晶系特性,进一步提高该陶瓷刮板的机械性能。
附图说明
图1为本发明结构整体示意图。
图中:1、外基板;11、刮板口;2、芯板;21、芯网板。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例一
请参阅图1,一种陶瓷刮板,包括外基板1,外基板1的内部包覆有芯板2,芯板2包括外部固定连接有芯网板21,外基板1的设置有刮板口11;
所述外基板1和刮板口11设置为陶瓷材料,其按重量组份数比为:
硅粉7-8份、氧化铝6-9份、滑石5-6份、氧化镁3-5份、氧化钛2-5份、膨润土3-6份、钨粉2-4份、萤石7-11份、锌粉3-4份、二氧化钼0.1-0.3份、二氧化硅5-8份、碳化硅4-7份;
所述芯板2和芯网板21的材料为镍基高温合金钢,芯板2和芯网板21一体成型,芯网板21设计为网状。
本实施例中,所述芯板2的表面开设有贯穿连通孔。
实施例二
一种陶瓷刮板制备方法,包括以下步骤:
S1、备料硅粉7份、氧化铝6份、滑石5份、氧化镁3份、氧化钛2份、膨润土3份、钨粉2份、萤石7份、锌粉3份、二氧化钼0.1份、二氧化硅5份、碳化硅份;
S2、将原料分开进行煅烧预处理,其中,氧化铝预烧温度为1400℃,保2h,氧化镁预烧温度大于1400℃,滑石预烧温度在1300℃,其余材料预烧温度在1270℃;
S3、将预烧后材料加入球磨破碎混合;
S4、将混合后原料加入塑化剂,通过喷雾造粒机制备成团粒;
S5、将球团颗粒添加高温粘接剂,并将芯板2为衬板压制成型;
S6、将成型件进行高温煅烧,先控制温度从室温提升至300℃,升温时间为5h;再控制温度从300升至950℃,升温时间为10h,再控制温度提升至1600℃,保温4h;
S7、在煅烧完成后,控制降温,降温时长为10h;
S8、将烧结后陶瓷刮板坯料按照设计尺寸进行磨削加工处理;
S9、将磨削处理后的陶瓷进行施釉处理,得到成品陶瓷刮板。
本实施例中,所述氧化铝为α-Al2O3、β-Al2O3、γ-Al2O3的任意比例混合,将氧化铝经过高温预烧中加入H3BO3添加剂,保温时间2h。
本实施例中,所述S4步骤化剂为聚醋酸乙烯酯,制备团粒为20-80目。
本实施例中,所述S5步骤高温粘接剂采用GWJ-350型高温粘接剂。
实施例三
一种陶瓷刮板制备方法,包括以下步骤:
S1、备料硅粉8份、氧化铝9份、滑石6份、氧化镁5份、氧化钛5份、膨润土6份、钨粉4份、萤石11份、锌粉4份、二氧化钼0.3份、二氧化硅8份、碳化硅7份;
S2、将原料分开进行煅烧预处理,其中,氧化铝预烧温度为1450℃,保3h,氧化镁预烧温度大于1400℃,滑石预烧温度在1500℃,其余材料预烧温度在1390℃;
S3、将预烧后材料加入球磨破碎混合;
S4、将混合后原料加入塑化剂,通过喷雾造粒机制备成团粒;
S5、将球团颗粒添加高温粘接剂,并将芯板2为衬板压制成型;
S6、将成型件进行高温煅烧,先控制温度从室温提升至300℃,升温时间为8h;再控制温度从300升至950℃,升温时间为13h,再控制温度提升至1700℃,保温6h;
S7、在煅烧完成后,控制降温,降温时长为15h;
S8、将烧结后陶瓷刮板坯料按照设计尺寸进行磨削加工处理;
S9、将磨削处理后的陶瓷进行施釉处理,得到成品陶瓷刮板。
本实施例中,所述氧化铝为α-Al2O3、β-Al2O3、γ-Al2O3的任意比例混合,将氧化铝经过高温预烧中加入H3BO3添加剂,保温时间3h。
本实施例中,所述S4步骤化剂为聚醋酸乙烯酯,制备团粒为20-80目。
本实施例中,所述S5步骤高温粘接剂采用GWJ-350型高温粘接剂。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (6)
1.一种陶瓷刮板,其特征在于:包括外基板(1),外基板(1)的内部包覆有芯板(2),芯板(2)包括外部固定连接有芯网板(21),外基板(1)的设置有刮板口(11);
所述外基板(1)和刮板口(11)设置为陶瓷材料,其按重量组份数比为:
硅粉7-8份、氧化铝6-9份、滑石5-6份、氧化镁3-5份、氧化钛2-5份、膨润土3-6份、钨粉2-4份、萤石7-11份、锌粉3-4份、二氧化钼0.1-0.3份、二氧化硅5-8份、碳化硅4-7份;
所述芯板(2)和芯网板(21)的材料为镍基高温合金钢,芯板(2)和芯网板(21)一体成型,芯网板(21)设计为网状。
2.根据权利要求1所述的一种陶瓷刮板,其特征在于:所述芯板(2)的表面开设有贯穿连通孔。
3.一种陶瓷刮板制备方法,其特征在于:包括以下步骤:
S1、备料硅粉、氧化铝、滑、氧化镁、氧化钛、膨润土、钨粉、萤石、锌粉、二氧化钼、二氧化硅和碳化硅;
S2、将原料分开进行煅烧预处理,其中,氧化铝预烧温度为1400-1450℃,保1-3h,氧化镁预烧温度大于1400℃,滑石预烧温度在1300-1500℃,其余材料预烧温度在1270-1390℃;
S3、将预烧后材料加入球磨破碎混合;
S4、将混合后原料加入塑化剂,通过喷雾造粒机制备成团粒;
S5、将球团颗粒添加高温粘接剂,并将芯板(2)为衬板压制成型;
S6、将成型件进行高温煅烧,先控制温度从室温提升至300℃,升温时间为5-8h;再控制温度从300升至950℃,升温时间为10-13h,再控制温度提升至1600-1700℃,保温4-6h;
S7、在煅烧完成后,控制降温,降温时长为10-15h;
S8、将烧结后陶瓷刮板坯料按照设计尺寸进行磨削加工处理;
S9、将磨削处理后的陶瓷进行施釉处理,得到成品陶瓷刮板。
4.根据权利要求3所述的一种陶瓷刮板制备方法,其特征在于:所述氧化铝为α-Al2O3、β-Al2O3、γ-Al2O3的任意比例混合,将氧化铝经过高温预烧中加入H3BO3添加剂,保温时间2-3h。
5.根据权利要求3所述的一种陶瓷刮板制备方法,其特征在于:所述S4步骤化剂为聚醋酸乙烯酯,制备团粒为20-80目。
6.根据权利要求1所述的一种陶瓷刮板及其制备方法,其特征在于:所述S5步骤高温粘接剂采用GWJ-350型高温粘接剂。
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CN101053976A (zh) * | 2007-02-12 | 2007-10-17 | 洛阳市涧西区金硕耐磨材料厂 | 超耐磨复合陶瓷刮刀/板及其制备方法 |
CN201659628U (zh) * | 2010-03-29 | 2010-12-01 | 珠海仕高玛机械设备有限公司 | 一种刮刀 |
CN109928764A (zh) * | 2019-02-27 | 2019-06-25 | 郑海东 | 一种led灯用陶瓷材料及其制备方法 |
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