CN114461037A - Computer water-cooling heat abstractor - Google Patents
Computer water-cooling heat abstractor Download PDFInfo
- Publication number
- CN114461037A CN114461037A CN202011235900.6A CN202011235900A CN114461037A CN 114461037 A CN114461037 A CN 114461037A CN 202011235900 A CN202011235900 A CN 202011235900A CN 114461037 A CN114461037 A CN 114461037A
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- CN
- China
- Prior art keywords
- computer
- heat
- water
- water tank
- power switch
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 48
- 238000005057 refrigeration Methods 0.000 claims abstract description 26
- 238000010521 absorption reaction Methods 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 description 4
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a computer water-cooling heat dissipation device which comprises a heat radiator body, a heat absorption pipe, a power switch, a power plug, a refrigeration water tank, a pressurizing device, a pressurizing controller, a computer anti-skidding baffle, a heat absorption port, a water inlet pipe, a water return pipe and a condenser. The device utilizes the water-cooling to absorb the hot gas that gives off on the computer, dispels the heat for the computer, improves computer life.
Description
Technical Field
The invention relates to a heat dissipation device, in particular to a computer water-cooling heat dissipation device, and belongs to the field of computer application.
Background
Computer radiator: the device or the instrument can timely transfer heat generated by machinery or other appliances during working so as to avoid influencing the normal work of the machinery or other appliances. Common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode. Integrated circuits are heavily used in computer components. It is well known that high temperatures are a rival of integrated circuits. The high temperature can not only cause unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the computer components is ensured to be normal. Most heat sinks absorb heat by contacting the surfaces of heat-generating components, and then transfer the heat to a remote location by various methods, such as air in a chassis, and then the chassis transfers the hot air to the outside of the chassis, thereby dissipating heat from the computer. The types of radiators are very many, and CPUs, display cards, mainboard chip sets, hard disks, cases, power supplies and even optical drives and memories all need radiators, and the different radiators cannot be used in a mixed manner, wherein the radiator of the CPU is the most frequently contacted. According to the way of taking away heat from the heat sink, the heat sink of the computer can be divided into active heat dissipation and passive heat dissipation. The former is commonly an air-cooled heat sink, while the latter is commonly a heat sink. The further subdivision heat dissipation mode can be divided into air cooling, heat pipes, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like. These radiators are all the radiators of computers, the life is more and more convenient at present, people use notebook computers more and more generally, and it is unlikely that large-scale cooling systems are installed on the notebook computers, so that the heat dissipation of the notebook computers is grippy to people, most of the radiating holes are arranged at the bottom and the side edges of the computers, but the radiating holes at the side edges are slow and poor in effect, most of the radiating holes at the bottom are blocked by the desktop and cannot dissipate heat, and many people use fans to dissipate heat of the computers at present and blow away hot air, but the effect of the method is not obvious, the temperature of the computers is reduced slowly, and therefore the water-cooling heat dissipation device for the computers is provided.
Disclosure of Invention
The invention aims to solve the technical problem that the existing computer radiator can not perform secondary heat dissipation on a computer by using water cooling, and provides a water-cooling heat dissipation device for a computer.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides a computer water-cooling heat dissipation device, which comprises a heat sink body, a heat absorption pipe, a power switch, a power plug, a refrigeration water tank, a pressurizing device, a pressurizing controller, a computer anti-skid baffle, a heat absorption port, a water inlet pipe, a water return pipe and a condenser, wherein the computer anti-skid baffle is arranged on one side of the heat sink body, the water return pipe is arranged on the other side of the heat sink body, the heat absorption pipe is arranged in the middle of the heat sink body, the heat absorption port is arranged on the heat absorption pipe, the pressurizing controller is arranged at the bottom end of the heat sink body, the refrigeration water tank is arranged at the top end of the pressurizing controller, the water inlet pipe is arranged at the top end of the refrigeration water tank, the condenser is arranged on one side of the refrigeration water tank, the pressurizing device is arranged on the other side of the refrigeration water tank, and the power switch is arranged on one side of the condenser, one side of the power switch is provided with the power plug.
As a preferred technical solution of the present invention, the power plug is electrically connected to the power switch, and the power switch is electrically connected to the condenser.
As a preferred technical solution of the present invention, the power plug is electrically connected to the power switch, the power switch is electrically connected to the pressurization controller, and the pressurization controller is electrically connected to the pressurization device.
The invention has the following beneficial effects: the device is a computer water-cooling heat abstractor, uses the device's the biggest benefit to carry out the secondary for the computer and dispels the heat, improves the life of computer, lets the computer use more smoothly, absorbs the steam that the computer gived off through cold water heat absorption moreover and then gives off, and the device simple structure conveniently promotes.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
in the figure: 1. a heat sink body; 2. a heat absorbing tube; 3. a power switch; 4. a power plug; 5. a refrigeration water tank; 6. a pressurizing device; 7. a pressurization controller; 8. a computer antiskid baffle; 9. a heat absorption port; 10. a water inlet pipe; 11. a water return pipe; 12. a condenser.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1
As shown in figure 1, the invention provides a computer water-cooling heat dissipation device, which comprises a heat sink body 1, a heat absorption pipe 2, a power switch 3, a power plug 4, a refrigeration water tank 5, a pressure device 6, a pressure controller 7, a computer antiskid baffle 8, a heat absorption port 9, a water inlet pipe 10, a water return pipe 11 and a condenser 12, wherein one side of the heat sink body 1 is provided with the computer antiskid baffle 8, the other side of the heat sink body 1 is provided with the water return pipe 11, the middle part of the heat sink body 1 is provided with the heat absorption pipe 2, the heat absorption port 9 is arranged on the heat absorption pipe 2, the bottom end of the heat sink body 1 is provided with the pressure controller 7, the top end of the pressure controller 7 is provided with the refrigeration water tank 5, the top end of the refrigeration water tank 5 is provided with the water inlet pipe 10, one side of the refrigeration water tank 5 is provided with the condenser 12, the other side of the refrigeration water tank 5 is provided with the pressure device 6, one side of the condenser 12 is provided with the power switch 3, one side of the power switch 3 is provided with a power plug 4.
Further, the power plug 4 is electrically connected to the power switch 3, and the power switch 3 is electrically connected to the condenser 12. The condenser can convert gas or vapor into liquid to transfer the heat from the computer to the air near the radiator in a quick way.
The power plug 4 is electrically connected with the power switch 3, the power switch 3 is electrically connected with the pressure controller 7, and the pressure controller 7 is electrically connected with the pressure device 6. Cold water is circulated through the water pipe by pressurization.
The device is a computer water-cooling heat dissipation device, when using the device, firstly putting a computer on a heat sink body 1, using a computer antiskid baffle plate 8 to prevent the computer from slipping off, then plugging a power plug 4 to electrify a pressurization controller 7, controlling a pressurization device 6 to pressurize a refrigeration water tank 5, enabling water on the refrigeration water tank 5 to flow into a heat absorption pipe 2 on the heat sink body 1 through a water inlet pipe 10 and return to the refrigeration water tank 5 through a water return pipe 11, wherein ammonium nitrate is arranged in the refrigeration water tank 5, when the water in the heat absorption pipe 2 absorbs heat emitted by the computer, the water is pressurized by the pressurization device 6 to return to the refrigeration water tank 5 to be rapidly cooled when encountering the ammonium nitrate and then is pressurized to impact the water inlet pipe 10, so as to absorb the heat emitted by the computer back and forth, meanwhile, a heat absorption port 9 can absorb the heat of the computer in the heat sink, gas or vapor can be converted into liquid through a condenser 12, with the heat that the computer gived off to in the mode very fast, reach the air near the radiator to give the computer heat dissipation once more, the maximum benefit of using the device is exactly can carry out the secondary for the computer and dispel the heat, improves the life of computer, lets the computer use more smoothly, absorbs the steam that the computer gived off and then gives off through cold water heat absorption moreover, the device simple structure, convenient popularization.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A computer water-cooling heat dissipation device comprises a heat sink body (1), a heat absorption pipe (2), a power switch (3), a power plug (4), a refrigeration water tank (5), a pressure device (6), a pressure controller (7), a computer anti-skid baffle (8), a heat absorption port (9), a water inlet pipe (10), a water return pipe (11) and a condenser (12), and is characterized in that the computer anti-skid baffle (8) is arranged on one side of the heat sink body (1), the water return pipe (11) is arranged on the other side of the heat sink body (1), the heat absorption pipe (2) is arranged in the middle of the heat sink body (1), the heat absorption port (9) is arranged on the heat absorption pipe (2), the pressure controller (7) is arranged at the bottom end of the heat sink body (1), the refrigeration water tank (5) is arranged at the top end of the pressure controller (7), the top of refrigeration water tank (5) is equipped with inlet tube (10), one side of refrigeration water tank (5) is equipped with condenser (12), the opposite side of refrigeration water tank (5) is equipped with pressure device (6), one side of condenser (12) is equipped with switch (3), one side of switch (3) is equipped with power plug (4).
2. The water-cooled heat dissipation device for computers as claimed in claim 1, wherein the power plug (4) is electrically connected to the power switch (3), and the power switch (3) is electrically connected to the condenser (12).
3. The water-cooled heat dissipation device for computers of claim 1, wherein the power plug (4) is electrically connected to the power switch (3), the power switch (3) is electrically connected to the pressure controller (7), and the pressure controller (7) is electrically connected to the pressure device (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011235900.6A CN114461037A (en) | 2020-11-09 | 2020-11-09 | Computer water-cooling heat abstractor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011235900.6A CN114461037A (en) | 2020-11-09 | 2020-11-09 | Computer water-cooling heat abstractor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114461037A true CN114461037A (en) | 2022-05-10 |
Family
ID=81404187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011235900.6A Pending CN114461037A (en) | 2020-11-09 | 2020-11-09 | Computer water-cooling heat abstractor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114461037A (en) |
-
2020
- 2020-11-09 CN CN202011235900.6A patent/CN114461037A/en active Pending
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PB01 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220510 |
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WD01 | Invention patent application deemed withdrawn after publication |