CN114454485A - Device and method for cleaning micro-nano 3D printing head - Google Patents
Device and method for cleaning micro-nano 3D printing head Download PDFInfo
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- CN114454485A CN114454485A CN202210203987.1A CN202210203987A CN114454485A CN 114454485 A CN114454485 A CN 114454485A CN 202210203987 A CN202210203987 A CN 202210203987A CN 114454485 A CN114454485 A CN 114454485A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 91
- 238000010146 3D printing Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 108
- 238000007639 printing Methods 0.000 claims abstract description 90
- 238000005201 scrubbing Methods 0.000 claims abstract description 24
- 238000002791 soaking Methods 0.000 claims abstract description 24
- 239000002699 waste material Substances 0.000 claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 239000010703 silicon Substances 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 4
- 238000010009 beating Methods 0.000 abstract description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 14
- 238000003860 storage Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000007788 liquid Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/35—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
A device for cleaning a micro-nano 3D printing head comprises a base and an adjusting mechanism arranged on the base, wherein the adjusting mechanism is provided with an integrated cleaning mechanism and a contact sensor, the integrated cleaning mechanism comprises a base body and a soaking and cleaning station, a waste station, a scrubbing station, a positioning station and a preprinting station which are arranged on the base body, the contact sensor is connected to one side of the integrated cleaning mechanism, and the top of the contact sensor is parallel to the surface of the positioning station; compared with the prior art, through set up on the pedestal and soak the washing station, the waste material station, clean the station, the station is washd and the station is printed in advance, realize the concentrated integration design on the pedestal, satisfy the washing of beating printer head, the location with print the function in advance, and set up contact pick-up on integral type wiper mechanism, can realize the regulation to the height of beating printer head, satisfy and beat printer head and print the back on printing the station in advance, need not to modify and beat printer head height, can reach and directly print the operation to the machined surface, sparingly print the step.
Description
Technical Field
The invention relates to the technical field of printing head cleaning, in particular to a device and a method for cleaning a micro-nano 3D printing head.
Background
3D printing, which is one of the rapid prototyping technologies, is also called additive manufacturing, which is a technology for constructing an object by using an adhesive material such as powdered metal or plastic and the like, and by printing layer by layer, based on a digital model file.
3D printing is typically achieved using digital technology material printers. The method is often used for manufacturing models in the fields of mold manufacturing, industrial design and the like, and is gradually used for directly manufacturing some products, and parts printed by the technology are already available. The technology has applications in jewelry, footwear, industrial design, construction, engineering and construction, automotive, aerospace, dental and medical industries, education, geographic information systems, civil engineering, and other fields.
Wherein need wash the printer head of 3D printer after printing the completion, be convenient for print next time, also prevent the material to the jam of syringe needle, need wash after dismantling printer head usually among the prior art, this just makes need relocate printer head's position after the reinstallation of printer head, has aggravated operating personnel's work load.
Chinese patent No. CN201920516803.0 discloses a beat printer head and use high-efficient cleaning equipment, the power distribution box comprises a box body, there is the chamber door box front side through hinge connection, and the inside top of box is provided with first water storage chamber, and first water storage chamber lower extreme is provided with the outlet, and both ends are provided with the holder about the outlet downside, box upside fixed mounting has second water storage chamber, and second water storage chamber upside right-hand member is provided with the filler, and the filler upside is provided with seals the stopper, and the second water storage chamber left and right sides is connected with first water storage chamber through the drain pipe, installs the drain pump on the drain pipe, adjustable brushing device is installed to the bottom half.
Above-mentioned this kind of cleaning equipment of disclosing inside the washing liquid suction of second water storage chamber inside with first water storage intracavity portion, the inside cleaning solution in first water storage intracavity portion will flow through the inside pipeline of printing head to can wash the inside pipeline of printing head, this kind of washing mode structure is complicated, and first water storage chamber and second water storage chamber structure are great, dismantle the difficulty.
Disclosure of Invention
The invention provides a device and a method for cleaning a micro-nano 3D printing head, which are simple in structure, integrally designed and convenient to calibrate, and aims to overcome the defects in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: a device for cleaning a micro-nano 3D printing head comprises a base and an adjusting mechanism arranged on the base, wherein the adjusting mechanism is provided with an integrated cleaning mechanism and a contact sensor, the integrated cleaning mechanism comprises a base body, and a soaking cleaning station, a waste station, a scrubbing station, a positioning station and a preprinting station which are arranged on the base body, the contact sensor is connected to one side of the integrated cleaning mechanism, and the top of the contact sensor is parallel to the surface of the positioning station; the soaking and cleaning station, the waste material station and the scrubbing station are sequentially arranged and are positioned on the same straight line; the positioning station is located at the corner of the integrated cleaning mechanism.
As a preferable scheme of the invention, the adjusting mechanism comprises a lifting adjusting mechanism and an angle adjusting mechanism which are connected, the angle adjusting mechanism is connected to the lifting adjusting mechanism, the integrated cleaning mechanism and the contact sensor are connected to the angle adjusting mechanism, and the lifting adjusting mechanism is connected with the base.
As a preferred scheme of the invention, the soaking and cleaning station is a bin body structure embedded in the seat body, an opening is formed at the top of the bin body, and cleaning liquid is filled in the bin body.
As a preferred scheme of the invention, the waste material station is also of a bin body structure embedded in the seat body, and the bin body is of an empty bin structure.
As a preferable scheme of the invention, the scrubbing station is a sponge block embedded in the seat body.
As a preferred scheme of the invention, the positioning station comprises a silicon wafer and a first wedge-shaped block which are matched with each other, a first mounting groove matched with the silicon wafer and a first wedge-shaped groove matched with the first wedge-shaped block are formed on the base, the first wedge-shaped groove is communicated with the first mounting groove, a first screw countersunk groove is formed on the first wedge-shaped groove, and a first positioning groove matched with the first screw countersunk groove is formed on the base.
As a preferable scheme of the invention, the preprinting station comprises a ceramic sheet and a second wedge-shaped block which are matched with each other, a second mounting groove matched with the ceramic sheet and a second wedge-shaped groove matched with the second wedge-shaped block are formed on the base, the second wedge-shaped groove is communicated with the second mounting groove, a second screw countersunk groove is formed on the second wedge-shaped groove, and a second positioning groove matched with the second screw countersunk groove is formed on the base.
In a preferred embodiment of the present invention, the positioning station and the preprinting station are located on the same level.
A method for cleaning a device of a micro-nano 3D printing head comprises the following steps:
step A: a base is arranged on one side of the processing table, a lifting adjusting mechanism and an angle adjusting mechanism are arranged on the base, an integrated cleaning mechanism is arranged on the angle adjusting mechanism, and a contact sensor is arranged on the integrated cleaning mechanism;
and B: the integrated cleaning mechanism and the contact sensor are subjected to position adjustment through adjusting the lifting adjusting mechanism and the angle adjusting mechanism, wherein the vertical height of the integrated cleaning mechanism is adjusted through the lifting adjusting mechanism, and the angle displacement angle of the integrated cleaning mechanism is adjusted through the angle adjusting mechanism;
and C: descending a printing head to touch a contact sensor 4, hitting a light spot at the center of the contact sensor 4 through a laser height measuring sensor 5 to obtain a height H1, descending the printing head to touch the contact sensor 4 to obtain a moving height H2, and obtaining a height difference delta H between the lower end surface of the laser height measuring sensor 5 and the printing head, wherein the height distance between the printing head and the printing plane is Hp measured by the laser height measuring sensor 5 during printing, and the height Hh = Hp-delta H from the printing plane of the printing head, so that the distance between the printing head and the printing plane is calibrated, the heights of a silicon wafer 3-7 and a ceramic wafer 3-13 are measured through the laser height measuring sensor 5, and the required descending amount of the printing head during matching with the silicon wafer 3-7 or the ceramic wafer 3-13 is controlled according to the obtained distance between the printing head and the printing plane;
aligning the printing head to the sharp corner of the positioning station to be used as an identification point for fixing the calibration of the relative XY position relation of the workpiece, calculating the path relation from the point to the soaking and cleaning station, the waste station, the scrubbing station, the preprinting station and the processing surface in advance, and setting corresponding path codes;
step E: moving the printing head to a waste station, a soaking and cleaning station and a scrubbing station in sequence, and printing on the processing surface according to the path code;
step F: after printing is finished, the printing head is moved to the soaking and cleaning station and the scrubbing station in sequence according to the path code to be cleaned and scrubbed, and cleaning operation before and after printing of the printing head is finished
As a preferred embodiment of the present invention, the laser height measurement sensor measures heights of multiple points of the pre-printing station to calculate an inclination angle of the pre-printing station, and similarly, the laser height measurement sensor measures heights of multiple points of the processing surface to calculate an inclination angle of the processing surface, and the elevation adjustment mechanism and the angular position adjustment mechanism are adjusted to make the pre-printing station parallel to the processing surface.
Compared with the prior art, the invention has the beneficial effects that:
1. the seat body is provided with the soaking and cleaning station, the waste station, the scrubbing station, the positioning station and the preprinting station, so that the centralized integrated design on the seat body is realized, and the cleaning, positioning and preprinting functions of the printing head are met;
2. the contact sensor is arranged on the integrated cleaning mechanism, so that the height of the printing head can be adjusted, the requirement that the printing head does not need to be modified after printing on a preprinting station is met, the printing operation can be directly carried out on a processing surface, and the printing step is saved;
3. through the cooperation of wedge and potsherd or silicon chip, can realize the dismouting of potsherd or silicon chip convenient, be convenient for potsherd or silicon chip's washing and change, also ensure the centre gripping of potsherd or silicon chip simultaneously and stabilize.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of an integrated purge mechanism;
FIG. 3 is a schematic structural view of an integrated purge mechanism;
FIG. 4 is a top view of the present invention;
FIG. 5 is a schematic view of the installation of a laser altimeter sensor;
reference numerals: the device comprises a base 1, an adjusting mechanism 2, a lifting adjusting mechanism 2-1, an angle adjusting mechanism 2-2, an integrated cleaning mechanism 3, a base body 3-1, a soaking cleaning station 3-2, a waste station 3-3, a scrubbing station 3-4, a positioning station 3-5, a preprinting station 3-6, a silicon wafer 3-7, a first wedge block 3-8, a first mounting groove 3-9, a first wedge groove 3-10, a first screw countersunk groove 3-11, a first positioning groove 3-12, a ceramic wafer 3-13, a second wedge block 3-14, a second mounting groove 3-15, a second wedge groove 3-16, a second screw countersunk groove 3-17, a second positioning groove 3-18, a contact sensor 4 and a laser height measuring sensor 5.
Detailed Description
The following describes embodiments of the present invention in detail with reference to the accompanying drawings.
As shown in fig. 1-5, a device for cleaning a micro-nano 3D printing head comprises a base 1 and an adjusting mechanism 2 arranged on the base 1, wherein the adjusting mechanism 2 is provided with an integrated cleaning mechanism 3 and a contact sensor 4, the integrated cleaning mechanism 3 comprises a base body 3-1, and a soaking cleaning station 3-2, a waste station 3-3, a scrubbing station 3-4, a positioning station 3-5 and a preprinting station 3-6 which are arranged on the base body 3-1, the contact sensor 4 is connected to one side of the integrated cleaning mechanism 3, and the top of the contact sensor 4 is parallel to the surface of the positioning station 3-5; the soaking and cleaning station 3-2, the waste material station 3-3 and the scrubbing station 3-4 are sequentially arranged, and the soaking and cleaning station 3-2, the waste material station 3-3 and the scrubbing station 3-4 are positioned on the same straight line; and the positioning stations 3-5 are positioned at the corners of the integrated cleaning mechanism 3.
A base of an integrated structure with the base body 3-1 is formed on one side of the base body 3-1, and the contact sensor 4 is fixedly connected to the base through a bolt, so that the integrated cleaning mechanism 3 and the contact sensor 4 can synchronously move in the adjusting process.
The adjusting mechanism 2 comprises a lifting adjusting mechanism 2-1 and an angle adjusting mechanism 2-2 which are connected, the angle adjusting mechanism 2-2 is connected to the lifting adjusting mechanism 2-1, the integrated cleaning mechanism 3 and the contact sensor 4 are connected to the angle adjusting mechanism 2-2, and the lifting adjusting mechanism 2-1 is connected with the base 1.
The lifting adjusting mechanism 2-1 is a Z-axis horizontal lifting displacement sliding table with a crossed guide rail, high-strength aluminum alloy is adopted, black anode oxidation is carried out through sand blasting, then a high-precision crossed roller guide rail is assembled, the lifting adjusting mechanism is suitable for light and heavy loads and is a direct-acting platform with excellent performance, the angular position adjusting mechanism 2-2 can adopt an OMO-VM series cylindrical V-shaped adjusting frame, 2 M6x0.25 fine tooth promoters are arranged, the precise adjustment of +/-3 degrees can be realized, and the fine tooth promoters are designed with flexible locking mechanisms to provide long-term reliability.
The integrated cleaning mechanism 3 and the contact sensor 4 are adjusted under the action of the lifting adjusting mechanism 2-1 and the angle adjusting mechanism 2-2.
Soak and wash station 3-2 for the embedded storehouse body structure in pedestal 3-1, storehouse body top is formed with the opening, and the internal portion in storehouse has been irritated the washing liquid, and the washing liquid can be alcohol or acetic acid or ethyl ester, can set up according to the material of actually printing, and it is internal that the storehouse is gone into through the opening at storehouse body top to beat printer head, realizes will beating printer head and soak in the internal storehouse, realizes the washing to the printer head outer wall.
The waste material station 3-3 is also a bin body structure embedded in the base body 3-1, the bin body is an empty bin structure, the printing head enters the bin body through an opening in the top of the bin body, and the material extrusion operation can be performed in the empty bin structure, so that the situation that the printing head is blocked is prevented, and the initial discharge end of the printing head is removed.
The bin body is a cavity structure arranged on the base body 3-1, the selection of functions is carried out according to actual needs, when cleaning liquid is filled in the bin body, the bin body is a corresponding soaking and cleaning station 3-2, when the bin body is a hollow mechanism, the bin body is arranged in a corresponding waste material station 3-3, namely a waste material bin, the top of the bin body is provided with small holes corresponding to the printing head, and the washing liquid is prevented from shaking and overflowing corresponding to the soaking and cleaning station 3-2.
The scrubbing station 3-4 is a sponge block embedded in the base body 3-1, the surface of the sponge block is positioned above the base body 3-1, and when the printing head passes through the base body 3-1, the surface of the sponge block can rub against the printing head to realize scrubbing of the printing head.
The positioning station 3-5 comprises silicon wafers 3-7 and first wedge-shaped blocks 3-8 which are matched with each other, a first mounting groove 3-9 matched with the silicon wafers 3-7 and a first wedge-shaped groove 3-10 matched with the first wedge-shaped block 3-8 are formed in the base 1, the first wedge-shaped groove 3-10 is communicated with the first mounting groove 3-9, a first screw countersunk groove 3-11 is formed in the first wedge-shaped groove 3-10, and a first positioning groove 3-12 matched with the first screw countersunk groove 3-11 is formed in the base 1.
The size of the first wedge-shaped block 3-8 corresponds to that of the first wedge-shaped groove 3-10, so that the surface of the first wedge-shaped block 3-8 is flush with the surface of the seat body 3-1, the needle of the printing head can be conveniently moved, meanwhile, the first wedge-shaped groove 3-10 is of a trapezoidal structure, the first wedge-shaped block 3-8 is of a corresponding trapezoidal structure, and through sliding of the first wedge-shaped block 3-8 in the first wedge-shaped groove 3-10, two sides of the silicon chip 3-7 are simultaneously abutted against the first wedge-shaped block 3-8 and the first installation groove 3-9, and clamping of the silicon chip 3-7 is realized.
The depth of the first wedge groove 3-10 is greater than the depth of the first mounting groove 3-9, and the first wedge block 3-8 does not interfere with the first mounting groove 3-9 in the sliding process.
The first screw countersunk head groove 3-11 is a strip-shaped structure arranged along the length direction of the first wedge-shaped block 3-8, after the first wedge-shaped block 3-8 is moved to different positions of the first wedge-shaped groove 3-10 and the silicon chip 3-7 is clamped, the fixed connection of the first wedge-shaped block 3-8 on the first wedge-shaped groove 3-10 can be realized by arranging a screw in the first screw countersunk head groove 3-11 and connecting the screw with the first positioning groove 3-12, so that the silicon chip 3-7 is stably clamped.
The preprinting station 3-6 comprises ceramic plates 3-13 and second wedge-shaped blocks 3-14 which are matched with each other, second mounting grooves 3-15 matched with the ceramic plates 3-13 and second wedge-shaped grooves 3-16 matched with the second wedge-shaped blocks 3-14 are formed on the base 1, the second wedge-shaped grooves 3-16 are communicated with the second mounting grooves 3-15, second screw countersunk grooves 3-17 are formed on the second wedge-shaped grooves 3-16, and second positioning grooves 3-18 matched with the second screw countersunk grooves 3-17 are formed on the base 1.
The size of the second wedge-shaped block 3-14 corresponds to that of the second wedge-shaped groove 3-16, so that the surface of the second wedge-shaped block 3-14 is flush with the surface of the seat body 3-1, the needle moving of the printing head is facilitated, meanwhile, the second wedge-shaped groove 3-16 is of a trapezoidal structure, the second wedge-shaped block 3-14 is of a corresponding trapezoidal structure, and through the sliding of the second wedge-shaped block 3-14 in the second wedge-shaped groove 3-16, two sides of the ceramic plate 3-13 are simultaneously abutted against the second wedge-shaped block 3-14 and the second mounting groove 3-15, and the clamping of the ceramic plate 3-13 is realized.
The depth of the second wedge-shaped grooves 3-16 is greater than the depth of the second mounting grooves 3-15, and the second wedge-shaped blocks 3-14 do not interfere with the second mounting grooves 3-15 in the sliding process.
The second screw countersunk grooves 3-17 are long strip-shaped structures arranged along the length direction of the second wedge-shaped block 3-14, and after the second wedge-shaped block 3-14 is moved to different positions of the second wedge-shaped groove 3-16 and the ceramic sheet 3-13 is clamped, the screw is arranged in the second screw countersunk groove 3-17 and is connected with the second positioning groove 3-18, so that the fixed connection of the second wedge-shaped block 3-14 on the second wedge-shaped groove 3-16 is realized, and the ceramic sheet 3-13 is stably clamped.
The surfaces of the positioning stations 3-5 and the surfaces of the preprinting stations 3-6 are positioned at the same horizontal height, and after the printing head is positioned on the positioning stations 3-5, the preprinting on the preprinting stations 3-6 can be realized without repeated height positioning.
A method for cleaning a device of a micro-nano 3D printing head comprises the following steps:
step A: a base 1 is installed on one side of a machining table, a lifting adjusting mechanism 2-1 and an angle adjusting mechanism 2-2 are installed on the base 1, an integrated cleaning mechanism 3 is installed on the angle adjusting mechanism 2-2, and a contact sensor 4 is installed on the integrated cleaning mechanism 3, so that integral primary installation is achieved.
And B: the integrated cleaning mechanism 3 and the contact sensor 4 are subjected to position adjustment by adjusting the lifting adjusting mechanism 2-1 and the angle adjusting mechanism 2-2, so that the integrated cleaning mechanism 3 and the contact sensor 4 are roughly positioned.
And C: the method comprises the steps of descending a printing head to touch a contact sensor 4, hitting light spots at the center of the contact sensor 4 through a laser height measuring sensor 5 to obtain a height H1, descending the printing head to touch the contact sensor 4 to obtain a moving height H2, and obtaining a height difference delta H between the lower end face of the laser height measuring sensor 5 and the printing head, wherein the height distance between the printing head and a printing plane is measured to be Hp by the laser height measuring sensor 5 during printing, the height distance between the printing head and the printing plane is calibrated in such a way, the height of a silicon chip 3-7 is measured through the laser height measuring sensor 5, and the required descending amount of the printing head when the printing head is matched with the silicon chip 3-7 or the silicon chip 3-13 is controlled according to the obtained distance between the printing head and the printing plane.
After the height of the silicon wafer 3-7 is measured, further, the height of the ceramic wafer 3-13 is measured.
The laser height measuring sensor 5 is arranged in parallel with the printing head, the laser height measuring sensor 5 is used for measuring the multi-point height of the preprinting station 3-6 plane, so that the inclination angle of the preprinting station 3-6 is calculated, the height of the processing surface is measured through the laser height measuring sensor 5 multi-point, the inclination angle of the processing surface is calculated, the lifting adjusting mechanism 2-1 and the angular position adjusting mechanism 2-2 are adjusted to enable the preprinting station 3-6 to be parallel to the processing surface, and accurate positioning of the integrated cleaning mechanism 3 and the contact sensor 4 is achieved.
After the printing head is adjusted, the printing head can be directly printed on the processing surface after being printed from the preprinting station 3-6 without modifying the height of the printing head.
And D, aligning the printing head at a sharp corner of the positioning station 3-5, using the printing head as an identification point for fixing the calibration of the relative XY position relationship of the workpiece, calculating the path relationship of the point to the soaking and cleaning station 3-2, the waste station 3-3, the scrubbing station 3-4, the preprinting station 3-6 and the processing surface in advance, and setting corresponding path codes.
Specifically, a relative relation is established by using the identification points of the positioning stations 3-5, the positions of the soaking and cleaning station 3-2, the waste station 3-3, the scrubbing station 3-4, the preprinting station 3-6 and the processing surface are all established on the coordinate system, and the printing head can be moved to a required position as required by moving the printing head.
Step E: before printing, the printing head moves to a waste soaking station 3-3 or a preprinting station 3-6, a cleaning station 3-2 and a scrubbing station 3-4 in sequence, and printing on the processing surface is carried out according to the path code.
The waste material station 3-3 corresponds to a printing head for jet printing, the preprinting station 3-6 corresponds to a printing head for extrusion printing, and the printing head is ensured to be cleaned and scrubbed before moving to a processing surface under the action of the cleaning station 3-2 and the scrubbing station 3-4.
The printing head is used for cleaning the surface of the soaking and cleaning station 3-2, and material is removed initially on the waste station 3-3, so that the printing head is ensured to be extruded stably, the printing head after the material is extruded is wiped on the scrubbing station 3-4, and then the printing head is moved to the preprinting station 3-6 to observe the preprinting condition, so that the stability and reliability of printing on a processing surface are ensured.
Step F: and after printing is finished, sequentially moving the printing head to the soaking and cleaning station 3-2 and the scrubbing station 3-4 according to the path code to clean and wipe, and finishing the cleaning operation of the printing head before and after printing.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention; thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Although the reference numerals in the figures are used more here: the device comprises a base 1, an adjusting mechanism 2, a lifting adjusting mechanism 2-1, an angle adjusting mechanism 2-2, an integrated cleaning mechanism 3, a base body 3-1, a soaking cleaning station 3-2, a waste station 3-3, a scrubbing station 3-4, a positioning station 3-5, a preprinting station 3-6, a silicon wafer 3-7, a first wedge block 3-8, a first mounting groove 3-9, a first wedge groove 3-10, a first screw countersunk groove 3-11, a first positioning groove 3-12, a ceramic wafer 3-13, a second wedge block 3-14, a second mounting groove 3-15, a second wedge groove 3-16, a second screw countersunk groove 3-17, a second positioning groove 3-18, a contact sensor 4, a laser height measuring sensor 5 and other terms, but the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (10)
1. A device for cleaning a micro-nano 3D printing head comprises a base (1) and an adjusting mechanism (2) arranged on the base (1), wherein the adjusting mechanism (2) is provided with an integrated cleaning mechanism (3) and a contact sensor (4), and is characterized in that the integrated cleaning mechanism (3) comprises a base body (3-1), and a soaking cleaning station (3-2), a waste station (3-3), a scrubbing station (3-4), a positioning station (3-5) and a preprinting station (3-6) which are arranged on the base body (3-1), the contact sensor (4) is connected to one side of the integrated cleaning mechanism (3), and the top of the contact sensor (4) is parallel to the surface of the positioning station (3-5); the soaking and cleaning station (3-2), the waste station (3-3) and the scrubbing station (3-4) are sequentially arranged, and the soaking and cleaning station (3-2), the waste station (3-3) and the scrubbing station (3-4) are positioned on the same straight line; the positioning stations (3-5) are positioned at the corners of the integrated cleaning mechanism (3).
2. The device for cleaning the micro-nano 3D printing head according to claim 1, wherein the adjusting mechanism (2) comprises a lifting adjusting mechanism (2-1) and an angle adjusting mechanism (2-2) which are connected, the angle adjusting mechanism (2-2) is connected to the lifting adjusting mechanism (2-1), the integrated cleaning mechanism (3) and the contact sensor (4) are connected to the angle adjusting mechanism (2-2), and the lifting adjusting mechanism (2-1) is connected with the base (1).
3. The device for cleaning the micro-nano 3D printing head according to claim 1, wherein the soaking and cleaning station (3-2) is a bin body structure embedded in a base body (3-1), an opening is formed at the top of the bin body, and a cleaning solution is filled in the bin body.
4. The device for cleaning the micro-nano 3D printing head according to claim 1, wherein the waste material station (3-3) is also a bin body structure embedded in the seat body (3-1), and the bin body is an empty bin structure.
5. The device for cleaning the micro-nano 3D printing head according to claim 1, wherein the scrubbing station (3-4) is a sponge block embedded in the base body (3-1).
6. The device for cleaning the micro-nano 3D printing head according to claim 1, wherein the positioning station (3-5) comprises a silicon wafer (3-7) and a first wedge-shaped block (3-8) which are matched with each other, a first mounting groove (3-9) matched with the silicon wafer (3-7) and a first wedge-shaped groove (3-10) matched with the first wedge-shaped block (3-8) are formed on the base (1), the first wedge-shaped groove (3-10) is communicated with the first mounting groove (3-9), a first screw countersunk groove (3-11) is formed on the first wedge-shaped groove (3-10), and a first positioning groove (3-12) matched with the first screw countersunk groove (3-11) is formed on the base (1).
7. The device for cleaning the micro-nano 3D printing head according to claim 1, wherein the preprinting station (3-6) comprises a ceramic plate (3-13) and a second wedge-shaped block (3-14) which are matched with each other, a second mounting groove (3-15) matched with the ceramic plate (3-13) and a second wedge-shaped groove (3-16) matched with the second wedge-shaped block (3-14) are formed on the base (1), the second wedge-shaped groove (3-16) is communicated with the second mounting groove (3-15), a second screw countersunk groove (3-17) is formed on the second wedge-shaped groove (3-16), and a second positioning groove (3-18) matched with the second screw countersunk groove (3-17) is formed on the base (1).
8. Device for cleaning micro-nano 3D printing heads according to claim 1, characterized in that the positioning stations (3-5) and the preprinting stations (3-6) are positioned on the same level.
9. A method for cleaning a device of a micro-nano 3D printing head is characterized by comprising the following steps:
step A: a base (1) is installed on one side of a processing table, a lifting adjusting mechanism (2-1) and an angle adjusting mechanism (2-2) are installed on the base (1), an integrated cleaning mechanism (3) is installed on the angle adjusting mechanism (2-2), and a contact sensor (4) is installed on the integrated cleaning mechanism (3);
and B: the integrated cleaning mechanism (3) and the contact sensor (4) are subjected to position adjustment by adjusting the lifting adjusting mechanism (2-1) and the angle adjusting mechanism (2-2), wherein the vertical height of the integrated cleaning mechanism (3) is adjusted by the lifting adjusting mechanism (2-1), and the angle displacement angle of the integrated cleaning mechanism (3) is adjusted by the angle adjusting mechanism (2-2);
and C: descending a printing head to touch a contact sensor (4), hitting a light spot at the center of the contact sensor (4) through a laser height measuring sensor (5) to obtain a height H1, descending the printing head to touch the contact sensor (4) to obtain a moving height H2, obtaining a height difference delta H between the lower end face of the laser height measuring sensor (5) and the printing head, measuring the height distance between a printing plane and the printing head by the laser height measuring sensor (5) during printing to be Hp, and the height Hh = Hp-delta H between the printing head and the printing plane, so as to calibrate the distance between the printing head and the printing plane, measuring the height of a silicon wafer (3-7) through the laser height measuring sensor (5), and controlling the required descending amount of the printing head when the printing head is matched with the silicon wafer (3-7) or the ceramic wafer (3-13) according to the obtained distance between the printing head and the printing plane;
aligning the printing head to the sharp corner of the positioning station (3-5) to be used as an identification point for fixing the calibration of the relative XY position relation of the workpiece, calculating the path relation of the point to the soaking and cleaning station (3-2), the waste station (3-3), the scrubbing station (3-4), the preprinting station (3-6) and the processing surface in advance, and setting corresponding path codes;
step E: moving the printing head to a waste station (3-3) or a preprinting station (3-6), a soaking and cleaning station (3-2) and a scrubbing station (3-4) in sequence, and printing on the processing surface according to the path code;
step F: and after printing is finished, the printing head is sequentially moved to the soaking and cleaning station (3-2) and the scrubbing station (3-4) according to the path code to be cleaned and scrubbed, and cleaning operation before and after printing of the printing head is finished.
10. The method for cleaning the micro-nano 3D printing head device according to claim 9, characterized in that the laser height measuring sensor (5) measures the multi-point height of the pre-printing station (3-6) to calculate the inclination angle of the pre-printing station (3-6)), and similarly, the laser height measuring sensor (5) measures the height of the processing surface to calculate the inclination angle of the processing surface, and the elevation adjusting mechanism (2-1) and the angular position adjusting mechanism (2-2) are adjusted to enable the pre-printing station (3-6) to be parallel to the processing surface.
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