CN114454485B - Device and method for cleaning micro-nano 3D printing head - Google Patents
Device and method for cleaning micro-nano 3D printing head Download PDFInfo
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- CN114454485B CN114454485B CN202210203987.1A CN202210203987A CN114454485B CN 114454485 B CN114454485 B CN 114454485B CN 202210203987 A CN202210203987 A CN 202210203987A CN 114454485 B CN114454485 B CN 114454485B
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- cleaning
- adjusting mechanism
- printing head
- printing
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- 238000004140 cleaning Methods 0.000 title claims abstract description 106
- 238000010146 3D printing Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 107
- 238000007639 printing Methods 0.000 claims abstract description 88
- 238000002791 soaking Methods 0.000 claims abstract description 27
- 238000005201 scrubbing Methods 0.000 claims abstract description 25
- 239000002699 waste material Substances 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 238000003860 storage Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/35—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
The device for cleaning the micro-nano 3D printing head comprises a base and an adjusting mechanism arranged on the base, wherein the adjusting mechanism is provided with an integrated cleaning mechanism and a contact sensor, the integrated cleaning mechanism comprises a base, a soaking cleaning station, a waste station, a scrubbing station, a positioning station and a preprinting station which are arranged on the base, the contact sensor is connected to one side of the integrated cleaning mechanism, and the top of the contact sensor is arranged in parallel with the surface of the positioning station; compared with the prior art, through setting up on the pedestal and soaking cleaning station, waste material station, scrubbing station, location station and preprinting station, realize the centralized integrated design on the pedestal, satisfy the washing, the location and the preprinting function of print head to set up touch sensor on integral type wiper mechanism, can realize the regulation to the height of print head, satisfy the print head and print the back on preprinting station, need not to modify print head height, and directly print the operation to the machined surface, save the printing step.
Description
Technical Field
The invention relates to the technical field of printing head cleaning, in particular to a device and a method for cleaning a micro-nano 3D printing head.
Background
A 3D printing, namely a rapid prototyping technology, also called additive manufacturing, is a technology for constructing objects by using powdery metal or plastic and other bondable materials in a layer-by-layer printing mode based on digital model files.
3D printing is typically implemented using a digital technology material printer. Often in the fields of mould manufacture, industrial design, etc., are used to manufacture models, and later gradually in the direct manufacture of some products, parts have been printed using this technique. The technology has application in jewelry, footwear, industrial design, construction, engineering and construction, automotive, aerospace, dental and medical industries, education, geographic information systems, civil engineering, firearms, and other fields.
Wherein need wash the print head of 3D printer after printing, be convenient for print next time, also prevent the jam of material to the syringe needle, need dismantle the print head in prior art after wash usually, this just makes need to carry out repositioning to the position of print head after the reinstallation of print head, has aggravated operating personnel's work load.
Chinese patent No. CN201920516803.0 discloses a print head is with high-efficient cleaning equipment, which comprises a box body, the box front side has the chamber door through hinge connection, and the inside top of box is provided with first water storage chamber, and first water storage chamber lower extreme is provided with the outlet, and both ends are provided with the clamping part about the outlet downside, box upside fixed mounting has the second water storage chamber, and second water storage chamber upside right-hand member is provided with the filler, and the filler upside is provided with seals the stopper, and second water storage chamber left and right sides is connected with first water storage chamber through the drain pipe, installs the drain pump on the drain pipe, adjustable brushing device is installed to the bottom half.
The cleaning device disclosed by the above is used for sucking the cleaning liquid stored in the second water storage cavity into the first water storage cavity, and the cleaning solution in the first water storage cavity flows out through the pipeline in the printing head, so that the pipeline in the printing head can be cleaned.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a device and a cleaning method for cleaning a micro-nano 3D printing head, which have simple structure, integrated design and convenient calibration.
In order to achieve the above object, the present invention adopts the following technical scheme: the device for cleaning the micro-nano 3D printing head comprises a base and an adjusting mechanism arranged on the base, wherein an integrated cleaning mechanism and a contact sensor are arranged on the adjusting mechanism, the integrated cleaning mechanism comprises a base, a soaking cleaning station, a waste station, a scrubbing station, a positioning station and a preprinting station which are arranged on the base, the contact sensor is connected to one side of the integrated cleaning mechanism, and the top of the contact sensor is arranged in parallel with the surface of the positioning station; the soaking and cleaning station, the waste material station and the scrubbing station are sequentially arranged, and the soaking and cleaning station, the waste material station and the scrubbing station are positioned on the same straight line; the positioning station is positioned at the corner of the integrated cleaning mechanism.
As a preferable scheme of the invention, the adjusting mechanism comprises a lifting adjusting mechanism and an angular position adjusting mechanism which are connected, the angular position adjusting mechanism is connected to the lifting adjusting mechanism, the integrated cleaning mechanism and the contact sensor are connected to the angular position adjusting mechanism, and the lifting adjusting mechanism is connected with the base.
As a preferable scheme of the invention, the soaking and cleaning station is a bin body structure embedded in the base body, an opening is formed at the top of the bin body, and cleaning liquid is filled in the bin body.
As a preferable scheme of the invention, the waste station is also of a bin body structure embedded in the base body, and the bin body is of an empty bin structure.
As a preferable scheme of the invention, the scrubbing station is a sponge block embedded on the base body.
As a preferable scheme of the invention, the positioning station comprises a silicon wafer and a first wedge block which are matched, a first mounting groove matched with the silicon wafer and a first wedge groove matched with the first wedge block are formed on the base, the first wedge groove is communicated with the first mounting groove, a first screw countersunk head groove is formed on the first wedge groove, and a first positioning groove matched with the first screw countersunk head groove is formed on the base.
As a preferable scheme of the invention, the preprinting station comprises a ceramic sheet and a second wedge block which are matched with each other, a second mounting groove matched with the ceramic sheet and a second wedge groove matched with the second wedge block are formed on the base, the second wedge groove is communicated with the second mounting groove, a second screw countersunk head groove is formed on the second wedge groove, and a second positioning groove matched with the second screw countersunk head groove is formed on the base.
As a preferred embodiment of the present invention, the positioning station and the preprinting station are located at the same level.
A method for cleaning a micro-nano 3D printhead device, comprising the steps of:
step A: a base is arranged on one side of the processing table, a lifting adjusting mechanism and an angular position adjusting mechanism are arranged on the base, an integrated cleaning mechanism is arranged on the angular position adjusting mechanism, and a contact sensor is arranged on the integrated cleaning mechanism;
and (B) step (B): position adjustment is carried out on the integrated cleaning mechanism and the contact sensor by adjusting the lifting adjusting mechanism and the angular position adjusting mechanism, wherein the vertical height of the integrated cleaning mechanism is adjusted by the lifting adjusting mechanism, and the angular position adjusting mechanism adjusts the angular displacement angle of the integrated cleaning mechanism;
step C: the method comprises the steps that a printing head descends to touch a contact sensor, a light spot is printed on the center of the contact sensor through a laser altimeter sensor to obtain the height H1, the descending touch contact sensor of the printing head obtains the moving height H2, the height difference delta H between the lower end face of the laser altimeter sensor and the printing head is obtained, the laser altimeter sensor detects that the height distance between the printing plane and the printing head is Hp, the height Hh=Hp-delta H between the printing head and the printing plane is measured, the distance between the printing head and the printing plane is calibrated, the heights of a silicon wafer and a ceramic wafer are measured through the laser altimeter sensor, and the descending amount required when the printing head is matched with the silicon wafer or the ceramic wafer is controlled according to the obtained distance between the printing head and the printing plane;
aligning a printing head to the sharp angle of a positioning station, using the sharp angle as an identification point for calibrating the relative XY position relation of a fixed workpiece, calculating the path relation from the point to a soaking cleaning station, a waste station, a scrubbing station, a preprinting station and a processing surface in advance, and setting corresponding path codes;
step E: sequentially moving the printing head to a waste station, a soaking and cleaning station and a scrubbing station, and printing on a processing surface according to path codes;
step F: after printing, the printing head is sequentially moved to a soaking cleaning station and a scrubbing station according to the path codes to clean and wipe, and cleaning operations before and after printing of the printing head are completed
As a preferable scheme of the invention, the laser height measuring sensor measures the multipoint height of the preprinting station, so as to calculate the inclination angle of the preprinting station, and similarly, the laser height measuring sensor measures the height of the processing surface at a plurality of points, so as to calculate the inclination angle of the processing surface, and the elevation adjusting mechanism and the angular position adjusting mechanism are adjusted to enable the preprinting station to be parallel to the processing surface.
Compared with the prior art, the invention has the beneficial effects that:
1. the integrated design of centralization on the seat body is realized by arranging the soaking and cleaning station, the waste material station, the scrubbing station, the positioning station and the preprinting station on the seat body, so that the cleaning, positioning and preprinting functions of the printing head are satisfied;
2. the integrated cleaning mechanism is provided with the contact sensor, so that the height of the printing head can be adjusted, the printing head does not need to be modified after printing on a preprinting station, the printing operation can be directly performed on a processing surface, and the printing step is saved;
3. through the cooperation of wedge and potsherd or silicon chip, can realize that potsherd or silicon chip's dismouting is convenient, and the washing and the change of potsherd or silicon chip of being convenient for also ensure simultaneously that potsherd or silicon chip's centre gripping is stable.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic structural view of an integrated cleaning mechanism;
FIG. 3 is a schematic view of the structure of the integrated cleaning mechanism;
FIG. 4 is a top view of the present invention;
FIG. 5 is a schematic view of the installation of a laser altimeter sensor;
reference numerals: the device comprises a base 1, an adjusting mechanism 2, a lifting adjusting mechanism 2-1, an angular position adjusting mechanism 2-2, an integrated cleaning mechanism 3, a base body 3-1, a soaking cleaning station 3-2, a waste station 3-3, a scrubbing station 3-4, a positioning station 3-5, a preprinting station 3-6, a silicon wafer 3-7, a first wedge-shaped block 3-8, a first mounting groove 3-9, a first wedge-shaped groove 3-10, a first screw countersink 3-11, a first positioning groove 3-12, a ceramic plate 3-13, a second wedge-shaped block 3-14, a second mounting groove 3-15, a second wedge-shaped groove 3-16, a second screw countersink 3-17, a second positioning groove 3-18, a contact sensor 4 and a laser height sensor 5.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
1-5, a device for cleaning a micro-nano 3D printing head comprises a base 1 and an adjusting mechanism 2 arranged on the base 1, wherein an integrated cleaning mechanism 3 and a contact sensor 4 are arranged on the adjusting mechanism 2, the integrated cleaning mechanism 3 comprises a base 3-1, a soaking cleaning station 3-2, a waste station 3-3, a scrubbing station 3-4, a positioning station 3-5 and a preprinting station 3-6 which are arranged on the base 3-1, the contact sensor 4 is connected to one side of the integrated cleaning mechanism 3, and the top of the contact sensor 4 is arranged in parallel with the surface of the positioning station 3-5; the soaking and cleaning station 3-2, the waste station 3-3 and the scrubbing station 3-4 are sequentially arranged, and the soaking and cleaning station 3-2, the waste station 3-3 and the scrubbing station 3-4 are positioned on the same straight line; the positioning station 3-5 is positioned at the corner of the integrated cleaning mechanism 3.
One side of the base body 3-1 is provided with a base which is of an integrated structure with the base body 3-1, and the contact sensor 4 is fixedly connected to the base through bolts, so that the integrated cleaning mechanism 3 and the contact sensor 4 can synchronously move in the adjustment process.
The adjusting mechanism 2 comprises a lifting adjusting mechanism 2-1 and an angular position adjusting mechanism 2-2 which are connected, the angular position adjusting mechanism 2-2 is connected to the lifting adjusting mechanism 2-1, the integrated cleaning mechanism 3 and the contact sensor 4 are connected to the angular position adjusting mechanism 2-2, and the lifting adjusting mechanism 2-1 is connected with the base 1.
The lifting adjusting mechanism 2-1 is a cross guide rail Z-axis horizontal lifting displacement sliding table, adopts high-strength aluminum alloy, is subjected to sand blasting black anodic oxidation, is then assembled with a high-precision cross roller guide rail, is suitable for light and heavy load and frequent adjustment, is a linear motion platform with excellent performance, and the angular position adjusting mechanism 2-2 can adopt an OMO-VM (open-close-virtual machine) series cylindrical V-shaped adjusting frame, is provided with 2M 6x0.25 fine tooth accelerators, can realize +/-3 DEG precise adjustment, and is provided with a flexible locking mechanism for providing long-term reliability.
The integrated cleaning mechanism 3 and the contact sensor 4 are adjusted under the action of the lifting adjusting mechanism 2-1 and the angular position adjusting mechanism 2-2.
The soaking and cleaning station 3-2 is a bin body structure embedded in the base body 3-1, an opening is formed in the top of the bin body, cleaning liquid is filled in the bin body, the cleaning liquid can be alcohol or acetic acid or ethyl ester, the cleaning liquid can be set according to actual printing materials, a printing head enters the bin body through the opening in the top of the bin body, the printing head is soaked in the bin body, and the outer wall of the printing head is cleaned.
The waste station 3-3 is also of a bin body structure embedded in the base body 3-1, the bin body is of an empty bin structure, the printing head enters the bin body through an opening at the top of the bin body, and extrusion operation can be performed in the empty bin structure, so that the printing head is prevented from being blocked, and the initial discharge end of the printing head is also removed.
The bin body is of a cavity structure which is placed on the base body 3-1, functions are selected according to actual needs, when the bin body is filled with cleaning liquid, the bin body is a corresponding soaking cleaning station 3-2, and when the bin body is of a hollow mechanism, the bin body is in place, corresponding waste stations 3-3, namely waste bins, small holes corresponding to printing heads are formed in the top of the bin body, and shaking and overflow of the cleaning liquid are prevented corresponding to the soaking cleaning stations 3-2.
The scrubbing station 3-4 is a sponge block embedded on the base body 3-1, the surface of the sponge block is positioned above the base body 3-1, and when the printing head passes through the base body 3-1, the surface of the sponge block can rub with the printing head, so that the printing head can be wiped.
The positioning station 3-5 comprises a silicon wafer 3-7 and a first wedge-shaped block 3-8 which are matched with each other, a first mounting groove 3-9 which is matched with the silicon wafer 3-7 and a first wedge-shaped groove 3-10 which is matched with the first wedge-shaped block 3-8 are formed on the base 1, the first wedge-shaped groove 3-10 is communicated with the first mounting groove 3-9, a first screw countersink 3-11 is formed on the first wedge-shaped groove 3-10, and a first positioning groove 3-12 which is matched with the first screw countersink 3-11 is formed on the base 1.
The size of the first wedge-shaped block 3-8 corresponds to the size of the first wedge-shaped groove 3-10, so that the surface of the first wedge-shaped block 3-8 is flush with the surface of the base body 3-1, the needle of the printing head is convenient to walk, meanwhile, the first wedge-shaped groove 3-10 is of a trapezoid structure, the first wedge-shaped block 3-8 is of a corresponding trapezoid structure, and through sliding of the first wedge-shaped block 3-8 in the first wedge-shaped groove 3-10, two sides of the silicon wafer 3-7 are propped against the first wedge-shaped block 3-8 and the first mounting groove 3-9 at the same time, and clamping of the silicon wafer 3-7 is achieved.
The depth of the first wedge-shaped groove 3-10 is greater than the depth of the first mounting groove 3-9, and does not interfere with the first mounting groove 3-9 during sliding of the first wedge-shaped block 3-8.
The first screw countersunk head groove 3-11 is of a strip-shaped structure arranged along the length direction of the first wedge-shaped block 3-8, after the first wedge-shaped block 3-8 is moved to different positions of the first wedge-shaped groove 3-10 and the silicon wafer 3-7 is clamped, the screw can be arranged in the first screw countersunk head groove 3-11 and connected with the first positioning groove 3-12, so that the first wedge-shaped block 3-8 is fixedly connected to the first wedge-shaped groove 3-10, and the silicon wafer 3-7 is clamped stably.
The preprinting station 3-6 comprises a ceramic sheet 3-13 and a second wedge-shaped block 3-14 which are matched, a second mounting groove 3-15 which is matched with the ceramic sheet 3-13 and a second wedge-shaped groove 3-16 which is matched with the second wedge-shaped block 3-14 are formed on the base 1, the second wedge-shaped groove 3-16 is communicated with the second mounting groove 3-15, a second screw countersunk head groove 3-17 is formed on the second wedge-shaped groove 3-16, and a second positioning groove 3-18 which is matched with the second screw countersunk head groove 3-17 is formed on the base 1.
The size of the second wedge-shaped block 3-14 corresponds to the size of the second wedge-shaped groove 3-16, so that the surface of the second wedge-shaped block 3-14 is flush with the surface of the base body 3-1, the needle of the printing head is convenient to walk, meanwhile, the second wedge-shaped groove 3-16 is of a trapezoid structure, the second wedge-shaped block 3-14 is of a corresponding trapezoid structure, and the two sides of the ceramic piece 3-13 are propped against the second wedge-shaped block 3-14 and the second mounting groove 3-15 simultaneously through sliding of the second wedge-shaped block 3-14 in the second wedge-shaped groove 3-16, so that the ceramic piece 3-13 is clamped.
The depth of the second wedge-shaped groove 3-16 is greater than the depth of the second mounting groove 3-15, and does not interfere with the second mounting groove 3-15 during sliding of the second wedge-shaped block 3-14.
The second screw countersunk head groove 3-17 is of a strip-shaped structure arranged along the length direction of the second wedge-shaped block 3-14, after the second wedge-shaped block 3-14 is moved to different positions of the second wedge-shaped groove 3-16 and the ceramic plate 3-13 is clamped, a screw can be arranged in the second screw countersunk head groove 3-17 and connected with the second positioning groove 3-18, so that the second wedge-shaped block 3-14 is fixedly connected to the second wedge-shaped groove 3-16, and the ceramic plate 3-13 is clamped stably.
The surfaces of the positioning station 3-5 and the preprinting station 3-6 are positioned on the same horizontal height, and after the printing head is positioned on the positioning station 3-5, the preprinting on the preprinting station 3-6 can be realized without repeated height positioning.
A method for cleaning a micro-nano 3D printhead device, comprising the steps of:
step A: a base 1 is arranged on one side of a processing table, a lifting adjusting mechanism 2-1 and an angular position adjusting mechanism 2-2 are arranged on the base 1, an integrated cleaning mechanism 3 is arranged on the angular position adjusting mechanism 2-2, and a contact sensor 4 is arranged on the integrated cleaning mechanism 3, so that the integral preliminary installation is realized.
And (B) step (B): the lifting adjusting mechanism 2-1 and the angular position adjusting mechanism 2-2 are adjusted to adjust the positions of the integrated cleaning mechanism 3 and the contact sensor 4, so that coarse positioning of the integrated cleaning mechanism 3 and the contact sensor 4 is realized.
Step C: the printing head descends to touch the contact sensor 4, a light spot is printed at the center of the contact sensor 4 through the laser height measuring sensor 5 to obtain the height H1, the printing head descends to touch the contact sensor 4 to obtain the moving height H2, the height difference delta H between the lower end face of the laser height measuring sensor 5 and the printing head is obtained, the laser height measuring sensor 5 measures the height distance between the printing plane and the printing plane to be Hp during printing, the printing head is at the distance from the printing plane to be Hh=Hp-delta H, the distance between the printing head and the printing plane is calibrated, the height of the silicon chip 3-7 is measured through the laser height measuring sensor 5, and the descending amount of the printing head required when the printing head is matched with the silicon chip 3-7 or the ceramic chip 3-13 is controlled according to the obtained distance between the printing head and the printing plane.
After the height of the silicon wafer 3-7 is measured, further, the height of the ceramic wafer 3-13 is measured.
The laser height measuring sensor 5 is arranged in parallel with the printing head, the laser height measuring sensor 5 is used for measuring the multipoint height of the plane of the preprinting station 3-6, so that the inclination angle of the preprinting station 3-6 is calculated, the laser height measuring sensor 5 is used for measuring the height of the processing surface in a multipoint manner, the inclination angle of the processing surface is calculated, the lifting adjusting mechanism 2-1 and the angle position adjusting mechanism 2-2 are adjusted to enable the preprinting station 3-6 to be parallel with the processing surface, and the accurate positioning of the integrated cleaning mechanism 3 and the contact sensor 4 is realized.
After the printing head is adjusted, printing from the preprinting station 3-6 can be directly carried out on the processing surface, and the height of the printing head is not required to be modified.
And D, aligning the printing head to the sharp angle of the positioning station 3-5 to serve as an identification point for calibrating the relative XY position relation of the fixed workpiece, calculating the path relation from the point to the soaking cleaning station 3-2, the waste station 3-3, the scrubbing station 3-4, the preprinting station 3-6 and the processing surface in advance, and setting corresponding path codes.
Specifically, the relative relationship is established by the identification points of the positioning stations 3-5, and the positions of the soaking cleaning station 3-2, the waste material station 3-3, the scrubbing station 3-4, the preprinting station 3-6 and the processing surface are all established on the coordinate system, so that the printing head can be moved to the required position according to the requirement by moving the printing head.
Step E: before printing, the printing head is sequentially moved to a waste soaking station 3-3 or a preprinting station 3-6, a cleaning station 3-2 and a scrubbing station 3-4, and printing on the processing surface is performed according to path codes.
The waste station 3-3 corresponds to a printing head for jet printing, the preprinting station 3-6 corresponds to a printing head for extrusion printing, and cleaning and scrubbing are ensured before the printing head moves to a processing surface under the action of the cleaning station 3-2 and the scrubbing station 3-4.
The printing head is used for cleaning the surface of the printing head at the soaking and cleaning station 3-2, and is used for cleaning materials at the waste station 3-3 at the initial time, so that the extrusion stability of the printing head is ensured, the printing head after extrusion is wiped at the scrubbing station 3-4, and then the printing head is moved to the preprinting station 3-6 to observe the preprinting condition, so that the stable and reliable printing on a processing surface is ensured.
Step F: after printing, the printing head is sequentially moved to the soaking cleaning station 3-2 and the scrubbing station 3-4 according to the path codes to clean and wipe, and cleaning operations before and after printing of the printing head are completed.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention; thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Although the reference numerals in the figures are used more herein: the device comprises a base 1, an adjusting mechanism 2, a lifting adjusting mechanism 2-1, an angular position adjusting mechanism 2-2, an integrated cleaning mechanism 3, a base body 3-1, a soaking cleaning station 3-2, a waste station 3-3, a scrubbing station 3-4, a positioning station 3-5, a preprinting station 3-6, a silicon wafer 3-7, a first wedge-shaped block 3-8, a first mounting groove 3-9, a first wedge-shaped groove 3-10, a first screw countersink 3-11, a first positioning groove 3-12, a ceramic plate 3-13, a second wedge-shaped block 3-14, a second mounting groove 3-15, a second wedge-shaped groove 3-16, a second screw countersink 3-17, a second positioning groove 3-18, a contact sensor 4, a laser height sensor 5 and other terms, but the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.
Claims (10)
1. The cleaning method for the device for cleaning the micro-nano 3D printing head comprises a base (1) and an adjusting mechanism (2) arranged on the base (1), wherein the adjusting mechanism (2) is provided with an integrated cleaning mechanism (3) and a contact sensor (4), and the cleaning method is characterized by comprising the following steps:
step A: a base (1) is arranged on one side of a processing table, a lifting adjusting mechanism (2-1) and an angular position adjusting mechanism (2-2) are arranged on the base (1), an integrated cleaning mechanism (3) is arranged on the angular position adjusting mechanism (2-2), and a contact sensor (4) is arranged on the integrated cleaning mechanism (3);
and (B) step (B): the position of the integrated cleaning mechanism (3) and the position of the contact sensor (4) are adjusted by adjusting the lifting adjusting mechanism (2-1) and the angular position adjusting mechanism (2-2), wherein the vertical height of the integrated cleaning mechanism (3) is adjusted by the lifting adjusting mechanism (2-1), and the angular displacement angle of the integrated cleaning mechanism (3) is adjusted by the angular position adjusting mechanism (2-2);
step C: the method comprises the steps that a printing head descends to touch a contact sensor (4), a light spot is printed at the center of the contact sensor (4) through a laser height measuring sensor (5) to obtain the height H1, the printing head descends to touch the contact sensor (4) to obtain the moving height H2, the height difference delta H between the lower end face of the laser height measuring sensor (5) and the printing head is obtained, the laser height measuring sensor (5) measures the height interval of a printing plane to be Hp during printing, the height Hh=Hp-delta H between the printing head and the printing plane, the distance between the printing head and the printing plane is calibrated, the height of a silicon wafer (3-7) is measured through the laser height measuring sensor (5), and the required descending amount of the printing head when the printing head is matched with the silicon wafer (3-7) or a ceramic wafer (3-13) is controlled according to the obtained distance between the printing head and the printing plane;
aligning a printing head to the sharp angle of a positioning station (3-5) to serve as an identification point for calibrating the relative XY position relation of a fixed workpiece, calculating the path relation from the point to a soaking cleaning station (3-2), a waste material station (3-3), a scrubbing station (3-4), a preprinting station (3-6) and a processing surface in advance, and setting corresponding path codes;
step E: the printing head is sequentially moved to a waste station (3-3) or a preprinting station (3-6), a soaking and cleaning station (3-2) and a scrubbing station (3-4), and printing on a processing surface is performed according to path codes;
step F: after printing, the printing head is sequentially moved to a soaking cleaning station (3-2) and a scrubbing station (3-4) according to the path codes to clean and wipe, and cleaning operations before printing and after printing of the printing head are completed.
2. A cleaning method of a device for cleaning micro-nano 3D printheads according to claim 1, wherein the laser altimeter sensor (5) measures the multipoint height of the preprinting station (3-6) to calculate the inclination angle of the preprinting station (3-6), and the laser altimeter sensor (5) measures the height of the working surface at a plurality of points to calculate the inclination angle of the working surface, and the elevation adjusting mechanism (2-1) and the angular position adjusting mechanism (2-2) are adjusted to make the preprinting station (3-6) or parallel to the working surface.
3. A device for cleaning a micro-nano 3D printing head, characterized in that a method for cleaning a micro-nano 3D printing head is based on the device of any one of claims 1-2, wherein the integrated cleaning mechanism (3) comprises a base body (3-1) and a soaking cleaning station (3-2), a waste material station (3-3), a scrubbing station (3-4), a positioning station (3-5) and a preprinting station (3-6) which are arranged on the base body (3-1), the contact sensor (4) is connected to one side of the integrated cleaning mechanism (3), and the top of the contact sensor (4) is arranged in parallel with the surface of the positioning station (3-5); the soaking and cleaning station (3-2), the waste station (3-3) and the scrubbing station (3-4) are sequentially arranged, and the soaking and cleaning station (3-2), the waste station (3-3) and the scrubbing station (3-4) are positioned on the same straight line; the positioning station (3-5) is positioned at the corner of the integrated cleaning mechanism (3).
4. A device for cleaning a micro-nano 3D printhead according to claim 3, wherein the adjusting mechanism (2) comprises a lifting adjusting mechanism (2-1) and an angular position adjusting mechanism (2-2) which are connected, the angular position adjusting mechanism (2-2) is connected to the lifting adjusting mechanism (2-1), the integral cleaning mechanism (3) and the contact sensor (4) are connected to the angular position adjusting mechanism (2-2), and the lifting adjusting mechanism (2-1) is connected to the base (1).
5. A device for cleaning a micro-nano 3D printhead according to claim 3, wherein the soaking and cleaning station (3-2) is a bin structure embedded in the base (3-1), an opening is formed at the top of the bin, and cleaning liquid is filled in the bin.
6. A device for cleaning micro-nano 3D printheads according to claim 3 wherein the waste station (3-3) is also a bin structure embedded in the base (3-1) and the bin is a blank bin structure.
7. A device for cleaning micro-nano 3D printheads according to claim 3 wherein the scrubbing station (3-4) is a sponge block embedded in the base (3-1).
8. A device for cleaning a micro-nano 3D printing head according to claim 3, wherein the positioning station (3-5) comprises a silicon wafer (3-7) and a first wedge block (3-8) which are matched with each other, a first mounting groove (3-9) which is matched with the silicon wafer (3-7) and a first wedge groove (3-10) which is matched with the first wedge block (3-8) are formed on the base (1), the first wedge groove (3-10) is communicated with the first mounting groove (3-9), a first screw countersink groove (3-11) is formed on the first wedge groove (3-10), and a first positioning groove (3-12) which is matched with the first screw countersink groove (3-11) is formed on the base (1).
9. A device for cleaning a micro-nano 3D printhead according to claim 3, wherein the preprinting station (3-6) comprises a ceramic plate (3-13) and a second wedge-shaped block (3-14) which are matched, a second mounting groove (3-15) which is matched with the ceramic plate (3-13) and a second wedge-shaped groove (3-16) which is matched with the second wedge-shaped block (3-14) are formed on the base (1), the second wedge-shaped groove (3-16) is communicated with the second mounting groove (3-15), a second screw countersink (3-17) is formed on the second wedge-shaped groove (3-16), and a second positioning groove (3-18) which is matched with the second screw countersink (3-17) is formed on the base (1).
10. A device for cleaning micro-nano 3D printheads according to claim 3 wherein the positioning stations (3-5) and pre-printing stations (3-6) are at the same level.
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