CN114437512A - Epoxy molding compound and preparation method thereof - Google Patents
Epoxy molding compound and preparation method thereof Download PDFInfo
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- CN114437512A CN114437512A CN202210014201.1A CN202210014201A CN114437512A CN 114437512 A CN114437512 A CN 114437512A CN 202210014201 A CN202210014201 A CN 202210014201A CN 114437512 A CN114437512 A CN 114437512A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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Abstract
The invention discloses an epoxy molding compound, which comprises the following components in parts by weight: 100 parts of epoxy resin, 30-60 parts of phenolic resin, 300 parts of filler 200-materials, 300 parts of glass fiber (including pretreated and non-pretreated by coupling agent), 5-15 parts of environment-friendly flame retardant, 1-3 parts of carbon black, 3-8 parts of wax, 1-4 parts of dispersant, 1-4 parts of defoamer, 3-10 parts of coupling agent and 1-3 parts of accelerator, wherein the filler has the characteristic of low shrinkage due to the fact that the addition amount of the filler is large, the dispersant is a solid high-molecular dispersant or a solvent-free liquid dispersant, the defoamer is of a solvent-free organic silicon type, and the dispersant and the defoamer are added, so that the filler can be uniformly dispersed in the resin.
Description
Technical Field
The invention relates to the field of epoxy resin, in particular to preparation of an epoxy molding compound. The product can be applied to the field of packaging protection of chip packaging, semiconductor packaging, electronic devices and electromechanical products.
Background
Epoxy molding compounds generally refer to a class of resin compositions consisting of epoxy resins, curing agents, fillers, accelerators and other necessary auxiliaries. The ceramic material has the characteristics of good corrosion resistance, electrical property, mechanical property, excellent process operability, low price and the like, and gradually replaces the status of metal, glass and ceramic materials in the field of electronic packaging. With the concern of environmental protection and the further improvement of the requirement of the epoxy molding compound on the capability of protecting the chip in a harsh environment, the development of an environment-friendly epoxy molding compound with high strength and high impact resistance (including cold and thermal impact and mechanical impact) becomes an important subject.
Because the strength of the resin is insufficient, reinforcing fibers are often required to be added into the resin so as to achieve the product strength required by customers. Wherein, the carbon fiber, the glass fiber, the polyethylene fiber, the polyaramide fiber and the like can effectively improve the strength of the resin. Chinese patent application publication No. CN104277421A is to reinforce epoxy resin by surface activating carbon fibers. Patent CN102529239A is a neutron radiation shielding material made of polyethylene fiber reinforced epoxy resin. Patent CN102321340A improves the strength of the product by adding chopped glass fibers to the epoxy molding compound.
However, the total inorganic filler filling amount of patent CN102321340A is low and less than 70%, and the problems that the material is easy to absorb moisture, the cold and hot shrinkage is serious, and the TCT cycle test is easy to crack exist. Patent CN101343398A adopts glass fiber and silicon dioxide powder as filler, the filling amount reaches more than 75%, but the bending strength of the material is less than 120MPa, and the material is easy to damage in use. The increase of the filler amount inevitably causes dispersion problems, and poor dispersion causes obvious defects of the material, thereby affecting the mechanical property and the electrical property of the product and also causing negative effects on the production operability.
Disclosure of Invention
In order to solve the problems, the invention provides an epoxy molding compound and a preparation method thereof.
An epoxy molding compound comprises the following components in parts by weight: 100 parts of epoxy resin, 30-60 parts of phenolic resin, 300 parts of filler 200-one, 300 parts of pretreated glass fiber (including pretreated and non-pretreated glass fiber) 140-one, 5-15 parts of environment-friendly flame retardant, 1-3 parts of carbon black, 3-8 parts of wax, 1-4 parts of dispersant, 1-4 parts of defoaming agent, 3-10 parts of coupling agent and 1-3 parts of accelerator, wherein the dispersant is a solid polymer type dispersant or a solvent-free type liquid dispersant, and the defoaming agent is a solvent-free organic silicon type.
In the material components, the strength of the material can be greatly enhanced by adding the pretreated glass fiber; under the condition of high integral filling amount, adding a dispersing agent, particularly a polymeric organic polymer or solvent-free liquid dispersing agent, wherein the dispersing agent is dispersed on the surface of the filler, so that adjacent particles are separated due to volume effect; the polar ends of the outer layer of the dispersant molecules repel each other to make electrostatic repulsion between the fillers, which can resist the van der waals force between the particles, thus greatly improving the dispersing performance.
The gas in the cavity of each component during mould pressing, the moisture of the material and the volatile components of the gas released by reaction are the main sources of bubbles during the plastic packaging of the device by the epoxy molding compound, and the residual condition of the bubbles in the device during the plastic packaging can be improved by adding the defoaming agent, particularly the solvent-free organic silicon defoaming agent. Firstly, the addition of the defoaming agent can reduce the viscosity of a bubble liquid film, so that the flow of bubbles in an epoxy molding compound melt is accelerated; and secondly, the defoaming agent particles can replace active substances on the surface of the bubble liquid film to reduce the elasticity of the bubble liquid film, so that small bubbles with low moving speed are gradually recombined to form large bubbles capable of moving quickly, and finally, the large bubbles are broken at the front end of the epoxy molding compound melt, and gas is exhausted from a vent hole of the mold. Considering the solid system of epoxy molding compounds, solvent-based silicone defoamers containing small molecules cannot be used.
As a further improvement, the method is characterized in that: the surface of the glass fiber is pretreated by a silane coupling agent.
Because the glass fiber is an inorganic material, the bonding force between the glass fiber and the resin is relatively low, so that the resin and the glass fiber surface are easily separated to form mechanical defects. When pretreated, the coupling agent acts as a bridge in the middle, increasing its binding to the resin.
As a further improvement, the method is characterized in that: the silane coupling agent is one or more of 3-aminopropyltrimethoxysilane, 3- (2, 3-epoxypropoxy) propyltrimethoxysilane, dimethyldimethoxysilane and mercaptopropyltrimethoxysilane. The silane coupling agent herein is different from the above-mentioned coupling agents.
As a further improvement, the method is characterized in that: the mass of the silane coupling agent is 0.5-2% of the mass of the glass fiber.
As a further improvement, the method is characterized in that: the glass fiber is chopped glass fiber or glass fiber micro powder.
As a further improvement, the method is characterized in that: the environment-friendly flame retardant comprises one or more of a phosphorus flame retardant, a nitrogen flame retardant and a metal oxide.
As a further improvement, the method is characterized in that: the wax comprises one or more of a carnauba wax, a montan wax, a polyethylene wax, an oxidized polyethylene wax, or a polyamide wax.
The dispersing agent comprises one or more of BYK-LP N21938, BYK-LP W21672, BYK-LP N22216 and BYK 9076.
The defoaming agent comprises one or more of sileasycoat8018, sileasycoat8018D, sileasycat 8020D, BYK-1796, BYK-1797, BYK-1799, BYK-028, BYK-088, BYK-093 and BYK-P9920.
The curing accelerator is one or more of imidazole compounds, amine compounds and derivatives thereof, and organic phosphorus compounds and derivatives thereof.
As a further improvement, the method is characterized in that: the epoxy resin is one or more of bisphenol A type epoxy resin, o-cresol formaldehyde epoxy resin, biphenyl type epoxy resin and bisphenol F type epoxy resin.
As a further improvement, the method is characterized in that: the phenolic resin is one or more of phenolic ether phenolic resin, o-methyl phenolic resin and diphenol phenolic resin.
As a further improvement, the method is characterized in that: the filler is one or more of crystal angle type silicon dioxide powder, crystal fillet type silicon dioxide powder, fused angle type silicon dioxide powder, fused spherical silicon dioxide powder, spherical alumina, spherical magnesia, spherical aluminum nitride and spherical boron nitride.
The preparation method of the epoxy molding compound comprises the following specific steps:
the method comprises the following steps: weighing the components in corresponding parts and parts by mass;
step two: putting the glass fiber into a high-temperature stirrer, uniformly spraying a coupling agent 3-aminopropyltrimethoxysilane on the surface of the glass fiber at normal temperature, slowly stirring at the normal temperature for 5 minutes at a speed of 15rad/min, and then stirring at the temperature of 85 ℃ for 30 minutes at a speed of 30 rad/mim;
step three: uniformly mixing the coupling agent, the filling material and the pretreated glass fiber, uniformly mixing with other components at the mixing temperature of 20-30 ℃ for 2-4min, then mixing for 3-5 min by a rubber mixing mill, wherein the temperature of a hot roll is 95-110 ℃, the temperature of a cold roll is 10-25 ℃, and tabletting, cooling and crushing are carried out after uniform mixing to obtain the epoxy molding compound.
The invention has the beneficial effects that: the content of the inorganic filler of the epoxy molding compound reaches over 75 percent, so the epoxy molding compound has the characteristic of low shrinkage, is not easy to crack under multiple TCT cycles, and can reach the temperature of between 35 ℃ below zero and 135 ℃, one cycle of 2 hours and no crack after 300 cycles. The filler can be uniformly dispersed in the resin due to the addition of the dispersing agent and the defoaming agent. The pretreatment technology is used for treating the surface of the glass fiber, so that the binding force between the glass fiber and resin is increased, the normal-temperature bending strength of the material reaches 160Mpa, and the Tg reaches above 160 ℃, and the glass fiber can be used for automobile exhaust treatment devices and other fields requiring high strength and high TCT (thermal transfer test) resistance.
Detailed Description
In order to enhance the understanding of the present invention, the present invention will be further described in detail with reference to the following examples, which are provided for the purpose of illustration only and are not intended to limit the scope of the present invention.
Example 1
100.0 parts of o-cresol formaldehyde epoxy resin (NPCN-702L)
44.6 parts of phenolic novolac resin (NPCN-701)
391.4 parts of silicon dioxide (DQ 1150)
Glass fiber (ECS 11-3.0-T435W) 143.9 parts
2.5 parts of carbon black
Coupling agent (mercaptopropyltrimethoxysilane Dynasylan MTMO) 10.0 parts
7.2 parts of flame retardant (phosphate GC-PNP)
Oxidized polyethylene wax (Licowax PED522) 0.7 part
2.5 parts of palm WAX (WAX POWDER)
Polyethylene wax (Ceridust 3620) 1.8 parts
0.6 part of 2-methylimidazole
Accurately weighing the phosphate flame retardant, oxidized polyethylene wax, palm wax, polyethylene wax and 2-methylimidazole, adding the weighed materials into a high-speed mixer, mixing, controlling the mixing temperature to be 20-30 ℃, and mixing for 2 minutes. And after uniformly mixing, adding the o-cresol formaldehyde epoxy resin and the linear phenolic resin, and continuously mixing, wherein the mixing temperature is controlled to be 20-30 ℃, and the mixing time is 2 minutes. Taking out the mixture as the component A after the mixture is uniformly mixed. Adding glass fiber and silicon dioxide into a high-speed mixer, dropwise adding a coupling agent 3-aminopropyl trimethoxy silane to the surface of the silicon dioxide, manually carrying out primary mixing, then opening the high-speed mixer for mixing, controlling the mixing temperature at 20-30 ℃, and mixing for 1 minute, wherein the component is used as a component B. Continuously mixing the component A and the component B in a high-speed stirrer, controlling the mixing temperature to be 20-30 ℃ and the mixing time to be 2 minutes. And plasticating the mixed powder on a double-roller rubber mixing mill, controlling the temperature of a hot roller to be 95-110 ℃, controlling the temperature of a cold roller to be 10-25 ℃, and mixing for 3-5 minutes. After mixing, the mixed material is pressed into a sheet with the thickness of 2mm, and the glass fiber reinforced epoxy molding compound is prepared after cooling and crushing.
Example 2
This example is different from example 1 in that the amount of glass fiber added was increased to 215.8 parts and the amount of silica added was decreased to 319.4 parts.
Example 3
This example is different from example 1 in that the amount of glass fiber added was increased to 287.8 parts and the amount of silica added was decreased to 247.4 parts.
Example 4
This example is different from example 1 in that the amount of glass fiber added was increased to 359.7 parts and the amount of silica added was decreased to 175.5 parts.
Example 5
This example differs from example 1 in that the amount of glass fiber added was increased to 287.8 parts, the amount of silica added was decreased to 247.4 parts, and 1.4 parts BYK-LP N22216 dispersant was added to the formulation along with the wax and accelerator.
Example 6
This example differs from example 1 in that the amount of glass fiber added was increased to 287.8 parts, the amount of silica added was decreased to 244.6 parts, and 2.9 parts of BYK-LP N22216 dispersant was added to the formulation along with the wax and accelerator.
Example 7
This example differs from example 1 in that the amount of glass fiber added was increased to 287.8 parts, the amount of silica added was decreased to 244.6 parts, and 4.3 parts of BYK-LP N22216 dispersant was added to the formulation along with the wax and accelerator.
Example 8
This example differs from example 1 in that the amount of glass fiber added was increased to 287.8 parts, the amount of silica added was decreased to 244.6 parts, and 2.9 parts BYK-LP N22216 dispersant was added to the formulation in the same manner as the wax and accelerator, and 2.9 parts BYK-P9920 defoamer was added to the formulation in the same manner as the coupling agent.
Example 9
The difference between this example and example 1 is that the addition amount of glass fiber is increased to 287.8 parts, the addition amount of silica is decreased to 247.4 parts, and the glass fiber used is the glass fiber pretreated by the coupling agent.
Example 10
The difference between this example and example 1 is that the addition amount of glass fiber is increased to 287.8 parts, the addition amount of silica is decreased to 244.6 parts, and the glass fiber used is the glass fiber pretreated by the coupling agent. In addition, 2.9 parts of BYK-LP N22216 dispersant is added into the formula in the same way as the wax and the accelerator, and 2.9 parts of BYK-P9920 defoamer is added into the formula in the same way as the coupling agent.
The test method comprises the following steps:
spiral flow length (SF): this measurement was made in accordance with EMMI-1-66, using a die to measure spiral flow length. The length of the spiral flow, measured in cm, was measured at a mold press temperature of 175 deg.C, an injection mold pressure of 6.9MPa, and a hardening time of 120 seconds.
Gel Time (GT): the method is used for measuring the molding curing property and the mixing uniformity of the epoxy molding compound. Pouring the epoxy molding compound powder onto the center of an electric hot plate at 175 +/-2 ℃, immediately flattening the powder by using a tongue spatula, and controlling the flattened area to be 5cm2. When the powder melting was started, the melt was ejected at a frequency of 1 time/second using a spatula, and when the melt became a gel from the fluid, the melt was judged as an end point, and the time taken was read. The same procedure was carried out three times (three measurements differed by no more than 2 s) and the gelation time was averaged over three times.
Flash length (Flash): generally used for representing the mixing degree of each component in the molding compound, and has small flash when the mixing effect is good. Measured on a molding press by means of a flash metal mold, the mold temperature is 175 + -2 ℃, and the transmission pressure is 70kg + -2 kg/cm2. And (3) taking 20 +/-2 g of sample powder, and pouring the sample powder into a material cavity of a plastic packaging machine for molding. After 120 seconds of molding and opening the mold, the mold was moved to the operating table and the FLASH mold measured the length of FLASH overflowing from the various grooves, in units of mm.
Shrinkage rate: pressing sample strips (the size of the sample strips is 120mm long, 5mm wide and 6mm high) by a mould press, wherein the forming conditions are as follows: the temperature of the metal mold is 175 plus or minus 2 ℃, and the injection pressure is 70 plus or minus 2kg/cm2Cure time 120 s. Naturally cooling the molded sample strip, and measuring the length and width of the sample strip with vernier caliperAnd (4) comparing the difference with the mold to obtain the shrinkage rate.
Flexural strength modulus: pressing sample strips (the size of the sample strips is 80mm long, 10mm wide and 4mm high) by a mould press, wherein the forming conditions are as follows: the temperature of the metal mold is 175 +/-2 ℃, and the injection pressure is 70 +/-2 kg/cm2Cure time 120 s. The molded sample is subjected to postcuring at 175 +/-2 ℃ for 6 hours and then taken out for cooling at room temperature. And then measuring the flexural strength modulus on a universal tensile machine by adopting a three-point bending test method.
Flame retardancy: pressing sample strips (the size of the sample strips is 127mm in length, 12.7mm in width and 0.8mm in height) by a mould press, wherein the forming conditions are as follows: the temperature of the metal mold is 175 +/-2 ℃, the injection pressure is 70 +/-2 kg/cm2, and the curing time is 120 s. The molded sample is subjected to postcuring at 175 +/-2 ℃ for 6 hours and then taken out for cooling at room temperature. A layer of absorbent cotton with the thickness of about 6.4mm is laid under an alcohol lamp. The alcohol burner was ignited and the blue flame was adjusted to a height of 19 mm. The specimen was held by a clamp at a distance of 6.4mm from the end of the specimen and placed vertically in the center of the flame for 10 seconds. After 10 seconds the bars were removed from the flame for at least 152mm and the bar Flaming and Glowing times were recorded using a stopwatch. When extinguished, the contact flame was again carried out immediately at the same point for 10 seconds, and the specimen was then removed from the flame for at least 152mm while the Flaming and Glowing times were recorded on a stopwatch. 5 splines were tested for 10 sets of data.
TCT test, the client presses the product (the product size is 50mm, the inner diameter is 25mm, the outer diameter is 30 mm) by a mould press, and the forming conditions are as follows: the temperature of the metal mold is 175 +/-2 ℃, the injection pressure is 80 +/-2 kg/cm2, and the curing time is 150 s. And post-curing the formed product at 175 +/-2 ℃ for 6 hours, and then taking out the product to cool at room temperature. And (3) placing the product into a cold-hot cycle impact test box, and continuously circulating for 300 cycles from-35 ℃ to 130 ℃ within two hours.
The data obtained from the tests carried out on the epoxy molding compounds indicated in the above examples are shown in Table 1: TABLE 1
As can be seen from the test results of the examples in Table 1, in comparative examples 1 to 4, it can be seen that the SF is gradually reduced with the increase of the amount of the glass fiber, mainly because the glass fiber is in a columnar structure, different from silica, the fluidity is poor, and it can be seen from the flash situation that the dispersion uniformity of each component is obviously reduced with the increase of the amount of the glass fiber. In the bending strength of comparative examples 1 to 4, it was found that the glass fiber was added in an amount such that the strength at room temperature and high temperature was gradually increased, but when the glass fiber was added in an excessive amount, the strength was rather decreased as in example 4, and thus the glass fiber added in example 3 was used in the subsequent examples. Comparative examples 3, 5, 6 and 7 show that a small amount of dispersant does not significantly improve the dispersion effect, and both Flash and strength can be reflected. When the amount of the dispersant is too large, the strength is rather lowered, which is associated with the fact that the dispersant itself is low in strength and does not participate in the reaction in the system. The most suitable amount of the dispersant to be added can be determined by comparing examples 5, 6 and 7 to 2.9 parts. Comparing examples 3, 6 and 8, it can be seen that the addition of the dispersant has no significant effect on the flow length, the addition of the defoamer significantly increases the flow length, the addition of the dispersant and the defoamer significantly reduces the flash, and the addition of the two additives makes the components in the epoxy molding compound more uniformly mixed and the bending strength is also significantly improved. Comparing example 3 and example 9 with example 8 and example 10, it can be seen that the glass fiber pretreated by the silane coupling agent can improve the overall fluidity of the formulation, improve the mixing uniformity of the formulation, and remarkably improve the bending strength of the formulation sample bar with little influence on the modulus.
Claims (9)
1. An epoxy molding compound comprises the following components in parts by weight: 100 parts of epoxy resin, 30-60 parts of phenolic resin, 300 parts of filler 200-materials, 300 parts of glass fiber 140-materials, 5-15 parts of environment-friendly flame retardant, 1-3 parts of carbon black, 3-8 parts of wax, 1-4 parts of dispersant, 1-4 parts of defoaming agent, 3-10 parts of coupling agent and 1-3 parts of accelerator, wherein the dispersant is a solid polymer type dispersant or a solvent-free type liquid dispersant, and the defoaming agent is a solvent-free organic silicon type.
2. The epoxy molding compound as claimed in claim 1, wherein: the surface of the glass fiber is pretreated by a silane coupling agent.
3. The epoxy molding compound as claimed in claim 2, wherein: the silane coupling agent is one or more of 3-aminopropyltrimethoxysilane, 3- (2, 3-epoxypropoxy) propyltrimethoxysilane, dimethyldimethoxysilane and mercaptopropyltrimethoxysilane.
4. The epoxy molding compound as claimed in claim 2, wherein: the mass of the silane coupling agent is 0.5-2% of the mass of the glass fiber.
5. An epoxy molding compound as claimed in claim 1 or 2, characterized in that: the glass fiber is chopped glass fiber or glass fiber micro powder.
6. The epoxy molding compound as claimed in claim 1, wherein: the epoxy resin is one or more of bisphenol A type epoxy resin, o-cresol formaldehyde epoxy resin, biphenyl type epoxy resin and bisphenol F type epoxy resin.
7. The epoxy molding compound as claimed in claim 1, wherein: the phenolic resin is one or more of phenolic ether phenolic resin, o-methyl phenolic resin and diphenol phenolic resin.
8. The epoxy molding compound as claimed in claim 1, wherein: the filler is one or more of crystal angle type silicon dioxide powder, crystal fillet type silicon dioxide powder, fused angle type silicon dioxide powder, fused spherical silicon dioxide powder, spherical alumina, spherical magnesia, spherical aluminum nitride and spherical boron nitride.
9. A method for preparing the epoxy molding compound of claim 1, comprising the following steps:
the method comprises the following steps: weighing the components in corresponding parts and parts by mass;
step two: putting the glass fiber into a high-temperature stirrer, uniformly spraying a coupling agent 3-aminopropyltrimethoxysilane on the surface of the glass fiber at normal temperature, slowly stirring at the normal temperature for 5 minutes at a speed of 15rad/min, and then stirring at the temperature of 85 ℃ for 30 minutes at a speed of 30 rad/mim;
step three: uniformly mixing the coupling agent, the filling material and the pretreated glass fiber, uniformly mixing with other components at the mixing temperature of 20-30 ℃ for 2-4min, then mixing for 3-5 min by a rubber mixing mill, wherein the temperature of a hot roll is 95-110 ℃, the temperature of a cold roll is 10-25 ℃, and tabletting, cooling and crushing are carried out after uniform mixing to obtain the epoxy molding compound.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117467243A (en) * | 2023-12-05 | 2024-01-30 | 昆山兴凯半导体材料有限公司 | High-heat-conductivity and high-insulativity epoxy composition and application thereof |
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| CN107353598A (en) * | 2017-08-22 | 2017-11-17 | 江苏中鹏新材料股份有限公司 | Glass epoxy molding plastic and preparation method thereof |
| CN107429039A (en) * | 2015-03-19 | 2017-12-01 | 衡所华威电子有限公司 | Epoxy molding compounds, preparation method and use |
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- 2022-01-07 CN CN202210014201.1A patent/CN114437512A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107429039A (en) * | 2015-03-19 | 2017-12-01 | 衡所华威电子有限公司 | Epoxy molding compounds, preparation method and use |
| CN107353598A (en) * | 2017-08-22 | 2017-11-17 | 江苏中鹏新材料股份有限公司 | Glass epoxy molding plastic and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117467243A (en) * | 2023-12-05 | 2024-01-30 | 昆山兴凯半导体材料有限公司 | High-heat-conductivity and high-insulativity epoxy composition and application thereof |
| CN117467243B (en) * | 2023-12-05 | 2024-04-09 | 昆山兴凯半导体材料有限公司 | High-heat-conductivity and high-insulativity epoxy composition and application thereof |
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