CN115960548A - Epoxy resin adhesive film for encapsulating chip and preparation method thereof - Google Patents
Epoxy resin adhesive film for encapsulating chip and preparation method thereof Download PDFInfo
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- CN115960548A CN115960548A CN202310067630.XA CN202310067630A CN115960548A CN 115960548 A CN115960548 A CN 115960548A CN 202310067630 A CN202310067630 A CN 202310067630A CN 115960548 A CN115960548 A CN 115960548A
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- epoxy resin
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 76
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 76
- 239000002313 adhesive film Substances 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 23
- 239000007822 coupling agent Substances 0.000 claims abstract description 19
- 238000003756 stirring Methods 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 16
- 238000013329 compounding Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000000049 pigment Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229920006332 epoxy adhesive Polymers 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 238000004100 electronic packaging Methods 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 235000010215 titanium dioxide Nutrition 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical group 0.000 claims description 3
- 150000004645 aluminates Chemical class 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021538 borax Inorganic materials 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000391 magnesium silicate Substances 0.000 claims description 3
- 229910052919 magnesium silicate Inorganic materials 0.000 claims description 3
- 235000019792 magnesium silicate Nutrition 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000010907 mechanical stirring Methods 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 claims description 3
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 4
- 238000011417 postcuring Methods 0.000 abstract description 3
- 238000013019 agitation Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 6
- 229920006336 epoxy molding compound Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 229920006335 epoxy glue Polymers 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses an epoxy resin adhesive film for encapsulating chips and a preparation method thereof, and the technical scheme comprises the following steps: step 1, mixing materials: firstly, stirring and mixing the epoxy resin composition and the curing agent uniformly at 70-80 ℃, uniformly mixing the inorganic filler, the pigment and the coupling agent, and stirring and modifying; adding the pigment mixture to the resin curing agent mixture using mechanical agitation; adding the accelerant, and stirring and mixing uniformly again; step 2, coating: coating the epoxy resin composition on the base film, and controlling the thickness of the coating thickness to be 1.0-1.2 times of that of the adhesive film; step 3, surface drying: carrying out step curing, heating at 80-100 ℃, then heating at 110-135 ℃, and finally heating at 80-100 ℃; step 4, compounding; the invention has the advantages that better smoothness can be kept in the curing and forming process, the thicknesses of the center position and the corners of the wafer are more uniform, the encapsulation is finished in a vacuum film sticking machine, the post-curing can be carried out in batch after the integration for many times, and further higher plastic package capacity is obtained.
Description
Technical Field
The invention relates to the technical field of electronic packaging materials, in particular to an epoxy resin adhesive film for chip packaging and a preparation method thereof.
Background
The chip package is a casing for mounting semiconductor integrated circuit chip, plays the role of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also a bridge for establishing connection between the wire on the printed board and other devices. Thus, packaging plays an important role for both the CPU and other integrated circuits.
From the raw material perspective, the Epoxy Molding Compound (EMC) is a key material in the field of electronic packaging, mainly functions to protect high-density arranged solder balls and chips and ensure the processability and safety and reliability of the chips, has been widely applied in the fields of semiconductor devices, integrated circuits, consumer electronics and the like, and occupies more than 90% of the market of electronic packaging materials.
From the technical point of view, in the industry at present, EMC uses epoxy resin and phenolic resin as main resin, a high proportion of filler is added, and the plastic package material particles which are granular at room temperature are prepared through mixing, crushing and film pressing, and in the using process, EMC is extruded into a die cavity by a transfer molding method, and a semiconductor chip in the die cavity is embedded, and simultaneously, the semiconductor chip is crosslinked, cured and molded to form a semiconductor device with a certain structural shape. The complexity of the material mixing, sample preparation and use processes seriously influences the plastic packaging efficiency; meanwhile, the fluidity, filling property and smoothness of EMC are difficult to control in the injection molding process; when the injection molding is cooled or the temperature difference of the device use environment is large, the pressure welding points can be separated, the welding lines are broken, and even the bonding part of the encapsulating layer and the frame is separated, so that the device can be failed.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, an object of the present invention is to provide an epoxy resin adhesive film for encapsulating a chip and a method for manufacturing the same, which have the advantages of maintaining better flatness during the curing and molding process, making the thickness of the center position and the corners of the wafer more uniform, completing encapsulation in a vacuum film sticking machine, performing post-curing in batches after accumulating for many times, and further obtaining higher plastic encapsulation productivity.
The technical purpose of the invention is realized by the following technical scheme:
a preparation method of an epoxy resin adhesive film for chip encapsulation comprises the following steps:
step 1, mixing materials: firstly, stirring and mixing the epoxy resin composition and the curing agent uniformly at 70-80 ℃, uniformly mixing the inorganic filler, the pigment and the coupling agent by using a homogenizer, and stirring and modifying at high temperature; adding the modified pigment mixture into a resin curing agent mixture by using mechanical stirring, then grinding by using a three-roll grinder to control the particle size and dispersion of the filler, fully dispersing the whole formula by using a homogenizer, and vacuumizing and defoaming; finally, adding the accelerant, and stirring and mixing uniformly again;
step 4, compounding: and (4) compounding the film surface of the epoxy resin adhesive film obtained in the step (3) with a protective film, and rolling.
Further, in the step 1, the temperature of high-temperature stirring modification is 120 ℃, and the time range of high-temperature stirring modification is 1-2 h.
Further, in the step 3, the heating time is 0.5 to 3min in the stage of 80 to 100 ℃.
Further, in the step 3, the heating time is 3-10 min in the stage of 110-135 ℃.
Further, in the step 3, the heating time is 0.5 to 3min in the stage of 80 to 100 ℃.
Furthermore, in the step 4, the compounding temperature is 20-135 ℃, the compounding pressure is 0.5-5MPa, and the compounding speed is 2.5-5 m/s.
Further, in the step 1, the grinding parameters of the three-roller grinding machine are to control the grain diameter of the discharged material to be not more than 10um, and grinding is carried out for 3 times.
An epoxy resin adhesive film comprises a protective film, an epoxy adhesive layer and a base film which are arranged layer by layer from top to bottom, wherein the epoxy adhesive layer comprises the following components in parts by weight: 100 parts of epoxy resin, 4-120 parts of curing agent, 0.5-1 part of accelerator, 300-800 parts of inorganic filler, 2-3 parts of pigment and 4-10 parts of coupling agent.
Further, the epoxy resin is selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type, bisphenol AF type, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, silicon-containing epoxy resin, epoxy resin with partial hydrogen atoms replaced by halogen; the curing agent is any one or a composition of at least two of acid anhydride, amine and phenol; the accelerator is any one or a composition of at least two of imidazoles and derivatives thereof, organic phosphorus compounds, amines and quaternary ammonium salts; the inorganic filler is any one or a composition of at least two of silicon micropowder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium silicate, aluminum silicate, calcium oxide, magnesium oxide, aluminum oxide, titanium oxide, aluminum borate, zinc borate, calcium borate, sodium borate, aluminum nitride, boron nitride, silicon dioxide, titanium dioxide, talcum powder and mica; the pigment is one of carbon black and titanium dioxide; the coupling agent is alkane coupling agent, aluminate coupling agent and titanate coupling agent.
The epoxy resin adhesive film is applied to the packaging of chips in the field of electronic packaging.
In conclusion, the invention has the following beneficial effects:
1. in the prior art, the temperature is controlled to be above 80 ℃ mainly by adopting a planetary stirring mode, or a large amount of solvent is added, and the glue solution has the processing flowability. The invention is a solvent-free formula, and the whole formula is a liquid with medium and low viscosity at room temperature by using a low-viscosity curing agent, so that operations such as mixing, coating and the like can be carried out at room temperature.
2. According to the invention, a wet film is formed by a coating mode, the glue solution has certain fluidity at about 80 ℃, so that the glue film has good smoothness, semi-solidification is realized by an oven with the temperature of more than 110 ℃, the glue film with good smoothness is prepared, and the packaging with higher surface smoothness is realized.
3. The invention partially cures the epoxy glue layer, and controls the adhesive property of the glue film at different temperatures by adjusting the curing conditions and controlling the crosslinking degree of the glue film. The adhesive film is in a non-flowing, non-sticky and soft adhesive film state at normal temperature, and is easy to carry out cutting construction operation at normal temperature. After reaching the specified temperature, the adhesive property is recovered, the wafer can be attached, the attaching property is good, the volatility is low after curing, and the protection and sealing effects are achieved.
4. According to the invention, the plastic package material is prepared into the adhesive film, and the adhesive film can be directly attached when in use, so that the complex operation that the existing epoxy plastic package material needs high-temperature melting and injection molding is avoided, the semi-cured adhesive film is beneficial to controlling the fluidity and the bottom filling property of the plastic package material, and meanwhile, the production and packaging efficiency can be improved through batch postcuring.
5. According to the invention, the adhesive film is used to enable the surface energy of the film and the surface energy of the adhesive layer to achieve a better matching effect, so that the adhesive layer does not shrink, and when the adhesive layer is peeled from the film, the problems of difficult peeling, adhesive layer separation and the like caused by excessive surface energy are avoided.
6. The epoxy adhesive film can be applied to chip packaging, and has the functions of protection, insulation and heat dissipation.
Drawings
Fig. 1 is a schematic structural view of an epoxy adhesive film.
In the figure, 1, an epoxy glue layer; 2. a protective film; 3. a base film.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings and the following detailed description. The advantages and features of the present invention will become more apparent from the following description.
Example 1:
an epoxy resin adhesive film for encapsulating a chip, as shown in fig. 1, includes a protective film, an epoxy adhesive layer and a base film arranged layer by layer from top to bottom.
Wherein the base film is a PET film.
Wherein the protective film is a PET release film. The release force of the PET release film is light release force, and is 5g/25mm.
The thickness ratio of the base film to the protective film is 1 (10): 1 (10) and 38um thick.
The base film and the protective film are antistatic films.
The epoxy glue layer comprises epoxy resin, a curing agent, an accelerator, inorganic filler, pigment and a coupling agent.
The epoxy resin is selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type, bisphenol AF type, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, silicon-containing epoxy resin and epoxy resin with partial hydrogen atoms replaced by halogen. In this embodiment, 100 parts of novolac epoxy resin is preferred.
The curing agent is any one or a composition of at least two of acid anhydride, amine and phenol. In this example, 100 parts of a methyltetrahydrophthalic anhydride curing agent is preferred.
The accelerant is 0.5 part of any one or a composition of at least two of imidazole and derivatives thereof, organic phosphorus compounds, amines and quaternary ammonium salts.
The inorganic filler is any one or a combination of at least two of silicon micropowder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium silicate, aluminum silicate, calcium oxide, magnesium oxide, aluminum oxide, titanium oxide, aluminum borate, zinc borate, calcium borate, sodium borate, aluminum nitride, boron nitride, silicon dioxide, titanium dioxide, talcum powder and mica. In the embodiment, the inorganic filler is 300 parts of silicon micropowder.
One of carbon black and titanium dioxide. In this example, the pigment was 3 parts of a carbon black pigment.
Coupling agent alkane coupling agent, aluminate coupling agent and titanate coupling agent. In the embodiment, the coupling agent is 5 parts of silane coupling agent KH-550.
A preparation method of an epoxy resin adhesive film for chip encapsulation comprises the following steps:
step 1, mixing materials: adding 100 parts of novolac epoxy resin and 100 parts of methyl tetrahydrophthalic anhydride curing agent in a ratio into a 500mL container, stirring for 0.5h at the temperature of 80 ℃, and cooling to room temperature; dispersing 300 parts of silicon micro powder filler, 3 parts of carbon black pigment and 5 parts of silane coupling agent KH-550 in a homogenizer at the speed of 800r/min for 1min according to the proportion, and then stirring and modifying at the speed of 800r/min at 120 ℃ for 1h; adding the modified pigment mixture into the resin curing agent mixture by using mechanical stirring, stirring for 1h until all agglomerated particles disappear, grinding the obtained liquid rubber material for 3 times by using a three-roll grinder, and controlling the feed particle size to be 20um and the discharge particle size to be 10um; pouring the ground liquid rubber material into a homogenizer, setting the vacuum pumping and defoaming at 1200r/min for 3min; finally, 0.5 part of accelerator is added, and the mixture is mixed and stirred for 1 hour.
And 4, compounding the membrane surface of the semi-cured epoxy resin adhesive membrane obtained in the step 3 with a protective membrane at the temperature of 75 ℃, wherein the compounding pressure is 0.5-5MPa, and the compounding speed is 5m/s.
The prepared epoxy resin adhesive film is applied to the packaging of chips in the field of electronic packaging.
And (3) product performance testing:
and (4) testing standard:
according to the testing methods of GB/T2794-2013 adhesive viscosity determination single-cylinder rotation viscometer method and GB/T36800.2-2018 plastic thermal mechanical analysis method, a beaker is used as a sample holder for holding glue solution for viscosity determination, the capacity is 600ml, the outer diameter (90.0 +/-2.0 mm), the total height (125.0 +/-3.0 mm) and the wall thickness are 1.5mm, and a thermal performance analysis sample sheet is a thin sheet (5 x 5 2mm).
And (3) product test results:
the viscosity was 45000cP, the glass transition temperature (Tg) was 152 ℃, and the Coefficient of Thermal Expansion (CTE) was 30/90 ppm/deg.C.
Example 2:
the present embodiment is different from embodiment 1 in that:
an epoxy resin adhesive film for encapsulating a chip comprises 460 parts of inorganic filler silica powder, and the other components are the same as those in example 1. The preparation method of the epoxy resin adhesive film for encapsulating the chip is the same.
And (3) product test results:
the viscosity was 60000cP, the glass transition temperature (Tg) was 150 ℃ and the Coefficient of Thermal Expansion (CTE) was 23/65 ppm/. Degree.C.
Example 3:
the present embodiment is different from embodiment 1 in that,
an epoxy resin adhesive film for encapsulating a chip comprises 600 parts of inorganic filler silicon micro powder, and the other components are the same as those in the embodiment 1. The preparation method of the epoxy resin adhesive film for encapsulating the chip is the same.
And (3) product test results:
viscosity 90000cP, glass transition temperature (Tg) 153 ℃ and Coefficient of Thermal Expansion (CTE) 18/44 ppm/DEG C.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent should be subject to the appended claims.
Claims (10)
1. A preparation method of an epoxy resin adhesive film for chip encapsulation is characterized by comprising the following steps:
step 1, mixing materials: firstly, stirring and mixing the epoxy resin composition and the curing agent uniformly at 70-80 ℃, uniformly mixing the inorganic filler, the pigment and the coupling agent by using a homogenizer, and stirring and modifying at high temperature; adding the modified pigment mixture into a resin curing agent mixture by using mechanical stirring, then grinding by using a three-roll grinder to control the particle size and dispersion of the filler, fully dispersing the whole formula by using a homogenizer, and vacuumizing and defoaming; finally, adding the accelerant, and stirring and mixing uniformly again;
step 2, coating: coating the epoxy resin composition obtained in the step (1) on a base film, and controlling the coating thickness to be 1.0-1.2 times of the thickness of the surface-dried adhesive film;
step 3, surface drying: carrying out step curing, namely heating the epoxy resin wet glue film obtained in the step (2) at 80-100 ℃, then heating at 110-135 ℃, and finally heating at 80-100 ℃;
step 4, compounding: and (4) compounding the film surface of the epoxy resin adhesive film obtained in the step (3) with a protective film, and rolling.
2. The method for preparing an epoxy resin adhesive film for chip encapsulation according to claim 1, wherein: in the step 1, the high-temperature stirring modification temperature is 120 ℃, and the high-temperature stirring modification time range is 1-2 h.
3. The method for preparing an epoxy resin adhesive film for chip encapsulation according to claim 1, wherein: in step 3, the heating time is 0.5-3 min in the stage of 80-100 ℃.
4. The method for preparing the epoxy resin adhesive film for chip encapsulation according to claim 4, wherein: in step 3, the heating time is 3-10 min at 110-135 ℃.
5. The method for preparing the epoxy resin adhesive film for chip encapsulation according to claim 5, wherein: in step 3, the heating time is 0.5-3 min at the stage of 80-100 ℃.
6. The method for preparing the epoxy resin adhesive film for chip encapsulation according to claim 1, wherein: in the step 4, the compounding temperature is 20-135 ℃, the compounding pressure is 0.5-5MPa, and the compounding speed is 2.5-5 m/s.
7. The method for preparing an epoxy resin adhesive film for chip encapsulation according to claim 1, wherein: in the step 1, the grinding parameters of the three-roller grinder are that the grain diameter of discharged materials is controlled to be not more than 10um, and grinding is carried out for 3 times.
8. An epoxy resin adhesive film produced by the method for producing an epoxy resin adhesive film for chip encapsulation according to any one of claims 1 to 7, characterized in that: the adhesive comprises a protective film, an epoxy adhesive layer and a base film which are arranged layer by layer from top to bottom, wherein the epoxy adhesive layer comprises the following components in parts by weight: 100 parts of epoxy resin, 4-120 parts of curing agent, 0.5-1 part of accelerator, 300-800 parts of inorganic filler, 2-3 parts of pigment and 4-10 parts of coupling agent.
9. The epoxy adhesive film of claim 8, wherein: the epoxy resin is selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type, bisphenol AF type, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, silicon-containing epoxy resin and epoxy resin with partial hydrogen atoms replaced by halogen; the curing agent is any one or a composition of at least two of acid anhydride, amine and phenol; the accelerant is any one or a composition of at least two of imidazoles and derivatives thereof, organic phosphorus compounds, amines and quaternary ammonium salts; the inorganic filler is any one or a composition of at least two of silicon micropowder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium silicate, aluminum silicate, calcium oxide, magnesium oxide, aluminum oxide, titanium oxide, aluminum borate, zinc borate, calcium borate, sodium borate, aluminum nitride, boron nitride, silicon dioxide, titanium dioxide, talcum powder and mica; the pigment is one of carbon black and titanium dioxide; the coupling agent is an alkane coupling agent, an aluminate coupling agent and a titanate coupling agent.
10. Use of an epoxy resin adhesive film according to any one of claims 8 to 9, characterized in that: the epoxy resin adhesive film is applied to the packaging of chips in the field of electronic packaging.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116694275A (en) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
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| CN107791627A (en) * | 2017-10-27 | 2018-03-13 | 景旺电子科技(龙川)有限公司 | A kind of metal-based copper-clad plate preparation method of resinous composition |
| CN111592849A (en) * | 2020-07-02 | 2020-08-28 | 青岛德聚胶接技术有限公司 | Semi-cured epoxy adhesive film and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116694275A (en) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
| CN116694275B (en) * | 2023-04-26 | 2024-03-08 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
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Application publication date: 20230414 |