CN114427921A - Zero heat flow temperature sensor and preparation method thereof - Google Patents

Zero heat flow temperature sensor and preparation method thereof Download PDF

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Publication number
CN114427921A
CN114427921A CN202111580882.XA CN202111580882A CN114427921A CN 114427921 A CN114427921 A CN 114427921A CN 202111580882 A CN202111580882 A CN 202111580882A CN 114427921 A CN114427921 A CN 114427921A
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thermistor
insulator
ltcc ceramic
cavity
temperature sensor
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康昊
严家佳
张俊锋
陈君
何性顺
王丹
叶希洋
李毅卓
姬建荣
苏健军
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Xian Modern Chemistry Research Institute
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Xian Modern Chemistry Research Institute
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)

Abstract

The invention discloses a zero heat flow temperature sensor and a preparation method thereof. The disclosed sensor comprises two thermistors, wherein a first heat insulator is arranged in the middle of each thermistor, thermistor slurry is printed on LTCC (Low temperature Co-fired ceramic) tiles on the upper surface and the lower surface of the first heat insulator so as to realize temperature detection, and each thermistor can be communicated with a bonding pad on the top layer through a through hole on each layer of the tiles. The thermistors on the bottom surface are contacted with the intermediate medium, and the temperature of the object to be measured can be obtained through the temperatures measured by the two thermistors.

Description

Zero heat flow temperature sensor and preparation method thereof
Technical Field
The invention relates to the technical field of temperature sensors, in particular to a zero heat flow temperature sensor.
Background
For some environments which are difficult to directly measure the temperature, such as human kernels and some severe environments, the temperature sensor cannot be directly placed in the environment to be measured, or the environment to be measured has extremely adverse effects on the sensor, so that the temperature of the environment to be measured needs to be obtained in a non-contact temperature measurement mode.
From the second law of thermodynamics, heat transfer from a high temperature object to a low temperature object occurs spontaneously and cannot be transferred from the low temperature object to the high temperature object spontaneously. Therefore, when the temperature gradient exists between the environment to be measured and the intermediate medium, the heat loss of the intermediate medium is completely blocked, the heat is continuously stored, and the temperature of the intermediate medium is continuously increased. When the intermediate medium and the environment to be measured are in heat balance, the heat can not be continuously transferred from the environment to be measured to the intermediate medium, and the temperature of the intermediate medium does not rise any more. According to the thermodynamic principle, the temperature of the surface of the intermediate medium is equal to the temperature of the environment to be measured. By measuring the temperature of the intermediate medium, the temperature of the environment to be measured can be obtained, which is called zero heat flow method. In the traditional zero heat flow temperature sensor, the time for the temperature to reach the balance is longer; in addition, an additional constant temperature heating module is required, increasing the complexity of the system.
Disclosure of Invention
Aiming at the defects or shortcomings of the prior art, the invention provides a zero-heat-flow temperature sensor.
Therefore, the zero heat flow temperature sensor provided by the invention comprises a sensor body made of a plurality of layers of LTCC ceramic chips, wherein a first thermistor and a first metal lead wire which are connected with each other are arranged on the bottom surface of the sensor body, a bonding pad is arranged on the top surface of the sensor body, a cavity is arranged in the sensor body, a second thermistor and a second metal lead wire which are connected with each other are arranged on the top surface in the cavity, the cross section size of the cavity is larger than that of the first thermistor and that of the second thermistor, a first heat insulator is also arranged in the cavity, the top of the first heat insulator is contacted with the second thermistor, the bottom of the first heat insulator is contacted with the bottom surface in the cavity, the first heat insulator is not contacted with the side wall of the cavity, the bottom of the first heat insulator is coaxial with the first thermistor or partially coaxial with the first thermistor, and a through hole for connecting the first metal lead wire and the bonding pad and connecting the second metal lead wire and the bonding pad is arranged in the sensor body, and a conductive material is arranged in the through hole and used for realizing the electric connection between the first metal wire and the bonding pad and the electric connection between the second metal wire and the bonding pad.
In some embodiments, a second thermal insulator is disposed in the cavity, the second thermal insulator being disposed around the first thermal insulator, and the second thermal insulator having a thermal conductivity less than that of the first thermal insulator.
Optionally, the first insulator is made of alumina aerogel or a material with the same or similar thermal conductivity coefficient with the alumina aerogel.
Optionally, the second insulator is made of a material selected from ceramic fibers or a material similar to or identical to a ceramic fiber heat conduction system.
Preferably, the first thermistor and the second thermistor have the same resistance value.
Preferably, the shape and size of the top surface of the first insulator, the shape and size of the bottom surface of the first insulator, the shape and size of the first thermistor, and the shape and size of the second thermistor are the same, and the alumina aerogel, the second thermistor, and the first thermistor are coaxially disposed.
In some aspects, the second thermistor and the second metal lead are embedded in a top surface of the cavity.
Optionally, the cavity is cylindrical. The first insulator is of a cylindrical structure. The second insulator is of a circular ring cylinder structure.
Further, the sensor body is sequentially made of a first LTCC ceramic chip, a second LTCC ceramic chip and a third LTCC ceramic chip from bottom to top, the thickness of the second LTCC ceramic chip in the direction from bottom to top is larger than that of the first LTCC ceramic chip and that of the second LTCC ceramic chip, and the cavity is formed by a space arranged in the second LTCC ceramic chip; the through hole for connecting the first metal lead and the bonding pad penetrates through the first LTCC ceramic chip, the second LTCC ceramic chip and the third LTCC ceramic chip, and the through hole for connecting the second metal lead and the bonding pad penetrates through the third LTCC ceramic chip.
The invention also provides a preparation method of the zero heat flow temperature sensor. The provided method comprises the following steps:
(1) punching holes on the first LTCC ceramic chip to form through holes, filling conductive materials in the through holes, and then performing screen printing on the bottom surface of the first LTCC ceramic chip to form a first thermistor and a first metal lead;
(2) punching holes in the second LTCC ceramic chip to respectively form a space of a cavity and a through hole, and then filling silver paste in the through hole;
(3) punching holes in the third LTCC ceramic chip to form through holes and filling silver paste, then performing silk-screen printing on the bottom surface of the third LTCC ceramic chip to form a second thermistor and a second metal lead, and performing pad printing on the upper surface of the third LTCC ceramic chip;
(4) stacking the second LTCC ceramic chip on the first LTCC ceramic chip to form a cavity, and placing a first heat insulator in the cavity; then placing a third LTCC ceramic chip;
(5) stacking a third LTCC chip above the first insulator;
(6) carrying out static pressure on the laminated device at 70-90 ℃ and under the pressure of 5-20 MPa;
(7) and sintering at 800-950 ℃ after static pressure to obtain the zero heat flow temperature sensor.
In a further aspect, a first insulator and a second insulator are placed in the cavity in step (4).
The temperature sensor comprises two thermistors, wherein one thermistor is contacted with an intermediate medium, and the temperature of the environment to be measured contacted with the intermediate medium can be obtained according to the temperatures measured by the two thermistors and the heat conductivity coefficients of the heat insulation material and the intermediate medium.
The temperature sensor is manufactured based on the LTCC process, devices with high layer number are easy to manufacture by the LTCC technology, heat insulation materials can be embedded in the devices, the cost of packaging the sensor is avoided, passive and active integration can be realized, a test circuit can be integrated in the devices, the size and the weight are further reduced, the temperature response time of the temperature sensor is greatly reduced, and the temperature sensor is convenient to test in special environments such as narrow space; the ceramic fiber is arranged on the side surface of the middle heat insulation material alumina aerogel, so that heat can be effectively prevented from being dissipated from the side surface, and the test accuracy is ensured; the sensor does not need thermostatic control, and the complexity of the system is reduced.
Drawings
Fig. 1 is a structural sectional view of a zero heat flow temperature sensor of the present invention.
FIG. 2 is a three-dimensional structural view of an alumina aerogel in an example embodiment.
FIG. 3 is a three-dimensional structural drawing of a ceramic fiber in an exemplary embodiment.
FIG. 4 is a flow chart of a zero heat flow temperature sensor fabrication in an embodiment.
Fig. 5 is a schematic diagram of the zero heat flow temperature sensor test of the present invention.
Detailed Description
Unless otherwise indicated, the terms or methods herein are understood or implemented using established methods as recognized by one of ordinary skill in the relevant art.
Referring to fig. 1-3, the sensor of the present invention comprises a sensor body made of multiple layers of LTCC ceramic sheets, wherein a first thermistor 1-1 and a first metal wire 8 are disposed on a bottom surface of the sensor body, a bonding pad 9 is disposed on a top surface of the sensor body, a cavity is disposed in the sensor body, a second thermistor 1-2 and a second metal wire 8 are disposed on a top surface of the cavity, a cross-sectional dimension of the cavity is larger than a dimension of the first thermistor and a dimension of the second thermistor, a first insulator 6 is disposed in the cavity, a top of the first insulator is in contact with the second thermistor, a bottom of the first insulator is in contact with an inner bottom surface of the cavity, and the first insulator is not in contact with a sidewall of the cavity, i.e., the first insulator has a gap from the sidewall of the cavity, and a bottom of the first insulator is coaxial with the first thermistor or a part of the first and the first thermistor is coaxial so that the first thermistor and the second thermistor are insulated by the first insulator The temperature difference is generated between the sensitive resistors, a through hole 7 for connecting the first metal wire and the bonding pad and connecting the second metal wire and the bonding pad is arranged in the sensor body, and a conductive material is arranged in the through hole and used for realizing the electric connection between the first metal wire and the bonding pad and the electric connection between the second metal wire and the bonding pad.
Referring to fig. 5, the sensor of the present invention is suitable for measuring some environments where it is not easy to directly measure temperature, such as human body core and some harsh environments, or for detecting the temperature of an environment to be measured which has an extremely adverse effect on the sensor, that is, the sensor of the present invention is suitable for a non-contact temperature measurement manner.
The working principle of the sensor is as follows: heat is spontaneously conducted from the high temperature to the low temperature, and there is a heat flow from the environment to be measured to the intermediate medium and through the thermal barrier. After a certain time, the heat transfer between the intermediate medium and the heat insulation layer can reach a steady state, during detection, the thermistor 1-1 is contacted with the intermediate medium 10 (such as biomass and other solids), and the temperature of the medium to be detected (or the environment to be detected) 11 can be obtained according to the formula (1), wherein T is the temperature of the medium to be detected 11, and T is the temperature of the medium to be detected 111Is the temperature, T, measured by the first thermistor 1-12Is the temperature measured by the second thermistor 1-2, K1Is the thermal conductivity, K, of the alumina aerogel 62Is the thermal conductivity of the intermediate medium 10,
Figure BDA0003427084140000051
in some preferred schemes, in order to ensure that the detection result is accurate, a heat insulation material 5 is further arranged in the cavity, the second heat insulation body is positioned around the first heat insulation body, and the heat conductivity coefficient of the second heat insulation body is smaller than that of the first heat insulation body.
In a specific scheme, the first heat insulator is selected from alumina aerogel or a material with a heat conductivity coefficient similar to that of the alumina aerogel. In still other embodiments, the second insulator is made of a material selected from the group consisting of ceramic fibers and materials that are close to the ceramic fiber thermal conduction system.
In some aspects, the second thermistor and the second metal lead are embedded in a top surface of the cavity under the influence of processing conditions.
In order to ensure that the detection result is accurate, the resistance values of the first thermistor and the second thermistor are the same. In some further preferred embodiments, the shape and size of the top surface of the first insulator, the shape and size of the bottom surface of the first insulator, the shape and size of the first thermistor, and the shape and size of the second thermistor are the same, and the alumina aerogel, the second thermistor, and the first thermistor are coaxially disposed.
The specific shape of the cavity and its contents, which in some embodiments is cylindrical, can be selected by one skilled in the art based on the actual processing conditions. The alumina aerogel is of a cylindrical structure. The ceramic fiber is in a circular ring cylinder structure.
Considering materials and processing conditions, the sensor body is sequentially made of a first LTCC ceramic chip, a second LTCC ceramic chip and a third LTCC ceramic chip from bottom to top, the thickness of the second LTCC ceramic chip in the direction from bottom to top is larger than that of the first LTCC ceramic chip and that of the second LTCC ceramic chip, and the cavity is formed by a space arranged in the second LTCC ceramic chip; the through hole for connecting the first metal lead and the bonding pad penetrates through the first LTCC ceramic chip, the second LTCC ceramic chip and the third LTCC ceramic chip, and the through hole for connecting the second metal lead and the bonding pad penetrates through the third LTCC ceramic chip.
In a specific scheme, a person skilled in the art can determine the specific sizes of all parts, parts and structures in the sensor under the condition of meeting the requirement of accurate detection results of the object to be detected as far as possible according to actual processing conditions.
Example (b):
the sensor body of this embodiment is composed of a first LTCC ceramic tile 2, a second LTCC ceramic tile 3 and a third LTCC ceramic tile 4, wherein the number of layers of the first LTCC ceramic tile 2 is one, the number of layers of the second LTCC ceramic tile 3 is 24, the number of layers of the third LTCC ceramic tile 4 is 4, and the thickness of a single layer LTCC ceramic tile (dupont) is 127 μm;
in this embodiment, the cavity and the first insulator are both cylindrical, the thermal insulation material is in the shape of a circular cylinder, the thermal insulation material is arranged around the first insulator, the first insulator is selected from alumina aerogel, the thermal insulation material is selected from ceramic fiber, referring to fig. 2, the alumina aerogel 6 is 3mm in height and 3mm in diameter, referring to fig. 3, the ceramic fiber 5 is a hollow cylinder 3mm in height, 3mm in inner diameter and 10mm in outer diameter, and the thermistor 1-1, the thermistor 1-2 and the alumina aerogel 6 are coaxially arranged.
Referring to fig. 4, the method for manufacturing the zero heat flow temperature sensor of this embodiment includes:
(a) punching the first LTCC ceramic chip 2 to form a through hole 2-1;
(b) filling conductive silver paste 7-1 into the through hole 2-1 and performing screen printing on the first thermistor 1-1 and the metal lead 8 on the lower surface of the first LTCC ceramic chip 2;
(c) punching each layer of ceramic tile 3-1 of the second LTCC ceramic tile 3 to form a through hole 3-2 and a cavity area 3-3 for placing alumina aerogel and ceramic fibers;
(d) filling silver paste 7-2 into the via hole 3-2;
(e) punching a bottom ceramic tile 4-1 of the third LTCC ceramic tile 4 to form a through hole 4-2;
(f) filling conductive silver paste 7-3 into the via hole 4-2 and performing screen printing on the second thermistor 1-2 and the metal lead 8;
(g) punching the 3 ceramic tiles 4-3 on the top layer of the third LTCC ceramic tile 4 to form through holes 4-4;
(h) filling conductive silver paste 7-4 into the through hole 4-4 and printing a pad 9 on the upper surface of the top layer 4-3 of the third LTCC ceramic chip;
(i) laminating the first LTCC ceramic sheet 2 to the middle LTCC ceramic sheet 3 in this order, and then placing the alumina aerogel 6 and the ceramic fiber 5 in the middle area;
(j) stacking the LTCC ceramic chips 4-1 to 4-3 above the alumina aerogel 5 and the ceramic fibers 6 in sequence;
(k) carrying out static pressure on the laminated device for 3-10 minutes at 70-90 ℃ and under the pressure of 5-20 MPa;
(l) Slicing the LTCC ceramic chip to form an individual device;
(m) sintering the device at 800-950 ℃, and completely finishing the manufacture of the LTCC-based zero heat flow temperature sensor.

Claims (13)

1. A zero heat flow temperature sensor is characterized by comprising a sensor body made of multiple layers of LTCC ceramic chips, wherein a first thermistor and a first metal lead which are connected with each other are arranged on the bottom surface of the sensor body, a bonding pad is arranged on the top surface of the sensor body, a cavity is arranged in the sensor body, a second thermistor and a second metal lead which are connected with each other are arranged on the top surface in the cavity, the cross section size of the cavity is larger than that of the first thermistor and that of the second thermistor, a first heat insulator is further arranged in the cavity, the top of the first heat insulator is in contact with the second thermistor, the bottom of the first heat insulator is in contact with the bottom surface in the cavity, the first heat insulator is not in contact with the side wall of the cavity, meanwhile, the bottom of the first heat insulator is coaxial with the first thermistor or locally coaxial with the first thermistor, and a through hole for connecting the first metal lead and the bonding pad and connecting the second metal lead and the bonding pad is arranged in the sensor body, and a conductive material is arranged in the through hole and used for realizing the electric connection between the first metal wire and the bonding pad and the electric connection between the second metal wire and the bonding pad.
2. The zero heat flow temperature sensor of claim 1, further comprising a second insulator disposed within the cavity and surrounding the first insulator, the second insulator having a lower thermal conductivity than the first insulator.
3. The zero heat flow temperature sensor of claim 1, wherein the first insulator is made from an alumina aerogel or a material having the same thermal conductivity as the alumina aerogel.
4. The zero heat flow temperature sensor of claim 1, wherein the second insulator is made of a material selected from the group consisting of ceramic fibers and the same material as the ceramic fiber thermal conduction system.
5. The zero heat flow temperature sensor of claim 1, wherein the first thermistor and the second thermistor have the same resistance.
6. The zero heat flow temperature sensor of claim 1, wherein the shape and size of the top surface of the first insulator, the shape and size of the bottom surface of the first insulator, the shape and size of the first thermistor, and the shape and size of the second thermistor are the same, and the alumina aerogel, the second thermistor, and the first thermistor are coaxially disposed.
7. The zero heat flow temperature sensor of claim 1, wherein the second thermistor and the second metal lead are embedded in a top surface of the cavity.
8. The zero heat flow temperature sensor of claim 1, wherein the cavity is cylindrical.
9. The zero heat flow temperature sensor of claim 1, wherein the first insulator is a cylindrical structure.
10. The zero heat flow temperature sensor of claim 1, wherein the second insulator is an annular cylinder structure.
11. The zero heat flux temperature sensor of claim 1, wherein the sensor body is made of a first LTCC ceramic sheet, a second LTCC ceramic sheet and a third LTCC ceramic sheet in sequence from bottom to top, the second LTCC ceramic sheet has a thickness in the direction from bottom to top greater than the thickness of the first LTCC ceramic sheet and the thickness of the second LTCC ceramic sheet, and the cavity is formed by a space opened in the second LTCC ceramic sheet; the through hole for connecting the first metal lead and the bonding pad penetrates through the first LTCC ceramic chip, the second LTCC ceramic chip and the third LTCC ceramic chip, and the through hole for connecting the second metal lead and the bonding pad penetrates through the third LTCC ceramic chip.
12. A method of making a zero heat flux temperature sensor as claimed in claim 1 or 11, the method comprising:
(1) punching holes on the first LTCC ceramic chip to form through holes, filling conductive materials in the through holes, and then performing screen printing on the bottom surface of the first LTCC ceramic chip to form a first thermistor and a first metal lead;
(2) punching holes in the second LTCC ceramic chip to respectively form a space of a cavity and a through hole, and then filling silver paste in the through hole;
(3) punching holes in the third LTCC ceramic chip to form through holes and performing silver paste filling, performing screen printing on the bottom surface of the third LTCC ceramic chip to form a second thermistor and a second metal lead, and performing pad printing on the upper surface of the third LTCC ceramic chip;
(4) stacking a second LTCC ceramic chip on the first LTCC ceramic chip to form a cavity, and placing a first heat insulator in the cavity; then placing a third LTCC ceramic chip;
(5) stacking a third LTCC tile over the first insulator;
(6) carrying out static pressure on the laminated device at 70-90 ℃ and under the pressure of 5-20 MPa;
(7) and sintering at 800-950 ℃ after static pressure to obtain the zero heat flow temperature sensor.
13. The method of claim 11, wherein step (4) places a first insulator and a second insulator in the cavity.
CN202111580882.XA 2021-12-22 2021-12-22 Zero heat flow temperature sensor and preparation method thereof Pending CN114427921A (en)

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Application Number Priority Date Filing Date Title
CN202111580882.XA CN114427921A (en) 2021-12-22 2021-12-22 Zero heat flow temperature sensor and preparation method thereof

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