CN114409248B - 一种低热损的碲-锂-硅-锆体系玻璃料及其导电浆料与应用 - Google Patents
一种低热损的碲-锂-硅-锆体系玻璃料及其导电浆料与应用 Download PDFInfo
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- CN114409248B CN114409248B CN202210009639.0A CN202210009639A CN114409248B CN 114409248 B CN114409248 B CN 114409248B CN 202210009639 A CN202210009639 A CN 202210009639A CN 114409248 B CN114409248 B CN 114409248B
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- lithium
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Classifications
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- Spectroscopy & Molecular Physics (AREA)
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- Photovoltaic Devices (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Abstract
Description
样品 | P11 | P12 |
<![CDATA[TeO<sub>2</sub>]]> | 40% | 32% |
<![CDATA[Li<sub>2</sub>O]]> | 20% | 10% |
<![CDATA[SiO<sub>2</sub>]]> | 12% | 20.0% |
<![CDATA[ZrO<sub>2</sub>]]> | 5% | 1.5% |
PbO | 14% | 25% |
<![CDATA[Bi<sub>2</sub>O<sub>3</sub>]]> | 3% | 6% |
MgO | 2% | 2% |
CaO | 4% | 4% |
Total | 100% | 100% |
无机氧化物水失重 | 1.19% | 1.27% |
浆料粘度30天变化|Δη| | 11% | 11% |
光电转换效率 | 22.73% | 22.79% |
Claims (8)
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CN202210009639.0A CN114409248B (zh) | 2022-01-06 | 2022-01-06 | 一种低热损的碲-锂-硅-锆体系玻璃料及其导电浆料与应用 |
US17/680,878 US11697612B2 (en) | 2022-01-06 | 2022-02-25 | Low LOI tellurium-lithium-silicon-zirconium frit system and conductive paste and application thereof |
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CN202210009639.0A CN114409248B (zh) | 2022-01-06 | 2022-01-06 | 一种低热损的碲-锂-硅-锆体系玻璃料及其导电浆料与应用 |
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JP5782112B2 (ja) * | 2010-05-04 | 2015-09-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 鉛およびテルル酸化物を含有する厚膜ペーストと半導体デバイスの製造においてのそれらの使用 |
JP5698365B2 (ja) * | 2010-09-16 | 2015-04-08 | ダウニア・ソーラー・セル・ソシエタ・ア・レスポンサビリタ・リミタータDAUNIA SOLAR CELL S.r.L. | 電子デバイスの調製に有用な低軟化温度をもつシール剤 |
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TWI594268B (zh) * | 2012-04-17 | 2017-08-01 | 賀利氏貴金屬北美康舍霍肯有限責任公司 | 用於導電膏組成物之無機反應系統 |
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