CN114388545A

CN114388545A - Imaging module and electronic equipment

Info

Publication number: CN114388545A
Application number: CN202111678940.2A
Authority: CN
Inventors: 朱清三; 秦锋; 席克瑞; 贾振宇; 王明煜; 粟平; 韩笑男
Original assignee: Shanghai Tianma Microelectronics Co Ltd
Current assignee: Shanghai Tianma Microelectronics Co Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-04-22

Abstract

The application discloses formation of image module and electronic equipment, the formation of image module includes: a first substrate having opposing first and second surfaces; a wiring layer disposed on the first surface; the photosensitive chip is positioned on one side of the wiring layer, which is far away from the first base body, and is electrically connected with the wiring layer; the packaging layer covers the photosensitive chip, and at least part of the photosensitive chip facing the first base body is exposed out of the packaging layer; the driving device is arranged on the second surface; the wiring layer is provided with a first connecting part, the driving device is provided with a second connecting part, and the first connecting part is electrically connected with the second connecting part. The utility model provides a photosensitive chip's photosensitive surface is towards first base member and constitutes flip-chip packaging structure, and external light can be followed first base member below and is penetrated to photosensitive chip. And manufacturing a wiring layer on the first substrate, reasonably laying out the connecting circuit of the photosensitive chip again by using the wiring layer, and realizing the electrical connection between the driving device and the photosensitive chip. The imaging module is thin in thickness, compact in overall structure and reliable in internal connection.

Description

Imaging module and electronic equipment

Technical Field

The application belongs to the technical field of imaging module, especially relates to an imaging module and electronic equipment.

Background

With the development of electronic devices, image functions such as photographing, shooting, and code scanning have increasingly become indispensable functions of electronic devices. In recent years, consumers have made higher demands for miniaturization of electronic devices, and image forming modules have been developed to have higher integration and smaller size. The applicant has noticed that the improved package technology can reduce the volume of a CMOS Image Sensor (CIS) chip package structure, and thus reduce the volume of an imaging module, however, the conventional routing and internal connection structure of the imaging module cannot be adapted to a new package structure.

Disclosure of Invention

The embodiment of the application provides an imaging module and electronic equipment, can make imaging module internal connection adapt to miniaturized demand, reduce the shaping module volume.

In a first aspect, the present application provides an imaging module, comprising: a first substrate having opposing first and second surfaces; a wiring layer disposed on the first surface; the photosensitive chip is positioned on one side, away from the first base body, of the wiring layer and is electrically connected with the wiring layer; the packaging layer covers the photosensitive chip, and at least part of the photosensitive chip facing to the first base body is exposed out of the packaging layer; the driving device is arranged on the second surface; the wiring layer is provided with a first connecting part, the driving device is provided with a second connecting part, and the first connecting part is electrically connected with the second connecting part.

In a second aspect, an electronic device is provided, which includes the imaging module of the first aspect.

According to the imaging module and the electronic device provided in the embodiment, the photosensitive surface of the photosensitive chip faces the first substrate and forms the flip-chip package structure, and external light can enter the photosensitive chip from the lower side of the first substrate. And manufacturing a wiring layer on the first substrate, reasonably laying out the connecting circuit of the photosensitive chip again by using the wiring layer, and realizing the electrical connection between the driving device and the photosensitive chip. The imaging module is thin in thickness, compact in overall structure and reliable in internal connection. The electronic equipment comprising the imaging module also has a thin and compact structure and reliable internal connection.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of an internal structure of an imaging module according to an embodiment of the present disclosure;

FIG. 2 is a top view of the imaging module of FIG. 1;

fig. 3 is a schematic view of an internal structure of an imaging module according to an embodiment of the present disclosure;

fig. 4 is a schematic view of an internal structure of an imaging module according to an embodiment of the present disclosure;

fig. 5 is a schematic view of an internal structure of an imaging module according to an embodiment of the present disclosure;

FIG. 6 is a top view of the imaging module of FIG. 4;

fig. 7 is a schematic view of an internal structure of an imaging module according to an embodiment of the present disclosure;

fig. 8 is a schematic view illustrating an internal structure of an imaging module according to an embodiment of the present disclosure;

fig. 9 is a schematic view of an internal structure of an imaging module according to an embodiment of the present disclosure;

FIG. 10 is a top view of the imaging module of FIG. 8;

fig. 11 is a schematic view illustrating an internal structure of an imaging module according to an embodiment of the present disclosure;

fig. 12 is a schematic view illustrating an internal structure of an imaging module according to an embodiment of the present disclosure;

FIG. 13 is an electronic device according to an embodiment of the application.

In the drawings:

1. a first substrate; 11. a first surface; 12. a second surface; 13. a first transfer channel; 14. a first pad; 15. a filter element;

2. a wiring layer; 21. a first connection portion; 22. an anti-oxidation layer; 23. a conductive block; 24. a sub-wiring layer; 25. hollowed-out area

3. A photosensitive chip; 31. a light-sensitive surface;

4. a packaging layer;

5. a drive device; 51. a second connecting portion; 52. first lead wire

6. A first connecting line;

7. a second substrate; 71. a third surface; 72. a fourth surface; 73. a second switching channel; 74. a through hole;

8. an optical component;

9A, a first circuit board; 9B, a second circuit board; 91. a first control chip; 92. a second control chip;

100. an electronic device.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The embodiments will be described in detail below with reference to the accompanying drawings.

Relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.

In addition, the term "and/or" herein is only one kind of association relationship describing an associated object, and means that there may be three kinds of relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that in the embodiment of the present application, "a and B are connected" may be that a and B are directly connected, or a and B are indirectly connected, "a and B are electrically connected," a and B are directly electrically connected, or a and B are in communication signal connection, a and B are electrically connected through a connecting element, or a and B are in direct contact to achieve electrical connection, or a and B are in communication signal connection.

It should be understood that in the embodiment of the present application, "B corresponding to a" means that B is associated with a, from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.

With the trend of miniaturization of electronic devices and the increasing requirements of people on image functions, imaging modules are developed towards high integration and miniaturization.

The applicant has found and recognized that the conventional camera module is usually packaged in a cob (chip on board) process, that is, a CMOS Image Sensor (CIS) chip or a photo Sensor chip and electronic components are mounted on a Surface of a circuit board through a Surface Mount Technology (SMT), the circuit board is packaged in a wire bonding manner, and the photo Sensor chip, the circuit board, a lens and a focus motor are stacked, so that not only is the packaging structure large in size, but also a large number of traces exist between the photo Sensor chip and the circuit board, and the trace yield is low.

Further, the applicant believes that the photosensitive chip can be packaged by a Fan-Out (Fan-Out) packaging technology, in particular, a Fan-Out type panel level packaging process (FOPLP), the photosensitive chip of the imaging module is electrically connected with the electronic component to replace a circuit board in a traditional packaging structure, and a connection point between the chip and the outside is redistributed to a reasonable position by using a Redistribution Layer (RDL) technology, so that the volume of the imaging module is reduced. However, the wiring method in the conventional package structure is difficult to be applied to the novel package structure, and the connection method between the photosensitive chip and the focusing motor and other components also needs to be redesigned.

The present application is therefore directed to alleviating or solving, at least to some extent, the above-mentioned problems.

The embodiment of the application provides an imaging module, and fig. 1 shows a schematic structural diagram of the imaging module provided by the embodiment of the application. Fig. 2 shows a top view of the imaging module of fig. 1.

Referring to fig. 1 and fig. 2, an imaging module according to an embodiment of the present disclosure includes: the device comprises a first base body 1, a wiring layer 2, a photosensitive chip 3, a packaging layer 4 and a driving device 5. The first substrate 1 has a first surface 11 and a second surface 12 opposite to each other. The wiring layer 2 is provided on the first surface 11. The photosensitive chip 3 is located on the side of the wiring layer 2 away from the first substrate 1 and is electrically connected with the wiring layer 2. The encapsulation layer 4 covers the photosensitive chip 3, and at least a part of the photosensitive chip 3 facing the first substrate 1 is exposed from the encapsulation layer 4. The driving means 5 are provided on the second surface 12. The wiring layer 2 has a first connection portion 21, the driving device 5 has a second connection portion 51, and the first connection portion 21 is electrically connected to the second connection portion 51.

The photosensitive chip 3, also called a CMOS image sensor chip, is used to convert an external optical signal into an electrical signal. The photosensitive chip 3 is located on the side of the wiring layer 2 away from the first substrate 1 and is electrically connected with the wiring layer 2. The wiring layer 2 is electrically connected with the photosensitive chip 3, so that not only can the connecting circuit of the photosensitive chip 3 be expanded and rearranged through the wiring layer 2, but also various electronic components can be electrically connected to the wiring layer 2, and the function of the photosensitive chip 3 can be expanded. On one hand, the wiring layer 2 is manufactured on the first base body 1, and can replace a circuit board of a traditional packaging structure, so that the packaging structure of the photosensitive chip 3 is reduced, and the size of the imaging module is also reduced; on the other hand, the wiring layer 2 can also reasonably arrange the connection point position between the photosensitive chip 3 and the outside, and optimize the packaging structure and the whole structure of the imaging module, so that the imaging module has compact and small structural configuration.

Optionally, referring to fig. 1, the exposed conductive structure on the wiring layer 2 may be covered by an anti-oxidation layer 22, so as to prevent the exposed conductive structure on the wiring layer 2 from being oxidized to degrade the electrical characteristics, and improve the connection reliability of the wiring layer 2. The material of the oxidation resistant layer 22 may include a material that is not easily oxidized, such as a nickel alloy, and is not limited herein.

The packaging layer 4 covers the photosensitive chip 3, and can coat and protect the photosensitive chip 3, so that the photosensitive chip 3 cannot be influenced by water, oxygen, dirt and stray light to reduce the imaging quality. Moreover, at least a portion of the encapsulation layer 4 facing the photosensitive chip 3 of the first substrate 1 is exposed from the encapsulation layer 4, that is, the encapsulation layer 4 leaves a portion for exposing the photosensitive chip 3, so that the encapsulation layer 4 does not affect the photosensitive performance of the photosensitive chip 3 itself.

Alternatively, the encapsulation layer 4 may be a plastic encapsulation layer 4, and may be specifically formed by Epoxy Molding Compound (EMC) or other materials. The EMC is a powdery molding compound formed by mixing epoxy resin serving as matrix resin, high-performance phenolic resin serving as a curing agent, silicon micropowder and other fillers and various auxiliaries, has good sealing property and easy plastic packaging property, and can be used for carrying out plastic packaging protection on the photosensitive chip 3 covered by the packaging layer 4.

The driving device 5 may be a linear motor, and is used for driving the lens to move during the photographing and shooting process, so as to achieve the purpose of adjusting the focal length. The wiring layer 2 is disposed on the first surface 11 and has a first connection portion 21; the driving device 5 is disposed on the second surface 12 and has a second connection portion 51, and the first connection portion 21 is electrically connected to the second connection portion 51 to electrically connect the driving device 5 to the wiring layer 2, so as to electrically connect the photosensitive chip 3 to the driving device 5. The first connection portion 21 and the second connection portion 51 may be electrically connected directly or through signal communication. The following discussion will discuss the electrical connection between the first connection portion 21 and the second connection portion 51 as a direct electrical connection, but the present invention is not limited thereto. The first connection portion 21 and the second connection portion 51 may be electrically connected through a connection element, or the first connection portion 21 and the second connection portion 51 may be directly contacted to achieve electrical connection. In the imaging module provided in this embodiment, the photosensitive surface 31 of the photosensitive chip 3 faces the first substrate 1 and forms a flip-chip package structure, and external light can enter the photosensitive chip 3 from below the first substrate 1. The wiring layer 2 is manufactured on the first substrate 1, the connection circuit of the photosensitive chip 3 is reasonably arranged again by using the wiring layer 2, and the electric connection between the driving device 5 and the photosensitive chip 3 is realized. The imaging module is thin in thickness, compact in overall structure and reliable in internal connection.

In the above embodiment, the first substrate 1 includes a transparent material, that is, the first substrate 1 is a transparent substrate or the first substrate 1 has a transparent region, the light sensing chip 3 is inversely installed on the first substrate 1, and the process that the external light passes through the transparent region of the first substrate 1 and enters the light sensing chip 3 is not shielded by the first substrate 1 itself, so that the light loss is small.

Exemplarily, the first substrate 1 may be a rigid substrate, which enables the imaging module to have better supporting performance, and the whole structure is more stable and reliable. Specifically, the first base body 1 is made of glass, the wiring layer 2 can be formed on the glass substrate through a film forming process, wiring inside the wiring layer 2 can be more accurate, and connection accuracy between the pins of the photosensitive chip 3 and the wiring layer 2 can be improved. In addition, the glass is used as a base material, so that external light can directly penetrate through the first base body 1 without punching to irradiate the photosensitive chip 3, the manufacturing process is simplified, and the first base body 1 has better mechanical property.

Exemplarily, the first substrate 1 may be a flexible substrate, that is, the first substrate 1 may be formed by a polymer with a relatively thin thickness, or the first substrate 1 may include a flexible material, for example, a resin material with flexibility. Specifically, the material of the first substrate 1 may include Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), or the like. When the first base body 1 is a flexible base body, the deformation effects of bending, curling and the like can be realized, the development trend of flexible electronic products is adapted, and the imaging module can be deformed along with the flexible electronic equipment when the flexible electronic product is applied.

In some embodiments, referring to fig. 1, the imaging module further includes a first connecting line 6, wherein one end of the first connecting line 6 is electrically connected to the first connecting portion 21, and the other end is electrically connected to the second connecting portion 51. The inside mode of walking the line connection that adopts of imaging module will be packaged with the structure and the drive arrangement 5 electricity of sensitization chip 3 and be connected for sensitization chip 3 can adjust drive arrangement 5 motion according to the external light signal that sensitization chip 3 gathered with signal of telecommunication transmission to drive arrangement 5. The first connecting wires 6 are connected to respective connecting parts of the wiring layer 2 and the driving device 5, so that compared with the traditional packaging structure, the number of the connecting wires is reduced, and the wiring accuracy and the yield are higher.

Alternatively, the first connecting line 6 may be made of a material having a better conductivity, such as copper, silver, gold, nickel, or the like.

In some embodiments, with continued reference to fig. 1, the first connection line may be a jumper connection, which is simple and easy to maintain.

In this embodiment, the number of the first connection portions 21 and the second connection portions 51 is not limited, and the number of the first connection portions 21 and the number of the second connection portions 51 may be the same or different, and may be one or more. In this embodiment, the number of the first connecting lines 6 is not limited, and the number of the first connecting lines 6 may be determined according to the positions, the numbers and the actual needs of the first connecting portions 21 and the second connecting portions 51, and the number of the first connecting lines 6 may be one or multiple.

Referring to fig. 3, fig. 3 is a schematic diagram illustrating an internal structure of an imaging module according to an embodiment of the present disclosure.

As shown in fig. 3, the first connection portion 21 may be directly disposed on the first surface 11 and electrically connected to the wiring layer 2, the second connection portion 51 is disposed on the side of the driving device 5 facing the first substrate 1, and the first connection portion 21 is disposed in the first surface 11 by adjusting the position of the wiring layer 2, so that the first connection portion 21 is relatively independent from other portions of the wiring layer 2, and thus, the circuit detection is easier.

In the embodiment of the present application, the arrangement positions of the first connection portion 21 and the second connection portion 51 are not limited. The first connecting portion 21 may be, as shown in fig. 3, the first connecting portion 21 is disposed on the first surface 11; as shown in fig. 1, the first connection portion 21 may be provided on the surface of the wiring layer 2 and directly connected to the wiring layer 2; the first connection portion 21 may also be provided inside the wiring layer 2 or led out from the wiring layer 2. As shown in fig. 3, the second connection portion 51 may be provided on the side of the driving device 5 facing the first base 1, or the second connection portion 51 may be provided inside the driving device 5.

In the embodiment of the present application, the structures of the first connection portion 21 and the second connection portion 51 are not limited, and the first connection portion 21 and the second connection portion 51 may be pads, wires, connection ends of wires, conductive materials of the wiring layers themselves, or the like. The first connection portion 21 and the second connection portion 51 may have the same or different structures.

In the embodiment of the present application, the material of the first connection portion 21 and the second connection portion 51 is not limited, and any material may be used as long as the material has a conductive property or can conduct electricity under certain conditions.

Referring to fig. 4, fig. 4 is a schematic structural diagram of an imaging module according to an embodiment of the present disclosure.

In some embodiments, as shown in fig. 4, the driving device 5 has a first lead 52 led out by itself, the first lead 52 is reused as the first connecting line 6, and the driving device 5 and the photosensitive chip 3 can be electrically connected without an additional connecting line, so that the overall structure of the imaging module is more compact, and since no other conductive structure is required to be introduced, heat generation of the overall structure of the imaging module can be reduced, and energy consumption is reduced.

In some embodiments, as shown in fig. 4, the first connecting line may adopt a side routing manner, so as to make the internal structure of the imaging module more compact, reduce the routing path, and optimize the energy consumption.

Referring to fig. 5 and 6, fig. 5 is a schematic structural diagram illustrating an imaging module according to an embodiment of the present disclosure. Figure 6 shows a top view of the imaging module of figure 4.

In some embodiments, as shown in fig. 5 and 6, the imaging module further includes a first pad 14, and the first pad 14 is located on the second surface 12 and electrically connected to the second connection portion 51. The first connecting line 6 is electrically connected to the first pad 14. By providing the first bonding pad 14, the bonding of the first connection line 6 to the first bonding pad 14 can be facilitated, and the connection reliability between the driving device 5 and the first connection line 6 can be ensured.

The present embodiment does not limit the structural shape of the first pad 14, and the first pad 14 may be a structural body extending along a plane parallel to the second surface 12. For example, the first pad 14 may be a strip or a plane. By designing the shape of the first bonding pad 14 specifically, a better bonding position is obtained.

For example, if the first connection portion 21 and the second connection portion 51 are disposed along a plane parallel to the second surface 12 in a staggered manner, as shown in fig. 5, at least a portion of the first pad 14 is reused as the second connection portion, the shape of the first pad 14 may be defined as a strip-shaped structure extending along a direction parallel to the plane of the second surface 12 and along a direction from the first connection portion 21 to the second connection portion 51, and this arrangement can reduce the routing distance of the first connection line 6 by using the first pad 14, optimize the conductive path, and improve the energy consumption. Simultaneously, compare in the form of walking the line connection, the connected mode that adopts the pad is connected more firmly reliably, and difficult pine takes off, tears apart, need not to set up many conductor wires, can avoid because conductor wire quantity too much leads to the bloated big, the internal connection of imaging module structure unstable, conductor wire connection precision low, the great scheduling problem of consumption.

With continued reference to fig. 5 and 6, in some embodiments, the first substrate 1 has a first transition passage 13 penetrating through the first surface 11 and the second surface 12, and at least a portion of the first connection line 6 is located in the first transition passage 13. The first transfer channel 13 may be a through hole or a blind hole with a certain depth, for example. The first switching channel 13 can protect the first connecting line 6, so that the first connecting line 6 is prevented from being exposed to the outside as a whole, and the reliability of connection is improved. In addition, the wiring layers 2 and the driving devices 5 on both sides of the first substrate 1 can be electrically connected by the first transfer channels 13, so that the wiring paths for electrical connection are reduced, and the power consumption is reduced.

Referring to fig. 7, fig. 7 is a schematic diagram illustrating an internal structure of an imaging module according to an embodiment of the present disclosure.

In some embodiments, as shown in fig. 7, the imaging module further includes a second substrate 7, and the second substrate 7 is disposed on the second surface 12 of the first substrate 1 and between the first substrate 1 and the driving device 5. The second substrate 7 may comprise glass or a printed circuit board.

The introduction of the second substrate 7 allows for greater process flexibility than would be the case with only the first substrate 1. For example, the wiring layer 2 can be disposed on the first substrate 1, and the driving device 5 can be disposed on the second substrate 7, so that the packaging process of the wiring layer 2 and the photosensitive chip 3, and the mounting process of the driving device 5 and the second substrate 7 can be performed in parallel, the manufacturing process is optimized, and the production efficiency is improved; for another example, the second substrate 7 is glass, the conductive structure may be formed on the glass by a film forming process, and the pad structure may be printed on a printed circuit board by using a printed circuit board 7, or the functions may be expanded by using the printed circuit board. In addition, when first base member was flexible material, the second base member can be rigid material, and first base member 1 uses with second base member 7 combination, can improve self supporting capacity, is favorable to the imaging module overall structure to stabilize, improves overall structure's reliability.

In some embodiments, the second substrate 7 is a printed circuit board, and the first pads 14 are disposed on a side of the second substrate 7 facing away from the first substrate 1. The printed circuit board is provided with the welding pad, so that the process is simple and reliable, and the cost is low. Moreover, according to the position relationship between the driving device 5 and the wiring layer 2, especially, according to the position relationship between the second connection portion 51 and the first connection portion 21, a wiring form or a pad structure adapted to the position relationship can be manufactured on the printed circuit board, so that the conductive path can be optimized, and the internal wiring of the imaging module can be simpler and easier to maintain. In addition, the arrangement and technical effects of the first bonding pads 14 in the foregoing embodiments can be similar to those in the present embodiment, and thus are not described again.

Referring to fig. 7, in some embodiments, as shown in fig. 7, a first pad is disposed on a side of the second substrate 7 facing the driving device 5, the first pad 14 is reused as a second connection portion 51, and the first connection portion 21 and the second connection portion 51 are electrically connected by a jumper connection.

Referring to fig. 8, fig. 8 is a schematic diagram illustrating an internal structure of an imaging module according to an embodiment of the present disclosure.

In some embodiments, as shown in fig. 8, the second substrate 7 has a third surface 71 and a fourth surface 72 opposite to each other, and a second via 73 penetrating through the third surface 71 and the fourth surface 72, and the wiring layer 2 and the driving device 5 are respectively disposed on the third surface 71 and the fourth surface 72. At least part of the first connecting line 6 is located in the second transit passage 73. On the basis of the beneficial effects of the foregoing embodiment, the via connection between the wiring layer 2 and the driving device 5 is realized through the second via 73, the routing path of the first connection line 6 is reduced, and the energy consumption is optimized.

As shown in fig. 8, in the present embodiment, the second through hole 73 is penetrated through the first through hole 13, but the actual structure is not limited thereto. For example, the first and second switch holes 13 and 73 may be arranged offset, that is, the orthographic projections of the first and second switch holes 13 and 73 on the second base 7 have an interval.

With continued reference to fig. 8, in some embodiments, the imaging module further includes an optical element 8, and the optical element 8 can acquire an image signal. Illustratively, the optical component 8 may be one or more lenses.

In the present embodiment, the second base 7 has a through hole 74 penetrating in its thickness direction; the optical assembly 8 obtains image signals through the through hole 74, and external light captured by the optical assembly 8 can be directly incident to the photosensitive chip 3 through the through hole 74, so that light loss is reduced, and the imaging quality of the imaging module is improved.

Optionally, the second substrate 7 is a printed circuit board, and the through hole 74 is formed in the printed circuit board, so that the normal operation of other areas of the printed circuit board is not affected on the basis of ensuring the light transmittance.

In some embodiments, the first substrate 1 includes a transparent material, that is, the first substrate 1 is a light-transmissive substrate or the first substrate 1 has a light-transmissive region, and the optical component 8 at least partially corresponds to the light-transmissive region of the first substrate 1, so that the light captured by the optical component 8 can pass through the light-transmissive region to irradiate the photo chip 3 without performing operations such as punching and thinning on the first substrate 1, thereby simplifying the manufacturing process and improving the structural stability of the first substrate 1.

In some embodiments, the orthographic projection of the optical component 8 on the first surface 11 has a first profile, the first substrate 1 itself has a second profile, the first profile corresponding to the shape of the second profile. In this embodiment, the shapes of the first contour and the second contour are not limited, and the shapes may be circular or elliptical, square or rectangular. The first contour corresponds to the second contour, that is, the shapes of the optical element 8 and the first substrate 1 are adapted to each other, for example, the optical element 8 is a circular optical lens, the shape of the first substrate 1 can be circular, and the optical element 8 and the first substrate 1 have the adapted shapes to optimize the distribution of the internal space of the imaging module, so that the imaging module has a more compact structure.

Referring to fig. 9, fig. 9 is a schematic diagram illustrating an internal structure of an imaging module according to an embodiment of the present disclosure.

In some embodiments, as shown in fig. 9, the imaging module further includes a first circuit board 9A, and the first circuit board 9A is used for connecting an external circuit. The side of the wiring layer 2 facing away from the first base 1 has a conductive block 23, the first circuit board 9A includes a first control chip 91, and the wiring layer 2 is electrically connected to the first control chip 91 through the conductive block 23. The first control chip 91 is electrically connected to the photosensitive chip 3 through the first circuit board 9A and the wiring layer 2, and can process the electrical signal converted by the photosensitive chip 3, or directly control the photosensitive chip 3.

In this embodiment, the circuit board further includes a passive device, which may be, for example, a passive resistor or a passive capacitor. The passive device is connected to the first control chip 91 through the first circuit board 9A, and can realize a predetermined circuit function under the control of the first control chip 91.

Optionally, the passive device is electrically connected to the photosensitive chip 3 through a conductive structure inside the wiring layer 2, so as to electrically connect to the second control chip 92, and further form a circuit for implementing functions such as filtering and coupling with the second control chip 92.

The side of the wiring layer 2 facing away from the first substrate 1 is provided with conductive blocks 23, the number of the conductive blocks 23 can be one or more, and the photosensitive chip 3 can realize signal transmission with an external circuit through the conductive blocks 23. The conductive bumps 23 may be made of a material with good conductivity, such as copper, silver, gold, nickel, etc., so as to reduce the loss of signals when passing through the conductive bumps 23, and the number, shape and size of the conductive bumps 23 may be set according to practical situations, which is not particularly limited in this embodiment, but in order to facilitate the packaging, the assembly may be easily achieved by adopting a metal ball-planting form.

Referring to fig. 10 in conjunction with fig. 8, fig. 10 shows a top view of the imaging module of fig. 8.

In some embodiments, the imaging module includes a second control chip 92, which is located on a side of the wiring layer 2 away from the first substrate 1 and electrically connected to the wiring layer 2, and the encapsulation layer 4 covers the second control chip 92. The light sensing chip 3 converts the optical signal into an electrical signal, and the second control chip 92 can process and analyze the electrical signal. The encapsulation layer 4 covers the second control chip 92, and can protect the second control chip 92 from contamination of external water, oxygen and dirt, and external damage. The second control chip 92 and the photosensitive chip 3 are integrated in the package structure formed by the package layer 4, so that the thickness of the imaging module is thinner, and the structure is more compact.

For example, the second control chip 92 may be an active chip, and the active chip may include a Digital Signal Processing (DSP) module for analyzing the information collected by the light sensing chip 3.

In some embodiments, the first control chip 91 and the second control chip 92 may be packaged together in the first substrate 1 without disposing the first control chip 91 and the second control chip 92 on a flexible circuit board for connecting an external circuit. Therefore, the use of the flexible circuit board can be reduced, and the first control chip 91, the second control chip 92 and the photosensitive chip 3 are electrically connected only through the wiring layer 2, so that the whole structure of the imaging module is more compact and reliable.

Optionally, the first control chip 91 and/or the second control chip 92 are active chips.

Optionally, the first control chip 91 and/or the second control chip 92 are one or more of an AI chip, a Memory chip, a VPN chip, and an SOC chip.

In some embodiments, with reference to fig. 8, the imaging module further includes a second circuit board 9B for connecting with an external circuit, and in particular, the second circuit board 9B may be a Flexible Printed Circuit (FPC).

In some embodiments, with reference to fig. 8, the imaging module further includes a filter element 15, and the visual effect of the image collected by the imaging module is close to that of human vision through the filter element 15. The filter element 15 is disposed between the photosensitive chip 3 and the optical component 8, and can filter stray light in light collected by the optical component 8, so that the final imaging effect of the photosensitive chip 3 is close to human vision.

The filter element 15 includes, but is not limited to, blue glass, an infrared cut filter, a full spectrum filter, and the like. Optionally, the imaging module may further include a mounting bracket for the filter element 15, and the filter element 15 is mounted on the mounting bracket for the filter element 15, so as to maintain the photosensitive path between the filter element 15 and the photosensitive component, and improve the mounting environment of the filter element 15, thereby facilitating assembly, disassembly and replacement.

Optionally, the filter element 15 may be a filter film attached to a side of the first substrate close to the optical assembly, or the filter element 15 may also be a filter film attached to a side of the encapsulation layer. The filter element 15 is manufactured on the first substrate or the packaging layer through a film forming process, so that the number of elements inside the imaging module can be reduced, the thickness of the imaging module is reduced, and the imaging module is more flexible.

Optionally, the imaging module further includes a support of the filter element 15, and the support of the filter element 15 is supported on one side of the optical assembly 8, so that the distance between the filter element 15 and the optical assembly 8 is constant.

In some embodiments, as shown in fig. 11, the wiring layer 2 includes a plurality of sub-wiring layers 242 stacked, an insulating layer is disposed between adjacent sub-wiring layers 242, the insulating layer includes a hollow area 25, and at least a portion of the hollow area 25 corresponds to the photosensitive chip 3. External light need not to pass insulating material just can be directly incited to the sensitization district of photosensitive chip 3 through fretwork area 25, consequently can reduce the insulating layer to the loss of light, guarantees the degree of accuracy of incident light's optical signal, and the light quantity that increase photosensitive chip 3 gathered improves the imaging module's imaging accuracy.

It should be noted that the hollow area 25 can have various forms, please refer to fig. 11 and 12 together, and fig. 12 shows an internal structural schematic diagram of an imaging module according to an embodiment of the present application. As shown in fig. 11, the hollowed-out area 25 may be in the form of a full-surface hollowed-out; as shown in fig. 12, the hollow area 25 may also include a plurality of holes distributed and combined. Alternatively, the shape of the hollow area 25 corresponds to the shape of the photosensitive chip 3. Further, the shape of the hollow area 25 may correspond to the shape of the photosensitive area of the photosensitive chip 3.

Optionally, the hollowed-out area 25 is larger than the peripheral size of the photosensitive chip 3, and a certain light-feeding margin is left, so that the phenomenon that the light-feeding amount is insufficient due to shielding of a partial area of the photosensitive chip 3 can be avoided.

In some embodiments, the first substrate 1 comprises a flexible material and/or a light filtering material. First base member 1 includes flexible material, can be so that first base member 1 realizes buckling, flexible deformation functions such as curl, can be adapted to curved surface display device, and flexible base member is stronger than its toughness in rigid base member, and difficult rupture and fracture also can provide the buffering of certain degree to formation of image module overall structure when receiving the impact. The first base 1 includes a filter material, meaning that the first base 1 can serve not only as a substrate for the wiring layer 2 but also be multiplexed into a filter structure. Particularly, when the first substrate 1 has a high transparency, the first substrate 1 with the light filtering material and transmitting light can be reused as the light filtering lens, that is, other light filtering structures or light filtering lenses are not required to be arranged in the imaging module, so that the thickness of the whole structure of the imaging module can be reduced, and the product cost is optimized.

Fig. 13 is an electronic device according to an embodiment of the present application. Referring to fig. 13, an embodiment of the present application further provides an electronic device. The electronic equipment comprises the imaging module provided by any one of the embodiments. The electronic device provided by the embodiment of the application can be any product or component with an imaging function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

To sum up, the embodiment of the application provides an imaging module and electronic equipment, imaging module encapsulates sensitization chip 3 based on fan-out panel level packaging technology (FOPLP), utilize wiring layer 2 to carry out the rearrangement to sensitization chip 3's connecting circuit port, thereby make the position between sensitization chip 3's first connecting portion 21 and drive arrangement's the second connecting portion more free relatively with switching on, electric connection through between first connecting portion 21 and the second connecting portion realizes sensitization chip 3 and drive arrangement's electric connection, the hookup location is compact, reliably, the demand that adaptation imaging module that can be better is miniaturized.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An imaging module, comprising:

a first substrate having opposing first and second surfaces;

a wiring layer disposed on the first surface;

the photosensitive chip is positioned on one side, away from the first base body, of the wiring layer and is electrically connected with the wiring layer;

the packaging layer covers the photosensitive chip, and at least part of the photosensitive chip facing to the first base body is exposed out of the packaging layer;

the driving device is arranged on the second surface; wherein the content of the first and second substances,

the wiring layer is provided with a first connecting part, the driving device is provided with a second connecting part, and the first connecting part is electrically connected with the second connecting part.

2. The imaging module of claim 1, further comprising:

and one end of the first connecting wire is electrically connected to the first connecting part, and the other end of the first connecting wire is electrically connected to the second connecting part.

3. The imaging module of claim 2,

the driving device is provided with a first lead led out by the driving device, and the first lead is multiplexed into the first connecting wire.

4. The imaging module of claim 2, further comprising:

the first bonding pad is positioned on the second surface and is electrically connected with the second connecting part; the first connection line is electrically connected to the first pad.

5. The imaging module of claim 2, wherein the first substrate has a first transition channel extending through the first surface and the second surface, at least a portion of the first connecting line being located in the first transition channel.

6. The imaging module of claim 1, further comprising:

the second base body is arranged on the second surface of the first base body and is positioned between the first base body and the driving device, and the second base body comprises glass or a printed circuit board.

7. The imaging module of claim 6, wherein the second substrate is a printed circuit board, and the first pad is disposed on a side of the second substrate facing away from the first substrate.

8. The imaging module of claim 6, wherein the second substrate has third and fourth opposing surfaces, and a second via extending through the third and fourth surfaces, the wiring layers and the driving device being disposed on the third and fourth surfaces, respectively;

at least part of the first connecting line is positioned in the second switching channel.

9. The imaging module of claim 7, wherein the second substrate has a through hole penetrating in a thickness direction thereof;

the imaging module further comprises an optical assembly, and the optical assembly acquires image signals through the through hole.

10. The imaging module of claim 9, wherein an orthographic projection of the optical assembly on the first surface has a first contour, and the first substrate itself has a second contour, the first contour corresponding to a shape of the second contour.

11. The imaging module of claim 1, further comprising:

a first circuit board for connecting an external circuit;

the side, away from the first base body, of the wiring layer is provided with a conductive block, the first circuit board comprises a first control chip, and the wiring layer is electrically connected with the first control chip through the conductive block.

12. The imaging module of claim 1, wherein the imaging module comprises:

and the second control chip is positioned on one side of the wiring layer, which is deviated from the first base body, and is electrically connected with the wiring layer, and the packaging layer covers the second chip.

13. The imaging module of claim 1, wherein the wiring layer comprises a plurality of sub-wiring layers arranged in a stacked manner, an insulating layer is disposed between adjacent sub-wiring layers, the insulating layer comprises a hollow area, and at least a portion of the hollow area corresponds to the photosensitive chip.

14. The imaging module of claim 1, wherein the first substrate comprises a flexible material and/or a filter material.

15. An electronic device comprising the imaging module of any one of claims 1 to 14.