CN114378388B

CN114378388B - Method for fully automatically assembling supporting piece in backlight source

Info

Publication number: CN114378388B
Application number: CN202210130564.1A
Authority: CN
Inventors: 张云柱
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-02-11
Filing date: 2022-02-11
Publication date: 2023-06-16
Anticipated expiration: 2042-02-11
Also published as: CN114378388A

Abstract

A method for fully automatically assembling a support member in a backlight source is provided, the backlight source comprises a PCB substrate and a luminous member, a first bonding pad is arranged on the PCB substrate, and solder paste is brushed on the first bonding pad; providing a support member, wherein a second bonding pad is arranged on the bottom surface of the support member, the second bonding pad is subjected to tinning treatment, and the top surface of the support member is a plane; the chip mounter places the supporting piece on the first bonding pad; placing the backlight source and the support piece into a reflow oven to enable the tin paste plated on the second bonding pad to be fused with the tin paste on the first bonding pad; after the solder paste is cooled, the first bonding pad and the second bonding pad are connected in a welding way. Through setting the top surface of support piece to the plane, the suction nozzle contact plane of chip mounter makes the chip mounter can be steady absorb support piece, and the chip mounter is put support piece on first pad, and the heating is put into the reflow oven again, fuses the solder paste that plates on the second pad with the solder paste on the first pad, and after the cooling of taking out, first pad and second pad welded connection are in the same place to accomplish full-automatic assembly support piece.

Description

Method for fully automatically assembling supporting piece in backlight source

Technical Field

The invention belongs to the technical field of backlight sources, and particularly relates to a method for fully automatically assembling a support piece in a backlight source.

Background

The existing backlight generally comprises a substrate and LED lamp beads arranged on the substrate, when the light guide plate and the diffusion plate are installed, the LED lamp beads are easy to strike, so that the LED lamp beads are easy to damage, and therefore supporting pieces (namely, anti-collision blocks) can be arranged on the substrate, and the heights of the supporting pieces are higher than those of the LED lamp beads.

The existing support is manually assembled into the backlight, and the manually assembled support has the following problems: the assembly efficiency is low, the labor intensity is high, the assembly is easy to be missed, and the assembly precision is not high.

Disclosure of Invention

It is an aim of embodiments of the present application to provide a method for fully automatically assembling a support in a backlight, which aims to improve the efficiency of support assembly.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows: there is provided a method of fully automatically assembling a support in a backlight,

providing a backlight source, wherein the backlight source comprises a PCB substrate and a luminous piece arranged on the PCB substrate, the PCB substrate is provided with a first bonding pad, and the first bonding pad is positioned beside the luminous piece; brushing solder paste on the first bonding pad;

providing a support, wherein a second bonding pad is arranged on the bottom surface of the support, the second bonding pad is subjected to tinning treatment, and the top surface of the support is a plane;

a suction nozzle of the chip mounter is propped against the plane to suck the supporting piece, and the chip mounter places the supporting piece on the first bonding pad; contacting the second pad with the first pad;

placing the backlight source and the supporting piece into a reflow oven to enable the tin paste plated on the second bonding pad to be fused with the tin paste on the first bonding pad;

and after the solder paste is cooled, the first bonding pad and the second bonding pad are connected in a welding way.

In one embodiment, the step of brushing the solder paste on the first bonding pad is as follows:

preparing a flow blocking layer on the periphery of the first bonding pad for preventing solder paste on the first bonding pad from flowing out of the first bonding pad;

and placing the backlight source in a tin paste brushing machine, sending the backlight source into a tin paste brushing station by the tin paste brushing machine, wherein a tin paste is sprayed on the first bonding pad area by a tin paste spraying mechanism in the tin paste brushing machine, and the flow blocking layer prevents the tin paste from flowing out of the first bonding pad.

In one embodiment, the solder paste on the first pad has a thickness of 3-5 microns.

In one embodiment, the flow blocking layer is one of epoxy, silicone, PPSU, PPS, or a compound thereof.

In one embodiment, the choke layer is filled with heat dissipation particles, and the particle size of the heat dissipation particles in the choke layer, which are in contact with the PCB substrate, is smaller than the particle size of the heat dissipation particles in the choke layer, which are not in contact with the PCB substrate.

In one embodiment, the step of providing the support is as follows:

the supporting pieces are respectively placed into a plurality of discharging grooves in the discharging tray under the conveying of the feeder, and a metal sensor is arranged at the bottom of each discharging groove and used for sensing the second bonding pad;

the chip mounter absorbs the supporting piece, and when the metal sensor does not sense the second bonding pad any more, the chip mounter is indicated to absorb the supporting piece successfully; and when the metal sensor can sense the second bonding pad, indicating that the chip mounter fails to suck the supporting piece.

In one embodiment, the support includes a body and the second pad integrally connected to a bottom surface of the body.

The beneficial effects of this application lie in: through establishing the top surface of support piece as the plane, the suction nozzle contact plane of chip mounter makes the chip mounter can be steady absorb support piece, chip mounter puts support piece on first pad, make second pad and first pad contact, put into the heating in the reflow oven again, melt the tin cream that plates on the second pad and fuse with the tin cream on the first pad, after the cooling of taking out, first pad and second pad welded connection are in the same place, thereby accomplish full-automatic assembly support piece, assemble support piece in the backlight with traditional manual work, its production efficiency promotes greatly, and the precision is higher.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a first angular perspective view of a support provided in an embodiment of the present application;

FIG. 2 is a second angular perspective view of a support provided in an embodiment of the present application;

fig. 3 is an assembly schematic diagram of a support and a backlight according to an embodiment of the present disclosure.

Wherein, each reference sign in the figure:

10. PCB substrate 11, first bonding pad

20. Light emitting member 30, support member

31. Second bonding pad 32, plane

33. Body 40, choke layer.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1-3, embodiments of the present application provide a method of fully automatically assembling a support in a backlight,

providing a backlight source, wherein the backlight source comprises a PCB substrate 10 and a luminous element 20 arranged on the PCB substrate, the PCB substrate 10 is provided with a first bonding pad 11, and the first bonding pad 11 is positioned beside the luminous element 20; brushing solder paste on the first bonding pad 11;

providing a support 30, wherein a second bonding pad 31 is arranged on the bottom surface of the support 30, the second bonding pad 31 is subjected to tinning treatment, and the top surface of the support 30 is a plane 32;

the suction nozzle of the chip mounter is propped against the plane 32 to suck the supporting piece 30, and the chip mounter places the supporting piece 30 on the first bonding pad 11; bringing the second pad 31 into contact with the first pad 11;

placing the backlight source and the supporting member 30 in a reflow oven to melt the solder paste plated on the second bonding pad 31 and fuse the solder paste on the first bonding pad 11;

after the solder paste is cooled, the first pad 11 and the second pad 31 are soldered.

Through setting the top surface of support piece 30 to the plane, the suction nozzle contact plane of chip mounter makes the chip mounter can be steady absorb support piece, chip mounter puts support piece 30 on first pad 11, make second pad 31 contact with first pad 11, put into the reflow oven again and heat, melt the solder paste that plates on the second pad 31 and the solder paste fusion on the first pad 11, after the cooling of taking out, first pad 11 and second pad 31 welded connection together, thereby accomplish full-automatic assembly support piece 30, assemble the support piece in the backlight with traditional manual work, its production efficiency promotes greatly, and the precision is higher.

Illustratively, the chip mounter sets the operation parameters in advance according to the positional relationship of the support member attached to the backlight source, so that the chip mounter can accurately suck up the support member and then accurately place it on the first pad 11.

Alternatively, the PCB substrate 10 may be replaced with an aluminum substrate.

Illustratively, the lighting member 20 is an LED lamp.

Before being put into the reflow oven, the solder paste on the first bonding pad 11 is not cooled, so that the solder paste on the first bonding pad 11 can fix the supporting member 30, and the supporting member 30 and the first bonding pad 11 are prevented from being emitted to deviate in the moving process.

The first bonding pad 11 is subjected to the following steps of:

a choke layer 40 for preventing solder paste on the first pad from flowing out of the first pad is prepared on the periphery of the first pad 11, and it is also understood that the surface of the PCB substrate 10 except the first pad 11 is provided with the choke layer 40, and the height of the choke layer 40 is higher than that of the first pad 40.

The backlight source is placed in a tin paste brushing machine, the tin paste brushing machine sends the backlight source into a tin paste brushing station, a tin paste is sprayed on the first bonding pad area by a tin paste spraying mechanism in the tin paste brushing machine, and the flow blocking layer 40 prevents the tin paste from flowing out of the first bonding pad 11. Thereby avoiding damage to other locations of the PCB substrate 10 caused by the solder paste.

The solder paste on the first pads 11 is illustratively 3-5 microns thick.

The current blocking layer 40 is one of epoxy, silicone, PPSU, PPS, or a combination thereof. The use of the resistive layer 40 of one or more of epoxy, silicone, PPSU, PPS, and combinations thereof, in addition to restricting solder paste flow, may also provide heat dissipation to the PCB substrate 10.

The heat dissipation particles are filled in the current blocking layer 40, and the particle size of the heat dissipation particles contacting the PCB substrate 10 in the current blocking layer 40 is smaller than the particle size of the heat dissipation particles not contacting the PCB substrate 10 in the current blocking layer 40. Smaller diameter heat dissipating particles can provide higher thermal conductivity, i.e., smaller particle size heat dissipating particles are filled near the PCB substrate 10 to maximize overall heat transfer through the system.

Illustratively, the heat sink particle material may be, but is not limited to, talc, silica, titania, boron nitride or aluminum oxide or mixtures thereof. Preferably, aluminum oxide is used.

The steps of providing the support 30 are as follows:

the plurality of supporting pieces 30 are respectively put into a plurality of discharging grooves in the discharging tray under the conveying of the feeder, and a metal sensor is arranged at the bottom of each discharging groove and used for sensing the second bonding pad 31;

the chip mounter sucking the supporting member 30, when the metal sensor no longer senses the second bonding pad, it is indicated that the chip mounter sucking the supporting member is successful; when the metal sensor can sense the second bonding pad, the failure of the chip mounter to suck the supporting piece is indicated.

The support 30 includes a main body 33 and a second pad 31, and the second pad 31 is integrally connected to the bottom surface of the main body 33. Through connecting second bonding pad 31 integrated into one piece at the bottom surface of main part 33, compare with traditional bonding with solder paste or glue, its structure is more stable, and has reduced once reflow soldering, has practiced thrift the cost, has improved production efficiency

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims

1. A method of fully automatically assembling a support in a backlight, comprising:

after the solder paste is cooled, the first bonding pad is connected with the second bonding pad in a welding way;

the step of brushing solder paste on the first bonding pad is as follows:

placing the backlight source in a tin paste brushing machine, sending the backlight source into a tin paste brushing station by the tin paste brushing machine, enabling a tin paste to be dotted in the first bonding pad area by a tin dotted mechanism in the tin paste brushing machine, and preventing the tin paste from flowing out of the first bonding pad by the flow blocking layer;

the flow blocking layer is one of epoxy, silicone, PPSU and PPS or a compound thereof;

and the flow blocking layer is filled with heat dissipation particles, and the particle size of the heat dissipation particles in the flow blocking layer, which are in contact with the PCB substrate, is smaller than that of the heat dissipation particles in the flow blocking layer, which are not in contact with the PCB substrate.

2. A method of fully automatically assembling a support in a backlight as recited in claim 1, wherein: the thickness of the solder paste on the first bonding pad is 3-5 microns.

3. A method of fully automatically assembling a support in a backlight as recited in claim 1, wherein: the step of providing the support is as follows:

4. A method of fully automatically assembling a support in a backlight as recited in claim 1, wherein: the support piece comprises a main body and the second bonding pad, and the second bonding pad is integrally connected to the bottom surface of the main body.