CN114375101A - Circuit board electroplating heat treatment integrated system under low oxygen environment - Google Patents

Circuit board electroplating heat treatment integrated system under low oxygen environment Download PDF

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Publication number
CN114375101A
CN114375101A CN202210101845.4A CN202210101845A CN114375101A CN 114375101 A CN114375101 A CN 114375101A CN 202210101845 A CN202210101845 A CN 202210101845A CN 114375101 A CN114375101 A CN 114375101A
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CN
China
Prior art keywords
electroplating
heat treatment
groove
moving
gear
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Granted
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CN202210101845.4A
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Chinese (zh)
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CN114375101B (en
Inventor
曾庆辉
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Ganzhou Jidao Electrode Technology Co ltd
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Ganzhou Jidao Electrode Technology Co ltd
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Priority to CN202210101845.4A priority Critical patent/CN114375101B/en
Publication of CN114375101A publication Critical patent/CN114375101A/en
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Publication of CN114375101B publication Critical patent/CN114375101B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention provides a circuit board electroplating heat treatment integrated system under a low-oxygen environment, which comprises a fixed seat, wherein the upper surface of the fixed seat is provided with an electroplating and heat treatment mechanism, when a supporting plate moves, the supporting plate can drive a driving gear to roll on a rack, so that a rotating rod and a mounting plate can be driven to rotate through transmission, when the mounting plate rotates, a transmission gear can be driven to roll on a gear ring, so that a bidirectional reciprocating screw rod can be driven to rotate, the bidirectional reciprocating screw rod can drive a sliding block to drive a lifting plate to reciprocate through matching with a bidirectional reciprocating screw rod nut, so that the circuit board can be clamped at the edge of the fixed seat through a mechanical grabbing hand, when the bidirectional reciprocating screw rod moves above an electroplating bath, the circuit board descends to the middle of the electroplating bath for electroplating operation, and when the supporting plate moves to the upper part of the electroplating bath, the circuit board moves to a drying bath for drying, thereby the electroplating solution is shaped and the phenomenon that the electroplating solution is driven to scatter and needs secondary treatment is avoided.

Description

Circuit board electroplating heat treatment integrated system under low oxygen environment
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board electroplating heat treatment integration system in a low-oxygen environment.
Background
Printed Circuit Boards (PCBs) are the basis of almost any electronic product and are found in a variety of electronic devices, and generally, if electronic components are present in a device, they are mounted on the surface of Circuit boards having various sizes. In addition to holding various components, the main function of the circuit board is to provide a connection circuit between the components. As electronic devices become more complex and require more and more components, the circuits and components on the surface of the PCB become more and more dense. The circuit board is made of insulating and heat-insulating materials, and conductive circuits and functional components are arranged on the surface of the circuit board, wherein the conductive circuits are mainly circuit patterns formed by processing copper foil materials. When a circuit board is processed to form a conductive circuit, firstly, copper foil is formed on the surface of the circuit board through deposition or electroplating and the like, and covers the whole surface of the circuit board to form a layered structure. Then, the copper layer is selectively etched to form a circuit pattern. In the manufacturing process, the circuit pattern is mostly formed by printing to be etched, so that the name of the circuit board is obtained.
The electroplating operation and the heat treatment operation of the existing circuit board are separately processed, a large amount of electroplating solution can be remained on the surface of the existing circuit board at the later stage of electroplating completion, the electroplating solution can scatter everywhere in the conveying process, a part of running cost can be wasted on the scattered treatment, and meanwhile, the continuous flowing of the electroplating after the circuit board is taken out is easy to drive a circuit with an incompletely fixed surface to shake, so that the quality of the circuit board is influenced, and therefore, a system for electroplating, heat treatment and integration of the circuit board under a low-oxygen environment is necessary to be provided.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, adapt to the practical requirements and provide a circuit board electroplating heat treatment integrated system in a low-oxygen environment.
In order to realize the purpose of the invention, the technical scheme adopted by the invention is as follows:
the design is a circuit board electroplating heat treatment integrated system under low oxygen environment, and comprises a fixed seat, an electroplating and heat treatment mechanism is arranged on the upper surface of the fixed seat, a moving mechanism is arranged on the upper surface of the fixed seat, a rotating mechanism is fixedly arranged on the upper surface of the moving mechanism, and a lifting mechanism is fixedly arranged inside the rotating mechanism.
Furthermore, the electroplating and heat treatment mechanism comprises an electroplating bath, the electroplating bath is arranged on the upper surface of the fixing seat, a cathode is fixedly arranged on the bath wall of the electroplating bath close to the bottom end, and an anode is fixedly arranged on the bath wall of the electroplating bath close to the bottom end.
Furthermore, the cathode and the anode are symmetrically arranged relative to the center of the electroplating bath.
Furthermore, a drying groove is formed in the upper surface of the fixing seat on one side of the electroplating groove, two fixing supports are fixedly mounted on the wall of the drying groove, and a plurality of drying lamps are fixedly mounted on the two fixing supports.
Furthermore, a plurality of drying lamps are two sets of settings, and two sets of drying lamps are respectively through two fixed bolster fixed mounting on the relative cell wall in stoving groove.
Furthermore, a plurality of drying lamps all are vertical form setting.
Furthermore, the moving mechanism comprises two moving grooves, the two moving grooves are formed in the upper surface of the fixing seat, and a moving block is connected to the inner portions of the two moving grooves in a sliding mode.
Furthermore, the upper ends of the two moving blocks penetrate through and extend out of the fixed seat, and one end, located outside the fixed seat, of the two moving blocks is fixedly connected with a supporting plate.
Furthermore, a lead screw is rotatably connected between the groove walls of the two moving grooves through a bearing, a lead screw nut is in threaded connection with each rod wall of the two lead screws, and the two lead screw nuts are fixedly sleeved on the two moving blocks respectively.
Furthermore, one end of each of the two screw rods penetrates through and extends out of the fixing seat, and one end of each of the two screw rods, which is located outside the fixing seat, is fixedly connected with a first bevel gear.
Furthermore, two driving motors are fixedly mounted on the outer side wall of the fixing seat at the positions below the two first bevel gears, the output ends of the two driving motors are fixedly connected with second bevel gears through couplers, and the two second bevel gears are respectively meshed with the two first bevel gears.
Furthermore, two the shifting chutes are respectively arranged at the edge of the upper surface of the fixed seat, and the two shifting chutes are arranged in parallel.
Furthermore, the two moving grooves are arranged on the upper surfaces of the fixed seats outside the electroplating bath and the drying groove.
Furthermore, two ball grooves are formed in the lower surfaces of the two moving blocks, and a ball is connected in each of the four ball grooves in a rolling mode.
Furthermore, the lower ends of the four balls respectively penetrate through the two moving grooves and extend into the two moving grooves, and the lower ends of the four balls respectively abut against the groove bottoms of the two moving grooves.
Further, slewing mechanism includes a dwang, the dwang passes through the bearing and rotates the connection between two backup pads, the dwang is located a mounting panel of fixedly connected with on the pole wall between two backup pads.
Furthermore, one end of the rotating rod penetrates through the two supporting plates and extends to the outside of the two supporting plates, and the rotating rod is located at one end of the two supporting plates and fixedly connected with a driven gear.
Furthermore, the outer side wall of the supporting plate located below the driven gear is rotatably connected with an installation rod through a bearing, one end of the installation rod penetrates through the supporting plate and extends to the outside of the supporting plate, and is fixedly connected with a driving gear, and the driving gear is meshed with the driven gear.
Furthermore, a rack is fixedly connected to the upper surface of the fixed seat at the position below the driving gear, and the driving gear is meshed with the rack.
Further, elevating system includes a lift groove, the lower surface at the mounting panel is seted up in the lift groove, just sliding connection has a lifter plate in the lift groove.
Furthermore, two chutes are formed in the wall of the lifting groove, two sliders are connected to the chutes in a sliding manner, and one ends of the two sliders penetrate through the lifting groove and are fixedly connected to the outer side wall of the lifting plate.
Furthermore, a bidirectional reciprocating screw rod is rotatably connected between the groove walls of one of the chutes through a bearing, a bidirectional reciprocating screw rod nut is connected to the rod wall of the bidirectional reciprocating screw rod in a threaded manner, and the bidirectional reciprocating screw rod nut is fixedly sleeved on one of the slide blocks.
Furthermore, a mounting hole is formed in the upper end groove wall of one of the sliding grooves in a penetrating mode, a rotating shaft is fixedly mounted in the mounting hole, and a first transmission gear is fixedly mounted on the rotating shaft.
Furthermore, the both ends of first drive gear run through the both ends drill way of mounting hole respectively, just the both ends of first drive gear run through respectively and extend to outside the mounting panel and in one of them spout.
Furthermore, a second transmission gear is fixedly sleeved on the wall of the bidirectional reciprocating screw rod corresponding to one end position of the first transmission gear in the sliding groove, and the second transmission gear is meshed with the first transmission gear.
Furthermore, correspond a gear ring of fixedly connected with in the backup pad of the one end position that first transmission gear is located the mounting panel outside, gear ring meshes with first transmission gear mutually.
Furthermore, two mechanical grabbing hands are fixedly mounted on the lower surface of the lifting plate.
Furthermore, dwang and mounting panel all are the paralleling form setting about plating bath and stoving groove.
Furthermore, a drain pipe is fixedly arranged on the bottom end tank wall of the electroplating tank.
Furthermore, one end of the drain pipe runs through and extends to the outside of the fixing base, and a valve is fixedly mounted at one end of the drain pipe, which is positioned outside the fixing base.
The invention has the beneficial effects that:
(1) the invention relates to a circuit board electroplating heat treatment integrated system under a low-oxygen environment, which is provided with a fixed seat, an electroplating and heat treatment mechanism, a moving mechanism, a rotating mechanism and a lifting mechanism, wherein when a supporting plate moves, the supporting plate can drive a driving gear to roll on a rack, so that a rotating rod and a mounting plate can be driven to rotate through transmission, when the mounting plate rotates, a transmission gear can be driven to roll on a gear ring, so that a bidirectional reciprocating screw rod can be driven to rotate, the bidirectional reciprocating screw rod can drive a sliding block to drive a lifting plate to reciprocate through matching with a bidirectional reciprocating screw rod nut, so that a circuit board can be clamped at the edge of the fixed seat through a mechanical grabbing hand, and when the bidirectional reciprocating screw rod moves above a plating bath, the circuit board is lowered to the middle of the plating bath for electroplating operation.
(2) The invention relates to a circuit board electroplating heat treatment integrated system under a low oxygen environment, which is provided with a fixed seat, an electroplating and heat treatment mechanism, a moving mechanism, a rotating mechanism and a lifting mechanism, when the circuit board is electroplated, a supporting plate can be driven to move continuously, so that the circuit board can be recycled into a lifting groove, the mounting plate is driven to rotate by the rotating rod, the collision between the mounting plate and a partition wall between an electroplating bath and a drying groove is avoided, the supporting plate moves to the position above the drying groove, the circuit board can be lowered into the drying groove to be dried, the circuit board is shaped, the phenomenon that the electroplating solution is driven to scatter and need secondary treatment is avoided, and the fixing of a mechanical grabbing hand can be released and the circuit board can be taken down when the supporting plate moves to the edge of the other side of the fixed seat.
Drawings
FIG. 1 is a schematic diagram of a system for electroplating, heat-treating and integrating a circuit board in a low oxygen environment according to the present design;
FIG. 2 is a schematic diagram of the electroplating state structure of the electroplating heat treatment-integration system of the circuit board in a low oxygen environment according to the present design;
FIG. 3 is a schematic diagram of the loading state structure of the electroplating heat treatment-integration system of the circuit board under the low oxygen environment according to the present design;
FIG. 4 is a schematic view of the mounting structure of the fixing base and the electroplating and heat treatment mechanism in the present design;
FIG. 5 is a schematic view of the mounting structure of the rotating mechanism in the present design;
FIG. 6 is a schematic view of the mounting structure of the moving mechanism in the present design;
fig. 7 is a schematic structural diagram of the moving block in the present design.
Detailed Description
The invention is further illustrated with reference to the following figures and examples:
example (b): a plating heat treatment integration system for circuit board under low oxygen environment is disclosed, referring to fig. 1-7.
This design circuit board electroplating heat treatment-integration system under low oxygen environment, including a fixing base 1, an electroplating and heat treatment mechanism 2 has been seted up to the upper surface of fixing base 1, and the upper surface of fixing base 1 is provided with a moving mechanism 3, and moving mechanism 3's last fixed surface installs a slewing mechanism 4, and slewing mechanism 4's inside fixed mounting has a elevating system 5.
Further, the electroplating and heat treatment mechanism 2 includes an electroplating tank 21, the electroplating tank 21 is disposed on the upper surface of the fixing base 1, a cathode 22 is fixedly mounted on a tank wall of the electroplating tank 21 near the bottom end, an anode 23 is fixedly mounted on a tank wall of the electroplating tank 21 near the bottom end, and the electroplating operation is performed on the circuit board by the reaction of the cathode 22 and the anode 23 on the electroplating solution in the electroplating tank 21.
Further, the cathode 22 and the anode 23 are disposed symmetrically with respect to the center of the plating tank 21.
Furthermore, a drying groove 24 is formed in the upper surface of the fixing seat 1 on one side of the electroplating groove 21, two fixing supports 25 are fixedly mounted on the wall of the drying groove 24, and a plurality of drying lamps 26 are fixedly mounted on each of the two fixing supports 25.
Further, a plurality of drying lamps 26 are arranged in two groups, and two groups of drying lamps 26 are respectively fixedly installed on the opposite slot walls of the drying slot 24 through two fixing brackets 25, and the circuit board located in the middle position is dried from two sides.
Further, a plurality of drying lamps 26 are all arranged vertically.
Further, the moving mechanism 3 includes two moving grooves 31, the two moving grooves 31 are both formed in the upper surface of the fixing base 1, a moving block 32 is slidably connected to the inside of each of the two moving grooves 31, and the moving block 32 can move in parallel in the moving grooves 31.
Further, the upper ends of the two moving blocks 32 all penetrate and extend out of the fixing base 1, and one end of the two moving blocks 32, which is located outside the fixing base 1, is fixedly connected with a supporting plate 39, and the moving blocks 32 can drive the supporting plate 39 to move synchronously.
Further, a lead screw 33 is rotatably connected between the groove walls of the two moving grooves 31 through a bearing, a lead screw nut 34 is connected to the rod wall of each lead screw 33 in a threaded manner, the two lead screw nuts 34 are respectively fixedly sleeved on the two moving blocks 32, and the lead screws 33 can drive the moving blocks 32 to move through the matching of the lead screw nuts 34.
Further, one end of each of the two screw rods 33 is penetrated and extended out of the fixing seat 1, and one end of each of the two screw rods 33, which is located outside the fixing seat 1, is fixedly connected with a first bevel gear 35.
Furthermore, two driving motors 36 are fixedly mounted on the outer side wall of the fixing seat 1 below the two first bevel gears 35, the output ends of the two driving motors 36 are fixedly connected with a second bevel gear 37 through a coupler, the two second bevel gears 37 are respectively meshed with the two first bevel gears 35, and the driving motors 36 can drive the screw rods 33 to rotate through the meshing of the second bevel gears 37 and the first bevel gears 35.
Further, two moving grooves 31 are respectively arranged at the edge of the upper surface of the fixing seat 1, and the two moving grooves 31 are arranged in parallel.
Further, two moving grooves 31 are provided on the upper surface of the fixing base 1 outside the plating bath 21 and the drying bath 24.
Further, two ball grooves 310 are formed in the lower surfaces of the two moving blocks 32, and a ball 38 is connected to the four ball grooves 310 in a rolling manner.
Furthermore, the lower ends of the four balls 38 respectively penetrate and extend into the two moving grooves 31, and the lower ends of the four balls 38 respectively abut against the bottoms of the two moving grooves 31, so that the moving block 32 can move conveniently by the rolling of the balls 38 in the moving grooves 31.
Further, the rotating mechanism 4 includes a rotating rod 41, the rotating rod 41 is rotatably connected between the two supporting plates 39 through a bearing, the rotating rod 41 is located on the rod wall between the two supporting plates 39 and is fixedly connected with an installation plate 42, and the installation plate 42 and the rotating rod 41 rotate synchronously.
Furthermore, one end of the rotating rod 41 penetrates and extends out of the two supporting plates 39, and one end of the rotating rod 41, which is located outside the two supporting plates 39, is fixedly connected with a driven gear 43, and the driven gear 43 and the rotating rod 41 rotate synchronously.
Furthermore, an installation rod 44 is rotatably connected to the outer side wall of the supporting plate 39 at the position below the driven gear 43 through a bearing, one end of the installation rod 44 penetrates through the supporting plate 39 and extends to the outside, and is fixedly connected with a driving gear 45, the driving gear 45 is meshed with the driven gear 43, and transmission is performed between the driving gear 45 and the driven gear 43.
Furthermore, a rack 46 is fixedly connected to the upper surface of the fixing base 1 below the driving gear 45, and the driving gear 45 is engaged with the rack 46 and can drive the driving gear 45 to rotate when the driving gear 45 moves.
Further, the lifting mechanism 5 includes a lifting slot 51, the lifting slot 51 is opened on the lower surface of the mounting plate 42, and a lifting plate 52 is slidably connected in the lifting slot 51.
Further, two chutes 53 have been seted up on the cell wall of lifting groove 51, equal sliding connection has a slider 54 in two chutes 53, and wherein one end of two sliders 54 all runs through and extends to in the lifting groove 51 and fixed connection is on the lateral wall of lifter plate 52, and is spacing to lifter plate 52, avoids it to rock and the skew.
Furthermore, a bidirectional reciprocating screw rod 55 is rotatably connected between the groove walls of one of the chutes 53 through a bearing, a bidirectional reciprocating screw rod nut 56 is connected to the rod wall of the bidirectional reciprocating screw rod 55 in a threaded manner, the bidirectional reciprocating screw rod nut 56 is fixedly sleeved on one of the sliders 54, and when the bidirectional reciprocating screw rod 55 rotates, the sliders 54 can be driven to perform reciprocating lifting operation in the chutes 53 through the matching of the bidirectional reciprocating screw rod 55 and the bidirectional reciprocating screw rod nut 56.
Furthermore, a mounting hole 57 is formed in the upper end groove wall of one of the sliding grooves 53 in a penetrating manner, a rotating shaft 58 is fixedly mounted in the mounting hole 57, and a first transmission gear 59 is fixedly mounted on the rotating shaft 58.
Further, two ends of the first transmission gear 59 respectively penetrate through the two end openings of the mounting hole 57, and two ends of the first transmission gear 59 respectively penetrate and extend out of the mounting plate 42 and into one of the sliding grooves 53.
Furthermore, a second transmission gear 510 is fixedly sleeved on the rod wall of the bidirectional reciprocating screw rod 55 corresponding to one end position of the first transmission gear 59 in the chute 43, the second transmission gear 510 is meshed with the first transmission gear 59, and transmission is performed between the second transmission gear 510 and the first transmission gear 59.
Furthermore, a gear ring 511 is fixedly connected to the supporting plate 39 corresponding to one end of the first transmission gear 59 located outside the mounting plate 42, the gear ring 511 is meshed with the first transmission gear 59, and transmission is performed between the gear ring 511 and the first transmission gear 59.
Furthermore, two mechanical grabbing hands 512 are fixedly mounted on the lower surface of the lifting plate 52, and the circuit board is clamped and fixed by the two mechanical grabbing hands 512.
Further, the rotating lever 41 and the mounting plate 42 are both provided in parallel with respect to the plating tank 21 and the drying tank 24.
Further, a drain pipe 27 is fixedly installed on the bottom end wall of the plating tank 21, and the plating solution in the plating tank 21 is discharged through the drain pipe 27.
Furthermore, one end of the water discharge pipe 27 extends through the fixing base 1, and a valve 28 is fixedly installed at the end of the water discharge pipe 27 located outside the fixing base 1, and the opening of the water discharge pipe 27 is controlled by the valve 28.
Specifically, when in use, when the supporting plate 39 is located at one side edge of the fixing base 1, the circuit board can be inserted into the lifting groove 51 until abutting against the lifting plate 52, at this time, the circuit board can be clamped and fixed by the two mechanical grippers 512, then the driving motor 36 can be started, the driving motor 36 drives the lead screw 33 to rotate through the engagement of the second bevel gear 37 and the first bevel gear 35, the lead screw 33 drives the moving block 32 to move in the moving groove 31 through the cooperation with the lead screw nut 23, the moving block 32 simultaneously drives the supporting plate 39 to move when moving, the supporting plate 39 simultaneously drives the rotating rod 41 and the mounting plate 42 to move, the supporting plate 39 drives the driving gear 45 to roll on the rack 46 when moving, and the driven gear 43 is driven to rotate through the rolling of the driving gear 45 through the engagement with the driving gear 45, the driven gear 43 drives the rotating rod 41 to rotate, the rotating rod 41 drives the mounting plate 42 to rotate, and further when the supporting plate 39 moves to the upper part of the electroplating bath 21, the rotating rod 41 drives the lower surface of the mounting plate 42 to rotate into the electroplating bath 21, and simultaneously when the mounting plate 42 rotates, the first transmission gear 59 is driven to roll on the gear ring 512, the second transmission gear 510 can drive the bidirectional reciprocating screw rod 55 to rotate by meshing with the first transmission gear 59, the bidirectional reciprocating screw rod 55 can drive the sliding block 54 to reciprocate in the sliding groove 53 by matching with the bidirectional reciprocating screw rod 56, and the sliding block 54 can drive the lifting plate 52 to synchronously reciprocate, so that when the mounting plate 42 rotates into the electroplating bath 21, the lifting plate 52 drives the circuit board to descend into the electroplating bath 21 for electroplating operation, and after the electroplating is completed, the supporting plate 39 can be continuously driven to move, and when backup pad 39 removed, lifter plate 52 can drive the circuit board and rise to in the lift tank 51, mounting panel 42 can rotate to the top simultaneously, thereby avoid can colliding with the wall between plating bath 21 and the stoving groove 24, and in can rotating mounting panel 42 when backup pad 39 removed to stoving groove 24 top in the stoving groove 24, and can descend the circuit board and dry in the stoving groove 24, can drive backup pad 39 after the stoving and remove the edge to fixing base 1 opposite side, mounting panel 42 was the level shape setting this moment, and outside the circuit board was propelling movement to lift tank 51, thereby make things convenient for taking of circuit board.
The embodiments of the present invention are disclosed as the preferred embodiments, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention and make various extensions and changes without departing from the spirit of the present invention.

Claims (10)

1. The utility model provides a circuit board electroplating heat treatment-materialization system under low oxygen environment, includes a fixing base, its characterized in that: the upper surface of the fixing seat is provided with an electroplating and heat treatment mechanism, the upper surface of the fixing seat is provided with a moving mechanism, the upper surface of the moving mechanism is fixedly provided with a rotating mechanism, and the inside of the rotating mechanism is fixedly provided with a lifting mechanism.
2. The system of claim 1, wherein the plating heat treatment system comprises: the electroplating and heat treatment mechanism comprises an electroplating bath, the electroplating bath is arranged on the upper surface of the fixed seat, a cathode is fixedly arranged on the bath wall of the electroplating bath close to the bottom end, and an anode is fixedly arranged on the bath wall of the electroplating bath close to the bottom end; the cathode and the anode are symmetrically arranged relative to the center of the electroplating bath; the upper surface of the fixed seat positioned on one side of the electroplating bath is provided with a drying groove, the wall of the drying groove is fixedly provided with two fixed brackets, and a plurality of drying lamps are fixedly arranged on the two fixed brackets; the drying lamps are arranged in two groups, and the two groups of drying lamps are fixedly arranged on the opposite groove walls of the drying groove through two fixing supports respectively; and the drying lamps are arranged vertically.
3. The system of claim 1, wherein the plating heat treatment system comprises: the moving mechanism comprises two moving grooves, the two moving grooves are formed in the upper surface of the fixed seat, and a moving block is connected to the inner parts of the two moving grooves in a sliding mode; the upper ends of the two moving blocks penetrate through and extend out of the fixed seat, and one ends of the two moving blocks, which are positioned outside the fixed seat, are fixedly connected with a supporting plate; the two moving grooves are respectively formed in the edge of the upper surface of the fixed seat, and are arranged in parallel; the two moving grooves are arranged on the upper surfaces of the fixed seats outside the electroplating bath and the drying groove; the lower surfaces of the two moving blocks are respectively provided with two ball grooves, and a ball is connected in each of the four ball grooves in a rolling manner; the lower ends of the four balls respectively penetrate through the two moving grooves and extend into the two moving grooves, and the lower ends of the four balls respectively abut against the groove bottoms of the two moving grooves.
4. The system of claim 3, wherein the plating heat treatment system comprises: and a lead screw is rotatably connected between the groove walls of the two moving grooves through a bearing, a lead screw nut is in threaded connection with each rod wall of the two lead screws, and the two lead screw nuts are fixedly sleeved on the two moving blocks respectively.
5. The system of claim 3, wherein the plating heat treatment system comprises: one end of each of the two screw rods penetrates through the fixing base and extends out of the fixing base, and one end of each of the two screw rods, which is located outside the fixing base, is fixedly connected with a first bevel gear.
6. The system of claim 3, wherein the plating heat treatment system comprises: two driving motors are fixedly mounted on the outer side wall of the fixing seat at the positions below the two first bevel gears, the output ends of the two driving motors are fixedly connected with second bevel gears through couplers, and the second bevel gears are respectively meshed with the two first bevel gears.
7. The system of claim 1, wherein the plating heat treatment system comprises: the rotating mechanism comprises a rotating rod, the rotating rod is rotatably connected between the two supporting plates through a bearing, and an installation plate is fixedly connected to the rod wall of the rotating rod between the two supporting plates; the rotating rod and the mounting plate are arranged in parallel with respect to the electroplating bath and the drying bath; one end of the rotating rod penetrates through the two supporting plates and extends out of the two supporting plates, and a driven gear is fixedly connected to one end of the rotating rod, which is positioned outside the two supporting plates; the outer side wall of the support plate positioned below the driven gear is rotatably connected with an installation rod through a bearing, one end of the installation rod penetrates through the support plate and extends out of the support plate and is fixedly connected with a driving gear, and the driving gear is meshed with the driven gear; and the upper surface of the fixed seat positioned below the driving gear is fixedly connected with a rack, and the driving gear is meshed with the rack.
8. The system of claim 1, wherein the plating heat treatment system comprises: the lifting mechanism comprises a lifting groove, the lifting groove is formed in the lower surface of the mounting plate, and a lifting plate is connected in the lifting groove in a sliding mode; two sliding grooves are formed in the groove wall of the lifting groove, a sliding block is connected in each sliding groove in a sliding mode, and one end of each of the two sliding blocks penetrates through the lifting groove to extend into the lifting groove and is fixedly connected to the outer side wall of the lifting plate; and a bidirectional reciprocating screw rod is rotatably connected between the groove walls of one of the chutes through a bearing, a bidirectional reciprocating screw rod nut is in threaded connection with the rod wall of the bidirectional reciprocating screw rod, and the bidirectional reciprocating screw rod nut is fixedly sleeved on one of the slide blocks.
9. The system of claim 8, wherein the plating heat treatment system comprises: a mounting hole is formed in the upper end groove wall of one of the sliding grooves in a penetrating manner, a rotating shaft is fixedly mounted in the mounting hole, and a first transmission gear is fixedly mounted on the rotating shaft; two ends of the first transmission gear respectively penetrate through orifices at two ends of the mounting hole, and two ends of the first transmission gear respectively penetrate and extend out of the mounting plate and into one of the sliding grooves; a second transmission gear is fixedly sleeved on the wall of the bidirectional reciprocating screw rod at one end position in the sliding groove corresponding to the first transmission gear, and the second transmission gear is meshed with the first transmission gear; correspond a gear ring of fixedly connected with in the backup pad of the one end position that first transmission gear is located the outer mounting panel, gear ring meshes with first transmission gear mutually.
10. The system of claim 2, wherein the plating heat treatment system comprises: a drain pipe is fixedly arranged on the bottom end tank wall of the electroplating tank; one end of the drain pipe runs through and extends to the outside of the fixing base, and the drain pipe is fixedly provided with a valve at one end positioned outside the fixing base.
CN202210101845.4A 2022-01-27 2022-01-27 Circuit board electroplating heat treatment-integration system in low-oxygen environment Active CN114375101B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565427A1 (en) * 1992-04-06 1993-10-13 Automa-Tech Device for transferring printed circuit boards for an installation for thermal treatment by convection and installation therefor
JP2005322732A (en) * 2004-05-07 2005-11-17 Seiko Epson Corp Manufacturing method of flexible printed wiring board
CN210394578U (en) * 2019-08-23 2020-04-24 东莞永将电子有限公司 Electroplating device for processing PCB (printed circuit board)
CN212274445U (en) * 2020-05-14 2021-01-01 无锡市凯灵电镀设备有限公司 Electroplated part drying device of electroplating production line
CN112609222A (en) * 2020-12-14 2021-04-06 李从贵 Washing and drying integrated electroplating device
CN213186734U (en) * 2020-08-05 2021-05-11 临安天宇电子有限公司 Cleaning and spin-drying device for electroplating processing of circuit board
US20210246568A1 (en) * 2020-02-11 2021-08-12 Minhou Forao Arts&Crafts Co., Ltd Rotating fixture for plating plates

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565427A1 (en) * 1992-04-06 1993-10-13 Automa-Tech Device for transferring printed circuit boards for an installation for thermal treatment by convection and installation therefor
JP2005322732A (en) * 2004-05-07 2005-11-17 Seiko Epson Corp Manufacturing method of flexible printed wiring board
CN210394578U (en) * 2019-08-23 2020-04-24 东莞永将电子有限公司 Electroplating device for processing PCB (printed circuit board)
US20210246568A1 (en) * 2020-02-11 2021-08-12 Minhou Forao Arts&Crafts Co., Ltd Rotating fixture for plating plates
CN212274445U (en) * 2020-05-14 2021-01-01 无锡市凯灵电镀设备有限公司 Electroplated part drying device of electroplating production line
CN213186734U (en) * 2020-08-05 2021-05-11 临安天宇电子有限公司 Cleaning and spin-drying device for electroplating processing of circuit board
CN112609222A (en) * 2020-12-14 2021-04-06 李从贵 Washing and drying integrated electroplating device

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