CN107493654B - Organic conductive film covering device of FPC circuit board - Google Patents
Organic conductive film covering device of FPC circuit board Download PDFInfo
- Publication number
- CN107493654B CN107493654B CN201710731849.XA CN201710731849A CN107493654B CN 107493654 B CN107493654 B CN 107493654B CN 201710731849 A CN201710731849 A CN 201710731849A CN 107493654 B CN107493654 B CN 107493654B
- Authority
- CN
- China
- Prior art keywords
- film covering
- rotating shaft
- mounting plate
- gear
- device body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1563—Reversing the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses an organic conductive film covering device of an FPC (flexible printed circuit) board, which comprises a device body, wherein the device body is of a rectangular cavity structure, two groups of cylinders are arranged on the inner wall of the top of the device body, piston rods of the two groups of cylinders are connected with a first mounting plate, first springs are uniformly arranged on the lower surface of the first mounting plate at equal intervals along the length direction, one end, far away from the first mounting plate, of each first spring is connected with a second mounting plate, a film covering device is fixed on the lower surface of each second mounting plate, a rod is movably mounted in the middle of the inner wall of a bottom plate of the device body, a first rotating shaft is arranged on the lower surface of the bottom plate. According to the invention, the circuit board can be fixed during film covering, so that the film covering is more accurate, and the defective rate is reduced; simultaneously quick carry out the tectorial membrane to its another side, convenient quick, reduce operating time, improve production efficiency, this device simple structure, the modern design is worth promoting.
Description
Technical Field
The invention relates to the technical field of organic conductive film covering, in particular to an organic conductive film covering device of an FPC (flexible printed circuit) board.
Background
A Flexible Printed Circuit (FPC) is a highly reliable and excellent Flexible Printed Circuit board made of polyimide or polyester film as a base material. The method has the characteristics of high wiring density, light weight, thin thickness and good bending property, and pre-production pretreatment is particularly important in order to prevent the problems of FPC board scrapping and material supplement caused by too low yield rate or reduction of rough process problems such as drilling, calendering and cutting due to too many open and short circuits in the production process and evaluate how to select materials to achieve the flexible circuit board with the best effect for customers.
In the pre-production pretreatment of the circuit board, the film coating treatment is needed to be carried out on the circuit board, so that the film coated circuit board has better performance, but in the existing pre-production pretreatment process of the circuit board, when the film coating is carried out on the circuit board, in order to improve the efficiency, the circuit board is not fixed, so that the film coating possibly generates deviation, more defective products are caused, the cost is wasted, the operation is troublesome when the film coating is carried out on the double surfaces of the circuit board, the time is wasted, and the production efficiency is reduced.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides an organic conductive film covering device of an FPC (flexible printed circuit) board.
In order to achieve the purpose, the invention adopts the following technical scheme:
an organic conductive film covering device of an FPC (flexible printed circuit) board comprises a device body, wherein the device body is of a rectangular cavity structure, two groups of cylinders are installed on the inner wall of the top of the device body, piston rods of the two groups of cylinders are connected with a first mounting plate, first springs are evenly arranged on the lower surface of the first mounting plate along the length direction at equal intervals, one end, far away from the first mounting plate, of each first spring is connected with a second mounting plate, a film covering device is fixed on the lower surface of each second mounting plate, a first rotating shaft is movably installed on a middle position of the inner wall of a bottom plate of the device body, a first gear is installed at the top of the first rotating shaft, two groups of second rotating shafts are installed on the inner wall of the bottom plate of the device body, the two groups of second rotating shafts are respectively located on two sides of the first rotating shaft, a second gear is installed at the top of the second, the intermediate position of third pivot installs the third gear, and is two sets of the installation piece is all installed to the one end that the third pivot is close to mutually, one side that the third pivot was kept away from to the installation piece is equipped with the spout along length direction, movable mounting has two sets of third mounting panels in the spout, and is two sets of be connected with the second spring between the third mounting panel, and is two sets of one side that the third mounting panel is close to mutually all is equipped with two sets of clamp splice, and just two sets of clamp splice are located the top and the bottom of third mounting panel lateral wall respectively, the intermediate position movable mounting of spout has the fourth pivot, the one end that the spout was kept away from in the fourth pivot is installed oval dish.
Preferably, the device body is made of stainless steel alloy.
Preferably, first pivot and fourth pivot are electronic pivot, and electronic pivot includes the axis of rotation on base and the base, installs the rolling disc on this axis of rotation upper portion, sets up the barrel on the rolling disc, and the barrel is built-in to be equipped with driving motor, and this driving motor is connected with rolling disc transmission and the power supply who installs on pivot upper portion.
Preferably, the clamping block is provided with a rectangular opening, and the size of the opening is matched with the thickness of the FPC board.
Preferably, the first gear is engaged with the second gear, and the second gear is engaged with the third gear.
Preferably, small steel balls are uniformly arranged in the sliding groove.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the driving motor in the third rotating shaft is started through the clamping block, and the circuit board can be fixed through the second spring, so that the circuit board is fixed during film covering, the film covering is more accurate, and the defective rate is reduced; after the one side of circuit board has been tectorial membrane simultaneously accomplished, start the driving motor in the first pivot, then drive second gear through first gear and rotate, drive third gear again and rotate, make the third pivot rotate, the quick turn-ups with the circuit board, then carries out the tectorial membrane to its another side, and convenient quick reduces operating time, improves production efficiency, and this device simple structure, the modern design is worth promoting.
Drawings
FIG. 1 is a schematic structural diagram of an organic conductive film covering device of an FPC board according to the present invention;
FIG. 2 is a schematic structural diagram of a mounting plate of an organic conductive film covering device of an FPC board according to the present invention;
fig. 3 is a cross-sectional view of a mounting board of an organic conductive film covering device of an FPC board according to the present invention.
In the figure: the device comprises a device body 1, a cylinder 2, a first mounting plate 3, a first spring 4, a second mounting plate 5, a film coating device 6, a first rotating shaft 7, a first gear 8, a second rotating shaft 9, a second gear 10, a third rotating shaft 11, a third gear 12, a mounting block 13, a third mounting plate 14, a sliding chute 15, a second spring 16, a clamping block 17, a fourth rotating shaft 18 and an elliptic disc 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 3, an organic conductive film covering device of an FPC circuit board comprises a device body 1, the device body 1 is made of stainless steel alloy, the device body 1 is of a rectangular cavity structure, two groups of cylinders 2 are mounted on the inner wall of the top of the device body 1, piston rods of the two groups of cylinders 2 are connected with a first mounting plate 3, first springs 4 are uniformly arranged on the lower surface of the first mounting plate 3 along the length direction at equal intervals, one ends of the first springs 4 far away from the first mounting plate 3 are connected with a second mounting plate 5, a film covering device 6 is fixed on the lower surface of the second mounting plate 5, a first rotating shaft 7 is movably mounted at the middle position of the inner wall of a bottom plate of the device body 1, a first gear 8 is mounted at the top of the first rotating shaft 7, two groups of second rotating shafts 9 are mounted on the inner wall of the bottom plate of the device body 1, a second gear 10 is arranged at the top of the second rotating shaft 9, third rotating shafts 11 are symmetrically and movably arranged on a group of opposite side walls in the device body 1, a third gear 12 is arranged in the middle of each third rotating shaft 11, the first gear 8 is meshed with the second gear 10, the second gear 10 is meshed with the third gear 12, mounting blocks 13 are arranged at the ends, close to the two groups of third rotating shafts 11, of the mounting blocks 13, sliding grooves 15 are formed in the sides, far away from the third rotating shafts 11, of the mounting blocks 13 along the length direction, small steel balls are uniformly arranged in the sliding grooves 15, two groups of third mounting plates 14 are movably arranged in the sliding grooves 15, a second spring 16 is connected between the two groups of third mounting plates 14, two groups of clamping blocks 17 are arranged at the sides, close to the two groups of third mounting plates 14, rectangular openings are formed in the clamping blocks 17, the size of the openings is matched with the thickness of the FPC circuit board, and the two, a fourth rotating shaft 18 is movably arranged in the middle of the sliding groove 15, the first rotating shaft 7 and the fourth rotating shaft 18 are both electric rotating shafts, each electric rotating shaft comprises a base, a rotating shaft on the base, a rotating disc arranged on the upper portion of the rotating shaft and a barrel arranged on the rotating disc, a driving motor is arranged in the barrel and is connected with a transmission and power supply of the rotating disc arranged on the upper portion of the rotating shaft, and an elliptical disc 19 is arranged at one end, far away from the sliding groove 15, of the fourth rotating shaft 18; after the one side of circuit board has been tectorial membrane simultaneously accomplished, start the driving motor in the first pivot 7, then drive second gear 10 through first gear 8 and rotate, drive third gear 12 again and rotate, make third pivot 11 rotate, the quick circuit board turn-ups that will turn over, then carries out the tectorial membrane to its another side, and is convenient quick, reduces operating time, improves production efficiency, and this device simple structure, the modern design is worth promoting.
The working principle is as follows: through the clamping block 17, the driving motor in the third rotating shaft 11 is started, and the circuit board can be fixed through the second spring 16, so that the circuit board is fixed during film covering, the film covering is more accurate, and the defective rate is reduced; meanwhile, after the film coating on one surface of the circuit board is finished, the driving motor in the first rotating shaft 7 is started, then the first gear 8 drives the second gear 10 to rotate, and then the third gear 12 is driven to rotate, so that the third rotating shaft 11 rotates, the circuit board is quickly flanged, and then the film coating is carried out on the other surface of the circuit board.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The organic conductive film covering device of the FPC circuit board comprises a device body (1) and is characterized in that the device body (1) is of a rectangular cavity structure, two groups of cylinders (2) are installed on the inner wall of the top of the device body (1), piston rods of the two groups of cylinders (2) are connected with a first mounting plate (3), first springs (4) are evenly arranged on the lower surface of the first mounting plate (3) along the length direction at equal intervals, one ends, far away from the first mounting plate (3), of the first springs (4) are connected with a second mounting plate (5), a film covering device (6) is fixed on the lower surface of the second mounting plate (5), a first rotating shaft (7) is movably installed on a middle position of the inner wall of a bottom plate of the device body (1), a first gear (8) is installed at the top of the first rotating shaft (7), two groups of second rotating shafts (9) are installed on the inner wall of the bottom plate of, and two sets of second pivot (9) are located the both sides of first pivot (7) respectively, second gear (10) are installed at the top of second pivot (9), symmetry movable mounting has third pivot (11) on a set of relative lateral wall in device body (1), third gear (12) are installed to the intermediate position of third pivot (11), two sets of installation piece (13) are all installed to the one end that third pivot (11) are close to mutually, one side that third pivot (11) were kept away from to installation piece (13) is equipped with spout (15) along length direction, movable mounting has two sets of third mounting panel (14) in spout (15), be connected with second spring (16) between two sets of third mounting panel (14), two sets of one side that third mounting panel (14) are close to mutually all is equipped with two sets of clamp splice (17), and two sets of clamp splice (17) are located the top and the bottom of third mounting panel (14) lateral wall respectively, a fourth rotating shaft (18) is movably mounted in the middle of the sliding groove (15), and an elliptic disc (19) is mounted at one end, far away from the sliding groove (15), of the fourth rotating shaft (18).
2. The organic conductive film covering device of an FPC board as claimed in claim 1, wherein the device body (1) is made of stainless steel alloy.
3. The organic conductive film covering device of the FPC board according to claim 1, wherein the first rotating shaft (7) and the fourth rotating shaft (18) are both electric rotating shafts, each electric rotating shaft comprises a base, a rotating shaft on the base, a rotating disc mounted on the upper portion of the rotating shaft, and a cylinder body mounted on the rotating disc, and the cylinder body is internally provided with a driving motor which is connected with a rotating disc transmission and power supply mounted on the upper portion of the rotating shaft.
4. The organic conductive film covering device of FPC board according to claim 1, wherein said clamping block (17) is provided with a rectangular opening, and the size of the opening matches with the thickness of FPC board.
5. An organic conductive film covering device of an FPC circuit board according to claim 1, wherein said first gear (8) is engaged with a second gear (10), and said second gear (10) is engaged with a third gear (12).
6. The organic conductive film covering device of an FPC circuit board according to claim 1, wherein small steel balls are uniformly arranged in the sliding grooves (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731849.XA CN107493654B (en) | 2017-08-23 | 2017-08-23 | Organic conductive film covering device of FPC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731849.XA CN107493654B (en) | 2017-08-23 | 2017-08-23 | Organic conductive film covering device of FPC circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107493654A CN107493654A (en) | 2017-12-19 |
| CN107493654B true CN107493654B (en) | 2020-03-24 |
Family
ID=60646448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710731849.XA Active CN107493654B (en) | 2017-08-23 | 2017-08-23 | Organic conductive film covering device of FPC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107493654B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108163257B (en) * | 2017-12-28 | 2020-04-10 | 铜陵安博电路板有限公司 | PCB moisture-proof oxygen-blocking packaging device |
| CN112954993A (en) * | 2021-02-01 | 2021-06-11 | 北海翰博士科技有限公司 | Electromagnetic waveguide electric metal film with EMI resistance |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202542432U (en) * | 2012-04-23 | 2012-11-21 | 朗星辉电子设备（深圳）有限公司 | Printed circuit board (PCB) turnover machine in surface mount technology (SMT) industry |
| CN103747631A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating hot-pressing jig |
| CN106323984B (en) * | 2016-08-23 | 2018-11-02 | 唐山市梦动力文化传播有限公司 | A kind of pretreatment unit for integrated circuit detection |
-
2017
- 2017-08-23 CN CN201710731849.XA patent/CN107493654B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107493654A (en) | 2017-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107493654B (en) | Organic conductive film covering device of FPC circuit board | |
| CN102951317B (en) | Full-automatic mylar adhering equipment | |
| CN105522378B (en) | It is a kind of be used for align from Hui Zhong rotary deviation-rectifyings mechanism and rotation press-in device | |
| CN114953702B (en) | Processing device for preparing copper-clad plate | |
| CN202962796U (en) | Rail width adjusting mechanism of three-proofing lacquer sprayed PCB (Printed Circuit Board) transmission system | |
| CN216820226U (en) | Flexible printed circuit board cutting mechanism suitable for different specifications | |
| CN217749026U (en) | Sheet metal part positioning mechanism for automobile sheet metal | |
| CN206811946U (en) | Five shaft mechanical arms | |
| CN202861074U (en) | Pipe clamping device | |
| CN109640527B (en) | Dry film applying device for thick copper PCB production | |
| CN202595261U (en) | Magnetic control sputtering rotation target | |
| CN211385585U (en) | Lithium battery gravure gap and continuous coating mechanism | |
| CN102423760A (en) | Automatic mould cleaning device used on FPC (Flexible Printed Circuit) die cutting machine | |
| CN212449845U (en) | Coiling mechanism is used in copper foil production | |
| CN221371344U (en) | Double-sided contact barrel plating machine | |
| CN208127043U (en) | A kind of winding device | |
| CN211217240U (en) | End cover bearing spraying device | |
| CN112792866B (en) | Cutting device is used in production of copper-clad plate | |
| CN215366046U (en) | Auxiliary device for reducing plating degree of plated part | |
| CN216491301U (en) | Turnover device for turnover of FPC (Flexible printed Circuit) | |
| CN116463713B (en) | Energy-saving type rack with movable plating roll for rolling plating line | |
| CN220413582U (en) | Battery piece electroplating device | |
| CN210497805U (en) | Pipe bending machine with adjustable pipe diameter | |
| CN221434502U (en) | Adjustable aluminum product bending device | |
| CN220407763U (en) | High-efficient riveting device of pivot device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 334000 Hebei Industrial Road, Guangfeng Economic Development Zone, Shangrao City, Jiangxi Province Patentee after: Jiangxi Goldstar Optoelectronic Technology Co.,Ltd. Address before: 334000 No.11 Changqing Road, Luyang Industrial Park, Guangfeng Economic Development Zone, Shangrao City, Jiangxi Province Patentee before: JIANGXI KAIQIANG INDUSTRIAL Co.,Ltd. |
|
| CP03 | Change of name, title or address |