CN107493654A - A kind of Organic Conductive Films cladding system of FPC circuit boards - Google Patents
A kind of Organic Conductive Films cladding system of FPC circuit boards Download PDFInfo
- Publication number
- CN107493654A CN107493654A CN201710731849.XA CN201710731849A CN107493654A CN 107493654 A CN107493654 A CN 107493654A CN 201710731849 A CN201710731849 A CN 201710731849A CN 107493654 A CN107493654 A CN 107493654A
- Authority
- CN
- China
- Prior art keywords
- rotating shaft
- installing plate
- gear
- device body
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1563—Reversing the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of Organic Conductive Films cladding system of FPC circuit boards, including device body, described device body is rectangular enclosure structure, two groups of cylinders are installed in the top inner wall of described device body, the piston rod of cylinder is connected with the first installing plate described in two groups, the lower surface of first installing plate is equidistant along its length to be uniformly provided with the first spring, the described one end of first spring away from the first installing plate is connected with the second installing plate, the lower surface of second installing plate is fixed with film covering device, the plate inner wall centre position activity mounting rod of described device body has first rotating shaft, first gear is installed at the top of the first rotating shaft.It in the present invention, can be fixed with wiring board in overlay film, make its overlay film more accurate, reduction in the numbers of seconds；Overlay film quickly is carried out to its another side simultaneously, fast and easy, reduces the operating time, improves production efficiency, the present apparatus is simple in construction, novel in design, is worthy to be popularized.
Description
Technical field
The present invention relates to Organic Conductive Films soverlay technique field, more particularly to a kind of Organic Conductive Films of FPC circuit boards to cover
Lid arrangement.
Background technology
Flexible PCB (Flexible Printed Circuit abbreviation FPC) is using polyimides or polyester film as base
It is a kind of made of material that there is height reliability, excellent flexible printed circuit.With Distribution density is high, in light weight, thickness
Thin, the characteristics of bending property is good, in process of production, cause yield too low in order to prevent out short-circuit excessive or reduce drilling, pressure
Prolong, cut etc. FPC plates caused by thick technological problemses scrap, feed supplement the problem of, and assess how selection, which can reach client, makes
The FPC of optimum efficiency, antenatal pretreatment, which seems, to be even more important.
Need to carry out aluminum coated steel to circuit board in antenatal pretreatment, make the wiring board after overlay film that there is more preferably property
Can, but in the antenatal preprocessing process of existing wiring board, when carrying out overlay film to wiring board, in order to improve efficiency, do not have
Wiring board is fixed, makes overlay film cause substandard products more there may be deviation, cost of idleness, and to circuit board double overlay film
When it is troublesome in poeration, lose time, reduce production efficiency.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of FPC circuit boards proposed has
Machine conducting film cladding system.
To achieve these goals, present invention employs following technical scheme：
A kind of Organic Conductive Films cladding system of FPC circuit boards, including device body, described device body are rectangular enclosure
Structure, two groups of cylinders are installed in the top inner wall of described device body, the piston rod of cylinder is connected with the first peace described in two groups
Loading board, the lower surface of first installing plate is equidistant along its length to be uniformly provided with the first spring, and first spring is remote
One end of first installing plate is connected with the second installing plate, and the lower surface of second installing plate is fixed with film covering device, the dress
The plate inner wall centre position activity mounting rod for putting body has first rotating shaft, and the first tooth is provided with the top of the first rotating shaft
Wheel, the plate inner wall of described device body is provided with two group of second rotating shaft, and two group of second rotating shaft is respectively positioned at first rotating shaft
Both sides, are provided with second gear at the top of second rotating shaft, symmetrical activity in one group of relative side wall in described device body
3rd rotating shaft is installed, the centre position of the 3rd rotating shaft is provided with the 3rd gear, and the 3rd rotating shaft is mutually close described in two groups
One end is mounted on mounting blocks, and side of the mounting blocks away from the 3rd rotating shaft is provided with chute along its length, in the chute
Two group of the 3rd installing plate is movably installed with, second spring is connected between the 3rd installing plate described in two groups, the 3rd peace described in two groups
The mutually close side of loading board is equipped with two groups of fixture blocks, and two groups of fixture blocks are located at the top and bottom of the 3rd installing plate side wall respectively,
The centre position of the chute is movably installed with the 4th rotating shaft, and the described one end of 4th rotating shaft away from chute is provided with oval plate.
Preferably, described device body is made up of stainless steel alloy.
Preferably, the first rotating shaft and the 4th rotating shaft are electric rotation shaft, and electric rotation shaft is included on base and base
Rotary shaft, be installed in the rotating disc on the rotary shaft top, the cylinder being arranged on rotating disc, be equiped with cylinder driving electricity
Machine, the motor are connected with the rotating disc transmission and power supply for being installed in rotating shaft top.
Preferably, the fixture block is provided with rectangular aperture, and openings of sizes matches with FPC circuit plate thickness.
Preferably, the first gear engages with second gear, and second gear engages with the 3rd gear.
Preferably, small steel ball is uniformly provided with the chute.
Compared with prior art, the beneficial effects of the invention are as follows：In the present invention, by fixture block, then start the 3rd rotating shaft
Interior motor, wiring board can be fixed by second spring, wiring board is fixed in overlay film, make its overlay film
It is more accurate, reduction in the numbers of seconds；Simultaneously when the one side of wiring board is after the completion of overlay film, start the driving electricity in first rotating shaft
Machine, then drive second gear to rotate by first gear, then drive the 3rd pinion rotation, make the 3rd axis of rotation, quickly
By wiring board flange, overlay film is then carried out to its another side, fast and easy, reduces the operating time, improves production efficiency, the present apparatus
It is simple in construction, it is novel in design, it is worthy to be popularized.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the Organic Conductive Films cladding system of FPC circuit boards proposed by the present invention；
Fig. 2 is a kind of structural representation of the installing plate of the Organic Conductive Films cladding system of FPC circuit boards proposed by the present invention
Figure；
Fig. 3 is a kind of sectional view of the installing plate of the Organic Conductive Films cladding system of FPC circuit boards proposed by the present invention.
In figure：1 device body, 2 cylinders, 3 first installing plates, 4 first springs, 5 second installing plates, 6 film covering devices, 7
One rotating shaft, 8 first gears, 9 second rotating shafts, 10 second gears, 11 the 3rd rotating shafts, 12 the 3rd gears, 13 mounting blocks, 14 the 3rd peaces
Loading board, 15 chutes, 16 second springs, 17 fixture blocks, 18 the 4th rotating shafts, 19 oval plates.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
Reference picture 1-3, a kind of Organic Conductive Films cladding system of FPC circuit boards, including device body 1, device body 1 are
Stainless steel alloy is made, and device body 1 is rectangular enclosure structure, and two groups of cylinders 2 are provided with the top inner wall of device body 1,
The piston rod of two groups of cylinders 2 is connected with the first installing plate 3, and the lower surface of the first installing plate 3 is equidistant along its length uniformly to be set
There is the first spring 4, the one end of the first spring 4 away from the first installing plate 3 is connected with the second installing plate 5, the following table of the second installing plate 5
Face is fixed with film covering device 6, and the plate inner wall centre position activity mounting rod of device body 1 has first rotating shaft 7, first rotating shaft 7
Top first gear 8 is installed, the plate inner wall of described device body 1 is provided with two group of second rotating shaft 9, and two groups second turn
Axle 9 is located at the both sides of first rotating shaft 7 respectively, and the top of the second rotating shaft 9 is provided with second gear 10, one group of phase in device body 1
To side wall on be symmetrically movably installed with the 3rd rotating shaft 11, the centre position of the 3rd rotating shaft 11 is provided with the 3rd gear 12, first
Gear 8 engages with second gear 10, and second gear 10 engages with the 3rd gear 12, the mutually close one end of two group of the 3rd rotating shaft 11
It is mounted on mounting blocks 13, side of the mounting blocks 13 away from the 3rd rotating shaft 11 is provided with chute 15 along its length, in chute 15
It is even to be provided with small steel ball, two group of the 3rd installing plate 14 is movably installed with chute 15, is connected between two group of the 3rd installing plate 14
Two springs 16, two group of the 3rd mutually close side of installing plate 14 are equipped with two groups of fixture blocks 17, and fixture block 17 is provided with rectangular aperture, and
Openings of sizes matches with FPC circuit plate thickness, and two groups of fixture blocks 17 are located at the top and bottom of the side wall of the 3rd installing plate 14 respectively
Portion, the centre position of chute 15 are movably installed with the 4th rotating shaft 18, and the rotating shaft 18 of first rotating shaft 7 and the 4th is electric rotation shaft, electricity
Turn axle includes base and rotary shaft on base, is installed in the rotating disc on the rotary shaft top, is arranged on rotating disc
Cylinder, motor is equiped with cylinder, the motor and be installed in the rotating disc transmission on rotating shaft top and power supply connects
Connect, the 4th one end of rotating shaft 18 away from chute 15 is provided with oval plate 19, in of the invention, passes through fixture block 17, then starts the 3rd
Motor in rotating shaft 11, wiring board can be fixed by second spring 16, wiring board is fixed in overlay film,
Make its overlay film more accurate, reduction in the numbers of seconds；Simultaneously when the one side of wiring board is after the completion of overlay film, start in first rotating shaft 7
Motor, then drive second gear 10 to rotate by first gear 8, then drive the 3rd gear 12 to rotate, make the 3rd turn
Axle 11 rotates, and quickly by wiring board flange, overlay film is then carried out to its another side, fast and easy, reduces the operating time, is improved
Production efficiency, the present apparatus is simple in construction, novel in design, is worthy to be popularized.
Operation principle：By fixture block 17, then start the motor in the 3rd rotating shaft 11, can be with by second spring 16
Wiring board is fixed, wiring board is fixed in overlay film, makes its overlay film more accurate, reduction in the numbers of seconds；Work as line simultaneously
The one side of road plate after the completion of overlay film, starts the motor in first rotating shaft 7, then drives second by first gear 8
Gear 10 rotates, then drives the 3rd gear 12 to rotate, and rotates the 3rd rotating shaft 11, quickly by wiring board flange, then to it
Another side carries out overlay film.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (6)
1. a kind of Organic Conductive Films cladding system of FPC circuit boards, including device body (1), it is characterised in that described device sheet
Body (1) is rectangular enclosure structure, and two groups of cylinders (2), cylinder described in two groups are provided with the top inner wall of described device body (1)
(2) piston rod is connected with the first installing plate (3), and the lower surface of first installing plate (3) is equidistant along its length uniformly
Provided with the first spring (4), the one end of first spring (4) away from the first installing plate (3) is connected with the second installing plate (5), institute
The lower surface for stating the second installing plate (5) is fixed with film covering device (6), and the plate inner wall centre position of described device body (1) is lived
Dynamic mounting rod has first rotating shaft (7), and first gear (8), described device body (1) are provided with the top of the first rotating shaft (7)
Plate inner wall two group of second rotating shaft (9) be installed, and two group of second rotating shaft (9) is located at the both sides of first rotating shaft (7), institute respectively
State and second gear (10) is installed at the top of the second rotating shaft (9), symmetrically lived in one group of relative side wall in described device body (1)
Dynamic to be provided with the 3rd rotating shaft (11), the centre position of the 3rd rotating shaft (11) is provided with the 3rd gear (12), the described in two groups
The mutually close one end of three rotating shafts (11) is mounted on mounting blocks (13), side of the mounting blocks (13) away from the 3rd rotating shaft (11)
It is provided with chute (15) along its length, two group of the 3rd installing plate (14) is movably installed with the chute (15), the described in two group
Second spring (16) is connected between three installing plates (14), the mutually close side of the 3rd installing plate (14) is equipped with two described in two groups
Group fixture block (17), and two groups of fixture blocks (17) are located at the top and bottom of the 3rd installing plate (14) side wall, the chute (15) respectively
Centre position be movably installed with the 4th rotating shaft (18), the one end of the 4th rotating shaft (18) away from chute (15) is provided with ellipse
Disk (19).
A kind of 2. Organic Conductive Films cladding system of FPC circuit boards according to claim 1, it is characterised in that the dress
Body (1) is put to be made up of stainless steel alloy.
3. the Organic Conductive Films cladding system of a kind of FPC circuit boards according to claim 1, it is characterised in that described
One rotating shaft (7) and the 4th rotating shaft (18) are electric rotation shaft, and electric rotation shaft includes base and rotary shaft on base, is installed in
The rotating disc on the rotary shaft top, the cylinder being arranged on rotating disc, motor is equiped with cylinder, the motor and dress
It is located at the rotating disc transmission and power supply connection on rotating shaft top.
A kind of 4. Organic Conductive Films cladding system of FPC circuit boards according to claim 1, it is characterised in that the folder
Block (17) is provided with rectangular aperture, and openings of sizes matches with FPC circuit plate thickness.
5. the Organic Conductive Films cladding system of a kind of FPC circuit boards according to claim 1, it is characterised in that described
One gear (8) engages with second gear (10), and second gear (10) engages with the 3rd gear (12).
A kind of 6. Organic Conductive Films cladding system of FPC circuit boards according to claim 1, it is characterised in that the cunning
Small steel ball is uniformly provided with groove (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731849.XA CN107493654B (en) | 2017-08-23 | 2017-08-23 | Organic conductive film covering device of FPC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731849.XA CN107493654B (en) | 2017-08-23 | 2017-08-23 | Organic conductive film covering device of FPC circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107493654A true CN107493654A (en) | 2017-12-19 |
| CN107493654B CN107493654B (en) | 2020-03-24 |
Family
ID=60646448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710731849.XA Active CN107493654B (en) | 2017-08-23 | 2017-08-23 | Organic conductive film covering device of FPC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107493654B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108163257A (en) * | 2017-12-28 | 2018-06-15 | 铜陵安博电路板有限公司 | A kind of anti-tide-bound oxygen packing devices of PCB |
| CN112954993A (en) * | 2021-02-01 | 2021-06-11 | 北海翰博士科技有限公司 | Electromagnetic waveguide electric metal film with EMI resistance |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202542432U (en) * | 2012-04-23 | 2012-11-21 | 朗星辉电子设备（深圳）有限公司 | Printed circuit board (PCB) turnover machine in surface mount technology (SMT) industry |
| CN103747631A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating hot-pressing jig |
| CN106323984A (en) * | 2016-08-23 | 2017-01-11 | 王文庆 | Pre-treatment device for integrated circuit detection |
-
2017
- 2017-08-23 CN CN201710731849.XA patent/CN107493654B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202542432U (en) * | 2012-04-23 | 2012-11-21 | 朗星辉电子设备（深圳）有限公司 | Printed circuit board (PCB) turnover machine in surface mount technology (SMT) industry |
| CN103747631A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating hot-pressing jig |
| CN106323984A (en) * | 2016-08-23 | 2017-01-11 | 王文庆 | Pre-treatment device for integrated circuit detection |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108163257A (en) * | 2017-12-28 | 2018-06-15 | 铜陵安博电路板有限公司 | A kind of anti-tide-bound oxygen packing devices of PCB |
| CN112954993A (en) * | 2021-02-01 | 2021-06-11 | 北海翰博士科技有限公司 | Electromagnetic waveguide electric metal film with EMI resistance |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107493654B (en) | 2020-03-24 |
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Address after: 334000 Hebei Industrial Road, Guangfeng Economic Development Zone, Shangrao City, Jiangxi Province Patentee after: Jiangxi Goldstar Optoelectronic Technology Co.,Ltd. Address before: 334000 No.11 Changqing Road, Luyang Industrial Park, Guangfeng Economic Development Zone, Shangrao City, Jiangxi Province Patentee before: JIANGXI KAIQIANG INDUSTRIAL Co.,Ltd. |
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