CN114364143A - Circuit board preparation method and circuit board - Google Patents
Circuit board preparation method and circuit board Download PDFInfo
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- CN114364143A CN114364143A CN202111572612.4A CN202111572612A CN114364143A CN 114364143 A CN114364143 A CN 114364143A CN 202111572612 A CN202111572612 A CN 202111572612A CN 114364143 A CN114364143 A CN 114364143A
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- circuit board
- hard gold
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- dry film
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Abstract
The invention discloses a circuit board and a preparation method thereof, wherein the preparation method of the circuit board comprises the following steps: drilling, copper deposition and copper electroplating are carried out on the circuit board; obtaining pad parameters and a first preset thickness to determine the size of the hard gold area, and pasting a first dry film on the circuit board; exposing the hard gold area of the circuit board pasted with the first dry film, and removing the first dry film of the hard gold area; copper is reduced in the hard gold area on the circuit board, and nickel hard gold is plated, so that the hard gold area is flush with the circuit area of the circuit board; removing the first dry film on the circuit board, attaching a second dry film, and exposing the circuit board according to a preset circuit diagram to expose a substrate area; and etching the substrate region, and removing the second dry film to expose the bonding pad and the circuit. According to the invention, copper is reduced in the corresponding area of the circuit board according to the hard gold area, and then nickel gold and hard gold are plated in the copper-reduced area of the circuit board, so that the flatness of the hard gold bonding pad and the flatness of the other bonding pads of the circuit board are kept consistent.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board manufacturing method and a circuit board.
Background
With the rapid development of the electronic industry, the demand of printed circuit boards is increasing, various products are increasing in the market, and the structure is more and more complex. Wherein, there are some products in the circuit board and need to design the combination surface technology of local hard gold and other surface technologies.
In the related technology, a combined product of layout hard gold and other surface processes is processed, a circuit pattern needs to be exposed by pasting a dry film, then nickel gold and hard gold are plated on the circuit pattern, a nickel gold protection circuit is used as an etching-resistant layer, however, the method cannot realize a gold immersion or OSP process in a local area, a lead wire drawing mode needs to etch a lead wire in a secondary etching mode after first resistance welding is finished, and then secondary resistance welding is carried out to cover the lead wire position after the lead wire is etched, so that the whole process flow is long, and the problem of appearance problems caused by secondary resistance welding and the problem of height difference of resistance welding in the lead wire area affect the risk of product use.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the circuit board preparation method provided by the invention can be used for thinning the copper in the hard gold area to ensure that the final circuit flatness is kept consistent, no extra drawing wire is needed, no secondary lead etching is needed, and the processing efficiency and the flatness of the surface bonding pad are improved.
The invention also provides a circuit board.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a wiring board, including:
drilling, copper deposition and copper electroplating are carried out on the circuit board;
obtaining pad parameters and a first preset thickness to determine the size of a hard gold area, and pasting a first dry film on the circuit board;
exposing the area, except the hard gold area, of the circuit board attached with the first dry film, and removing the first dry film of the hard gold area;
copper is removed from a hard gold area on the circuit board, and nickel hard gold is plated, so that the hard gold area is flush with a circuit area of the circuit board;
removing the first dry film on the circuit board, attaching a second dry film, and exposing the circuit board according to a preset circuit diagram to expose a substrate area;
and etching the substrate area, and removing the second dry film to expose the bonding pad and the circuit.
The circuit board preparation method provided by the embodiment of the invention at least has the following beneficial effects: copper is reduced in the corresponding area of the circuit board according to the hard gold area, and then nickel gold and hard gold are plated in the copper-reduced area of the circuit board, so that the flatness of the hard gold bonding pad and the flatness of the other bonding pads of the circuit board are kept consistent.
According to the circuit board preparation method of other embodiments of the invention, the drilling, copper deposition and copper electroplating of the circuit board comprise:
drilling the circuit board to process a hole of the circuit board;
chemically depositing a layer of thin copper on the circuit board after drilling;
and thickening and copper plating are carried out on the outer layer and the hole of the circuit board after copper deposition according to a second preset thickness.
According to other embodiments of the present invention, a method for manufacturing a circuit board, wherein drilling a hole in the circuit board to form the hole in the circuit board, comprises:
and drilling the circuit board in a mechanical drilling mode or a laser drilling mode to process the hole of the circuit board.
According to the method for manufacturing a circuit board of another embodiment of the present invention, the obtaining of the pad parameter and the first preset thickness determines a size of a hard gold region, and attaching a first dry film to the circuit board includes:
increasing a preset difference value and the first preset thickness according to the pad parameter to determine the size of the hard gold area;
and pasting the first dry film on the circuit board.
According to other embodiments of the invention, the first dry film is an electroplating-resistant dry film.
According to the method for manufacturing a circuit board of another embodiment of the present invention, exposing a region of the circuit board to which the first dry film is attached, except for the hard gold region, and removing the first dry film of the hard gold region, includes:
exposing the area of the circuit board except the hard gold area;
and developing and removing the first dry film on the unexposed hard gold region.
According to another embodiment of the present invention, the method for manufacturing a circuit board, wherein the step of reducing copper and plating nickel hard gold on the hard gold region of the circuit board to make the hard gold region and the circuit region of the circuit board flush comprises:
copper is reduced from the hard gold area on the circuit board according to a third preset thickness;
and plating nickel gold and hard gold on the hard gold area of the circuit board after copper reduction so as to enable the hard gold area to be flush with the circuit area of the circuit board.
According to another embodiment of the present invention, a method for manufacturing a circuit board, wherein the first dry film on the circuit board is removed and a second dry film is attached, and the circuit board is exposed according to a predetermined circuit diagram to expose a substrate region, includes:
removing the first dry film on the circuit board, and sticking an anti-etching dry film;
and exposing the circuit board according to the circuit of the preset circuit diagram, and developing the substrate area of the circuit board.
In a second aspect, an embodiment of the present invention provides a wiring board formed by the wiring board manufacturing method according to the first aspect.
The circuit board of the embodiment of the invention at least has the following beneficial effects: the circuit board obtained by the circuit board preparation method of the first aspect ensures that the final circuit flatness of the circuit board is consistent and no extra lead is required to be pulled, so that the flatness of the pad on the board surface is improved.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 3a is a schematic diagram of a hole drilled in an embodiment of a method of fabricating a circuit board according to an embodiment of the invention;
FIG. 3b is a schematic diagram of copper deposition in an embodiment of the method for manufacturing a circuit board according to the present invention;
FIG. 3c is a schematic view of copper plating in an embodiment of a method for manufacturing a circuit board according to the present invention;
FIG. 4 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic diagram showing the dimensions of a bonding pad in an embodiment of the method for manufacturing a circuit board according to the invention;
FIG. 7 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 8 is a schematic view of a film in an embodiment of a method for manufacturing a circuit board according to the invention;
FIG. 9 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 10a is a schematic view of copper reduction in an embodiment of a method for fabricating a circuit board according to the present invention;
FIG. 10b is a schematic diagram of hard gold and nickel gold plating in an embodiment of a method for fabricating a circuit board according to the invention;
FIG. 11 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 12a is a schematic diagram of removing a first dry film in an embodiment of a method for fabricating a circuit board according to the invention;
FIG. 12b is a schematic diagram of a second dry film attached to a circuit region for developing the circuit region in an embodiment of the method for manufacturing a circuit board according to the invention;
FIG. 12c is a schematic illustration of etching in an embodiment of a method of fabricating a circuit board according to an embodiment of the invention;
fig. 12d is a schematic diagram of removing the second dry film in an embodiment of the method for manufacturing a circuit board according to the embodiment of the invention.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the description of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. If a feature is referred to as being "disposed," "secured," "connected," or "mounted" to another feature, it can be directly disposed, secured, or connected to the other feature or indirectly disposed, secured, connected, or mounted to the other feature.
In the description of the embodiments of the present invention, if "a number" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "greater than", "lower" or "inner" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
As the structure of the circuit board becomes more complex, a combined surface process combining local hard gold and other surface processes appears, but the local hard gold area is limited by the pattern distribution without farad leads. In the traditional mode, a dry film is pasted for exposure to expose a circuit pattern, and then nickel gold and hard gold are plated on the circuit pattern, wherein a nickel gold protective circuit is used as an anti-etching layer, but the mode cannot realize a local area gold immersion or OSP process; and the lead wire drawing mode needs to etch the lead wire in a secondary etching mode after the first solder mask is finished, and then the secondary solder mask is manufactured to cover the position of the lead wire after the lead wire is etched. However, the processing flow for manufacturing the circuit board by the method is long, and the lead area has the problems of appearance caused by secondary solder resistance and height difference of the solder resistance, so that the risk problem of using the product is influenced.
Based on the circuit board manufacturing method, the flatness of the final circuit is kept consistent by thinning the copper in the hard gold area, extra drawing wires are not needed, secondary etching of the leads is not needed, and the processing efficiency and the flatness of the surface bonding pad are improved.
Referring to fig. 1, an embodiment of the present application discloses a method for manufacturing a circuit board, including:
s100, drilling, copper deposition and copper electroplating are carried out on the circuit board;
s200, obtaining pad parameters and a first preset thickness to determine the size of a hard gold area, and pasting a first dry film on the circuit board;
s300, exposing the hard gold region-removed region of the circuit board pasted with the first dry film, and removing the first dry film of the hard gold region;
s400, reducing copper in a hard gold area on the circuit board and plating nickel hard gold to enable the hard gold area to be flush with the circuit area of the circuit board;
s500, removing the first dry film on the circuit board, attaching a second dry film, and exposing the circuit board according to a preset circuit diagram to expose a substrate area;
s600, etching the substrate area, and removing the second dry film to expose the bonding pad and the circuit.
After the circuit board is punched, the whole circuit board is electroplated to realize copper plating of hole copper and surface copper, pad parameters and a first preset thickness are obtained again to determine the size of a hard gold area, the thickness of copper to be reduced on the circuit board can be determined according to the size of the hard gold area, then a first dry film is attached to reduce copper, nickel gold and hard gold are plated on the hard gold area after copper reduction, and finally the pad and the circuit of the circuit board are exposed by retreating the first dry film. Therefore, the copper is reduced in the corresponding area of the circuit board according to the hard gold area, and then the nickel gold and the hard gold are plated in the copper-reduced area of the circuit board, so that the flatness of the hard gold bonding pad and the flatness of the rest bonding pads of the circuit board are kept consistent.
In some embodiments, referring to fig. 2, step S100 may include, but is not limited to including, the steps of:
s110, drilling a hole in the circuit board to process the hole in the circuit board;
s120, chemically depositing a layer of thin copper on the circuit board after drilling;
s130, thickening and copper plating are carried out on the outer layer and the hole of the circuit board after copper deposition according to a second preset thickness.
Referring to fig. 3a, 3b and 3c, before the hard gold region is determined, holes are drilled in the circuit board to process holes on the circuit board, and then a layer of thin copper is chemically deposited on the drilled circuit board, and the thin copper wraps the whole circuit board and the holes of the circuit board. The circuit board after copper deposition needs to be thickened on the copper in the whole outer layer and the hole so as to be plated with a layer of copper, and the copper layer of the circuit board is thickened according to a second preset thickness.
In some embodiments, referring to fig. 4, step S110 may include, but is not limited to including, the steps of:
and S111, drilling the circuit board in a mechanical drilling mode or a laser drilling mode to process the holes of the circuit board.
And drilling the circuit board according to requirements, wherein the drilling mode can adopt a mechanical drilling mode or a laser drilling mode. Therefore, different drilling modes can be selected according to the drilling requirements of the circuit board.
In some embodiments, referring to fig. 5, step S210 may include, but is not limited to including the steps of:
s211, increasing a preset difference value and a first preset thickness according to the parameters of the bonding pad to determine the size of the hard gold area;
s212, pasting the first dry film on the circuit board.
The first preset thickness is set according to the product requirements of the circuit board, so that the size of the hard gold area is determined according to the parameters of the bonding pad and the first preset thickness, and the surface size and the thickness of the hard gold area are also determined. And after the hard gold area of the circuit board is determined and the size of the hard gold area is determined, attaching a first dry film on the circuit board.
Specifically, the first dry film is an electroplating-resistant dry film, and the electroplating-resistant dry film is attached so that other areas of the circuit board are not affected when nickel gold and hard gold are electroplated.
Since the size of the hard gold region can be determined by ideally determining the pad parameters of the pad in the hard gold region, but actually the nickel layer is an etching-resistant layer, and the copper layer is a non-etching-resistant layer, a preset difference value needs to be added between the pad parameters and the first preset thickness to ensure the size of the pad.
For example, referring to fig. 6, the preset difference is 1mil, and if the pad is a square pad, the pad parameters of the hard gold pad of the square pad, that is, the length and width of the pad, are obtained, and the length and width are L, W respectively. The first preset thickness is H, so the length and width of the hard gold region to be manufactured are determined to be L +1mil and W +1mil respectively according to the length L and width W of the pad increased by 1 mil. And if the bonding pad is a circular bonding pad, acquiring the diameter of the bonding pad as D, and determining the diameter of the hard gold area as D +1mil according to the diameter of the bonding pad. Therefore, the pad size is ensured by enlarging the size of the pad by 1 mil.
In some embodiments, referring to fig. 7, step S300 may include, but is not limited to including the steps of:
s310, exposing the area except the hard gold area on the circuit board;
and S320, developing and removing the first dry film on the unexposed hard gold region.
Referring to fig. 8, since the hard gold region needs to be exposed, the other regions except the hard gold region need to be exposed, and then the unexposed region, that is, the dry film of the hard gold region is developed by developing, so as to expose the hard gold region.
In some embodiments, referring to fig. 9, step S400 may include, but is not limited to including, the steps of:
s410, copper is reduced in the hard gold area on the circuit board according to a third preset thickness;
and S420, plating nickel gold and hard gold on the hard gold area of the circuit board after copper reduction so as to enable the hard gold area to be flush with the circuit area of the circuit board.
Referring to fig. 10a and 10b, after the hard gold region of the circuit board is exposed, copper is reduced from the hard gold region on the circuit board, and copper is reduced according to a first preset thickness. And determining the thickness of the nickel-gold layer to be a third preset thickness according to the first preset thickness, and determining the copper reduction thickness of the circuit board according to the thickness of the nickel-gold layer. For example, if the thickness of the hard gold region is 0.76um and the thickness of the nickel layer is 4um, the copper is reduced by 4um for the hard gold region. And after copper is reduced, plating nickel gold and hard gold on the hard gold area, and plating the hard gold and the nickel gold until the hard gold area and the circuit area of the circuit board are level.
In some embodiments, referring to fig. 11, step S500 may include, but is not limited to including, the steps of:
s510, removing the first dry film on the circuit board, and sticking an anti-etching dry film;
and S520, exposing the circuit board according to the circuit of the preset circuit diagram, and developing the substrate area of the circuit board.
Referring to fig. 12a, 12b, 12c and 12d, after the hard gold region is processed, the corresponding pad needs to be exposed, so that the first dry film on the circuit board needs to be removed, and then an etching-resistant dry film needs to be attached, that is, the hard gold region on the circuit board is prevented from being damaged during etching. Therefore, the etching-resistant dry film is pasted, then the circuit is exposed according to the circuit corresponding to the preset circuit diagram, and then the non-circuit substrate area of the circuit board is exposed through development. And finally, removing the etching-resistant dry film to expose the required bonding pad and the circuit, thereby finishing the manufacture of the circuit board.
In addition, the application also discloses a circuit board which is formed by adopting the circuit board preparation method.
The circuit board obtained by the circuit board preparation method ensures that the final circuit flatness of the circuit board is kept consistent and no extra lead is required to be pulled, so that the flatness of the surface bonding pad is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (9)
1. A method for manufacturing a circuit board, comprising:
drilling, copper deposition and copper electroplating are carried out on the circuit board;
obtaining pad parameters and a first preset thickness to determine the size of a hard gold area, and pasting a first dry film on the circuit board;
exposing the area, except the hard gold area, of the circuit board attached with the first dry film, and removing the first dry film of the hard gold area;
copper is removed from a hard gold area on the circuit board, and nickel hard gold is plated, so that the hard gold area is flush with a circuit area of the circuit board;
removing the first dry film on the circuit board, attaching a second dry film, and exposing the circuit board according to a preset circuit diagram to expose a substrate area;
and etching the substrate area, and removing the second dry film to expose the bonding pad and the circuit.
2. The method for preparing a circuit board according to claim 1, wherein the drilling, copper deposition and copper electroplating are carried out on the circuit board, and the method comprises the following steps:
drilling the circuit board to process a hole of the circuit board;
chemically depositing a layer of thin copper on the circuit board after drilling;
and thickening and copper plating are carried out on the outer layer and the hole of the circuit board after copper deposition according to a second preset thickness.
3. The method for manufacturing a circuit board according to claim 2, wherein the drilling the circuit board to machine the hole of the circuit board comprises:
and drilling the circuit board in a mechanical drilling mode or a laser drilling mode to process the hole of the circuit board.
4. The method for manufacturing a circuit board according to claim 1, wherein the obtaining of the pad parameter and the first preset thickness determines a size of a hard gold region, and the attaching of a first dry film to the circuit board includes:
increasing a preset difference value and the first preset thickness according to the pad parameter to determine the size of the hard gold area;
and pasting the first dry film on the circuit board.
5. The method of manufacturing a wiring board according to claim 4, wherein the first dry film is an electroplating-resistant dry film.
6. The method for manufacturing a circuit board according to any one of claims 1 to 5, wherein the exposing the area of the circuit board to which the first dry film is attached, excluding the hard gold region, and removing the first dry film of the hard gold region comprises:
exposing the area of the circuit board except the hard gold area;
and developing and removing the first dry film on the unexposed hard gold region.
7. The method for preparing the circuit board according to any one of claims 1 to 5, wherein the step of reducing copper and plating hard gold on the hard gold region on the circuit board to make the hard gold region and the circuit region of the circuit board flush comprises the following steps:
copper is reduced from the hard gold area on the circuit board according to a third preset thickness;
and plating nickel gold and hard gold on the hard gold area of the circuit board after copper reduction so as to enable the hard gold area to be flush with the circuit area of the circuit board.
8. The method for preparing a circuit board according to any one of claims 1 to 5, wherein the removing the first dry film and attaching the second dry film on the circuit board and exposing the circuit board according to a predetermined circuit pattern to expose a substrate region comprises:
removing the first dry film on the circuit board, and sticking an anti-etching dry film;
and exposing the circuit board according to the circuit of the preset circuit diagram, and developing the substrate area of the circuit board.
9. A wiring board, characterized in that the wiring board is formed by the wiring board production method according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111572612.4A CN114364143A (en) | 2021-12-21 | 2021-12-21 | Circuit board preparation method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111572612.4A CN114364143A (en) | 2021-12-21 | 2021-12-21 | Circuit board preparation method and circuit board |
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| Publication Number | Publication Date |
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| CN114364143A true CN114364143A (en) | 2022-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111572612.4A Pending CN114364143A (en) | 2021-12-21 | 2021-12-21 | Circuit board preparation method and circuit board |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3485665A (en) * | 1967-08-22 | 1969-12-23 | Western Electric Co | Selective chemical deposition of thin-film interconnections and contacts |
| CN104105350A (en) * | 2013-04-02 | 2014-10-15 | 深南电路有限公司 | Selective nickel and gold plating method, PCB and device |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
-
2021
- 2021-12-21 CN CN202111572612.4A patent/CN114364143A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3485665A (en) * | 1967-08-22 | 1969-12-23 | Western Electric Co | Selective chemical deposition of thin-film interconnections and contacts |
| CN104105350A (en) * | 2013-04-02 | 2014-10-15 | 深南电路有限公司 | Selective nickel and gold plating method, PCB and device |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
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